CN213634097U

CN213634097U - Adsorption device for improving wafer spin coating and developing uniformity

Info

Publication number: CN213634097U
Application number: CN202022099983.2U
Authority: CN
Inventors: 全金花; 全金星; 张军区
Original assignee: WUXI YAMAI MICROELECTRONICS CO Ltd
Current assignee: WUXI YAMAI MICROELECTRONICS CO Ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-07-06
Anticipated expiration: 2030-09-23

Abstract

The utility model discloses an improve adsorption equipment of wafer spin coating development homogeneity, including the installation shell, the motor groove has been seted up to the interior bottom of installation shell, motor inslot fixed mounting has the motor, the rotation end fixedly connected with installation piece of motor, fixed mounting has micro vacuum pump in the installation piece, the top fixed mounting of installation piece has the adsorption plate, the installation piece passes through the vacuum connecting pipe intercommunication with the adsorption plate, the apron has been cup jointed at the top of adsorption plate, the top fixed mounting of installation shell one side has the pivot seat, the outside of pivot seat is rotated and is connected with the closing plate, the bottom fixed mounting of closing plate has the sealing ring. The utility model relates to an adsorption equipment technical field has solved current adsorption equipment and when adsorbing the wafer, is adsorbing wafer and adsorption plate in real empty room mostly, carries out even glue to the wafer again, can make even glue efficiency slow problem to improve the efficiency when adsorbing the wafer.

Description

Adsorption device for improving wafer spin coating and developing uniformity

Technical Field

The utility model relates to an adsorption equipment technical field especially relates to an improve adsorption equipment of wafer spin coating development homogeneity.

Background

Spin coating or spin coating is also called as one of the basic steps of the photoresist process, and after the bottom film is formed, the liquid phase photoresist material is coated on the wafer by a spin coating method;

however, when the conventional adsorption device adsorbs the wafer, the wafer and the adsorption plate are mostly adsorbed in the vacuum chamber, and then the wafer is subjected to glue homogenizing, so that the glue homogenizing efficiency is slow.

Therefore, an adsorption device for improving the wafer spin coating and developing uniformity is provided to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem existing in the prior art and providing an improve even adsorption equipment who glues development homogeneity of wafer.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an improve adsorption equipment of even gluey development homogeneity of wafer, includes the installation shell, the motor groove has been seted up to the interior bottom of installation shell, motor inslot fixed mounting has the motor, the rotation end fixedly connected with installation piece of motor, fixed mounting has micro vacuum pump in the installation piece, the top fixed mounting of installation piece has the adsorption plate, the installation piece passes through the vacuum connecting pipe intercommunication with the adsorption plate, the apron has been cup jointed at the top of adsorption plate, the top fixed mounting of installation shell one side has the pivot seat, the outside of pivot seat is rotated and is connected with the closing plate, the bottom fixed mounting of closing plate has the sealing ring, the outside of sealing ring offsets with the inside wall of installation shell.

Preferably, the top fixedly connected with air outlet of micro vacuum pump, just the one end fixed mounting of air outlet has prevents stifled return bend.

Preferably, the interior bottom fixed mounting of installation shell has the glue dripping round platform, the through-hole has been seted up at the middle part of glue dripping round platform, just the inside wall of through-hole offsets with the outside of motor.

Preferably, a plurality of drip glue collecting pipes are fixedly arranged on the inner bottom of the mounting shell at equal intervals.

Preferably, the other ends of the plurality of the drip glue collecting pipes are connected through a five-way connecting pipe, and a drip glue recycling pipe is fixedly installed at the bottom of the five-way connecting pipe.

Preferably, the middle position of the bottom of the sealing plate is provided with an observation port, and the top of the observation port is fixedly provided with transparent glass.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this use is novel, because the small-size vacuum pump is installed to the adsorption plate bottom, makes it realize absorption and the dismouting to the wafer board in the cavity, makes its efficiency increase by a wide margin to because the top of adsorption plate is provided with adsorbs the briquetting, also can make the wafer of built-in through-hole carry out the spin coating, and because the bottom of spin coating device is installed the glue dripping round platform, make the wafer glue dripping accessible ground that the inertia was thrown away when rotating glue the round platform and get into in the glue dripping recovery pipe, make it can retrieve and recycle.

2. The utility model discloses in, because the top of adsorption plate is provided with the apron, make it can be applicable to the different wafers of variation in size model, make adsorption equipment's suitability wider to because the rotation of installation shell top has the closing plate, and the bottom of closing plate installs the sealing ring, make adsorption equipment inside be in encapsulated situation when not using, make its inside bacterium be difficult for surviving.

Drawings

Fig. 1 is a schematic structural diagram of an adsorption apparatus for improving the developing uniformity of the wafer spin coating according to the present invention;

fig. 2 is a schematic cross-sectional structure diagram of an adsorption apparatus for improving the developing uniformity of the wafer spin coating according to the present invention;

fig. 3 is a schematic view of a part of the structure of an adsorption apparatus for improving the uniformity of the wafer spin coating and developing according to the present invention;

fig. 4 is an enlarged view of a portion a in fig. 2.

