CN213691971U

CN213691971U - Semiconductor processing equipment and process chamber thereof

Info

Publication number: CN213691971U
Application number: CN202022808460.0U
Authority: CN
Inventors: 马建强; 张宝辉; 王福来
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-07-13
Anticipated expiration: 2030-11-27

Abstract

The application discloses semiconductor process equipment and process chamber thereof, wherein process chamber includes the cavity body, cavity body inside has the reaction chamber, be provided with heater and shower nozzle portion in the reaction chamber, treat that the wafer of processing is fixed on the heater, the heater can treat the wafer of processing and heat, the shower nozzle portion includes injector head and spliced pole, the injector head sets up in the reaction chamber, gas outlet on the injector head is towards the heater, the shower nozzle portion can be with process gas injection to the wafer surface of treating that is located on the heater, with at wafer surface formation one deck deposit film, the one end and the shower nozzle portion of spliced pole are connected, the other end passes the upper cover of cavity body and extends to outside the reaction chamber, process chamber is provided with the lift portion outward. Through the shower head that will be used for controlling in this application and the lift portion setting of heater interval outside the reaction chamber, can needn't open the reaction chamber when adjusting shower head and heater interval, reduced the possibility that the reaction intracavity environment received the pollution.

Description

Semiconductor processing equipment and process chamber thereof

Technical Field

The present disclosure relates to semiconductor devices, and more particularly to a semiconductor processing device and a process chamber thereof.

Background

The distance between the spray head part and the heating device in the vapor deposition equipment is an important factor for determining the deposition effect, the distance between the spray head part and the heating device needs to be adjusted according to the actual condition in the deposition process, and the existing spray head part height adjusting mechanism is arranged in a reaction cavity and is difficult to adjust.

SUMMERY OF THE UTILITY MODEL

The application provides a process chamber in semiconductor processing equipment, including: the reaction chamber comprises a chamber body, wherein a reaction chamber is arranged inside the chamber body;

a heater disposed within the reaction chamber;

the spray head part comprises a spray head and a connecting column, the spray head is arranged in the reaction cavity, an air outlet on the spray head faces the heater, one end of the connecting column is connected with the spray head, and the other end of the connecting column penetrates through the upper cover of the chamber body and extends out of the reaction cavity;

the lifting part is arranged on the upper cover, connected with the connecting column and used for moving the connecting column and further adjusting the distance between the injection head and the heater.

Further, the lift portion is including being on a parallel with the clamp plate that the upper cover set up with establish immediately the lifter on the upper cover, the clamp plate with spliced pole fixed connection, the lifter with the mobilizable connection of clamp plate, the lifter can drive the clamp plate is followed the extending direction of lifter removes, and then removes the spliced pole.

Furthermore, a screw hole is formed in the pressing plate, the lifting rod is a jackscrew, one end of the lifting rod penetrates through the screw hole in the pressing plate and then is connected with the upper surface of the upper cover, and a fixing nut is arranged at the other end of the lifting rod.

Furthermore, the pressing plate is sleeved on the connecting column, a step surface which is abutted against the end surface of the pressing plate is arranged on the connecting column, and a pressing piece is further arranged on the connecting column to press the pressing plate on the step surface of the connecting column.

Furthermore, the device also comprises a guide rod vertically arranged on the upper cover, and the guide rod penetrates through the pressing plate and then is connected with the upper cover.

Furthermore, the lifting rods and the guide rods are multiple, the lifting rods are arranged around the central annular array of the pressing plate, and the guide rods are also arranged around the central annular array of the pressing plate.

Furthermore, step-shaped partition mounting holes are formed in the upper cover, the spray head partition matched with the partition mounting holes is detachably arranged in the partition mounting holes, and the connecting column penetrates through the spray head partition and extends to the outside of the reaction cavity.

Furthermore, the up end of shower nozzle portion isolator with the upper surface of upper cover flushes, the upper surface of upper cover with the junction pressure of the up end of shower nozzle portion isolator is equipped with the solid fixed ring of isolator, the solid fixed ring of isolator is used for with the shower nozzle portion isolator is fixed in the isolator mounting hole.

