CN213686277U

CN213686277U - Lamp with electric-conduction heat-conduction radiating substrate

Info

Publication number: CN213686277U
Application number: CN202021842815.1U
Authority: CN
Inventors: 不公告发明人
Original assignee: Cai Xiongchuang
Current assignee: Cai Xiongchuang
Priority date: 2019-08-30
Filing date: 2020-08-28
Publication date: 2021-07-13
Anticipated expiration: 2030-08-28

Abstract

The utility model relates to a lamps and lanterns with electrically conductive heat conduction heat dissipation base plate, it includes whole base plate and lamps and lanterns bulb, this lamps and lanterns bulb has a sealed chamber, this whole base plate sets up in this sealed chamber, several base plates connect into this whole base plate through insulating connector, each this base plate all includes light source fixed part and heat conduction heat dissipation part, this light source fixed part of several links together with this heat conduction heat dissipation part of several and forms this base plate, be provided with the LED light source on this light source fixed part, this heat conduction heat dissipation part is leaned on and pastes on the internal surface of glass bulb wall, this lamps and lanterns bulb includes this glass bulb wall and glass bulb inner wall, this internal surface with the help of this glass bulb wall and the surface of this glass bulb inner wall around forming this sealed chamber, this LED light source circular telegram is luminous, light shines away through this glass bulb wall, the heat that this base plate work produced distributes away for lamps and lanterns bulb wall through this heat conduction heat dissipation part and see through this glass bulb wall And (6) dissipating heat.

Description

Lamp with electric-conduction heat-conduction radiating substrate

Technical Field

The utility model relates to a lamp, in particular to a lamp which is provided with a LED light source and has the functions of electric conduction, heat conduction and heat dissipation.

Background

As is well known, with the further market withdrawal of incandescent lamps, the demand of LED filament lamps at home and abroad is more and more, and as the LED filament lamps have the large-angle luminous form of the traditional incandescent lamps which are familiar to people, the LED filament lamps are popular for application groups with the ancient style, so that the LED filament lamps which grow like the incandescent lamps find the depressions for the application. Since the manufacturing process of the LED filament lamp is similar to that of the incandescent lamp, it is a simple matter to turn the production of the LED filament lamp into the application field for the lighting manufacturers who are engaged in the manufacturing of the incandescent lamp. As LED filament lamps move from theoretical to realistic lighting products, the demand will expand increasingly from decorative applications to functional lighting applications.

However, in terms of technical composition, because the filament of the filament lamp is in a closed environment, and the area of the substrate of the LED filament is too small, under the requirements of small light attenuation and long service life, the heat dissipation in practical application is difficult to achieve ideal design requirements, the power cannot be improved all the time, and the maximum power can only wander between 6 and 8 watts at present; another disadvantage of the existing LED filament lamp is that because the heat dissipation area needs to be enlarged, the length of the filament is long, so that full-circle light is difficult to achieve structurally; in addition, because the light-emitting surface is large, the emitted light intensity can not achieve the effect of the traditional incandescent lamp, and the LED filament lamp can not well replace the incandescent lamp in many occasions.

The defects of the existing LED filament lamp are as follows: 1. the length of the transparent substrates such as sapphire and glass with light emitting from both sides is long, the light mainly faces the peripheral direction, and the light is dark under the lamp. 2. The soft aluminum substrate emits light on one side, namely, the main light also faces the periphery, and the light on the upper surface and the lower surface is weaker.