In the figure: 1. mounting a shell; 2. a motor slot; 3. a motor; 4. mounting blocks; 5. a micro vacuum pump; 6. an adsorption plate; 7. a vacuum connecting pipe; 8. a cover plate; 9. a rotating shaft seat; 10. a sealing plate; 11. a seal ring; 12. a glue dripping round table; 13. a drip collection tube; 14. a five-way connecting pipe; 15. a glue dripping recovery pipe; 16. anti-blocking bent pipes; 17. and (4) transparent glass.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-4, including a mounting case 1, a motor groove 2 is formed at the inner bottom of the mounting case 1, a motor 3 is fixedly installed in the motor groove 2, the model of the motor 3 is 80KTYZ, a mounting block 4 is fixedly connected to the rotating end of the motor 3, a micro vacuum pump 5 is fixedly installed in the mounting block 4, an adsorption plate 6 is fixedly installed at the top of the mounting block 4, the mounting block 4 is communicated with the adsorption plate 6 through a vacuum connecting pipe 7, a cover plate 8 is sleeved at the top of the adsorption plate 6, a rotating shaft seat 9 is fixedly installed at the top of one side of the mounting case 1, a sealing plate 10 is rotatably connected to the outer side of the rotating shaft seat 9, a sealing ring 11 is fixedly installed at the bottom of the sealing plate 10, the outer side of the sealing ring 11 abuts against the inner side wall of the mounting case 1, when the wafer needs to be uniformly glued, the sealing plate 10 is selectively opened by an operator, the cover plate 8 is taken, the larger wafer can be directly placed on the top of the adsorption plate 6, the micro vacuum pump 5 is powered on, the micro vacuum pump 5 sucks air at the contact part of the adsorption plate 6 and the wafer through the vacuum connecting pipe 7, the wafer can be adsorbed by making the inside in a negative pressure state, the larger wafer with a through hole in the middle can be inserted into the through hole of the wafer through the cover plate 8, the micro vacuum pump 5 is started again, the micro vacuum pump 5 sucks air between the adsorption plate 6 and the wafer through the vacuum connecting pipe 7, the negative pressure state is caused, the wafer and the adsorption plate 6 are adsorbed and fixed, at the moment, a worker can drip glue on the surface of the wafer, the motor 3 is started again to drive the mounting block 4 and the adsorption plate 6 to rotate, so that the wafer adsorbed on the top of the adsorption plate 6 rotates, because the motor 3 with the model of 80 YZ is provided with a speed reducer, the rotating speed of the motor 3 is not too high, so that the glue drops can not splash to the periphery, and the glue drops on the surface of the wafer can slowly move to the periphery of the wafer and cover the surface of the wafer due to the influence of inertia.

Wherein, the top fixedly connected with air outlet of micro vacuum pump 5, and the one end fixed mounting of air outlet has prevents stifled return bend 16, and the unnecessary glue of dripping can be by inertia influence drippage behind the wafer top surface cladding of glue dripping at the wafer surface, because the export of preventing stifled return bend 16 is downward, can guarantee that the drippage that drops can not the cladding prevents the export of stifled return bend 16.

Wherein, the interior bottom fixed mounting of installation shell 1 has the glue dripping round platform 12, and the through-hole has been seted up at the middle part of glue dripping round platform 12, and the inside wall of through-hole offsets with the outside of motor 3, because the installation of glue dripping round platform 12, can make the glue dripping of dripping through the landing of glue dripping round platform 12 to the bottom of installation shell 1 to because glue dripping round platform 12 offsets with motor 3, guaranteed that the glue dripping can not drip to motor 3 on, make motor 3 take place to damage.

Wherein, a plurality of drip rubber collecting pipes 13 are fixedly arranged at the inner bottom of the mounting shell 1 at equal intervals, and the drip rubber which slides from the drip rubber circular table 12 to the bottom of the mounting shell 1 can be collected through the drip rubber collecting pipes 13 and conveyed to the bottom of the drip rubber collecting pipes 13.

Wherein, the other end of a plurality of glue dripping collecting pipes 13 is connected through five-way connecting pipe 14, and the bottom fixed mounting of five-way connecting pipe 14 has glue dripping recovery tube 15, is connected with many glue dripping collecting pipes 13 through five-way connecting pipe 14, can make the glue dripping of collecting in the many glue dripping collecting pipes 13 collect through five-way connecting pipe 14 to accessible glue dripping recovery tube 15 carries the glue dripping of collecting to other positions.

Wherein, the viewing aperture has been seted up to the intermediate position of closing plate 10 bottom, and viewing aperture top fixed mounting has transparent glass 17, when motor 3 drove installation piece 4 and adsorption plate 6 and rotates, the condition that the glue drip splashes can appear, can prevent through transparent glass 17 that the viewing aperture has the glue drip to splash to can observe the even gluey condition of inside.