Furthermore, still be provided with on the shower nozzle portion isolator with the bottom plate that the clamp plate set up relatively, the bottom plate suit on the spliced pole and with shower nozzle portion isolator fixed connection, the bottom surface of bottom plate with set up the pinhole that corresponds the setting on the up end of shower nozzle portion isolator, the pinhole is used for holding the locating pin in order to fix a position the bottom plate, the one end of lifter with the bottom plate contact is connected, the one end of guide bar with the bottom plate is connected.

Furthermore, a first sealing groove surrounding the connecting column is formed in the bottom surface of the bottom plate, and a first sealing ring is arranged in the first sealing groove.

Further, be provided with the closing plate on the bottom plate, the closing plate suit on the spliced pole and with bottom plate fixed connection, set up on the closing plate and supply the through-hole that the spliced pole passed, the closing plate with set up on the terminal surface of bottom plate contact with the endocentric second seal groove of through-hole of closing plate, the lateral wall of second seal groove is the inclined plane, the internal diameter of the last notch of second seal groove is less than the internal diameter of lower notch, the second sealing washer has been put to the interior holding of second seal groove.

The application also provides semiconductor processing equipment comprising the process chamber.

Compared with the prior art, the beneficial effects of this application are as follows:

through the shower head that will be used for controlling in this application and the lift portion setting of heater interval outside the reaction chamber, can needn't open the reaction chamber when adjusting shower head and heater interval, reduced the possibility that the reaction intracavity environment received the pollution.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is an overall schematic diagram according to an embodiment of the present application;

FIG. 2 is an enlarged schematic view of the lift section area of the present application;

FIG. 3 is a schematic top view of the present application;

FIG. 4 is a schematic view of a seal plate of the present application;

fig. 5 is a schematic view of the showerhead of the present application.

Description of reference numerals: 100-chamber body, 110-reaction chamber, 120-upper cover, 121-nozzle part spacer, 122-spacer fixing ring, 200-heater, 300-nozzle part, 310-spray head, 320-connecting column, 400-lifting part, 410-pressing plate, 420-lifting rod, 430-fixing nut, 440-pressing piece, 500-guiding rod, 600-bottom plate, 610-positioning pin, 620-first sealing ring, 700-sealing plate, 710-second sealing ring and 720-second sealing groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 schematically shows a process chamber in semiconductor processing equipment according to an embodiment of the present application, the process chamber includes a chamber body 100, the chamber body 100 has a reaction chamber 110 therein, a heater 200 and a showerhead part 300 are disposed in the reaction chamber 110, a wafer to be processed is fixed on the heater 200, the heater 200 is capable of heating the wafer to be processed, the showerhead part 300 includes a showerhead 310 and a connection post 320, the showerhead 310 is disposed in the reaction chamber 110, a gas outlet of the showerhead 310 faces the heater 200, the showerhead part 300 is capable of jetting process gas onto the surface of the wafer to be processed on the heater 200 to form a deposited film on the wafer surface, one end of the connection post 320 is connected to the showerhead 310, and the other end extends out of the reaction chamber 110 through an upper cover 120 of the chamber body 100. The lifting part 400 is arranged outside the process chamber, specifically, the lifting part 400 is arranged on the upper cover 120 of the chamber body 100, the upper cover 120 is the upper end of the chamber body 100 and is connected with the connecting column 320, the lifting part 400 is used for moving the connecting column 320 so as to adjust the distance between the injector head 310 and the heater 200, and correspondingly, the distance between the air outlet of the injector head 310 and the wafer on the heater 200 can also be adjusted.

In the semiconductor processing process, the size of the gas outlet of the injector head 310 is adapted to the size of the wafer carried on the heater 200, so that the process gas injected to all positions on the surface of the wafer can be uniform, the distance between the gas outlet of the injector head 310 and the end face of the heater 200 for carrying the wafer is called GAP value in the semiconductor process, and the GAP value needs to be adjusted according to the actual situation in the processing process.

