CN213688883U

CN213688883U - Testing device for LED chip

Info

Publication number: CN213688883U
Application number: CN202023199154.8U
Authority: CN
Inventors: 李龙; 张帅
Original assignee: Xiamen Silan Advanced Compound Semiconductor Co Ltd
Current assignee: Xiamen Silan Advanced Compound Semiconductor Co Ltd
Priority date: 2020-12-26
Filing date: 2020-12-26
Publication date: 2021-07-13
Anticipated expiration: 2030-12-26

Abstract

The utility model discloses a testing arrangement of LED chip, including the integrating sphere and the test microscope carrier that is used for fixed LED chip, the below of integrating sphere is equipped with around the LED chip and receives the light-receiving mouth of the light that the LED chip sent. The utility model provides a testing arrangement of LED chip can utilize the receipts light mouth of integrating sphere below around the LED chip in the test process for the light homoenergetic that LED chip top surface and each side sent can be gathered by receiving the light mouth, consequently, this scheme can improve the receipts light rate of integrating sphere, reduces the test deviation, improves the test accuracy.

Description

Testing device for LED chip

Technical Field

The utility model relates to a LED chip test technical field especially relates to a testing arrangement of LED chip.

Background

At present, an optical testing device for an LED chip generally includes a testing stage, a probe seat, a probe, an edge finder, an integrating sphere, a detector, a spectrometer, and the like, wherein the testing stage is used for placing an LED chip to be tested; the edge finder is used for carrying the probe and adjusting the position of the probe and the depth of the needle insertion by matching with the probe seat; the integrating sphere is a hollow sphere with the inner wall coated with a white diffuse reflection material, and is also called a photometric sphere, a light flux sphere and the like, the lower part of the integrating sphere is a light receiving port structure with an opening, and the integrating sphere is usually designed into a cylindrical structure and is used for collecting light emitted by the LED chip; the detector is used for testing the brightness parameters of the LED chip; the spectrometer is used for converting optical signals into electric signals and analyzing light with different wave bands.

The existing LED chip testing method comprises the following steps: the probe and the LED chip are arranged below the light receiving port of the integrating sphere, and when the LED chip emits light in the testing process, light signals irradiated into the light receiving port of the integrating sphere are collected by the integrating sphere, and light parameters of the LED chip are obtained through calculation. The specific test process is as follows: and placing the LED chip on a test carrier, operating the test carrier to move the LED chip to a position to be tested, adjusting the position and the pin pressure of the probe through an edge finder and a probe seat, and then testing.

In the existing testing device, the light receiving rate of the integrating sphere is low, and light emitted from the side surface of the LED chip cannot be collected by the integrating sphere, so that the light signal collected by the integrating sphere is greatly different from the light signal actually emitted by the LED chip, and further the testing result is greatly deviated from the actual light parameter of the LED chip.

Therefore, how to improve the test accuracy of the LED chip is a technical problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a testing arrangement of LED chip for improve the rate of receiving light of integrating sphere, reduce the test deviation, improve the test accuracy.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a testing device for an LED chip comprises an integrating sphere and a testing carrier used for fixing the LED chip, wherein a light receiving opening which surrounds the LED chip and receives light emitted by the LED chip is arranged below the integrating sphere.

Preferably, the testing device for the LED chip further includes a probe, and a probe slot through which the probe passes is formed in a side wall of the light receiving opening.

Preferably, the lower end of the probe notch is opened on the lower end surface of the light receiving opening.

Preferably, the probe notch is a straight slit opening, and the extending direction of the probe notch is parallel to the height direction of the light receiving opening or has an acute included angle.

Preferably, the length of the probe slot is greater than the vertical distance between the probe and the lower end surface of the LED chip.

Preferably, the length of the probe notch is less than or equal to the height of the light receiving opening.

Preferably, the height of the light-collecting opening is 18-22 mm.

Preferably, the length of the probe notch is 14-16 mm.

Preferably, the width of the probe slot is equal to or greater than the outer diameter of the probe.

Preferably, the width of the probe notch is 1.6-2 times of the outer diameter of the probe.

Preferably, the width of the probe notch is 0.8-1 mm.

