CN213631342U

CN213631342U - Infrared baking equipment of silicon chip

Info

Publication number: CN213631342U
Application number: CN202021645492.7U
Authority: CN
Inventors: 初亚东
Original assignee: Tewoo Gold Best Microelectronics Co ltd
Current assignee: Tewoo Gold Best Microelectronics Co ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-07-06
Anticipated expiration: 2030-08-10

Abstract

The utility model provides a silicon wafer infrared baking device, which comprises a workbench, a turntable, an FFU fan filter unit and a wafer basket; the workbench is of a three-layer structure, the middle layer is provided with an installation position corresponding to the rotary table, the bottom layer is provided with a driving assembly for driving the rotary table to rotate, and the upper layer is used for installing an FFU fan filter unit; the middle layer is also provided with a cylindrical shell, and the turntable is arranged in the cylindrical shell; the turntable is provided with a plurality of working positions for placing the wafer basket; the center of the top of the cylindrical shell extends upwards to form a conical structure, and the top of the conical structure is provided with an air outlet; and a plurality of air supply outlets are arranged around the conical structure at the top of the cylindrical shell and are connected with an FFU fan filter unit through air pipes. The utility model adopts the FFU fan filter unit to supply air, so that the baking process is cleaner; the multi-station work can place more silicon wafer baskets, so that the baking efficiency is higher; the combination of the infrared lamp and the turntable is adopted, so that the baking effect is better.

Description

Infrared baking equipment of silicon chip

Technical Field

The utility model belongs to silicon chip production facility field especially relates to an infrared baking equipment of silicon chip.

Background

In the production process of the silicon wafer, a layer of water film is adsorbed on the surface of the cleaned silicon wafer, the water film cannot be removed completely, the surface dryness is poor, and certain influence can be caused on the quality of the silicon wafer. The silicon wafer is required to be dried on the surface after being cleaned, and because the silicon wafer is thin in thickness, the silicon wafer is easily cracked due to uneven heating when being dried by a conventional oven, various stains can be generated in the baking process, if the stains are not specially designed for the structure of the oven, the stains can be gathered in the oven, the oven becomes more and more dirty along with the accumulation of time, and the surface of the baked silicon wafer is not clean. Therefore, a silicon wafer drying device with good baking effect and low energy consumption is urgently needed.

Disclosure of Invention

In view of this, the present invention provides an infrared baking device for silicon wafers, which overcomes the above-mentioned drawbacks of the prior art.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

an infrared baking device for silicon wafers comprises a workbench, a turntable, an FFU fan filter unit and a wafer basket;

the workbench is of a three-layer structure, the middle layer is provided with an installation position corresponding to the rotary table, the bottom layer is provided with a driving assembly for driving the rotary table to rotate, and the upper layer is used for installing an FFU fan filter unit;

the middle layer is also provided with a cylindrical shell, and the turntable is arranged in the cylindrical shell; the turntable is provided with a plurality of working positions for placing the wafer basket;

the center of the top of the cylindrical shell extends upwards to form a conical structure, and the top of the conical structure is provided with an air outlet; and a plurality of air supply outlets are arranged around the conical structure at the top of the cylindrical shell and are connected with an FFU fan filter unit through air pipes.

Furthermore, an L-shaped lamp holder is arranged at the position, corresponding to the working position of the turntable, of the middle layer of the workbench; and the L-shaped lamp bracket is provided with an infrared lamp for heating.

Furthermore, double infrared lamps are arranged on the L-shaped lamp frame positioned at the inlet and outlet positions of the cylindrical shell.

Furthermore, the number of the working positions is eight, and two sheet baskets are arranged on each working position; the sheet basket is positioned below the infrared lamp.

Furthermore, a temperature control module is also arranged in the cylindrical shell, and two adjacent infrared lamps are connected with the same temperature control module; the model of the temperature control module is CHB 401-021-.

Furthermore, the air outlet is connected with an air exhaust device through an air pipe.

Furthermore, the number of the air supply outlets is four, and the four air supply outlets are respectively connected with four air outlets of the FFU fan filter unit through air pipes.

Compared with the prior art, the utility model discloses following advantage has:

the FFU fan filter unit is adopted for supplying air, so that the baking process is cleaner; the multi-station work can place more silicon wafer baskets, so that the baking efficiency is higher; the combination of the infrared lamp and the turntable is adopted, so that the baking effect is better.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:

FIG. 1 is a schematic view of a baking apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of the internal structure of the baking apparatus according to the embodiment of the present invention.

Description of reference numerals:

1. a work table; 2. a heat-insulating shell; 3. an FFU fan filter unit; 4. an air outlet; 5. an air supply outlet; 6. an air duct; 7. an infrared lamp; 701. a dual infrared lamp; 8. a tablet basket.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in attached figures 1 and 2, the silicon wafer infrared baking device comprises a workbench 1, a turntable, an FFU fan filter unit 3 and a wafer basket 8;

the workbench 1 is of a three-layer structure, the middle layer is provided with an installation position corresponding to the rotary table, the bottom layer is provided with a driving assembly for driving the rotary table to rotate, and the upper layer is used for installing the FFU fan filter unit 3;

the middle layer is also provided with a cylindrical shell, and the turntable is arranged in the cylindrical shell; the turntable is provided with a plurality of working positions for placing the wafer basket 8;

the center of the top of the cylindrical shell extends upwards to form a conical structure, and the top of the conical structure is provided with an air outlet 4; and a plurality of air supply outlets 5 are arranged around the conical structure at the top of the cylindrical shell, and the air supply outlets 5 are connected with the FFU fan filter unit 3 through air pipes 6.