In the embodiment of the present application, the elevating part 400 for adjusting the distance between the gas outlet of the injector head 310 and the end surface of the heater 200 for carrying the wafer is disposed outside the reaction chamber 110, so that the adjustment can be completed without opening the reaction chamber 110 in the actual adjustment process, thereby reducing the possibility of external contamination inside the reaction chamber 110. Meanwhile, the structure in the reaction chamber 110 is simplified, so that the available space in the reaction chamber 110 is larger, and the reliability of the chamber body 100 is better.

In one embodiment, the lifting part 400 includes a pressing plate 410 disposed parallel to the upper cover 120 and a lifting rod 420 vertically disposed on the upper cover 120, the pressing plate 410 is fixedly connected to the connecting column 320, the lifting rod 420 is movably connected to the pressing plate 410, and the lifting rod 420 can drive the pressing plate 410 to move along the extending direction of the lifting rod 420, thereby moving the connecting column 320.

Specifically, the lifting rod 420 is a jackscrew, and accordingly, a screw hole is formed in the pressing plate 410, one end of the lifting rod 420 passes through the screw hole in the pressing plate 410 and then contacts with the upper surface of the upper cover 120, a fixing nut 430 is arranged at the other end of the lifting rod 420, the lifting rod 420 serving as the jackscrew and the screw hole in the pressing plate 410 are matched to form a lifting screw mechanism, the pressing plate 410 can move along the extending direction of the lifting rod 420 by rotating the lifting rod 420, namely, the lifting rod moves along the direction perpendicular to the upper cover 120 of the chamber body 100, and correspondingly, the connecting column 320 connected with the pressing plate 410 can also move along the extending direction of the lifting rod 420, so that the distance between the air outlet of the injection head 310 and the heater 200 is adjustable. The fixing nut 430 sleeved on the lifting rod 420 can lock the pressing plate 410 and the lifting rod 420 to keep the pressing plate 410 stable, and correspondingly, the nozzle part 300 connected with the pressing plate 410 can also keep stable after being adjusted in place.

In one embodiment, in order to stably and firmly connect the pressing plate 410 and the connecting column 320, the pressing plate 410 is sleeved on the connecting column 320, the connecting column 320 has a step surface abutting against the end surface of the pressing plate 410, and the connecting column 320 is further provided with a pressing piece 440 for pressing the pressing plate 410 on the step surface of the connecting column 320. Specifically, the step surface on the connecting column 320 is abutted against the lower side end surface of the pressing plate 410, the step surface plays a role of supporting the pressing plate 410, and the pressing piece 440 is tightly pressed on the end surface of the upper side of the pressing plate 410 and is matched with the step surface, so that the connecting column 320 and the pressing plate 410 are completely constrained, and the relative displacement between the connecting column 320 and the pressing plate 410 is avoided.

Specifically, the pressing member 440 may be a nut, a screw thread is provided on a portion of the connecting column 320 that extends out of the upper end surface of the pressing plate 410, and the pressing member 440 serving as the nut is engaged with the screw thread, so that the pressing member 440 is pressed against the pressing plate 410.

In one embodiment, the upper cover 120 is further provided with a guide rod 500, the guide rod 500 is connected to the upper cover 120 after passing through the pressing plate 410, the purpose of the guide rod 500 is to keep the pressing plate 410 stable during the lifting process, and correspondingly, a through hole for passing through the guide rod 500 is formed in the pressing plate 410, and the aperture of the through hole is slightly larger than the outer diameter of the guide rod 500, so that the pressing plate 410 is prevented from shaking in the horizontal direction when being capable of moving along the axial direction of the guide rod 500. It should be noted that the outer wall of the guide bar 500 and the inner wall of the through hole of the pressing plate 410 should be smooth wall surfaces.