Preferably, the test carrier is provided with a fixing groove which is matched and fixed with the bottom of the LED chip.

Preferably, the testing apparatus for LED chips further includes a stage moving device for moving the test stage.

Preferably, the stage moving device includes a lifting device for lifting the test stage and a horizontal moving device for horizontally moving the test stage.

Preferably, the testing device for the LED chip further comprises a detector connected to the integrating sphere and a spectrometer connected to the integrating sphere through an optical fiber.

Preferably, the testing device for the LED chip further includes a probe base and an edge finder disposed on the probe base, wherein the edge finder is provided with a probe.

Preferably, the testing device for the LED chip further comprises a notch opening and closing mechanism, wherein the notch opening and closing mechanism comprises a shielding strip movably connected to the probe notch, and the shielding strip faces to one side surface of the inner side of the light receiving opening and the surface of the inner side of the light receiving opening, which are made of the same material.

Preferably, the shielding strip is in sliding fit with the probe slot along the length direction, and a side surface of the shielding strip facing the inner side of the light-absorbing opening is arranged tangentially to the inner side surface of the light-absorbing opening.

The utility model provides a testing arrangement of LED chip, including the integrating sphere with be used for fixed LED chip's test microscope carrier, the below of integrating sphere is equipped with centers on the LED chip receives the light receiving opening of the light that the LED chip sent.

The utility model provides a testing arrangement of LED chip can utilize the receipts light mouth of integrating sphere below around the LED chip in the test process for the light homoenergetic that LED chip top surface and each side sent can be gathered by receiving the light mouth, consequently, this scheme can improve the receipts light rate of integrating sphere, reduces the test deviation, improves the test accuracy.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a testing apparatus for an LED chip according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a position relationship between a light receiving opening of the integrating sphere, the LED chip and the probe according to an embodiment of the present invention;

fig. 3 is a side view of a light-collecting opening of an integrating sphere in an embodiment of the present invention.

The meaning of the various reference numerals in figures 1 to 3 is as follows:

1-LED chip, 2-test stage, 3-light receiving port, 4-light, 5-integrating sphere, 6-optical fiber, 7-detector, 8-edge finder, 9-probe seat, 10-probe, 11-stage moving device and 12-probe notch.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a testing apparatus for an LED chip according to an embodiment of the present invention; fig. 2 is a schematic diagram of a position relationship between a light receiving opening of the integrating sphere, the LED chip and the probe according to an embodiment of the present invention; fig. 3 is a side view of a light-collecting opening of an integrating sphere in an embodiment of the present invention.

The utility model provides a testing arrangement of LED chip, including integrating sphere 5 with be used for fixed LED chip 1's test microscope carrier 2, the below of integrating sphere 5 is equipped with around LED chip 1 and receives the receipts light mouth 3 of the light that LED chip 1 sent. It should be noted that, similar to the existing testing device, the testing device for the LED chip provided in this scheme further includes a detector 7 connected to the integrating sphere 5 and a spectrometer connected to the integrating sphere 5 through an optical fiber 6, where the detector 7 is used to test the brightness parameter of the LED chip 1; the spectrometer is used for converting the signal into an electrical signal and analyzing light with different wave bands. The testing device can also comprise a probe 10, a probe seat 9 and an edge finder 8 arranged on the probe seat 9, wherein the probe 10 is arranged on the edge finder 8. The edge finder 8 is used for carrying the probe 10 and adjusting the position and the pricking depth of the probe 10 by matching with the probe seat 9. The probe base 9 includes three sets of set screws for adjusting the position of the probe 10 in the front-back, left-right, and up-down directions, respectively. The probe 10 is in contact with an electrode at one end of the LED chip 1, an electrode at the other end of the LED chip 1 is in direct contact with the test carrier 2, and the test carrier 2 and the negative electrode of the test device have the same potential, so that the test of the LED chip can be realized.

The utility model provides a testing arrangement of LED chip can utilize the receipts light mouth 3 of integrating sphere 5 below to center on LED chip 1 in the test process for the light homoenergetic that LED chip 1's top surface and each side sent can be gathered by receiving light mouth 3, consequently, this scheme can improve the rate of receiving light of integrating sphere 5, reduces the test deviation, improves the test accuracy.

