CN213624441U

CN213624441U - Supporting layering copper billet conducting structure for electroplating processing

Info

Publication number: CN213624441U
Application number: CN202022436441.XU
Authority: CN
Inventors: 赵伟华; 洪礼
Original assignee: Wuxi Guangwei Environmental Protection Technology Co ltd
Current assignee: Wuxi Guangwei Environmental Protection Technology Co ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-07-06
Anticipated expiration: 2030-10-28

Abstract

The utility model discloses an electroplating process is with supporting layering copper billet conducting structure relates to electroplating process equipment technical field, has solved current conducting structure, and it is mostly the installation of stewing to electroplate the board, can not rotate in a flexible way and can not the layering centre gripping electroplate the plate, makes the fixed quantity of centre gripping to the plate less, the relatively poor problem of batch processing performance. A supporting layered copper block conductive structure for electroplating processing comprises PP mounting blocks, wherein the PP mounting blocks are symmetrically provided with two positions, and a rectangular PP mounting plate is fixed at the top ends of the two PP mounting blocks; four screw holes are symmetrically formed in the PP mounting plate, and bolts are meshed with the four screw holes in a threaded manner; a rectangular bottom plate is arranged at the top end of the PP mounting plate, and the rectangular bottom plate is locked and fixed through four bolts at four corners of the PP mounting plate. The utility model discloses the cooperation of the electrically conductive copper of different high positions is rotated and is deviate from the use and can the different electroplating plate of centre gripping thickness, and is compatible good, uses comparatively extensively.

Description

Supporting layering copper billet conducting structure for electroplating processing

Technical Field

The utility model relates to an electroplating processing equipment technical field specifically is an electroplating processing is with supporting layering copper billet conducting structure.

Background

The electroplating process is a process that metal ions in the plating solution are reduced into metal atoms through electrode reaction under the action of an external electric field, and metal deposition is carried out on a cathode. Therefore, the method is a metal electrodeposition process comprising the steps of liquid phase mass transfer, electrochemical reaction, electric crystallization and the like. Electroplating apparatus generally include conductive structures for conducting electricity.

For example, patent No. CN201920270028.5 discloses an electroplating conductive contact structure, which comprises a pump, a water storage tank is arranged on one side of the pump, the water storage tank is provided with a cathode box inlet and outlet pipe connected with a cathode box, one side of the cathode box close to the cathode box inlet and outlet pipe is provided with a rectifier cathode contact, a common cathode conductive copper spring and a common cathode conductive copper are arranged in a cavity of the cathode box, a conductive block is arranged at the upper end of the cathode box, the conductive block is connected with a clamp connecting rod through a bolt, a clamp is arranged at the middle lower end of the clamp connecting rod, and chains are arranged on two sides of the upper. The utility model has the advantages that: the cathode power supply transmits the common-cathode conductive copper through the cathode contact, the equipment runs for a long time, the common-cathode conductive copper is moved up and down through the common-cathode conductive copper spring, in order to cool the conductive copper in contact, water in the water storage tank is utilized in the cavity of the cathode box, the water in the water storage tank can be recycled, the water can be used for making the common-cathode conductive copper contact with the conductive blocks better than the conductor, and the conductive blocks arranged on each connecting rod are driven by the chain.

The electroplating plate of current conducting structure is mostly the installation of stewing, can not rotate in a flexible way and can not the layering centre gripping electroplate the plate, and it is less to make the fixed quantity of centre gripping of plate, and processing performance is relatively poor in batches, and compatibility is not good enough in addition, need frequently to make a round trip to change conductive fixture during the plate of the different thickness of centre gripping, and the operation is used comparatively trouble hard.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplate processing with supporting layering copper billet conducting structure to the electroplate board of proposing in solving above-mentioned background art is mostly the installation of stewing, can not rotate in a flexible way and can not the layering centre gripping electroplate the plate, makes the fixed quantity of centre gripping to the plate less, the relatively poor problem of batch processing performance.