The existing LED filament lamp with double-sided light emitting and single-sided light emitting has a problem that the limited substrate can not achieve the purpose of heat dissipation, and the substrate is made of sapphire, glass, aluminum, FPC and the like, and the wavelength of infrared rays radiated by the materials heated is more than 8 mu m, which belongs to middle and far infrared radiation; the glass of the filament lamp glass bulb shell is common soda-lime glass; the formula for the vibration frequency (eigenfrequency) of a substance is determined by the magnitude of the mechanical constants and the atomic weight, the glass forming oxides such asNa₂O·CaO·6SiO₂Or Na₂SiO₃、CaSiO₃、SiO₂The natural frequency is large, and the natural frequency can not transmit middle and far infrared rays, only can transmit near infrared rays, and can transmit near infrared short wave with the wavelength below 2.5 mu m, visible light and ultraviolet light. Therefore, the heat of the filament of the common filament lamp cannot be directly transmitted out of the glass shell, and can be transmitted to the outer surface of the limited glass through the gas and the glass with lower heat conduction only, and then is taken away by the air, so that the heat dissipation efficiency is poor, which is a main defect of the traditional technology.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical scheme who adopts does: a lamp with an electric, heat and radiation substrate is characterized in that: including whole base plate and lamps and lanterns bulb, this lamps and lanterns bulb has a sealed chamber, this whole base plate sets up in this sealed chamber, several base plates connect into this whole base plate through insulating connector, each this base plate all includes light source fixed part and heat conduction heat dissipation part, several this light source fixed part and several this heat conduction heat dissipation part link together and form this base plate, be provided with the LED light source on this light source fixed part, this heat conduction heat dissipation part is by pasting on the internal surface of glass bulb wall, this lamps and lanterns bulb includes this glass bulb wall and glass bulb inner wall, surround with the help of this internal surface of this glass bulb wall and the surface of this glass bulb inner wall and form this sealed chamber.

The utility model has the advantages that: the light source fixing parts and the heat-conducting and radiating parts of the utility model are connected together to form the base plate. The light source fixing part is provided with an LED light source. The LED light source can be an LED lamp bead, an LED light-emitting chip or other light sources. The substrate is arranged in a bulb of a lamp, and the heat-conducting and heat-dissipating part is attached to the inner surface of the wall of the glass bulb. The LED light source is electrified to emit light, light rays irradiate out through the glass bulb wall, and at the moment, heat generated by the work of the substrate is mainly emitted out through the heat conduction and dissipation part and the glass bulb wall in a heat radiation mode so as to achieve the effect of dissipating heat of the lamp. In practice, the intensity of thermal radiation is inversely proportional to the square of distance, the utility model discloses well adoption can make the distance between this base plate and this glass bulb wall dwindle to the shortest with this heat conduction radiating part direct mode of leaning on the internal surface of glass bulb wall to promote the radiation heat dissipation efficiency, thereby promote the radiating efficiency of whole lamps and lanterns. The utility model discloses in work, the produced most heat of this LED light source circular telegram luminous its work is directly conducted to this heat conduction heat dissipation part in, then distributes away the heat mainly with the form of heat radiation by this heat conduction heat dissipation part through this glass bulb wall.

Drawings

Fig. 1 is a front view of the base plate of the present invention.

Fig. 2 is a schematic structural diagram of the substrate of the present invention and a partial enlarged view thereof.

Fig. 3 is a schematic view of the substrate disposed in the bulb and a partial enlarged view thereof.

Fig. 4 is a schematic view of the bulb of the present invention.

Fig. 5 is a schematic view of the integrated substrate of the present invention.

Fig. 6 is a schematic view of the front fixing film of the present invention.

Fig. 7 is a schematic view of the back fixing film of the present invention.

Fig. 8 is a schematic view of the lamp of the present invention and a partial enlarged view thereof.

Fig. 9 is a schematic view of the heat conducting pillar of the present invention and a partial enlarged view thereof.

Fig. 10 is a schematic diagram of the spiral current forming the magnetic field of the light bar of the present invention.

Fig. 11 is a schematic view of the fan installed in the bulb of the present invention.

Fig. 12 is a schematic view of the lamp of the present invention being manufactured in a bulb shape.

Fig. 13 is a front view of another embodiment of the substrate of the present invention.