It should be noted that, in the present solution, the light receiving opening 3 may be arranged around the LED chip 1 through various implementation manners, for example, by connecting the LED chip 1 with the bent probe 10, the LED chip 1 may be located inside the light receiving opening 3 in the testing process; or a straight probe 10 is adopted, and a notch is formed in the side wall of the light receiving opening 3 for the probe 10 to rise, so that the LED chip 1 is positioned on the inner side of the light receiving opening 3 in the testing process; and so on. Preferably, the sidewall of the light receiving opening 3 of the present scheme is further provided with a probe slot 12 for the probe 10 to pass through, so that the probe 10 can extend into the inner side of the light receiving opening 3, so that the LED chip 1 is located in the inner side of the light receiving opening 3. Further preferably, the lower end of the probe slot 12 is opened to the lower end surface of the light receiving opening 3, as shown in fig. 3. The specific test process is as follows:

the LED chip 1 is fixedly placed on the test carrier 2, the probe 10 is correctly installed on the edge finder 8, then the probe 10 is lifted along the probe notch 12 from the lower part of the light receiving opening 3, the tail end of the probe 10 is positioned at the inner side of the light receiving opening 3, the test carrier 2 is operated to enable the LED chip 1 to move to a position to be tested at the inner side of the light receiving opening 3, the position and the needle pressure of the probe 10 are adjusted by the probe seat 9, and the optical test can be carried out after the probe 10 is adjusted to a proper position.

This scheme sets up probe notch 12 structure through the lateral wall at the light receiving port 3 of integrating sphere 5, can make probe 10 stretch into to light receiving port 3 inboardly, thereby the realization is placed LED chip 1 and is tested in light receiving port 3 inboardly, and then make the most light (as shown in fig. 1 and 2 light 4 that most light (shown in fig. 1 and 2) that all around the side sent that all light and the LED chip 1 top surface sent gather by integrating sphere 5, the light signal who guarantees that integrating sphere 5 collects more is close the light signal that LED chip 1 actually sent, the light receiving rate of integrating sphere has effectively been promoted, the test deviation has been reduced, the test accuracy has been improved.

It should be noted that the probe slot 12 formed on the side wall of the light receiving opening 3 of the integrating sphere 5 of the present invention can be designed as a straight slit type opening, or a rectangular opening, or a curved arc-shaped opening, etc. Preferably, for the convenience of processing and also for the convenience of operating the probe 10 to penetrate into the inner side of the light receiving port 3, the probe slot 12 is designed as a straight slit opening in the present scheme, as shown in fig. 3. In addition, the extending direction of the straight slit opening may be parallel to the height direction of the light receiving opening 3, or may be designed to be obliquely arranged with respect to the height direction of the light receiving opening 3, that is, the extending direction of the probe slot opening 12 and the height direction of the light receiving opening 3 form an acute included angle. The light receiving opening 3 is designed to be a cylindrical tubular structure, and the height direction of the light receiving opening 3 is also the axial direction of the light receiving opening 3. In this embodiment, the extending direction of the probe slot 12 is parallel to the height direction of the light receiving opening 3.

Preferably, the length of the probe slot 12 is greater than the vertical distance between the probe 10 and the lower end surface of the LED chip 1. So set up, just can make probe 10 further upwards promote along probe notch 12, correspondingly, LED chip 1 just can all stretch into the inboard of light-collecting opening 3 to further improve the rate of collection of integrating sphere 5.

In order to facilitate the processing of the light-receiving opening 3, the length of the probe slot 12 is preferably less than or equal to the height of the light-receiving opening 3. In a specific embodiment, the height of the light-receiving opening 3 is 18-22 mm, the diameter of the light-receiving opening 3 is 25-35 mm, and the length of the probe slot 12 is 14-16 mm.

