CN104848668A - Wafer drying system - Google Patents
Wafer drying system Download PDFInfo
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- CN104848668A CN104848668A CN201410053061.4A CN201410053061A CN104848668A CN 104848668 A CN104848668 A CN 104848668A CN 201410053061 A CN201410053061 A CN 201410053061A CN 104848668 A CN104848668 A CN 104848668A
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- wafer
- drying
- drying system
- fan
- circulating fan
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Abstract
The invention discloses a wafer drying system. The wafer drying system comprises a base, a heater, a drying chamber and a conveying belt passing through the drying chamber, and further comprises an air feeder, a circulating fan, a hot air cavity and a control valve, wherein a bearer for bearing wafers is arranged at the upper section of the conveying belt; the wafers are accommodated in the wafer bearer; the two sides of the upper section of the conveying belt are upwards or downwards inclined towards the center of the conveying belt; a microwave heating layer is arranged on the conveying belt; the two ends of the hot air cavity are respectively connected with an air outlet of the air feeder and an air outlet of the circulating fan; and an air return port and multiple air feeding ports are arranged between the hot air cavity and the drying chamber. The wafer drying system adopts self-designed drying equipment to dry ultrasonically cleaned glass substrates; the drying equipment airs the glass substrates in a clean strong cold air blowing manner to prevent the generation of watermarks on the glass surface in the drying process; and the wafer drying system is low in equipment manufacturing cost, low in operation cost and convenient to operate.
Description
Technical field
The present invention relates to and the present invention relates to Wafer Machining field, especially relates to a kind of wafer drying system of improvement.
Background technology
Carry out drying to glass, conventional is hot-air seasoning.For heavy sheet glass sheet, glass surface is not easy to occur watermark in drying course, but when preparing built-in C CD safety monitoring optical filter, glass sheet thickness only has 0.55mm or 0.3mm, water mark due to marginal portion cannot depart from completely opens optical surface, so there will be watermark in drying course, there is the glass substrate of watermark will occur mist spot after plated film.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of wafer drying system, and complete cost is low, the cold wind blow-dry device of works very well, greatly improves the qualification rate of product.
For solving the problems of the technologies described above, embodiments of the invention provide a kind of wafer drying system, comprise base, heater, drying chamber and the conveyer belt by drying chamber, also comprise pressure fan, circulating fan, hot air cavity and control valve, the epimere of described transport tape is provided with for bearing wafer carrier, described wafer is contained in described wafer carrier, the both sides of the epimere of described transport tape are on the mediad of described transport tape or downward-sloping, described conveyer belt is provided with heating using microwave layer, described hot air cavity two ends are connected with the air outlet of described pressure fan and the air outlet of described circulating fan respectively, return air inlet and multiple air outlet is provided with between described hot air cavity and described drying chamber, described air outlet is provided with the control valve controlling air intake flow, atomizer is provided with between described control valve, described return air inlet is connected with the air inlet of described circulating fan, described heater is positioned at the junction of the air outlet of described hot air cavity and described pressure fan, described pressure fan can be frequency conversion pressure fan, described circulating fan can be frequency conversion circulating fan, the air inlet of described pressure fan can be provided with filter, described heater can be electric heating pipe type heater, described atomizer upper end is connected with conduit, described conduit is provided with water inlet, described drying chamber both sides are equipped with liftable door.
As preferably, described pressure fan and described circulating fan are clean strong cold air drying blower fan.
As preferably, described conveyer belt bottom surface is coated with high-energy radiation dope layer.
As preferably, described base is provided with control flow, and described pressure fan, circulating fan, hot air cavity are all connected with control flow by wire with control valve, conveyer belt, atomizer, heater, control valve, heating using microwave layer.
As preferably, in described atomizer, be provided with quality purifying device for water.
As preferably, in described drying chamber, be also provided with dust investigating.
The drying equipment that present invention employs designed, designed carries out drying to the glass substrate that Ultrasonic Cleaning is crossed.The mode that drying equipment adopts clean strong cold wind to dry up is carried out air-dry to glass substrate, avoids in dry run and occurs watermark at glass surface.Low cost of manufacture, the operating cost of equipment are low, easy to operate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The present invention is directed to existing deficiency and a kind of wafer drying system is provided, as shown in Figure 1, comprise base 12, heater 3, drying chamber 10 and the conveyer belt 15 by drying chamber 10, also comprise pressure fan 1, circulating fan 7, hot air cavity 4 and control valve 5, the epimere of described transport tape 15 is provided with for bearing wafer carrier 17, described wafer is contained in described wafer carrier 17, the both sides of the epimere of described transport tape 15 are on the mediad of described transport tape 15 or downward-sloping, described conveyer belt 12 is provided with heating using microwave layer 13, described hot air cavity 4 two ends are connected with the air outlet 2 of described pressure fan and the air outlet 6 of described circulating fan respectively, return air inlet 11 and multiple air outlet 9 is provided with between described hot air cavity 4 and described drying chamber 10, described air outlet 9 is provided with the control valve 5 controlling air intake flow, atomizer 14 is provided with between described control valve 5, described return air inlet 11 is connected with the air inlet of described circulating fan, described heater 3 is positioned at the junction of the air outlet 2 of described hot air cavity 4 and described pressure fan, described pressure fan 1 can be frequency conversion pressure fan, described circulating fan 7 can be frequency conversion circulating fan, air inlet 8 place of described pressure fan can be provided with filter, described heater 3 can be electric heating pipe type heater, described atomizer 14 upper end is connected with conduit 8, described conduit 8 is provided with water inlet 16, described drying chamber 10 both sides are equipped with liftable door.
