CN213532157U

CN213532157U - Grinding clamp for micro suspended optical waveguide chip

Info

Publication number: CN213532157U
Application number: CN202022605869.2U
Authority: CN
Inventors: 郜飞飞; 尹小杰; 孙静雯; 常夏森
Original assignee: HENAN SHIJIA PHOTONS TECHNOLOGY CO LTD
Current assignee: HENAN SHIJIA PHOTONS TECHNOLOGY CO LTD
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2021-06-25
Anticipated expiration: 2030-11-12

Abstract

The utility model provides a grinding anchor clamps for miniature unsettled optical waveguide chip, including hypoplastron and apron, be equipped with the recess of single side area chamfer on the hypoplastron, be equipped with V type groove on the apron, the recess forms with optical waveguide chip assorted centre gripping chamber with the cooperation of V type groove, recess and the fixed optical waveguide chip of apron cooperation. The utility model discloses the beneficial effect who produces is: the substrate, the clamping plate, the chamfering clamping plate and the cover plate are respectively tightly attached to the optical waveguide chip, so that the optical waveguide chip is effectively fixed, and the end face of the optical waveguide chip is conveniently ground; the V-shaped groove and the chamfer structure correspond to the suspension structure of the optical waveguide chip, so that the suspension structure on the optical waveguide chip is prevented from being damaged; utilize hot melt adhesive mounting fixture to guarantee structural stability.

Description

Grinding clamp for micro suspended optical waveguide chip

Technical Field

The utility model relates to an optical waveguide chip's grinding and polishing processing field especially indicates a grinding anchor clamps that is used for miniature unsettled optical waveguide chip.

Background

In the industries of semiconductors, optical communication, mechanical processing and the like, after a general optical waveguide chip is processed, end face coupling cannot be directly carried out, the edge of the chip is uneven and not smooth, and the loss of the directly-carried end face coupling is large; to achieve end-coupling, the chip end-faces need to be smoothed. The most common grinding and polishing method is to use a grinder to fix the product in a fixture, place the product on a grinding disc, add a proper amount of grinding fluid, and utilize the rotation of the grinding disc to generate friction with the product, so as to achieve the purposes of thinning, grinding and chamfering by controlling the grinding time.

In actual processing, in the grinding and polishing mode of the micro optical waveguide chip, the size of the micro chip is small, a conventional clamping device cannot be used, clamping, grinding and polishing are difficult to carry out, a micro optical waveguide device with a suspension structure is difficult to effectively protect the suspension structure, and the chip is easy to damage.

SUMMERY OF THE UTILITY MODEL

The utility model provides a grind anchor clamps for miniature unsettled optical waveguide chip has solved the problem that miniature chip is difficult to the centre gripping among the prior art.

The technical scheme of the utility model is realized like this:

the utility model provides a grinding fixture for miniature unsettled optical waveguide chip, includes hypoplastron and apron, is equipped with the recess of single side area chamfer on the hypoplastron, is equipped with V type groove on the apron, the recess with V type groove cooperation form with optical waveguide chip assorted centre gripping chamber, the recess with lap cooperation fixed optical waveguide chip, make things convenient for the terminal surface grinding of optical waveguide chip.

The hypoplastron include base plate, splint and chamfer splint set up on the base plate side by side and form the recess jointly with the base plate, chamfer splint are close to splint side upper end and are equipped with the chamfer, the chamfer corresponds with V type groove and reserves the space and avoids destroying the unsettled structure on the optical waveguide chip.

The interval distance between the clamping plate and the chamfering clamping plate is equal to the width of the optical waveguide chip, the heights of the clamping plate and the chamfering clamping plate are equal to the height of the optical waveguide chip, and the end faces of the substrate, the clamping plate, the chamfering clamping plate and the cover plate are flush and the widths of the end faces of the substrate, the clamping plate, the chamfering clamping plate and the cover plate are approximately equal to the length of the optical waveguide.

The chamfering angle on the chamfering clamping plate is 40-45 degrees, and preferably 45 degrees.

V type groove angle be 110~130 degrees, preferred, V type groove angle is 120 degrees, V type groove width more than or equal to unsettled structure's width and V type groove left side sideline lie in between splint and the chamfer splint, avoid unsettled structure.

The length of the substrate and the cover plate is 13 times of the width of the optical waveguide chip, and the length of the clamping plate and the length of the chamfering clamping plate are 6 times of the width of the optical waveguide chip.

The base plate, the clamping plate, the chamfering clamping plate and the cover plate are all made of silicon dioxide.

The hot melt adhesive is adopted for fixing between the base plate and the clamping plate and between the clamping plate and the cover plate, and the hot melt adhesive is adopted for fixing between the base plate and the chamfering clamping plate and between the chamfering clamping plate and the cover plate.

The utility model discloses the beneficial effect who produces is: the substrate, the clamping plate, the chamfering clamping plate and the cover plate are respectively tightly attached to the optical waveguide chip, so that the optical waveguide chip is effectively fixed, and the end face of the optical waveguide chip is conveniently ground; the V-shaped groove and the chamfer structure correspond to the suspension structure of the optical waveguide chip, so that the suspension structure on the optical waveguide chip is prevented from being damaged; utilize hot melt adhesive mounting fixture to guarantee structural stability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a grinding fixture for a micro suspended optical waveguide chip according to the present invention.

Fig. 2 is a front view of the grinding fixture structure for a micro suspended optical waveguide chip according to the present invention.

