CN213578309U - Heat preservation express delivery cabinet - Google Patents
Heat preservation express delivery cabinet Download PDFInfo
- Publication number
- CN213578309U CN213578309U CN202022667113.0U CN202022667113U CN213578309U CN 213578309 U CN213578309 U CN 213578309U CN 202022667113 U CN202022667113 U CN 202022667113U CN 213578309 U CN213578309 U CN 213578309U
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- heat
- inner box
- heat insulation
- box
- plate
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- 238000004321 preservation Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 57
- 238000009413 insulation Methods 0.000 claims abstract description 49
- 238000005057 refrigeration Methods 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 28
- 239000011241 protective layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model discloses a heat-preservation express delivery cabinet, which comprises a cabinet body, wherein the cabinet body comprises a plurality of layers of independent boxes and a plurality of heat-insulation plates; each layer of independent box body comprises a plurality of independent box bodies and a front side box door of each independent box body, each independent box body comprises a heat conduction inner box and a heat preservation jacket, an upper convex part is arranged at the top of the heat conduction inner box, a lower convex part is arranged at the bottom of the heat conduction inner box, and the heat preservation jackets coat the left side, the right side and the rear side of the heat conduction inner box; the interval is provided with a plurality of logical grooves on the heat insulating board, and the lower protrusion one-to-one of each heat conduction inner box bottom portion on adjacent upper strata imbeds the upper portion in each logical inslot, and the last protrusion one-to-one at each heat conduction inner box top of adjacent lower floor imbeds the lower part in each logical inslot, all is provided with the semiconductor refrigeration piece in each logical inslot, and the orientation of the cold junction of two adjacent semiconductor refrigeration pieces is opposite from top to bottom and hot junction. The utility model discloses a semiconductor refrigeration piece realizes the heating and the refrigeration of each independent box, and its equipment and dismantlement of being convenient for, but each independent box arbitrary combination.
Description
Technical Field
The utility model relates to an express delivery cabinet technical field, concretely relates to heat preservation express delivery cabinet.
Background
The time that takeaway delivery personnel can be practiced thrift to the express delivery cabinet, delivery efficiency is improved, need keep warm, keep fresh when takeaway (like food and give birth to the bright) storage, and normal atmospheric temperature express delivery cabinet does not possess heat preservation, fresh-keeping function, and the time that can save takeaway food and give birth to the bright is shorter, in order to satisfy takeaway heat preservation, fresh-keeping requirement, keeps warm express delivery cabinet should take place. Semiconductor refrigeration piece can be used to heat preservation express delivery cabinet's heating and refrigeration, and its theory of operation is: when an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, the current flows from the N-type element to the joint of the P-type element to absorb heat to form a cold end, and flows from the P-type element to the joint of the N-type element to release heat to form a hot end. The cabinet body of current semiconductor refrigeration piece formula heat preservation express delivery cabinet generally adopts the integral type structure, and unable dismantlement can't make up according to required box quantity at will.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model provides a heat preservation express delivery cabinet to realize the heating and the refrigeration of each independent box through the semiconductor refrigeration piece, and its be convenient for equipment and dismantlement, but each independent box arbitrary combination.
The utility model provides a heat-preservation express delivery cabinet, which comprises a cabinet body; the cabinet body comprises a plurality of layers of independent box bodies which are sequentially overlapped from bottom to top and a plurality of heat insulation plates which are correspondingly supported between the independent box bodies in each layer one by one; each layer of independent box body comprises a plurality of independent box bodies which are arranged side by side, the front side of each independent box body is provided with a door capable of being opened and closed, each independent box body comprises a heat-conducting inner box and a heat-insulating jacket, the top of each heat-conducting inner box is provided with an upper convex part which protrudes upwards, the bottom of each heat-conducting inner box is provided with a lower convex part which protrudes downwards, and the heat-insulating jacket is coated on the left side, the right side and the rear side of each heat-conducting inner box; the heat insulation plate is provided with a plurality of through grooves at intervals, lower protruding portions of the bottoms of the heat conduction inner boxes on the adjacent upper layers are embedded into the upper portions of the through grooves in a one-to-one mode, upper protruding portions of the tops of the heat conduction inner boxes on the adjacent lower layers are embedded into the lower portions of the through grooves in a one-to-one mode, semiconductor refrigeration sheets are arranged in the through grooves in the through mode, cold ends and hot ends of the semiconductor refrigeration sheets are in contact with the corresponding upper protruding portions and the corresponding lower protruding portions respectively, and the cold ends and the hot ends of the two semiconductor refrigeration sheets which are adjacent.
