CN213638708U - Heat radiator for PCIE interface private network module - Google Patents
Heat radiator for PCIE interface private network module Download PDFInfo
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- CN213638708U CN213638708U CN202022791484.XU CN202022791484U CN213638708U CN 213638708 U CN213638708 U CN 213638708U CN 202022791484 U CN202022791484 U CN 202022791484U CN 213638708 U CN213638708 U CN 213638708U
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- fan
- private network
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- 239000003990 capacitor Substances 0.000 claims description 16
- 230000005669 field effect Effects 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Abstract
The utility model relates to a heat dissipation device of a PCIE interface private network module, which comprises a heat radiator, a temperature control circuit, a fan, a PCIE interface private network module and a heat conduction rubber cushion; one side of the heat-conducting rubber pad is attached to the shielding cover of the PCIE interface private network module, the other side of the heat-conducting rubber pad is attached to one end face of the radiator, the fan is fixed in a groove in the middle of the other end face of the radiator through four studs, and the temperature control circuit is fixed in a groove of the radiator on one side of the fan. The utility model discloses the technical effect who produces is: originally, do not take heat abstractor's equipment, at long-time work, the disconnected net phenomenon appears occasionally, installs the utility model discloses a behind the heat abstractor, no matter be in the normal operational environment or the high temperature environment that possess the air conditioner, equipment all can work steadily for a long time, has greatly improved communication equipment's reliability.
Description
Technical Field
The utility model relates to an electronic circuit field particularly, relates to a heat abstractor of PCIE interface private network module for among the LTE communication system, solve the heat dissipation problem of LTE communication system core component LTE module.
Background
The modern subway wireless communication widely adopts a private network module based on a Mini PCI Express interface (namely a PCIE interface), so that multimode wireless internet access can be realized, and digital communication between mobile equipment and the ground is realized. The private network module based on the Mini PCI Express interface has strong functions, high component density and large heat productivity, and if the heat dissipation problem cannot be solved well, the working performance of the module is influenced, even the module stops working due to overhigh temperature rise, so that the heat dissipation problem is solved very importantly.
At present, the commonly adopted heat dissipation measure for the module is a radiator with natural convection heat dissipation or simple installation, and the problem of module heat dissipation is not ideal.
Disclosure of Invention
In view of the not enough of current heat dissipation scheme existence, the utility model provides a heat abstractor of PCIE interface private network module, the purpose is to the communication system that most used PCIE interface private network module, especially to the great module of consumption, can solve the problem of LTE module temperature rise well, guarantees its normal work.
The utility model discloses a realize above-mentioned purpose, the technical scheme who adopts is: a heat abstractor of PCIE interface private network module which characterized in that: the device comprises a radiator, a temperature control circuit, a fan, a PCIE interface private network module and a heat-conducting rubber pad;
one side of the heat-conducting rubber pad is attached to a shielding cover of the PCIE interface private network module, the other side of the heat-conducting rubber pad is attached to one end face of the radiator, the fan is fixed in a groove in the middle of the other end face of the radiator through four studs, and the temperature control circuit is fixed in a radiator groove on one side of the fan;
the temperature control circuit comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected in series between a power supply and the ground, the junctions of the resistor R1 and the resistor R2 are respectively connected with the pin 5 of the non-inverting input end of the operational amplifier N1 and one end of the resistor R5 and one end of the capacitor C3, the resistor R3, the resistor R4 and the negative temperature coefficient thermistor RT1 are connected in series between the power supply and the ground, the junction of the resistor R3 and the resistor R4 is connected with the pin 6 of the inverting input end of the operational amplifier N1, the pin 7 of the output end of the operational amplifier N1 is respectively connected with one end of the resistor R6 and the other end of the resistor R5, the other end of the resistor R5 is respectively connected with one end of the resistor R5 and the grid of the field effect transistor VT 5, the drain of the field effect transistor VT 5, the positive pole of the switch diode VD 5 and the negative pole of the fan are connected together, the positive pole of the fan and the positive pole of the power supply and the diode VD 5, the negative pole of the capacitor C5 and the capacitor C5 are, The other end of the resistor R2 and the resistor R7 are grounded with the pin 4 of the grounding end of the operational amplifier N1 and the source of the field effect transistor VT1 respectively.