In order to achieve the above object, the utility model provides a following technical scheme: a supporting layered copper block conductive structure for electroplating processing comprises PP mounting blocks, wherein the PP mounting blocks are symmetrically provided with two positions, and a rectangular PP mounting plate is fixed at the top ends of the two PP mounting blocks; four screw holes are symmetrically formed in the PP mounting plate, and bolts are meshed with the four screw holes in a threaded manner; a rectangular bottom plate is arranged at the top end of the PP mounting plate and is locked and fixed through four bolts at four corners on the PP mounting plate; the bottom plate comprises a second conducting rod, the left rear side of the top end of the bottom plate is supported and welded with the second conducting rod, and the upper half section of the second conducting rod is screwed and sleeved with a jacking nut.

Preferably, the bottom plate further comprises a first conducting rod and an L-shaped supporting plate, the first conducting rod is welded at the left rear side of the bottom plate in a vertical supporting mode, and the L-shaped supporting plate is horizontally welded at the top end of the first conducting rod.

Preferably, the bottom plate further comprises a conductive copper plate, the first conductive rods are arranged on the right sides of the second conductive rods at intervals, and a row of rectangular conductive copper plates are arranged on the second conductive rods in a stacked and rotating manner.

Preferably, the tightening nut comprises a spring, the bottom of the tightening nut is fixedly welded with a spring, the spring is sleeved on the second conductive rod in a sliding manner, and the tail end of the spring abuts against a topmost conductive copper plate in a pressing manner.

Preferably, one row of the conductive copper plates rotate around the second conductive rod for 270 degrees, and the spacing groove between the two rotated conductive copper plates is used for clamping and fixing the electroplating plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the direction of the row of conductive copper plates can be freely adjusted along the second conductive rod, the use is flexible and convenient, a plurality of electroplating plates can be supported and clamped at different heights and angle positions in a layering way, the clamping and installing quantity of the conductive structure to the electroplating plates is effectively increased, the batch electroplating processing performance of the conductive structure is improved, and the practicability is better;

2. this practical not electrically conductive copper cooperation of co-altitude position is rotated and is deviate from the use and can the different electroplating plate of centre gripping thickness, and is compatible good, uses comparatively extensively, saves the trouble that the electrically conductive clamping device of the change comes to be suitable for different thickness plates that makes a round trip, uses convenient operation swift laborsaving.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a left side view of the structure of the present invention;

FIG. 3 is a right side view of the structure of the present invention;

fig. 4 is a schematic top view of the present invention;

in the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a PP mounting block; 2. mounting a PP plate; 3. a base plate; 301. a first conductive rod; 302. a second conductive rod; 303. a conductive copper plate; 304. an L-shaped support plate; 4. tightly pushing the screw cap; 401. a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 4, the present invention provides an embodiment: a supporting layered copper block conductive structure for electroplating processing comprises PP mounting blocks 1, wherein the PP mounting blocks 1 are symmetrically provided with two positions, and a rectangular PP mounting plate 2 is fixed at the top ends of the two PP mounting blocks 1; four screw holes are symmetrically formed in the PP mounting plate 2, and a bolt is engaged in each screw hole in a threaded manner; a rectangular bottom plate 3 is arranged at the top end of the PP mounting plate 2, and the rectangular bottom plate 3 is locked and fixed through four bolts at four corners of the PP mounting plate 2; the bottom plate 3 comprises a second conducting rod 302, the left rear side position of the top end of the bottom plate 3 is supported and welded with the second conducting rod 302, and the upper half section of the second conducting rod 302 is screwed and sleeved with a jacking nut 4; the bottom plate 3 further comprises a first conducting rod 301 and an L-shaped supporting plate 304, the first conducting rod 301 is vertically welded at the left rear side of the bottom plate 3, and the L-shaped supporting plate 304 is horizontally welded at the top end of the first conducting rod 301.

Further, bottom plate 3 still includes electrically conductive copper 303, first conducting rod 301 interval is located the right side of second conducting rod 302, and second conducting rod 302 goes up to pile up to be listed as changeing the cover and install one row of rectangle electrically conductive copper 303, one row of electrically conductive copper 303 can follow second conducting rod 302 free rotation and adjust the direction, it is nimble convenient to use, can support the centre gripping in different height and angle position with the electroplating plate layering of many places, the centre gripping installation quantity of electrically conductive structure to electroplating plate has effectively been increased, electrically conductive structure's batch electroplating process performance has been promoted, has better practicality.