An L-shaped lamp holder is arranged at the position, corresponding to the working position of the turntable, of the middle layer of the workbench 1; be equipped with the infrared lamp 7 that is used for the heating on the L type lighting fixture, adopt infrared heating cooperation FFU fan filter unit 3 cleaner high-efficient.

And the L-shaped lamp frame positioned at the inlet and outlet of the cylindrical shell is provided with the double infrared lamps 7, so that the heating is more uniform.

The number of the working positions is eight, and two sheet baskets 8 are arranged on each working position; the sheet basket 8 is located below the infrared lamp 7. A temperature control module is also arranged in the cylindrical shell, and two adjacent infrared lamps 7 are connected with the same temperature control module; the model of the temperature control module is CHB 401-021-.

The air outlet 4 is connected with an air exhaust device through an air pipe 6, so that air can be exhausted more conveniently.

The quantity of supply-air outlet 5 is four, connects four air outlets of FFU fan filter unit 3 through tuber pipe 6 respectively, and the hoop is bloied, makes to toast and is heated more evenly, and the effect is better.

The equipment is suitable for a five-inch polytetrafluoroethylene flower basket arrangement mode as shown in the figure, eight stations are provided, and two baskets are arranged in each station;

baking the inlet and the outlet: a pneumatic door heat preservation device, an upper FFU air supply device and an outlet material box detection device;

③ infrared baking: the external SUS304 plate is provided with an insulating layer, the temperature of the infrared heating pipe in the middle is controlled, the service temperature is about 150 ℃, and the infrared baking range is six stations. Wherein import and export for two infrared lamp 7 (2 x 700W) independent temperature control, four middle station single lamps (700W), two adjacent lamps are public one temperature control, remark: in the scheme, the infrared lamp 7 adopts a U-shaped tube, a direct wire outlet mode is adopted, and a middle ceramic block mode is adopted as a connection mode with an equipment power supply. Temperature control, model CHB 401-021-.

Fourthly, FFU air supply: the main FFU fan is divided into four air outlets which are respectively supplied to the inlet and the outlet and one baking part; the upper part of the discharging and waiting area is a transparent PC plate, the middle part is reinforced and supported, and the upper part is an FFU air supply outlet 5. FFU, model BH2 × 2L-1; the FFU is connected with an air supply outlet 5 through an air pipe 6.

The air exhaust device: as shown in the above figure, the exhaust air adopts an upward exhaust mode, and the odor generated by the baking part can be exhausted through the turntable and the gap on the baking inner side.

The control system comprises: 4.3 cun colored touch-sensitive screen is adopted, and PLC control can freely set for the dwell time of each station of carousel. The speed of the turntable is adjustable. The temperature control is divided into 4 temperature zones, PID operation and SSR zero-crossing triggering temperature control. Touch screen integrated machine, model MM _20MR _6MT _430A _ FX _ A.

3. Operation process

The device is operated by one person, as shown in the figure, the product to be dried is placed on the station corresponding to the inlet, and is dried to the discharge port through the intermittent motion of six stations, and the operator takes out the product.

The equipment has eight stations, two of the stations are outside, the other six stations are in the infrared box, and the speed of the turntable can be adjusted in a stepless mode through the speed regulating box. The turntable is operated intermittently, one station at a time.

After the equipment is started, the action of the turntable is as follows:

door opening → turning (speed adjustable) → stopping (time touchable screen setting) → door closing → door opening → turning → stopping → door closing → reciprocating therewith.

The baking time required by each silicon chip can be finally adjusted by adjusting two factors of the speed of the turntable and the waiting time of the station. The rotating assembly of the turntable is the protection content of the prior art and the scheme is not the scheme.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip infrared baking equipment which characterized in that: comprises a workbench (1), a turntable, an FFU fan filter unit (3) and a sheet basket (8);

the workbench (1) is of a three-layer structure, the middle layer is provided with a mounting position corresponding to the rotary table, the bottom layer is provided with a driving assembly for driving the rotary table to rotate, and the upper layer is used for mounting an FFU fan filter unit (3);

the middle layer is also provided with a cylindrical shell, and the turntable is arranged in the cylindrical shell; the turntable is provided with a plurality of working positions for placing the wafer basket (8);

the center of the top of the cylindrical shell extends upwards to form a conical structure, and the top of the conical structure is provided with an air outlet (4); a plurality of air supply outlets (5) are arranged on the periphery of the conical structure at the top of the cylindrical shell, and the air supply outlets (5) are connected with an FFU fan filter unit (3) through air pipes (6).

2. The silicon wafer infrared baking device of claim 1, characterized in that: an L-shaped lamp holder is arranged at the position, corresponding to the working position of the turntable, of the middle layer of the workbench (1); and an infrared lamp (7) for heating is arranged on the L-shaped lamp holder.

3. The silicon wafer infrared baking device of claim 2, characterized in that: and the L-shaped lamp frame positioned at the inlet and outlet positions of the cylindrical shell is provided with a double infrared lamp (7).

4. The silicon wafer infrared baking device of claim 2, characterized in that: the number of the working positions is eight, and each working position is provided with two sheet baskets (8); the sheet basket (8) is positioned below the infrared lamp (7).

5. The silicon wafer infrared baking device of claim 2, characterized in that: and a temperature control module is further arranged in the cylindrical shell, and two adjacent infrared lamps (7) are connected with the same temperature control module.

6. The silicon wafer infrared baking device of claim 1, characterized in that: the air outlet (4) is connected with an air exhaust device through an air pipe (6).

7. The silicon wafer infrared baking device of claim 1, characterized in that: the number of the air supply outlets (5) is four, and the four air supply outlets are respectively connected with four air outlets of the FFU fan filter unit (3) through air pipes (6).