The heat insulation cabinet further comprises a fixing frame, wherein the fixing frame comprises a heat insulation bottom plate arranged at the bottom end of the cabinet body, a heat insulation top plate arranged at the top end of the cabinet body and two side fixing plates clamped at two side ends of the cabinet body, and each side fixing plate is respectively fixed on the heat insulation bottom plate, each heat insulation plate and one end of the heat insulation top plate through bolts.
Furthermore, a plurality of first blind grooves are formed in the upper side of the heat insulation bottom plate, lower protruding portions of the bottom of each heat conduction inner box of the bottom layer are embedded into the first blind grooves in a one-to-one correspondence mode, a plurality of second blind grooves are formed in the lower side of the heat insulation top plate, and upper protruding portions of the top of each heat conduction inner box of the top layer are embedded into the second blind grooves in a one-to-one correspondence mode.
Further, the bottom of the first blind groove is provided with a heat conducting plate, and a semiconductor refrigerating piece is arranged between a lower protruding part at the bottom of each heat conducting inner box at the bottom layer and the corresponding heat conducting plate.
Furthermore, each semiconductor refrigeration piece is connected in parallel to the power supply main circuit, and a switch is respectively connected in series on a branch circuit where each semiconductor refrigeration piece is located.
Furthermore, each heat conduction inner box is internally provided with a supporting plate, the supporting plate is supported on the bottom of the heat conduction inner box through a spring, the switch is arranged below the supporting plate, when the supporting plate is pressed down, the supporting plate presses down the switch to switch on the branch where the semiconductor refrigerating piece is located, and when the supporting plate is released, the spring jacks up the supporting plate and releases the switch to switch off the branch where the semiconductor refrigerating piece is located.
Furthermore, the upper sides of the heat insulation plates and the heat insulation bottom plate are provided with wire grooves, the wire grooves in the heat insulation plates are communicated with the through grooves, and the wire grooves in the heat insulation bottom plate are communicated with the first blind grooves.
Further, the heat preservation overcoat is including locating in proper order middle heat preservation and the external protection layer outside the heat conduction inner box.
The beneficial effects of the utility model are embodied in: because the cold and hot both ends of semiconductor refrigeration piece respectively with two upper and lower heat conduction inner box contacts, when the semiconductor refrigeration piece circular telegram, the cold and hot both ends of semiconductor refrigeration piece carry out the heat transfer with two upper and lower heat conduction inner box respectively for one refrigeration, another heating in two upper and lower heat conduction inner box, thereby realize the heating and the refrigeration of each independent box through the semiconductor refrigeration piece.
During the equipment, install the independent box of bottom side by side earlier, will install on the independent box of bottom with the heat insulating board of corresponding length again, the last bulge one-to-one of the heat conduction inner box upper end in each independent box of bottom imbeds each logical inslot on this heat insulating board, then install the semiconductor refrigeration piece in each logical inslot on this heat insulating board again, install the independent box of last layer on this heat insulating board side by side in proper order again, the lower bulge one-to-one of the heat conduction inner box lower extreme in each independent box of last layer imbeds each logical inslot on this heat insulating board, make the semiconductor refrigeration piece press from both sides between two upper and lower heat conduction inner boxes, then continue each layer independent box above-mentioned step installation, can realize the equipment of the fast cabinet body.
The heat-preservation express cabinet is very convenient to assemble and disassemble, and the independent boxes in different numbers can be selected to be combined randomly according to actual requirements during assembly, so that the requirements of different use scenes can be met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a vertical cross-sectional view of an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat insulation board according to an embodiment of the present invention.
In the drawings, 100-independent box; 110-a thermally conductive inner box; 111-an upper projection; 112-lower projection; 113-a pallet; 114-a spring; 115-switch; 120-heat preservation outer sleeve; 121-intermediate insulating layer; 122-outer protective layer; 130-a door; 200-a heat insulation plate; 210-a through slot; 220-wire chase; 300-semiconductor refrigerating sheet; 400-heat insulation bottom plate; 410-a first blind slot; 420-a thermally conductive plate; 500-a thermally insulating roof; 510-a second blind slot; 600-side fixing plate; 610-bolt.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
As shown in fig. 1-3, the embodiment of the utility model provides a heat preservation express delivery cabinet, including the cabinet body, the cabinet body includes from supreme independent box 100 of multilayer and the polylith heat insulating board 200 that supports between independent box 100 of each layer of the support in proper order down.