The utility model discloses the technical effect who produces is:
originally, do not take heat abstractor's equipment, at long-time work, the disconnected net phenomenon appears occasionally, installs the utility model discloses a behind the heat abstractor, no matter be in the normal operational environment or the high temperature environment that possess the air conditioner, equipment all can work steadily for a long time, has greatly improved communication equipment's reliability.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view A-A of the structure of FIG. 1;
fig. 3 is a schematic diagram of the temperature control circuit of the present invention.
Fig. 4 is a usage state diagram of the present invention.
The specific implementation mode is as follows:
as shown in fig. 1, fig. 2, and fig. 3, a heat dissipation device for a PCIE interface private network module includes a heat sink 1, a temperature control circuit 2, a fan 3, a PCIE interface private network module 4, and a heat conductive rubber pad 5;
taking a heat-conducting rubber pad 5 with the size of 30 multiplied by 48mm, attaching one surface of the heat-conducting rubber pad 5 to a shielding cover of a PCIE interface private network module 4, attaching the other surface of the heat-conducting rubber pad 5 to one end surface of a radiator 1, fixing a fan 3 in a groove in the middle of the other end surface of the radiator 1 through four studs, and fixing a temperature control circuit 2 in the groove of the radiator 1 on one side of the fan 3;
the temperature control circuit 2 comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected between a power supply and the ground in series, the junctions of the resistor R1 and the resistor R2 are respectively connected with the pin 5 of the non-inverting input end of the operational amplifier N1, one end of the resistor R5 and one end of the capacitor C3, the resistors R3, R4 and the negative temperature coefficient thermistor RT1 are connected between the power supply and the ground in series, the junction of the resistor R3 and the resistor R4 is connected with the pin 6 of the inverting input end of the operational amplifier N1, the pin 7 of the output end of the operational amplifier N1 is respectively connected with one end of the resistor R1 and the other end of the resistor R1, the other end of the resistor R1 is respectively connected with one end of the resistor R1 and the grid of the field-effect tube VT1, the drain of the field-effect tube VT1 is respectively connected with the positive pole of the switch diode VD1 and the negative pole of the fan 3, the negative pole of the switch diode VD1 is connected with the power supply and the positive pole of the fan 3, the power supply, the pin 8 of the operational amplifier N, The other end of the resistor R7 is grounded to the ground terminal 4 pin of the operational amplifier N1 and the source of the field effect transistor VT1, respectively.
As shown in fig. 4, a method for implementing a heat dissipation device of a PCIE interface private network module includes the following steps:
fixing the heat dissipation device on a chassis bottom plate 7 of radio frequency transceiver equipment in a 4G and 5G communication system through a printed board 6, and pressing a heat conduction rubber pad 5;
the whole heat dissipation device is divided into 2 parts: a conductive heat dissipation part and a forced air cooling heat dissipation part;
the PCIE interface private network module 4 generates a large amount of heat due to large power consumption in the working process, a shielding cover is welded outside the whole PCIE interface private network module 4, the heat generated by a heating device is conducted to the shielding cover through heat conducting glue inside the PCIE interface private network module 4 and then conducted to the radiator 1 through a heat conducting glue pad 5, the heat is radiated by the radiator 1, a temperature control circuit 2 and a fan 3 are also arranged in a groove of the radiator 1, the temperature control circuit 2 detects the temperature of the radiator 1, when the temperature is higher than 50 ℃, the fan 3 is started to forcibly supply air to the radiator 1 for radiating, and the fan stops running until the temperature of the radiator 1 is lower than 40 ℃;
the working process of the temperature control circuit 2 is as follows: the negative temperature coefficient thermistor RT1 is tightly attached to the radiator 1 to detect the temperature of the radiator 1, when the temperature of the radiator 1 is higher than 50 ℃, the voltage division of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is lower than the voltage division of the resistor R1 and the resistor R2, namely the voltage of the in-phase end of the operational amplifier N1 is higher than the voltage of the reverse end, the high level is output, the field effect tube VT1 is driven to be conducted, the fan 3 is powered to operate, when the temperature of the radiator 1 is reduced to be lower than 40 ℃, the voltage division of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is higher than the voltage division of the resistor R1 and the resistor R2, namely the voltage of the in-phase end of the operational amplifier N1 is lower than the voltage of the reverse end, the low level is,
the output of the operational amplifier N1 is connected to the non-inverting terminal of the operational amplifier N1 through a resistor R5 as feedback to avoid frequent fan start.