In the figure: 1-substrate, 2-clamping plate, 3-chamfering clamping plate, 4-cover plate, 5-chamfering, 6-V-shaped groove, 7-optical waveguide chip and 8-suspended structure.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.

As shown in fig. 1, 2, embodiment 1, a grinding fixture for miniature unsettled optical waveguide chip, including hypoplastron and apron 4, be equipped with the recess of single side area chamfer on the hypoplastron, the hypoplastron includes base plate 1, splint 2 and chamfer splint 3, base plate 1, splint 2, chamfer splint 3 and apron 4 are the cuboid structure, between base plate 1 and the splint 2, it is fixed all to adopt the hot melt adhesive between splint 2 and the apron 4, between base plate 1 and the chamfer splint 3, it is fixed all to adopt the hot melt adhesive between chamfer splint 3 and the apron 4, the hot melt adhesive mounting fixture guarantees anchor clamps structural stability, splint 2 and chamfer splint 3 set up side by side on base plate 1 and form the recess jointly with base plate 1, be equipped with V type groove on the apron 4, the recess forms with optical waveguide chip 7 assorted centre gripping chambeies with V type.

Further, splint 2 and chamfer splint 3's interval distance equal the width of optical waveguide chip 7, splint 2 and chamfer splint 3 highly all equal the height of optical waveguide chip 7, the terminal surface of base plate, splint, chamfer splint and apron flushes and the width all approximately equals with the length of optical waveguide chip, base plate, splint, chamfer splint and apron paste tight optical waveguide chip respectively, the effective fixed light waveguide chip makes things convenient for the end face grinding of optical waveguide chip.

Further, chamfer splint 3 be close to splint 2 side upper end department and be equipped with the chamfer, preferably, the chamfer angle is 45 degrees, 4 inboard being close to chamfer splint 3 chamfer positions of apron is equipped with V type groove 6, preferably, V type groove angle is 120 degrees, 6 width more than or equal to suspended structure 8 in V type groove and 6 left side sidelines in V type groove are located between splint 2 and chamfer splint 3, avoid suspended structure 8, play the effect of protection suspended structure 8.

Further, the length of base plate 1 and apron 4 be 13 times of 7 width of optical waveguide chip, the length of splint 2 and chamfer splint 3 is 6 times of 7 width of optical waveguide chip, optical waveguide chip 7 is placed in the middle of base plate 1, splint 2 and chamfer splint 3 set up in 7 both sides of optical waveguide chip, splint 2 and chamfer splint 3 outer end flush with the both ends of base plate 1 and apron 4.

During the use, place optical waveguide chip 7 at base plate 1 top center, place splint 2 and chamfer splint 3 in optical waveguide chip 7 both sides and fixed with the hot melt adhesive, later fix splint 2 and chamfer splint 3 top with the hot melt adhesive with apron 4, whole anchor clamps structure is accomplished, can fill liquid wax at the gap department that chamfer and V type groove 6 left out at last, further protect unsettled structure 8.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The grinding clamp for the micro suspended optical waveguide chip comprises a lower plate and a cover plate (4), and is characterized in that a groove with a single-side chamfer is formed in the lower plate, a V-shaped groove is formed in the cover plate (4), and the groove and the V-shaped groove are matched to form a clamping cavity matched with the optical waveguide chip (7).

2. The grinding fixture for the micro suspended optical waveguide chip according to claim 1, wherein the lower plate comprises a substrate (1), a clamping plate (2) and a chamfering clamping plate (3), the clamping plate (2) and the chamfering clamping plate (3) are arranged side by side on the substrate (1) to form a groove together with the substrate (1), and the upper end of the chamfering clamping plate (3) close to the clamping plate (2) side is provided with a chamfer.

3. The lapping fixture for miniature suspended optical waveguide chips as claimed in claim 2, wherein the distance between the clamping plate (2) and the chamfering clamping plate (3) is equal to the width of the optical waveguide chip (7), and the heights of the clamping plate (2) and the chamfering clamping plate (3) are equal to the height of the optical waveguide chip (7).

4. The grinding fixture for the micro suspended optical waveguide chip according to claim 2, wherein the chamfer angle on the chamfer clamp plate (3) is 40-45 degrees.

5. The grinding clamp for the micro suspended optical waveguide chip according to claim 1, wherein the angle of the V-shaped groove (6) is 110-130 degrees, the width of the V-shaped groove (6) is greater than or equal to that of the suspended structure (8), and the left side line of the V-shaped groove (6) is located between the clamping plate (2) and the chamfering clamping plate (3).

6. The grinding fixture for the micro suspended optical waveguide chip according to claim 2, characterized in that the length of the base plate (1) and the cover plate (4) is 13 times of the width of the optical waveguide chip (7), and the length of the clamping plate (2) and the chamfering clamping plate (3) is 6 times of the width of the optical waveguide chip (7).

7. The grinding fixture for the micro suspended optical waveguide chip according to claim 2, characterized in that the base plate (1), the clamping plate (2), the chamfering clamping plate (3) and the cover plate (4) are all silicon dioxide plates.

8. The grinding fixture for the micro suspended optical waveguide chip according to claim 2, characterized in that the substrate (1) and the clamping plate (2) and the cover plate (4) are fixed by hot melt adhesive, and the substrate (1) and the chamfering clamping plate (3) and the cover plate (4) are fixed by hot melt adhesive.