Every layer of independent box 100 includes a plurality of independent boxes 100 side by side, the front side of independent box 100 is equipped with switch 115's chamber door 130, independent box 100 includes heat conduction inner box 110 and heat preservation overcoat 120, the top of heat conduction inner box 110 is equipped with the bellied epirelief portion 111 that makes progress, the bottom of heat conduction inner box 110 is equipped with bellied lower epirelief portion 112 downwards, heat conduction inner box 110 preferably adopts the metal material that the heat conductivility is strong, heat preservation overcoat 120 cladding is outside heat conduction inner box 110's the left and right sides and rear side.
Specifically, the heat insulating jacket 120 includes an intermediate heat insulating layer 121 and an outer protective layer 122 sequentially disposed outside the heat conducting inner box 110, the intermediate heat insulating layer 121 may be made of heat insulating material such as heat insulating cotton, and the outer protective layer 122 may be made of thin-walled steel plate.
The heat insulation board 200 is provided with a plurality of through grooves 210 at intervals, the lower protrusions 112 at the bottoms of the heat-conducting inner boxes 110 on the adjacent upper layers are embedded into the upper parts of the through grooves 210 in a one-to-one correspondence manner, the upper protrusions 111 at the tops of the heat-conducting inner boxes 110 on the adjacent lower layers are embedded into the lower parts of the through grooves 210 in a one-to-one correspondence manner, the semiconductor chilling plates 300 are arranged in the through grooves 210, the cold ends and the hot ends of the semiconductor chilling plates 300 are respectively contacted with the corresponding upper protrusions 111 and the lower protrusions 112, and the cold ends and the hot ends of the two vertically adjacent semiconductor chilling plates 300 face opposite directions.
Because the cold and hot both ends of semiconductor refrigeration piece 300 contact with two upper and lower heat conduction inner boxes 110 respectively, when semiconductor refrigeration piece 300 circular telegram, the cold and hot both ends of semiconductor refrigeration piece 300 carry out the heat transfer with two upper and lower heat conduction inner boxes 110 respectively for one in two upper and lower heat conduction inner boxes 110 refrigerates, another heating, thereby realizes the heating and the refrigeration of each independent box 100 through semiconductor refrigeration piece 300.
During assembly, the independent box bodies 100 at the bottom layer are firstly installed side by side, then the heat insulation boards 200 with corresponding lengths are installed on the independent box bodies 100 at the bottom layer, the upper convex parts 111 at the upper ends of the heat conduction inner boxes 110 in the independent box bodies 100 at the bottom layer are correspondingly embedded into the through grooves 210 on the heat insulation boards 200 one by one, then the semiconductor refrigeration pieces 300 are installed in the through grooves 210 on the heat insulation boards 200, then the independent box bodies 100 at the upper layer are sequentially installed on the heat insulation boards 200 side by side, the lower convex parts 112 at the lower ends of the heat conduction inner boxes 110 in the independent box bodies 100 at the upper layer are correspondingly embedded into the through grooves 210 on the heat insulation boards 200 one by one, so that the semiconductor refrigeration pieces 300 are clamped between the upper and lower heat conduction inner boxes 110, and then the steps are continuously repeated for installing the independent.
The heat-preservation express cabinet is very convenient to assemble and disassemble, and the independent boxes 100 in different quantities can be selected to be combined randomly according to actual requirements during assembly, so that the requirements of different use scenes can be met.
In a preferred embodiment, the fixing frame comprises an insulating bottom plate 400 disposed at the bottom of the cabinet, an insulating top plate 500 disposed at the top of the cabinet, and two side fixing plates 600 clamped at two sides of the cabinet, wherein each side fixing plate 600 is fixed to one end of the insulating bottom plate 400, each insulating plate 200 and the insulating top plate 500 by bolts 610. When the fixing frame is installed, the cabinet body is assembled on the heat insulation bottom plate 400, the heat insulation top plate 500 covers the top end of the cabinet body, the side fixing plates 600 are installed at the two side ends of the cabinet body, the two side fixing plates 600 are fixed to the side ends of the heat insulation bottom plate 400, the heat insulation plates 200 and the heat insulation top plate 500 through bolts 610, the assembled cabinet body can be further fixed, and the stability of the overall structure of the express cabinet is improved.
Preferably, the upper side of the heat insulation bottom plate 400 is provided with a plurality of first blind grooves 410, the lower convex portions 112 at the bottom of each heat conduction inner box 110 at the bottom layer are embedded into the first blind grooves 410 in a one-to-one manner, the lower side of the heat insulation top plate 500 is arranged in a plurality of second blind grooves 510, and the upper convex portions 111 at the top of each heat conduction inner box 110 at the top layer are embedded into the second blind grooves 510 in a one-to-one manner.