Preferably, the width of the probe slot 12 is equal to or greater than the outer diameter of the probe 10, facilitating the up and down movement of the probe 10 within the probe slot 12. In the present embodiment, the width of the probe slot 12 is not suitable to be too large, since the light emitted from the LED chip 1 will first irradiate the inner wall of the light receiving opening 3, and in order to reduce the light leaking from the probe slot 12 and reduce the test deviation, the width of the probe slot 12 is designed to be 1-2 times of the probe outer diameter, and further preferably to be 1.6-2 times of the probe outer diameter, for example, the outer diameter of the probe 10 is 0.5mm, and the width of the probe slot 12 is preferably designed to be 0.8-1 mm.

Preferably, the test carrier 2 is provided with a fixing groove for being fixed in cooperation with the bottom of the LED chip 1. The fixed recess is as the chip template of fixed LED chip 1, and the degree of depth of fixed recess is about 0.01mm, makes LED chip 1 can not remove along the horizontal direction, guarantees that LED chip 1 can not rock in the test procedure, and the degree of depth of fixed recess is about 1/20 of LED chip 1 thickness simultaneously, stops the light that LED chip 1 side sent as little as possible to improve efficiency of software testing and test accuracy.

Preferably, the testing apparatus for an LED chip provided in this embodiment further includes a stage moving device 11 for moving the test stage 2, where the test stage 2 and the stage moving device 11 may be designed as an integrated structure, or as a separate structure. In this way, the position of test stage 2 can be freely moved by stage moving device 11, and LED chip 1 can be easily raised inside integrating sphere 5 for testing. When the probe 10 needs to be replaced, the test stage 2 can be lowered, and the probe 10 is driven by the lowering of the probe base 9 to move out of the probe slot 12 downwards, so that the probe 10 is replaced.

Preferably, the stage moving device 11 includes a lifting device for lifting and lowering the test stage and a horizontal moving device for horizontally moving the test stage. Specifically, the lifting device and the horizontal moving device can be realized by adopting a motor to drive a belt transmission mechanism or a gear transmission mechanism or adopting a motor driven by a servo motor and the like, and the scheme is not repeated.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The testing device for the LED chip is characterized by comprising an integrating sphere and a testing carrier used for fixing the LED chip, wherein a light receiving port which surrounds the LED chip and receives light emitted by the LED chip is arranged below the integrating sphere.

2. The device for testing the LED chip of claim 1, further comprising a probe, wherein a probe slot through which the probe passes is opened on a side wall of the light-receiving opening.

3. The device for testing LED chips according to claim 2, wherein the lower end of the probe slot is open to the lower end surface of the light-receiving opening.

4. The device for testing the LED chip of claim 2, wherein the probe slot is a straight slit opening, and the extending direction of the probe slot is parallel to the height direction of the light receiving opening or has an acute included angle.

5. The apparatus of claim 2, wherein the probe slot has a length greater than a vertical distance between the probe and a lower end surface of the LED chip.

6. The device for testing LED chips according to claim 2 or 5, wherein the length of the probe slot is less than or equal to the height of the light receiving opening.

7. The LED chip testing device of claim 1, wherein the height of the light-collecting opening is 18-22 mm.

8. The LED chip testing device of claim 2, wherein the length of the probe slot is 14-16 mm.

9. The apparatus for testing LED chips of claim 2, wherein the width of the probe slot is equal to or greater than the outer diameter of the probe.

10. The device for testing LED chips according to claim 9, wherein the width of the probe slot is 1.6-2 times the outer diameter of the probe.

11. The device for testing LED chips as defined in claim 9, wherein the width of the probe slot is 0.8-1 mm.

12. The device for testing LED chips according to claim 1, wherein the test carrier is provided with a fixing groove for fitting and fixing with the bottom of the LED chip.

13. The apparatus for testing LED chips of claim 1, further comprising stage moving means for moving said test stage.

14. The apparatus for testing LED chips of claim 13, wherein said stage moving means includes a lifting means for lifting and lowering said test stage and a horizontal moving means for horizontally moving said test stage.

15. The apparatus for testing LED chips of claim 1, further comprising a detector connected to said integrating sphere and a spectrometer connected to said integrating sphere through an optical fiber.

16. The apparatus for testing LED chips of claim 1, further comprising a probe base and an edge finder disposed on the probe base, wherein the edge finder has a probe mounted thereon.