Specifically, the guide rod 500 may be a screw, and a screw hole is formed in the upper cover 120 to be matched with the screw, and the guide rod 500 is vertically arranged on the surface of the upper cover 120 by passing the guide rod 500 through the through hole of the pressure plate 410 and then matching with the screw hole of the upper cover 120. The end of the guide rod 500 of the screw structure, which is far away from the upper cover 120, is provided with a screw cap, the diameter of the screw cap should be larger than the inner diameter of the through hole on the pressure plate 410, so that the screw cap can apply downward pressure to the pressure plate 410, while the lifting rod 420 has a supporting function on the pressure plate 410, and the guide rod 500 and the lifting rod 420 cooperate to apply pressure to the pressure plate 410 from two opposite directions, namely, the upper direction and the lower direction, so that the pressure plate 410 can be kept stable relative to the upper cover 120.

Preferably, one end of the guide rod 500 near the upper cover 120 is provided with a screw thread, and the rest is an optical axis, so that the area of the guide rod 500 passing through the through hole on the pressing plate 410 is the optical axis, and friction between the guide rod 500 and the through hole on the pressing plate 410 can be reduced. The axial length of the portion of the guide rod 500 having the thread may be determined according to the height range to be adjusted by the actual head part 300. For larger differences in adjustment values, this can be accommodated by replacing the guide rod 500 with a thread flank of different axial length.

In order to solve the above problem, in one embodiment, there are a plurality of lifting rods 420 and guide rods 500, the plurality of lifting rods 420 are arranged around the central annular array of the platen 410, and the plurality of guide rods 500 are also arranged around the central annular array of the platen 410. Each lifting rod 420 is provided with a guide rod 500 which is correspondingly arranged, the surface of the pressing plate 410 can be uniformly divided into a plurality of adjustable areas by arranging the plurality of lifting rods 420 and the guide rods 500, when the air outlet end of the injection head 310 is not horizontal, the corresponding area on the pressing plate 410 is found by detecting the inclined area of the air outlet end, and the height of the corresponding area is adjusted by adjusting the lifting rods 420 and the guide rods 500 in the corresponding area, so that the effect of adjusting the horizontal degree of the injection head 310 is achieved.

Specifically, in this embodiment, the number of the lifting rods 420 and the guide rods 500 is three, and the lifting rods 420 and the guide rods 500 are distributed at an angle of 120 degrees, and of course, more lifting rods 420 and more guide rods 500 may be provided according to actual situations, the more the lifting rods 420 and the guide rods 500 are, the more the levelness adjustment of the injector head 310 is, and the specific number of the lifting rods 420 and the guide rods 500 is not specifically limited in this application.

In an embodiment, a stepped partition mounting hole is formed in the upper surface of the upper cover 120, a nozzle partition 121 having a shape matching the partition mounting hole is detachably disposed in the partition mounting hole, the connection column 320 passes through the nozzle partition 121 and extends out of the reaction chamber 110, the stepped surface of the partition mounting hole of the upper cover 120 can support the nozzle partition 121, the nozzle partition 121 can be used as a component of the upper cover 120, so that the upper cover 120 is integrally divided into different parts, thereby reducing the processing difficulty of the upper cover 120, and meanwhile, the lifting rod 420 and the guide rod 500 and other components used for adjusting the height and the levelness of the nozzle 300 can be configured to be matched with the nozzle partition 121.

In order to fix the nozzle part partition 121, the upper end surface of the nozzle part partition 121 is flush with the upper surface of the upper cover 120, so that the nozzle part partition 121 and the upper cover 120 are better integrated, a partition fixing ring 122 is pressed at the joint of the upper surface of the upper cover 120 and the upper end surface of the nozzle part partition 121, and the partition fixing ring 122 is fixedly connected with the upper cover 120 and used for fixing the nozzle part partition 121 in a partition mounting hole. In this embodiment, the overall shape of the chamber body 100 may be cylindrical, so that the upper end surface of the upper cover 120 is circular, the showerhead partition 121 and the upper cover 120 are concentrically arranged, the connection point of the showerhead partition 121 and the upper cover 120 is an annular gap around the center of the upper cover 120, and the entire annular gap can be covered by the partition fixing ring 122, so as to ensure the sealing performance of the reaction chamber 110 in the chamber body 100.