Fig. 14 is a cross-sectional view of another embodiment of the substrate of the present invention.

Fig. 15 is a front view of another embodiment of the substrate of the present invention.

Fig. 16 is a cross-sectional view of another embodiment of the substrate of the present invention.

Fig. 17 is a cross-sectional view of an embodiment of the present invention as a street light source.

Detailed Description

As shown in fig. 1 to 7, a substrate 500 with electrical, thermal, and heat dissipation functions includes a light source fixing portion 510 and a thermal, heat dissipation portion 520.

A plurality of the light source fixing portions 510 and a plurality of the heat conductive and dissipating portions 520 are coupled together to form the substrate 500.

In one embodiment, the light source fixing portion 510 is spaced apart from the heat conducting and dissipating portion 520, that is, one heat conducting and dissipating portion 520 is connected between two light source fixing portions 510, and one light source fixing portion 510 is connected between two heat conducting and dissipating portions 520.

The light source fixing portion 510 is provided with an LED light source 530.

The LED light source 530 may be an LED lamp bead, an LED light emitting chip, or other light source.

The substrate 500 is disposed in a lamp bulb of a lamp, and the heat-conducting heat-dissipating portion 520 is attached against an inner surface 610 of a glass bulb wall 600.

The LED light source 530 is turned on to emit light, and light is radiated through the glass bulb wall 600, and at this time, heat generated by the operation of the substrate 500 is mainly radiated through the heat-conducting heat-radiating portion 520 and through the glass bulb wall 600 in the form of heat radiation to radiate heat of the lamp.

In practice, the intensity of thermal radiation is inversely proportional to the square of distance, the utility model discloses in adopt this heat conduction heat dissipation portion 520 directly to lean on the mode of pasting on the internal surface 610 of glass bulb wall 600 can make the distance between this base plate 500 and this glass bulb wall 600 dwindle to the shortest to promote the radiation heat dissipation efficiency, thereby promote the radiating efficiency of whole lamps and lanterns.

The utility model discloses in the during operation, the produced most heat of this LED light source 530 circular telegram luminous its work is directly conducted to this heat conduction radiating part 520, and then mainly see through this glass bulb wall 600 with the heat with the form of heat radiation by this heat conduction radiating part 520 and distribute away.

In a specific implementation, the LED front-mounted chip directly disposed on the substrate 500 can also meet the above-mentioned heat dissipation requirement.

The light source fixing portion 510 has a fixing top surface 511, the LED light source 530 is disposed on the fixing top surface 511, the fixing top surface 511 is a reflective surface, a part of light emitted by the LED light source 530 directly irradiates through the glass bulb wall 600, and a part of light is reflected by the inner surface 610 of the glass bulb wall 600, finally reflected by the reflective surface and irradiates through the glass bulb wall 600.

The heat-conducting heat-dissipating portion 520 has a contact top surface 521, a plurality of contact ribs 522 are protruded on the contact top surface 521, and the plurality of contact ribs 522 contact the inner surface 610 of the glass bulb wall 600, so as to realize the function that the heat-conducting heat-dissipating portion 520 abuts against the inner surface 610 and dissipates heat.

Meanwhile, when the substrate 500 is integrally bent and placed in a bulb, the plurality of contact ribs 522 also have a function of ensuring a bending effect.

In one embodiment, as shown in fig. 4, the glass bulb wall 600 has a straight tubular shape, the inner surface 610 has a tubular shape, and a plurality of the heat-conducting and heat-dissipating portions 520 simultaneously abut against the tubular inner surface 610.

As shown in fig. 2, in an implementation, a near infrared radiation layer 13 is disposed on the contact top surface 521 of the heat conductive and dissipating portion 520.

It is noted that, at this time, the near-infrared radiation layer 13 is not disposed on the top of the contact rib 522, because the radiation material layer has a certain thermal resistance, which in turn affects the contact between the contact rib 522 and the inner surface 610 and affects the thermal conductivity.