As preferably, described pressure fan and described circulating fan 7 are clean strong cold air drying blower fan.
As preferably, described conveyer belt 15 bottom surface is coated with high-energy radiation dope layer.
As preferably, described base 12 is provided with control flow, and described pressure fan 1, circulating fan 7, hot air cavity 4 are all connected with control flow by wire with control valve 5, conveyer belt 15, atomizer 14, heater 3, control valve 5, heating using microwave layer 13.
As preferably, in described atomizer 14, be provided with quality purifying device for water.
As preferably, in described drying chamber 10, be also provided with dust investigating.
The drying equipment that present invention employs designed, designed carries out drying to the glass substrate that Ultrasonic Cleaning is crossed.The mode that drying equipment adopts clean strong cold wind to dry up is carried out air-dry to glass substrate, avoids in dry run and occurs watermark at glass surface.Low cost of manufacture, the operating cost of equipment are low, easy to operate.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. a wafer drying system, comprise base (12), heater (3), drying chamber (10) and the conveyer belt (15) by drying chamber (10), it is characterized in that, also comprise pressure fan (1), circulating fan (7), hot air cavity (4) and control valve (5), the epimere of described transport tape (15) is provided with for bearing wafer carrier (17), described wafer is contained in described wafer carrier (17), the both sides of the epimere of described transport tape (15) are on the mediad of described transport tape (15) or downward-sloping, described conveyer belt (12) is provided with heating using microwave layer (13), described hot air cavity (4) two ends are connected with the air outlet (2) of described pressure fan and the air outlet (6) of described circulating fan respectively, return air inlet (11) and multiple air outlet (9) is provided with between described hot air cavity (4) and described drying chamber (10), described air outlet (9) is provided with the control valve (5) controlling air intake flow, atomizer (14) is provided with between described control valve (5), described return air inlet (11) is connected with the air inlet of described circulating fan, described heater (3) is positioned at the junction of the air outlet (2) of described hot air cavity (4) and described pressure fan, described pressure fan (1) can be frequency conversion pressure fan, described circulating fan (7) can be frequency conversion circulating fan, air inlet (8) place of described pressure fan can be provided with filter, described heater (3) can be electric heating pipe type heater, described atomizer (14) upper end is connected with conduit (8), described conduit (8) is provided with water inlet (16), described drying chamber (10) both sides are equipped with liftable door.
2. a kind of wafer drying system according to claim 1, is characterized in that, described pressure fan and described circulating fan (7) are clean strong cold air drying blower fan.
3. a kind of wafer drying system according to claim 1, is characterized in that, described conveyer belt (15) bottom surface is coated with high-energy radiation dope layer.
4. a kind of wafer drying system according to claim 1, it is characterized in that, described base (12) is provided with control flow, and described pressure fan (1), circulating fan (7), hot air cavity (4) are all connected with control flow by wire with control valve (5), conveyer belt (15), atomizer (14) heater (3), control valve (5), heating using microwave layer (13).
5. a kind of wafer drying system according to claim 1, is characterized in that, described atomizer is provided with quality purifying device for water in (14).
6. a kind of wafer drying system according to claim 1, is characterized in that, described drying chamber is also provided with dust investigating in (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410053061.4A CN104848668A (en) | 2014-02-17 | 2014-02-17 | Wafer drying system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410053061.4A CN104848668A (en) | 2014-02-17 | 2014-02-17 | Wafer drying system |
Publications (1)
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CN104848668A true CN104848668A (en) | 2015-08-19 |
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Family Applications (1)
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CN201410053061.4A Pending CN104848668A (en) | 2014-02-17 | 2014-02-17 | Wafer drying system |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106345649A (en) * | 2016-11-22 | 2017-01-25 | 中国科学技术大学 | Method and device for applying micro-nano particles |
CN108266972A (en) * | 2017-12-26 | 2018-07-10 | 德淮半导体有限公司 | Drying wafer method |
CN110296583A (en) * | 2018-03-21 | 2019-10-01 | 安徽瑞科玛电池有限公司 | A kind of lithium battery drying unit |
CN111380349A (en) * | 2018-12-28 | 2020-07-07 | 扬博科技股份有限公司 | Microwave drying device for substrate process |
CN115540521A (en) * | 2021-06-29 | 2022-12-30 | 显示器生产服务株式会社 | Substrate drying device |
-
2014
- 2014-02-17 CN CN201410053061.4A patent/CN104848668A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106345649A (en) * | 2016-11-22 | 2017-01-25 | 中国科学技术大学 | Method and device for applying micro-nano particles |
CN106345649B (en) * | 2016-11-22 | 2020-01-03 | 中国科学技术大学 | Method and equipment for coating micro-nano particles |
CN108266972A (en) * | 2017-12-26 | 2018-07-10 | 德淮半导体有限公司 | Drying wafer method |
CN110296583A (en) * | 2018-03-21 | 2019-10-01 | 安徽瑞科玛电池有限公司 | A kind of lithium battery drying unit |
CN111380349A (en) * | 2018-12-28 | 2020-07-07 | 扬博科技股份有限公司 | Microwave drying device for substrate process |
CN115540521A (en) * | 2021-06-29 | 2022-12-30 | 显示器生产服务株式会社 | Substrate drying device |
CN115540521B (en) * | 2021-06-29 | 2024-03-19 | 显示器生产服务株式会社 | Substrate drying device |
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Application publication date: 20150819 |
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