Further, the tightening nut 4 includes a spring 401, the bottom of the tightening nut 4 is welded and fixed with a spring 401, the spring 401 is sleeved on the second conductive rod 302, the tail end of the spring 401 abuts against the topmost conductive copper plate 303, the tightening nut 4 cooperates with the spring 401 to press the row of conductive copper plates 303 downwards, and the electroplated plates clamped on the row of conductive copper plates 303 are fixed.

Further, one row electrically conductive copper 303 carries out 270 rotations around second conducting rod 302, and rotates the spacing groove between two electrically conductive copper 303 of deviating from and be used for the fixed electroplating plate of centre gripping, and the electrically conductive copper 303 cooperation of different high positions is rotated and is deviate from the use and can centre gripping different electroplating plate of thickness, and is compatible good, uses comparatively extensively, saves to make a round trip to change the trouble that electrically conductive clamping device suitable for different thickness plates, uses convenient operation swift laborsaving.

The working principle is as follows: one row of electrically conductive copper 303 can follow second conducting rod 302 free rotation direction of regulation, convenient and flexible to use, can support the centre gripping in height and angle position of difference with many places electroplating plate layering, the centre gripping installation quantity of electrically conductive structure to electroplating plate has effectively been increased, the batch electroplating processing performance of electrically conductive structure has been promoted, better practicality has, top tight nut 4 cooperates spring 401 to use together and can push up one row of electrically conductive copper 303 downwards, it is fixed with the electroplating plate of centre gripping on one row of electrically conductive copper 303, the electrically conductive copper 303 cooperation of different altitude positions is rotated and is deviate from the use and can centre gripping different electroplating plate of thickness, good compatibility, use comparatively extensively, save the trouble of making a round trip to change electrically conductive clamping device and be suitable for different thickness plates, use convenient operation is swift laborsaving.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an electroplate processing with supporting layering copper billet conducting structure which characterized in that: the device comprises PP mounting blocks (1), wherein the PP mounting blocks (1) are symmetrically provided with two positions, and a rectangular PP mounting plate (2) is fixed at the top ends of the two PP mounting blocks (1); four screw holes are symmetrically formed in the PP mounting plate (2), and a bolt is engaged in each screw hole in a threaded manner; a rectangular bottom plate (3) is arranged at the top end of the PP mounting plate (2), and the rectangular bottom plate (3) is locked and fixed through four bolts at four corners of the PP mounting plate (2); the bottom plate (3) comprises a second conducting rod (302), the left rear side position on the top end of the bottom plate (3) is supported and welded with the second conducting rod (302), and the upper half section of the second conducting rod (302) is screwed and sleeved with a jacking nut (4).

2. The matched layered copper block conductive structure for electroplating processing according to claim 1, wherein: the bottom plate (3) comprises a first conducting rod (301) and an L-shaped supporting plate (304), the first conducting rod (301) is welded at the left rear side of the bottom plate (3) in a vertical supporting mode, and the L-shaped supporting plate (304) is welded at the top end of the first conducting rod (301) in a horizontal mode.

3. The matched layered copper block conductive structure for electroplating processing according to claim 2, wherein: the bottom plate (3) further comprises a conductive copper plate (303), the first conductive rod (301) is located on the right side of the second conductive rod (302) at intervals, and the second conductive rod (302) is stacked up and sleeved with a row of rectangular conductive copper plates (303).

4. The matched layered copper block conductive structure for electroplating processing according to claim 1, wherein: the jacking nut (4) comprises a spring (401), the bottom of the jacking nut (4) is fixedly welded with the spring (401), the spring (401) is sleeved on the second conductive rod (302) in a sliding mode, and the tail end of the spring (401) abuts against one topmost conductive copper plate (303) in a pressing mode.

5. The matched layered copper block conductive structure for electroplating processing according to claim 3, wherein: and the row of conductive copper plates (303) rotates around the second conductive rod (302) for 270 degrees, and the spacing grooves between the two rotated conductive copper plates (303) are used for clamping and fixing the electroplated plates.