In particular implementation, as shown in fig. 2, a radiation reflecting layer 540 is disposed on the bottom surface of the substrate 500.

The radiation reflecting layer 540 may be a silver plated layer or other reflecting layer, with silver being a low radiation layer that does not pull down the effective front radiation temperature.

A portion of the heat radiation generated by the substrate 500 is directly radiated through the glass bulb wall 600, and another portion is reflected by the radiation reflective layer 540 and then radiated through the glass bulb wall 600.

In practice, the intensity of thermal radiation is proportional to the fourth power of the temperature: (273 ° + X)⁴Wherein X is temperature.

The radiation reflecting layer 540 is configured to enable a majority of the thermal radiation generated by the substrate 500 to radiate outward from the top of the substrate, and at this time, the temperature at the top of the substrate 500 is much higher than the temperature below the bottom of the substrate, so that the radiation rate of the substrate 500 outward from the top is stronger, and the cycle is such that the thermal radiation generated by the substrate 500 is radiated out through the glass bulb wall 600 directly and efficiently.

In practice, the radiation reflecting layer 540 is disposed on the bottom surfaces of the heat conductive and radiating portion 520 and the light source fixing portion 510.

As shown in fig. 5, it is another structural form of the substrate 500 of the present invention. Wherein the arrow direction is the overall bending direction, and the glass bulb is integrally placed in the glass bulb wall 600 after bending.

In one embodiment, a plurality of the substrates 500 are connected to a single substrate by the insulating connectors 700.

As shown in fig. 3, the integrated substrate is disposed in a lamp bulb, and the heat-conducting and heat-dissipating portions 520 of each of the substrates 500 constituting the integrated substrate are attached to the inner surface 610 of the glass bulb wall 600.

As shown in fig. 3, each of the substrates 500 is provided with a spring portion 550, and when the substrate 500 is bent, the spring portion 550 can apply a resilient force to the substrate 500, so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

When the glass bulb wall 600 has a straight tubular shape and the inner surface 610 has a tubular shape, the striking portion 550 is provided at the rear end portion of the base plate 500,

when the substrate 500 is bent into a ring shape, the pressing portion 550 presses the front end portion of the substrate 500, so that the heat conducting and dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 having a tubular shape.

In one embodiment, the insulating connector 700 includes a front fixing film 710 and a rear fixing film 720.

The front fixing film 710 is attached to the front surface of the integrated substrate, and the back fixing film 720 is attached to the back surface of the integrated substrate.

As shown in fig. 6, the front fixing film 710 has a light source window 711 and an infrared radiation window 712.

As shown in fig. 7, the back fixing film 720 is provided with a reflective window 721 and a lamp bead back radiation window 722.

The fixing top surface 511 of the light source fixing portion 510 and the LED light source 530 are in the light source window 711.

The contact top surface 521 of the heat conductive heat dissipation portion 520 and the near infrared radiation layer 13 thereon are in the infrared radiation window 712.

The radiation reflecting layer 540 on the bottom surface of the substrate 500 is in the reflective window 721.

The bottom surface of the light source-holding portion 510 is in the lamp bead rear radiation window 722.

In a specific implementation, the front fixing film 710 is a white fixing film to improve the light reflection effect of the LED light source 530.

In one embodiment, the lamp bulb is filled with a heat-dissipating gas, such as helium, argon, or the like.

The heat of the integrated substrate is mainly radiated through the light-emitting front surface of the integrated substrate, and the heat generated by the back surface of the integrated substrate is conducted out through the heat dissipation gas.

As shown in fig. 1 to 12, another embodiment of the present invention is as follows.

As shown in fig. 8, a lamp with heat conductive and heat dissipating substrates includes an integrated substrate and a lamp bulb, the lamp bulb has a sealed cavity 100, the integrated substrate is disposed in the sealed cavity 100, and a plurality of substrates 500 are connected to form the integrated substrate through an insulating connector 700.