The working principle is as follows: in the utility model, when the wafer is required to be uniformly coated, the sealing plate 10 is selected and installed by an operator firstly, then the cover plate 8 is taken out from the top of the adsorption plate 6, the operator can place the wafer according to the difference of the size and the model of the wafer, the larger wafer can be directly placed on the top of the adsorption plate 6, and the micro vacuum pump 5 is powered on, so that the micro vacuum pump 5 sucks the air at the contact part of the adsorption plate 6 and the wafer through the vacuum connecting pipe 7, the wafer can be adsorbed by the inside in a negative pressure state, the wafer with the through hole at the middle position can pass through the cover plate 8 and be inserted into the through hole of the wafer, the micro vacuum pump 5 is started again, so that the micro vacuum pump 5 sucks the air between the adsorption plate 6 and the wafer contact part through the vacuum connecting pipe 7 and the air between the adsorption plate 6 and the cover plate 8, so as to cause the, at this time, the worker can drip the adhesive on the surface of the wafer, after the wafer is fixed and the adhesive is dripped on the surface of the wafer, the worker can close the sealing plate 10 in a rotating manner, and make the sealing ring 11 abut against the inner wall of the mounting plate 1, so that the inside of the mounting plate 1 is kept sealed, then the motor 3 is started, so that the motor 3 drives the mounting block 4 and the adsorption plate 6 to rotate, thereby the wafer adsorbed on the top of the adsorption plate 6 rotates, because the motor 3 with the model of 80KTYZ is provided with a reducer, the rotating speed of the motor 3 is not too high, thereby the adhesive is splashed to the periphery, because of the influence of inertia, the adhesive on the surface of the wafer can slowly move to the periphery of the wafer and uniformly coat the surface of the wafer, the redundant adhesive can continuously move to the outside due to the influence of inertia after the adhesive is coated on the top surface of the wafer, the adhesive can drip under the influence of gravity when the, because the outlet of the anti-blocking bent pipe 16 is downward, the dropped glue can be ensured not to coat the outlet of the anti-blocking bent pipe 16, because the glue dripping round platform 12 is installed, the dropped glue can slide to the bottom of the installation shell 1 through the glue dripping round platform 12, and because the glue dripping round platform 12 is abutted against the motor 3, the glue dripping can be ensured not to drop to the motor 3, so that the motor 3 is damaged, the glue dripping sliding from the glue dripping round platform 12 to the bottom of the installation shell 1 can be collected through the glue dripping collecting pipe 13 and conveyed to the bottom of the glue dripping collecting pipe 13, the glue dripping collected in the glue dripping collecting pipes 13 can be collected through the five-way connecting pipe 14, the collected glue dripping can be conveyed to other positions through the glue dripping recycling pipe 15, when the motor 3 drives the installation block 4 and the adsorption plate 6 to rotate, the situation that the glue dripping splashes can occur, the transparent glass 17 can prevent the glue dripping from splashing at the observation port, and the glue homogenizing condition inside can be observed.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The adsorption device for improving the developing uniformity of the wafer spin coating comprises an installation shell (1) and is characterized in that a motor groove (2) is formed in the inner bottom of the installation shell (1), a motor (3) is fixedly installed in the motor groove (2), an installation block (4) is fixedly connected with the rotating end of the motor (3), a micro vacuum pump (5) is fixedly installed in the installation block (4), an adsorption plate (6) is fixedly installed at the top of the installation block (4), the installation block (4) is communicated with the adsorption plate (6) through a vacuum connecting pipe (7), a cover plate (8) is sleeved at the top of the adsorption plate (6), a rotating shaft seat (9) is fixedly installed at the top of one side of the installation shell (1), a sealing plate (10) is rotatably connected to the outer side of the rotating shaft seat (9), and a sealing ring (11) is fixedly installed at the bottom of the sealing plate (10), the outer side of the sealing ring (11) is abutted against the inner side wall of the mounting shell (1).

2. The adsorption device for improving the wafer spin coating and developing uniformity as recited in claim 1, wherein an air outlet is fixedly connected to the top of the micro vacuum pump (5), and an anti-blocking bent pipe (16) is fixedly installed at one end of the air outlet.

3. The adsorption device for improving the wafer spin coating development uniformity of claim 1, wherein a glue dripping circular table (12) is fixedly mounted at the inner bottom of the mounting shell (1), a through hole is formed in the middle of the glue dripping circular table (12), and the inner side wall of the through hole abuts against the outer side of the motor (3).

4. The adsorption device for improving the wafer spin coating development uniformity of claim 1, wherein a plurality of drip collection pipes (13) are fixedly installed at the inner bottom of the installation shell (1) at equal intervals.

5. The adsorption device for improving the wafer spin coating development uniformity of claim 4, wherein the other ends of the plurality of the drip glue collecting pipes (13) are connected through a five-way connecting pipe (14), and a drip glue recycling pipe (15) is fixedly installed at the bottom of the five-way connecting pipe (14).

6. The adsorption device for improving the wafer spin coating development uniformity as claimed in claim 1, wherein a viewing port is formed in the middle of the bottom of the sealing plate (10), and a transparent glass (17) is fixedly mounted on the top of the viewing port.