In order to fix the spacer fixing ring 122 to the upper cover 120, the upper cover 120 and the spacer fixing ring 122 are provided with corresponding screw holes, and the spacer fixing ring 122 and the upper cover 120 are fixed by inserting bolts into the screw holes of the upper cover 120 and the spacer fixing ring 122, and at the same time, the spacer fixing ring 122 also presses the head portion spacer 121 on the lower portion thereof, thereby achieving a function of fixing the head portion spacer 121 and the upper cover 120. In order to ensure the connection stability of the spacer fixing ring 122, at least two screw holes are formed in the spacer fixing ring 122 corresponding to the upper cover 120, and the screw holes are uniformly distributed in the spacer fixing ring 122.

In one embodiment, the nozzle part separator 121 is further provided with a bottom plate 600 disposed opposite to the pressure plate 410, the bottom plate 600 is sleeved on the connection post 320 and is fixedly connected to the nozzle part separator 121, the bottom surface of the bottom plate 600 and the upper end surface of the nozzle part separator 121 are provided with correspondingly disposed pin holes for receiving the positioning pins 610 to position the bottom plate 600, one end of the lifting rod 420 is in contact connection with the bottom plate 600, and one end of the guide rod 500 is connected to the bottom plate 600.

Through the arrangement of the bottom plate 600, the bottom plate 600 is in contact with the lifting rod 420 and the guide rod 500, so that the pressure of the lifting rod 420, the guide rod 500 and the pressing plate 410 can be prevented from being directly released to the nozzle part partition member 121, and the function of protecting the nozzle part partition member 121 is achieved. The corresponding pin holes are formed in the upper end face of the nozzle part partition 121 and the bottom face of the bottom plate 600, so that the bottom plate 600 can be conveniently mounted, and the pre-positioning effect is achieved. Corresponding screw holes can be further formed in the bottom plate 600 and the nozzle part partition member 121, after the bottom plate 600 is pre-positioned by the positioning pin 610, the screw holes of the bottom plate 600 and the nozzle part partition member 121 are also aligned at the moment, the bottom plate 600 and the nozzle part partition member 121 are fixed by inserting bolts, and correspondingly, the screw holes formed corresponding to the guide rods 500 are also formed in the bottom plate 600.

In one embodiment, in order to improve the sealing performance of the reaction chamber 110, a first sealing groove surrounding the connection column 320 is further formed on the bottom surface of the bottom plate 600, a first sealing ring 620 is disposed in the first sealing groove, and the first sealing ring 620 is simultaneously contacted with the nozzle part spacer 121 and the bottom plate 600, so as to ensure the sealing performance at the connection position of the nozzle part spacer 121 and the bottom plate 600.

Because the connecting column 320 is movable relative to the upper cover 120, in order to maintain the sealing performance at the connection between the connecting column 320 and the upper cover 120, in an embodiment, a sealing plate 700 is disposed on the bottom plate 600, the sealing plate 700 is sleeved on the connecting column 320 and is fixedly connected with the bottom plate 600, a through hole for the connecting column 320 to pass through is formed in the sealing plate 700, a second sealing groove 720 concentric with the through hole of the sealing plate 700 is formed in the end surface of the sealing plate 700 contacting the bottom plate 600, the side wall of the second sealing groove 720 is an inclined surface, the inner diameter of the upper notch of the second sealing groove 720 is smaller than that of the lower notch, and a second sealing ring 710 is disposed in.

The sidewall of the second seal groove 720 is an inclined surface, and the specific inclination angle may be 45 degrees, which is used to make the compressed amount of the second seal ring 710 contacting the inclined surface in the two axial and radial directions of the second seal groove 720 consistent, prolong the service life of the second seal ring 710, and ensure the air tightness of the chamber.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A process chamber in a semiconductor processing apparatus, comprising:

a chamber body (100), wherein the chamber body (100) is internally provided with a reaction cavity (110);

a heater (200), the heater (200) disposed within the reaction chamber (110);

the spray head part (300) comprises a spray head part (310) and a connecting column (320), the spray head part (310) is arranged in the reaction cavity (110), an air outlet on the spray head part (310) faces the heater (200), one end of the connecting column (320) is connected with the spray head part (310), and the other end of the connecting column passes through the upper cover (120) of the chamber body (100) and extends out of the reaction cavity (110);

a lifting part (400), the lifting part (400) is arranged on the upper cover (120), is connected with the connecting column (320) and is used for moving the connecting column (320), and further adjusting the distance between the injection head (310) and the heater (200).