As shown in fig. 1 to 7, each of the substrates 500 includes a light source fixing portion 510 and a heat conductive and dissipating portion 520.

The light source fixing portion 510 is provided with an LED light source 530.

The heat-conducting heat-dissipating portion 520 abuts against the inner surface 610 of the glass bulb wall 600.

As shown in fig. 8, the lamp bulb comprises the glass bulb wall 600 and a glass bulb inner wall 800, and the sealed cavity 100 is formed by the inner surface 610 of the glass bulb wall 600 and the outer surface of the glass bulb inner wall 800.

In practice, the square inverse ratio of intensity and distance of thermal radiation, the utility model discloses in adopt this heat conduction heat dissipation part 520 directly to lean on the mode of pasting on the internal surface 610 of glass bulb wall 600 can make the distance between this base plate 500 and this glass bulb wall 600 dwindle to the shortest to promote the radiant heat dissipation efficiency, thereby promote the radiating efficiency of whole lamps and lanterns, the utility model discloses in work, the most heat that this LED light source 530 circular telegram luminous its work produced is directly conducted to this heat conduction heat dissipation part 520, then is distributed away through this glass bulb wall 600 with the heat mainly with the form of thermal radiation by this heat conduction heat dissipation part 520.

In practice, a near infrared radiation layer 13 is disposed on the contact top surface 521 of the heat conductive and dissipating portion 520.

The near-infrared radiation layer 13 is also provided on the bottom surface of the substrate 500.

In an implementation, each of the substrates 500 is provided with a pressing portion 550, and when the substrate 500 is bent, the pressing portion 550 can apply an elastic force to the substrate 500, so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

When the glass bulb wall 600 is a straight tube and the inner surface 610 is a tube, the pressing portion 550 is disposed at the rear end of the substrate 500, and when the substrate 500 is bent into a ring shape, the pressing portion 550 presses against the front end of the substrate 500, so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 tightly adheres to the inner surface 610 having a tube shape.

In an implementation, the insulating connector 700 includes a front fixing film 710 and a back fixing film 720, wherein the front fixing film 710 is attached to the front surface of the integrated substrate, and the back fixing film 720 is attached to the back surface of the integrated substrate.

The front fixing film 710 is provided with a light source window 711 and an infrared radiation window 712, and the back fixing film 720 is provided with a lamp bead back radiation window 722.

The near infrared radiation layer 13 on the contact top surface 521 of the heat conductive and radiating portion 520 is in the infrared radiation window 712.

The near infrared radiation layer 13 on the bottom surface of the substrate 500 is located in the radiation window 722 on the back of the lamp bead.

In practice, the capsule 100 is filled with a heat-dissipating gas, such as helium, argon, etc.

In practical applications, the near infrared radiation layer 13 may be made of various materials, for example, a mixed material of nickel oxide 60 wt%, cobalt oxide 30 wt%, and iron oxide 10 wt%.

When the substrate 500 works, the LED light source 530 is powered on to emit light, heat generated by the work is conducted to the near-infrared radiation layer 13, and the near-infrared radiation layer 13 radiates the heat outwards in a near-infrared short wave manner, so that the substrate 500 is cooled and the working temperature of the substrate 500 is reduced.

The lamp further includes a heat-radiating pillar 20, and the heat-radiating pillar 20 corresponds to the near-infrared radiation layer 13 on the bottom surface of the substrate 500.

The heat-radiating pillars 20 are used to absorb the short near-infrared waves emitted from the near-infrared radiation layer 13.

During operation, the near-infrared radiation layer 13 radiates heat outwards in the form of near-infrared short waves, and at the moment, the heat-inducing columns 20 absorb the near-infrared short waves, and meanwhile, the heat is radiated outwards by the heat-inducing columns 20, so that the effect of radiating the lamp is achieved.