In this embodiment, the bottom of the first blind groove 410 is provided with a heat conducting plate 420, the semiconductor refrigerating fins 300 are disposed between the lower protrusions 112 at the bottom of each heat conducting inner box 110 at the bottom layer and the corresponding heat conducting plate 420, one end of each semiconductor refrigerating fin 300 in the first blind groove 410 heats or refrigerates the heat conducting inner box 110 at the bottom layer, and the other end exchanges heat with the outside through the heat conducting plate 420, thereby ensuring the heating or refrigerating effect.
In this embodiment, each semiconductor refrigeration piece 300 is connected in parallel to the power supply main circuit, and a switch 115 is respectively connected in series on a branch where each semiconductor refrigeration piece 300 is located, so as to ensure that the work of each semiconductor refrigeration piece 300 can be controlled independently, and the switch 115 of the semiconductor refrigeration piece 300 on the lower portion of the independent box body 100 is turned on when the independent box body 100 needs to be used, so that energy waste can be reduced, and the purposes of energy conservation and emission reduction can be achieved.
Preferably, a supporting plate 113 is arranged in each heat-conducting inner box 110, the supporting plate 113 is supported on the bottom of the heat-conducting inner box 110 through a spring 114, a switch 115 is arranged below the supporting plate 113, when the supporting plate 113 is pressed down, the supporting plate 113 presses the switch 115 to switch on the branch where the semiconductor chilling plate 300 is located, and when the supporting plate 113 is released, the spring 114 jacks the supporting plate 113 and releases the switch 115 to switch off the branch where the semiconductor chilling plate 300 is located.
On one hand, as the semiconductor refrigeration piece 300 is directly contacted with the bottom of the heat-conducting inner box 110, the temperature of the bottom of the heat-conducting inner box 110 contacted with the hot end of the semiconductor refrigeration piece 300 is higher, and the temperature of the bottom of the heat-conducting inner box 110 contacted with the cold end of the semiconductor refrigeration piece 300 is lower, when the semiconductor refrigeration piece is used, a takeout is placed on the supporting plate 113, but is not directly contacted with the bottom of the heat-conducting inner box 110, so that the local part of the takeout can be prevented from being scalded or frozen; on the other hand, the takeout is placed on the supporting plate 113, the supporting plate 113 descends, the spring 114 is compressed, the supporting plate 113 presses the switch 115 to switch on the branch where the semiconductor chilling plate 300 is located, the semiconductor chilling plate 300 is switched on to work, after the takeout is taken out, the supporting plate 113 is released, the supporting plate 113 is jacked up by the spring 114, the switch 115 is bounced, the semiconductor chilling plate 300 is powered off to stop working, and therefore the semiconductor chilling plate 300 is enabled to automatically start to work when the takeout is put in, and the semiconductor chilling plate 300 is automatically stopped to work when the takeout is taken out.
In order to facilitate the wiring of the live wire shaft and the neutral wire shaft of the main power supply path, the upper sides of each heat insulation plate 200 and the heat insulation bottom plate 400 are respectively provided with a wire groove 220, the wire grooves 220 on the heat insulation plates 200 are communicated with each through groove 210, and the wire grooves 220 on the heat insulation bottom plate 400 are communicated with each first blind groove 410.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (8)
1. The utility model provides a heat preservation express delivery cabinet, includes the cabinet body, its characterized in that:
the cabinet body comprises a plurality of layers of independent box bodies which are sequentially overlapped from bottom to top and a plurality of heat insulation plates which are correspondingly supported between the independent box bodies in each layer one by one;
each layer of independent box body comprises a plurality of independent box bodies which are arranged side by side, the front side of each independent box body is provided with a door capable of being opened and closed, each independent box body comprises a heat-conducting inner box and a heat-insulating jacket, the top of each heat-conducting inner box is provided with an upper convex part which protrudes upwards, the bottom of each heat-conducting inner box is provided with a lower convex part which protrudes downwards, and the heat-insulating jacket is coated on the left side, the right side and the rear side of each heat-conducting inner box;
the heat insulation plate is provided with a plurality of through grooves at intervals, lower protruding portions of the bottoms of the heat conduction inner boxes on the adjacent upper layers are embedded into the upper portions of the through grooves in a one-to-one mode, upper protruding portions of the tops of the heat conduction inner boxes on the adjacent lower layers are embedded into the lower portions of the through grooves in a one-to-one mode, semiconductor refrigeration sheets are arranged in the through grooves in the through mode, cold ends and hot ends of the semiconductor refrigeration sheets are in contact with the corresponding upper protruding portions and the corresponding lower protruding portions respectively, and the cold ends and the hot ends of the two semiconductor refrigeration sheets which are adjacent.