The fan is made by Nippon mountain company, model 109P0412H901, and the fan parameters are as follows:
supply voltage: 7V-13.8V; current: 0.07A; rotating speed: 6200/min; air volume: 0.15m3/min
Wind pressure: 41.2 Pa; service life: 40000 hours.
The radiator adopts standard section bars, can be according to different application scenarios, the corresponding mounting hole of processing.
Claims (1)
1. A heat abstractor of PCIE interface private network module which characterized in that: the device comprises a radiator (1), a temperature control circuit (2), a fan (3), a PCIE interface private network module (4) and a heat-conducting rubber mat (5);
one surface of the heat-conducting rubber pad (5) is attached to a shielding cover of the PCIE interface private network module (4), the other surface of the heat-conducting rubber pad (5) is attached to one end surface of the radiator (1), the fan (3) is fixed in a groove in the middle of the other end surface of the radiator (1) through four studs, and the temperature control circuit (2) is fixed in the groove of the radiator (1) on one side of the fan (3);
the temperature control circuit (2) comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected in series between a power supply and the ground, the joints of the resistor R1 and the resistor R2 are respectively connected with a pin 5 at the non-inverting input end of the operational amplifier N1 and one end of the resistor R5 and one end of the capacitor C3, the resistors R3, R4 and the negative temperature coefficient thermistor RT1 are connected in series between the power supply and the ground, the joint of the resistor R3 and the resistor R4 is connected with a pin 6 at the inverting input end of the operational amplifier N1, a pin 7 at the output end of the operational amplifier N1 is respectively connected with one end of the resistor R6 and the other end of the resistor R5, the other end of the resistor R6 is respectively connected with one end of the resistor R7 and the grid of the field effect transistor VT1, the drain of the field effect transistor VT1, the positive electrode of the switch diode VD1 and the negative electrode of the fan (3) are connected together, the positive electrode of the fan (3) and the positive electrode of the power supply, the diode VD1 are connected together, the negative electrode of, The other ends of the capacitor C2, the capacitor C3, the resistor R2 and the resistor R7 are grounded to the pin 4 of the ground terminal of the operational amplifier N1 and the source of the field-effect transistor VT1, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022791484.XU CN213638708U (en) | 2020-11-27 | 2020-11-27 | Heat radiator for PCIE interface private network module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022791484.XU CN213638708U (en) | 2020-11-27 | 2020-11-27 | Heat radiator for PCIE interface private network module |
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| Publication Number | Publication Date |
|---|---|
| CN213638708U true CN213638708U (en) | 2021-07-06 |
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| CN202022791484.XU Active CN213638708U (en) | 2020-11-27 | 2020-11-27 | Heat radiator for PCIE interface private network module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312750A (en) * | 2020-11-27 | 2021-02-02 | 天津七一二通信广播股份有限公司 | Heat dissipation device of PCIE interface private network module and implementation method |
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- 2020-11-27 CN CN202022791484.XU patent/CN213638708U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312750A (en) * | 2020-11-27 | 2021-02-02 | 天津七一二通信广播股份有限公司 | Heat dissipation device of PCIE interface private network module and implementation method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220318 Address after: 300140 No. 185, new great road, Tianjin, Hebei District Patentee after: TIANJIN 712 MOBILE COMMUNICATIONS Co.,Ltd. Address before: 300462 Tianjin Binhai New Area Economic and Technological Development Zone West District North Street 141 Patentee before: TIANJIN 712 COMMUNICATION & BROADCASTING Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 300140 No. 185, new great road, Tianjin, Hebei District Patentee after: Tianjin 712 Mobile Communication Co.,Ltd. Country or region after: China Address before: 300140 No. 185, new great road, Tianjin, Hebei District Patentee before: TIANJIN 712 MOBILE COMMUNICATIONS Co.,Ltd. Country or region before: China |