CN213634055U

CN213634055U - Chip-level display packaging structure

Info

Publication number: CN213634055U
Application number: CN202022221812.2U
Authority: CN
Inventors: 孙智江; 王书昶
Original assignee: Haidike Suzhou Photoelectric Technology Co Ltd
Current assignee: Haidike Nantong Photoelectric Technology Co Ltd; Haidike Suzhou Photoelectric Technology Co Ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-07-06
Anticipated expiration: 2030-10-09

Abstract

The utility model relates to a chip level shows packaging structure, its characterized in that: including base plate, red light chip, blue light chip, green light chip, the subsides of base plate upper surface are equipped with an at least RGB chipset, the RGB chipset includes an at least red light chip, a green light chip and a blue light chip, red light chip, green light chip and blue light chip pass through the transparent layer monolithic package on same base plate, and the top surface of transparent layer is provided with the reflection stratum under the regional coating of base plate upper surface outside red light chip, green light chip and the blue light chip has, forms a four sides light-emitting light emitting structure through setting up of upper and lower reflection stratum. The utility model has the advantages that: the light-emitting of accessible three-colour chip can furthest be realized, the colour gamut wider than quantum dot technique and OLED can be realized.

Description

Chip-level display packaging structure

Technical Field

The utility model relates to a LED chip, in particular to chip level display packaging structure.

Background

Currently, the lcd backlight module can be classified into a side-in type and a direct type. The direct type backlight source is simple in process, a light guide plate is not needed, the LED array is arranged at the bottom of the backlight module, light emitted from the LEDs is reflected through the bottom surface and the side surface, and then is uniformly emitted through the diffusion plate on the surface and the optical module. The thickness of the direct type backlight source is mainly determined by the bottom of the back plate and the light mixing distance, the light mixing distance is the distance from the LED to the scattering plate, and generally, the larger the light mixing distance is, the better the uniformity of the light emitted by the backlight module is. And the dynamic display range HDR of the lateral backlight is only 2000: 1.

The LED lamp beads are powered by the driving circuit through the PCB, so that the LED lamp beads generate light required by the backlight module, but the light directly emitted by the LED lamp beads is too concentrated and irradiates the diffusion plate, and obvious brightness and color difference occurs. At present, a lens is usually installed above an LED lamp bead of a conventional backlight module, so that light emitted by the LED lamp bead uniformly irradiates a diffusion plate after passing through the lens. The light type and the lens size and the light-emitting effect of LED lamp pearl have increased straight following formula backlight unit's thickness, and because the light that lens sent adjacent LED lamp pearl shines the regional existence that the diffuser plate was shone to the light through lens and overlaps, can't realize outstanding mixed light effect.

The mini backlight module usually adopts a direct type backlight scheme with small air gaps or even zero air gaps, the HDR can reach 10000:1, and when a light source adopts a blue light and quantum dot film mode, the color gamut can reach 85%.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a encapsulation technical scheme of super high colour gamut, high dynamic range HDR, when can reaching super high colour gamut, save the light filter, improve the whole luminance of light source.

In order to solve the technical problem, the utility model adopts the technical scheme that: a chip-scale display package structure is characterized in that: comprises a substrate, a red chip, a blue chip, a green chip, a lower reflecting layer, a transparent layer and an upper reflecting layer,

the utility model discloses a luminous structure, including base plate, base plate upper surface subsides, base plate upper surface is equipped with RGB chipset, RGB chipset includes a green glow chip, a blue light chip and an at least red light chip, green glow chip and blue light chip pass through the stratum lucidum whole encapsulation on same base plate, and the top surface of stratum lucidum is provided with the upper reflection stratum the regional coating of base plate upper surface outside red light chip, green glow chip and the blue light chip has lower reflection stratum, forms a four sides light-emitting light emitting structure through upper and lower reflection stratum setting.