2. The process chamber of claim 1, wherein the lifting part (400) comprises a pressing plate (410) arranged parallel to the upper cover (120) and a lifting rod (420) vertically arranged on the upper cover (120), the pressing plate (410) is fixedly connected with the connecting column (320), the lifting rod (420) is movably connected with the pressing plate (410), and the lifting rod (420) can drive the pressing plate (410) to move along the extending direction of the lifting rod (420) so as to move the connecting column (320).

3. The process chamber of claim 2, wherein the pressure plate (410) is provided with a screw hole, the lifting rod (420) is a jackscrew, one end of the lifting rod (420) passes through the screw hole on the pressure plate (410) and then is connected with the upper surface of the upper cover (120), and the other end is provided with a fixing nut (430).

4. The process chamber as claimed in claim 3, wherein the pressure plate (410) is sleeved on the connecting column (320), the connecting column (320) is provided with a step surface abutting against an end surface of the pressure plate (410), and the connecting column (320) is further provided with a pressing piece (440) for pressing the pressure plate (410) on the step surface of the connecting column (320).

5. The process chamber of claim 4, further comprising a guide rod (500) vertically arranged on the upper cover (120), wherein the guide rod (500) penetrates through the pressing plate (410) and is connected with the upper cover (120).

6. The process chamber of claim 5, wherein a plurality of the lift pins (420) and the guide pins (500) are provided, a plurality of the lift pins (420) being disposed about a central annular array of the platen (410), and a plurality of the guide pins (500) being also disposed about a central annular array of the platen (410).

7. The process chamber according to any one of claims 5 to 6, wherein the upper cover (120) is provided with a stepped partition mounting hole, a nozzle partition (121) matched with the partition mounting hole is detachably arranged in the partition mounting hole, and the connecting column (320) passes through the nozzle partition (121) and extends out of the reaction chamber (110).

8. The process chamber of claim 7, wherein the upper end surface of the showerhead part spacer (121) is flush with the upper surface of the upper cover (120), and a spacer fixing ring (122) is pressed at the junction of the upper surface of the upper cover (120) and the upper end surface of the showerhead part spacer (121), wherein the spacer fixing ring (122) is used for fixing the showerhead part spacer (121) in the spacer mounting hole.

9. The process chamber of claim 8, wherein a bottom plate (600) is disposed on the showerhead part spacer (121) and opposite to the pressure plate (410), the bottom plate (600) is sleeved on the connecting column (320) and is fixedly connected with the showerhead part spacer (121), correspondingly disposed pin holes are disposed on the bottom surface of the bottom plate (600) and the upper end surface of the showerhead part spacer (121), the pin holes are used for accommodating positioning pins (610) to position the bottom plate (600), one end of the lifting rod (420) is in contact connection with the bottom plate (600), and one end of the guide rod (500) is connected with the bottom plate (600).

10. The processing chamber of claim 9, wherein a bottom surface of the bottom plate (600) defines a first seal groove surrounding the connecting post (320), and a first seal ring (620) is disposed in the first seal groove.

11. The process chamber of claim 10, wherein a sealing plate (700) is disposed on the bottom plate (600), the sealing plate (700) is sleeved on the connecting column (320) and is fixedly connected to the bottom plate (600), a through hole for the connecting column (320) to pass through is formed in the sealing plate (700), a second sealing groove (720) concentric with the through hole of the sealing plate (700) is formed in an end surface of the sealing plate (700) contacting the bottom plate (600), a side wall of the second sealing groove (720) is an inclined surface, an inner diameter of an upper notch of the second sealing groove (720) is smaller than an inner diameter of a lower notch, and a second sealing ring (710) is disposed in the second sealing groove (720).

12. A semiconductor processing apparatus comprising the process chamber of any of claims 1-11.