An infrared absorption layer 21 is disposed on the outer surface of the heat-inducing pillars 20, the infrared absorption layer 21 corresponds to the near-infrared radiation layer 13 on the bottom surface of the substrate 500, and the infrared absorption layer 21 is used for absorbing the near-infrared short wave emitted from the near-infrared radiation layer 13.

In practical applications, the absorption rate of the infrared absorption layer 21 is controlled to be greater than 90%, and the emission rate is less than 20%, and the infrared absorption layer 21 may be formed by mixing various materials, for example, three powders, i.e., 60% nickel oxide, 30% cobalt oxide, and 10% iron oxide, by weight.

An aerogel layer 22 is also disposed on the outer surface of the heat-radiating column 20, and the aerogel layer 22 is disposed between the outer surface of the heat-radiating column 20 and the infrared absorption layer 21.

In operation, the infrared absorbing layer 21 absorbs the short near infrared waves emitted from the near infrared radiation layer 13, and at this time, heat is dissipated outward through the inner surface of the other side of the heat-radiating pillars 20 by means of the aerogel layer 22.

The aerogel (SiO _2 aerogel) making up the aerogel layer 22 has very low thermal conductivity due to its fine nano-porous structure, and pure aerogel is almost transparent to near-infrared wavelengths below 8 μm), when the heat generated after the near-infrared passes is absorbed by the black body substance whose eigenband is greater than 8um, the wavelength radiated after heating is greater than 8um, and is blocked by the aerogel, and the very poor thermal conductivity of the aerogel is 0.013W/m.k, the heat can only radiate out of the lamp from the inner surface of the heat-inducing column 20.

In specific implementation, the air around the heat-conducting column 20 flows to improve the heat-dissipating efficiency of the heat-conducting column 20 and improve the heat-dissipating effect of the lamp.

In practice, the glass bulb wall 600 and the glass bulb inner wall 800 are made of quartz or infrared glass.

The quartz or infrared glass allows near infrared, middle infrared and infrared reflected from the glass to pass therethrough, and the transmitted near infrared is absorbed by the heat-radiating pillars 20.

In one embodiment, the inner glass bulb wall 800 is an inner glass tube and the wall 600 is an outer glass tube.

The sealed cavity 100 is formed by the outer surface of the inner glass sleeve and the inner surface of the outer glass sleeve.

A ventilation and heat dissipation cavity 150 is formed by surrounding the inner surface of the glass inner sleeve, and the heat conducting column 20 is arranged in the ventilation and heat dissipation cavity 150.

The ventilation and heat dissipation chamber 150 includes an air inlet 151 and an air outlet 152.

The air inlet 151 and the air outlet 152 are respectively located at two ends of the lamp.

The air inlet 151 is located at the lamp holder, and the air outlet 152 is located at the front end of the lamp.

In one embodiment, the integral substrate is positioned around the heat-directing pins 20.

The monolithic substrate and the heat-radiating fins 20 are both tubular.

The integrated substrate is powered on to emit light, a spiral current 15 is formed by a current flowing in the integrated substrate along the spiral direction of the integrated substrate, a light bar magnetic field 16 is formed by the spiral current 15, the light bar magnetic field 16 is located in the ventilation and heat dissipation cavity 150, the heat-radiating column 20 is located in the light bar magnetic field 16, and the heat-radiating efficiency of the heat-radiating column 20 is improved by means of the light bar magnetic field 16.

Specifically, various optical phenomena caused by interaction of light (infrared light) with a substance in a magnetized state include a faraday's magneto-optical effect, a koton-mooton effect, a kerr magneto-optical effect, and the like. These effects all originate from the magnetization of the substance.

Which reflects the relationship between light and the magnetism of a substance. When light propagates in a medium, if a strong magnetic field is applied in a direction parallel to the propagation direction of the light, the vibration direction of the light is deflected, the deflection direction depends on the properties of the medium and the direction of the magnetic field, which is called a magneto-optical rotation effect, the energy level of the electromagnetic wave due to the external magnetic field is reduced, the heat required by the substrate for infrared radiation is reduced, and the radiation intensity is enhanced at the same temperature.