Preferably, the red light chip, the green light chip and the blue light chip are distributed in a ring shape as a whole, and long axes of the red light chip, the green light chip and the blue light chip extend along the radiation direction by taking the center of the ring shape as a radiation point.

Preferably, one end of each of the red light chip, the green light chip and the blue light chip, which is close to the center of the ring, is limited to be an inner end, and distances from the inner ends of the red light chip, the green light chip and the blue light chip to the center of the ring are all greater than or equal to 0.5mil, so that light emitting spaces are provided for light emitting surfaces at the inner ends of the red light chip, the green light chip and the blue light chip.

Preferably, the red light chip, the green light chip and the blue light chip are arranged in a line.

Preferably, the blue chip is located between the red chip and the green chip.

Preferably, the distance between adjacent chips in the red light chip, the blue light chip and the green light chip is greater than or equal to the length of the chip with the minimum length in the adjacent chips.

Preferably, there are two red light chips, one green light chip and one blue light chip, the red light chips, the green light chips and the blue light chips are arranged in a straight line, and the two red light chips are respectively located at two ends of the green light chips and the blue light chips.

Preferably, the height of the transparent layer is less than 180 μm.

The utility model has the advantages that: the RGB scheme adopted by the light source in the traditional direct type backlight adopts chips with independent colors, namely the light source is a plurality of independent blue light, red light or green light chips, and light mixing is carried out through a diffusion plate. And the utility model discloses in, adopt RGB chipset and four sides light-emitting structure to combine together and constitute a light source packaging body, produce the required light of backlight unit by a plurality of light source packaging bodies again, it is effectual to mix the broad width. In addition, compared with a blue light and quantum dot film adopted by the traditional mini backlight, the white light emitting from four sides is realized, the color gamut wider than that of quantum dots and OLED can be realized, and the light mixing effect is better. And the RGB chips distributed in a ring shape or a straight line shape can realize the light emission of the barrier-free three-color chip to the maximum extent.

Drawings

Fig. 1 is a schematic diagram of a first embodiment of the chip scale display package structure of the present invention.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is a schematic diagram of a second embodiment of the chip scale display package structure of the present invention.

Fig. 4 is a sectional view taken along line B-B of fig. 3.

Fig. 5 is a schematic diagram of a third embodiment of the chip scale display package structure of the present invention.

Fig. 6 is a cross-sectional view taken along line C-C of fig. 5.

Detailed Description

Example one

As shown in fig. 1, the chip scale display package structure of the present invention includes a substrate 1, a red light chip 2, a green light chip 3, a blue light chip 4, a lower reflective layer 5, a transparent layer 6, and an upper reflective layer 7.

The upper surface of the substrate 1 is attached with at least one RGB chip group, and the RGB chip group comprises a green light chip 3, a blue light chip 4 and at least one red light chip 2.

As shown in fig. 2, there is only one red light chip 2, one green light chip 3, and one blue light chip 4, the three are distributed in a ring shape, and the long axis of each of the red light chip 2, the green light chip 3, and the blue light chip 4 extends in the radiation direction with the center of the ring shape as the radiation point.

And the ends, close to the annular center, of the red light chip 2, the green light chip 3 and the blue light chip 4 are limited to be inner ends, and the distances from the inner ends of the red light chip 2, the green light chip 3 and the blue light chip 4 to the annular center are all larger than or equal to 0.5mil, so that light emitting spaces are provided for the light emitting surfaces of the inner ends of the red light chip 2, the green light chip 3 and the blue light chip 4.

The utility model discloses in, the regional coating of 1 upper surface of base plate beyond ruddiness chip 2, green glow chip 3 and blue light chip 4 has lower reflection stratum 5.