2. The insulated express delivery cabinet of claim 1, wherein: the heat insulation cabinet is characterized by further comprising a fixing frame, wherein the fixing frame comprises a heat insulation bottom plate arranged at the bottom end of the cabinet body, a heat insulation top plate arranged at the top end of the cabinet body and two side fixing plates clamped at two side ends of the cabinet body, and each side fixing plate is respectively fixed on the heat insulation bottom plate, the heat insulation plates and one end of the heat insulation top plate through bolts.
3. The insulated express delivery cabinet of claim 2, wherein: the upper side of the heat insulation bottom plate is provided with a plurality of first blind grooves, the lower convex parts of the bottom of each heat conduction inner box at the bottom layer are embedded into the first blind grooves in a one-to-one correspondence mode, the lower side of the heat insulation top plate is provided with a plurality of second blind grooves, and the upper convex parts of the top of each heat conduction inner box at the top layer are embedded into the second blind grooves in a one-to-one correspondence mode.
4. A thermal express cabinet according to claim 3, wherein: the bottom of the first blind groove is provided with a heat conducting plate, and a semiconductor refrigerating sheet is arranged between the lower protruding part of the bottom of each heat conducting inner box of the bottom layer and the corresponding heat conducting plate.
5. The insulated express delivery cabinet of claim 4, wherein: each semiconductor refrigeration piece is connected in parallel to a power supply main circuit, and a switch is respectively connected in series on a branch circuit where each semiconductor refrigeration piece is located.
6. The insulated express delivery cabinet of claim 5, wherein: each the heat conduction inner box is internally provided with a supporting plate, the supporting plate is supported on the bottom of the heat conduction inner box through a spring, the switch is arranged below the supporting plate, when the supporting plate is pressed down, the supporting plate presses down the switch to switch on the branch where the semiconductor refrigeration piece is located, and when the supporting plate is released, the spring jacks up the supporting plate and releases the switch to switch off the branch where the semiconductor refrigeration piece is located.
7. The insulated express delivery cabinet of claim 5 or 6, wherein: and the upper sides of the heat insulation plates and the heat insulation bottom plate are respectively provided with a wire groove, the wire grooves on the heat insulation plates are communicated with the through grooves, and the wire grooves on the heat insulation bottom plate are communicated with the first blind grooves.
8. The insulated express delivery cabinet of claim 1, wherein: the heat preservation overcoat is including locating in proper order middle heat preservation and the external protection layer outside the heat conduction inner box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022667113.0U CN213578309U (en) | 2020-11-17 | 2020-11-17 | Heat preservation express delivery cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022667113.0U CN213578309U (en) | 2020-11-17 | 2020-11-17 | Heat preservation express delivery cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213578309U true CN213578309U (en) | 2021-06-29 |
Family
ID=76538544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022667113.0U Expired - Fee Related CN213578309U (en) | 2020-11-17 | 2020-11-17 | Heat preservation express delivery cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213578309U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113397361A (en) * | 2021-07-08 | 2021-09-17 | 华春新能源股份有限公司 | Bright express delivery cabinet is given birth to energy-conserving multi-temperature-zone |
| CN115077195A (en) * | 2022-06-14 | 2022-09-20 | 极速(广东)冷链设备有限公司 | Energy-saving catering express cabinet based on semiconductor refrigeration sheet and temperature control method |
-
2020
- 2020-11-17 CN CN202022667113.0U patent/CN213578309U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113397361A (en) * | 2021-07-08 | 2021-09-17 | 华春新能源股份有限公司 | Bright express delivery cabinet is given birth to energy-conserving multi-temperature-zone |
| CN113397361B (en) * | 2021-07-08 | 2022-05-17 | 华春新能源股份有限公司 | Bright express delivery cabinet is given birth to energy-conserving multi-temperature-zone |
| CN115077195A (en) * | 2022-06-14 | 2022-09-20 | 极速(广东)冷链设备有限公司 | Energy-saving catering express cabinet based on semiconductor refrigeration sheet and temperature control method |
| CN115077195B (en) * | 2022-06-14 | 2024-03-12 | 极速(广东)冷链设备有限公司 | Energy-saving catering express cabinet based on semiconductor refrigerating sheet and temperature control method |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210629 |