As shown in fig. 11, in the implementation, a fan 155 is disposed in the ventilation and heat dissipation chamber 150 to improve heat dissipation efficiency.

In practice, the heat-inducing column 20 may be tubular, conical, etc. As shown in fig. 12, the lamp of the present invention can also be made in a bulb shape.

As shown in fig. 13-16, is an additional embodiment of the present invention.

A substrate with heat conducting and dissipating functions comprises a light source region 910 and a heat conducting and dissipating region 920.

A plurality of the light source regions 910 are disposed on the substrate.

In an implementation, the heat conducting and dissipating area 920 is located between two adjacent light source areas 910, the light source areas 910 may be disposed on a surface of the substrate, and the light source areas 910 may also be disposed in the substrate.

The light source region 910 has an LED light 930 disposed therein.

The substrate is disposed in the bulb of the lamp and the thermally conductive and heat dissipating region 920 is against the inner surface of the wall of the glass bulb.

The LED luminary 930 is powered on to emit light, and light is radiated through the glass bulb wall, at this moment, heat generated by the substrate working is mainly radiated through the heat conducting and radiating area 920 and through the glass bulb wall in a form of thermal radiation, so as to achieve the effect of radiating the light.

As shown in fig. 13-14, the LED luminary 930 is a front-mounted LED light emitting chip, and in practice, several front-mounted LED light emitting chips can be simultaneously arranged in the light source region 910.

In one implementation, a reinforcing plate 911 may be disposed below the light source region 910.

As shown in fig. 15-16, the LED luminary 930 is an LED light bar and the light source region 910 is a through-slot.

The LED light bar is connected to the substrate, and an LED light source on the LED light bar is located in the through groove.

At this moment, the whole substrate can be designed as a temperature equalizing plate, such as a thick copper plate, or a plate body provided with a temperature equalizing material layer.

The other structures of the substrate in the embodiment shown in fig. 13-16 are the same as those in fig. 1-12 and will not be described again here.

In addition, it is worth emphasizing that the direct replacement of led standard light sources for traditional high-pressure sodium lamps and metal halide light sources is always a goal pursued by led developers, and the direct replacement cannot be realized due to the fact that the power is large, the heat generation amount is large, the size is limited, and the radiating surface is not enough. Particularly, because the lamp housings of the traditional high-pressure sodium lamps and the traditional street lamps with ceramic metal halide lamp light sources are already accommodated in the urban road landscape, the traditional LED street lamps need to be replaced by the traditional LED street lamps, firstly, the replacement cost is high, and secondly, the appearance cannot be designed at will due to the influence of heat dissipation design.

At present, the general practice is to set up filament lamp strip at glass central zone and pass to glass by helium again, because the conductivity coefficient of helium is extremely low (0.2W/c.m), makes the chip to glass's the difference in temperature great (about 40 degrees or so), and when glass's temperature was 60 degrees, the temperature of chip had reached or exceeded 100 degrees, in order to dwindle this difference in temperature, the utility model discloses a design thinking can be with the nearly possible glass wall of pressing close to of the base plate of light source, preferably again by high heat-conducting medium filling, directly transmits heat for glass. The emissivity coefficient of glass is high-emissivity material up to 0.94, and the radiation intensity is proportional to the 4 th power of the black body temperature according to boltzmann's radiation law. The temperature of the glass is close to 100 ℃ under the condition of being tightly attached to the glass, the heat radiation is improved by nearly 1 time, namely the power can be improved by nearly 1 time under the condition of the same chip temperature, and the specific design idea is as follows.

As shown in fig. 17, the street lamp bulb shown in fig. 17 is manufactured by using the substrate shown in fig. 13 to 16, and the whole bulb can be in a shape of a circle, an ellipse, a flat plate, and the like.