Red light chip 2, green glow chip 3 and blue light chip 4 pass through the 6 monolithic packages of stratum lucidum on base plate 1 to be provided with reflection stratum 7 on the top surface of stratum lucidum 6, and then form the light emitting source monomer structure of a four sides light-emitting, the high setting of stratum lucidum 6 in the usable four sides light-emitting structure changes the position of reflection stratum 7, realizes going out the regulation of light angle. In this embodiment, the length and width dimensions of the red chip 2, the green chip 3 and the blue chip 4 are 0.5mil by 1mil, and the height of the transparent layer 6 is less than 180 μm.

Example two

The structure of the present embodiment is substantially the same as that of the first embodiment, and as shown in fig. 3, the present embodiment includes a substrate 1, a red chip 2, a green chip 3, a blue chip 4, a lower reflective layer 5, a transparent layer 6, and an upper reflective layer 7.

Red light chip 2, green glow chip 3 and blue light chip 4 pass through stratum lucidum 6 monolithic package on base plate 1, and the regional coating of base plate 1 upper surface outside red light chip 2, green glow chip 3 and the blue light chip 4 has lower reflection stratum 5 to be provided with upper reflection stratum 7 at the top surface of stratum lucidum 6, and then form the light emitting source monomer structure of a four sides light-emitting.

The difference lies in that: as shown in fig. 4, the red light chip 2, the green light chip 3, and the blue light chip 4 are arranged in a line, and the blue light chip 4 is located between the red light chip 2 and the green light chip 3.

In order to improve the light emitting effect, the distance between adjacent chips in the red light chip 2, the blue light chip 4 and the green light chip 3 is greater than or equal to the length of the chip with the minimum length in the adjacent chips. In this embodiment, if the length and width dimensions of the red light chip 2, the green light chip 3, and the blue light chip 4 are 0.5mil by 1mil, the distance between the red light chip 2 and the blue light chip 4, and the distance between the blue light chip 4 and the green light chip 3 are all greater than or equal to 1 mil.

EXAMPLE III

As shown in fig. 5 and 6, each includes a substrate 1, a red chip 2, a green chip 3, a blue chip 4, a lower reflective layer 5, a transparent layer 6, and an upper reflective layer 7.

In this embodiment, there are two red light chips 2, one green light chip 3 and one blue light chip 4, and the red light chip 2, the green light chip 3 and the blue light chip 4 are arranged in a line as in the embodiment, but the two red light chips 2 are respectively located at two ends of the green light chip 3 and the blue light chip 4. Not only can make up the deficiency of red light in the conventional scheme, but also has better uniformity of the whole light emission.

Claims

1. A chip scale display package structure, characterized in that: comprises a substrate, a red chip, a blue chip, a green chip, a lower reflecting layer, a transparent layer and an upper reflecting layer,

2. The chip scale display package structure of claim 1, wherein: the red light chips, the green light chips and the blue light chips are distributed in an annular shape integrally, and long axes of the red light chips, the green light chips and the blue light chips extend along the radiation direction by taking the annular center as a radiation point.

3. The chip scale display package structure of claim 2, wherein: and limiting one ends of the red light chip, the green light chip and the blue light chip, which are close to the center of the ring, as inner ends, wherein the distances from the inner ends of the red light chip, the green light chip and the blue light chip to the center of the ring are all more than or equal to 0.5mil, so that light emitting spaces are provided for the inner light emitting surfaces of the red light chip, the green light chip and the blue light chip.

4. The chip scale display package structure of claim 1, wherein: the red light chip, the green light chip and the blue light chip are arranged in a straight line shape.

5. The chip scale display package structure of claim 4, wherein: the blue light chip is positioned between the red light chip and the green light chip.

6. The chip scale display package structure of claim 4, wherein: the distance between adjacent chips in the red light chip, the blue light chip and the green light chip is larger than or equal to the length of the chip with the minimum length in the adjacent chips.

7. The chip scale display package structure of claim 4, wherein: the red light chips are arranged in a straight line, and the two red light chips are respectively positioned at two ends of the green light chips and the blue light chips.

8. The chip scale display package structure according to any one of claims 1 to 7, wherein: the height of the transparent layer is less than 180 μm.