The outer surface of the glass bulb wall 600 may be roughened, and the heat conducting and dissipating area 920 may be attached to the inner surface 610 of the glass bulb wall 600.

The surface of the light source region 910 may be provided with a reflective layer to reflect the light of the LED light 930.

In addition, a near infrared radiation layer 13 may be disposed on the back of the light source region 910.

The back surface of the heat conductive and radiating region 920 may be provided with an infrared absorption layer 21.

The near-infrared radiation layer 13 can radiate heat in the manner described above in this document.

In practice, a portion of the heat radiated by the radiation layer 13 is reflected, a portion is absorbed by the top absorbing coating and dissipated, and another portion is conducted to the walls of the glass bulb of the substrate and dissipated by the filled helium gas.

Claims

1. A lamp with an electric, heat and radiation substrate is characterized in that: comprises an integral substrate and a lamp bulb, wherein the lamp bulb is provided with a sealed cavity, the integral substrate is arranged in the sealed cavity, a plurality of substrates are connected into the integral substrate through an insulating connector,

each substrate comprises a light source fixing part and a heat conduction and dissipation part, a plurality of light source fixing parts and a plurality of heat conduction and dissipation parts are connected together to form the substrate,

the light source fixing part is provided with an LED light source, the heat conduction and dissipation part is attached to the inner surface of the wall of the glass bulb,

the lamp bulb comprises the glass bulb wall and a glass bulb inner wall, and the sealed cavity is formed by surrounding the inner surface of the glass bulb wall and the outer surface of the glass bulb inner wall.

2. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1, wherein: the light source fixing part is provided with a fixing top surface, the LED light source is arranged on the fixing top surface, the fixing top surface is a reflecting surface,

the heat-conducting heat-dissipating part is provided with a contact top surface, a plurality of contact ribs are convexly arranged on the contact top surface, and the contact ribs are contacted with the inner surface of the glass bulb wall.

3. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1 or 2, wherein: the near-infrared radiation layer is disposed on the bottom surface of the substrate.

4. A lamp as claimed in claim 3, wherein: the insulating connector comprises a front fixing film and a back fixing film, wherein the front fixing film is adhered on the front surface of the integrated substrate, the back fixing film is adhered on the back surface of the integrated substrate,

the front fixing film is provided with a light source window, the back fixing film is provided with a lamp bead back radiation window, the fixing top surface of the light source fixing part and the LED light source are positioned in the light source window, and the near infrared radiation layer on the bottom surface of the substrate is positioned in the lamp bead back radiation window.

5. A lamp as claimed in claim 3, wherein: the lamp further comprises a heat-conducting column, and the heat-conducting column corresponds to the near-infrared radiation layer on the bottom surface of the substrate.

6. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 5, wherein: an infrared absorption layer is arranged on the outer surface of the heat-leading column, an aerogel layer is further arranged on the outer surface of the heat-leading column, and the aerogel layer is arranged between the outer surface of the heat-leading column and the infrared absorption layer.

7. A lamp as claimed in claim 3, wherein: a ventilation and heat dissipation cavity is formed by surrounding the inner wall of the glass bulb and comprises an air inlet and an air outlet.

8. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 5, wherein: the integral substrate is arranged around the heat-conducting column in a surrounding mode, the integral substrate is electrified to emit light, current flowing in the integral substrate forms a spiral current along the spiral direction of the integral substrate, the spiral current forms a lamp strip magnetic field, the lamp strip magnetic field is located in the ventilation and heat dissipation cavity, and the heat-conducting column is located in the lamp strip magnetic field.

9. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 7, wherein: the ventilation and heat dissipation cavity is internally provided with a fan.

10. A lamp having an electrically, thermally, and thermally conductive substrate as claimed in claim 1 or 2, wherein: each of the substrates is provided with a spring portion.