CN213520281U - Integrated millimeter wave phased array antenna integrated framework - Google Patents
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- CN213520281U CN213520281U CN202023009004.6U CN202023009004U CN213520281U CN 213520281 U CN213520281 U CN 213520281U CN 202023009004 U CN202023009004 U CN 202023009004U CN 213520281 U CN213520281 U CN 213520281U
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Abstract
The application discloses integrated millimeter wave phased array antenna integrated architecture, this framework includes: the antenna unit is provided with a rectangular patch and a slot coupling feed layer, the rectangular patch is used for receiving and/or sending an antenna signal, and the slot coupling feed layer is used for feeding the antenna unit; an active power division network and a winding network are arranged in the radio frequency power division winding layer, two ends of the power division network are respectively connected to a radio frequency main port and an assembly main port, two ends of the winding network are respectively connected to a T/R assembly and an antenna unit, and the T/R assembly is connected to the assembly main port; a plurality of groups of power supply networks are arranged in the power control network distribution layer and are used for providing an electric connection network for the module layer; the module layer comprises a radio frequency main port, a T/R component and a power supply low-frequency mixed main port, wherein the power supply low-frequency mixed main port is used for receiving a differential control signal and a primary power supply, and the primary power supply is used for supplying power. Through the technical scheme in the application, the radio frequency leadless interconnection of the component antenna is realized, and the radio frequency loss is reduced.
Description
Technical Field
The application relates to the technical field of antennas, in particular to an integrated millimeter wave phased array antenna integration framework.
Background
The high integration and miniaturization of the 5G millimeter wave phased-array antenna are the development direction of the next-generation communication antenna, along with the continuous improvement of application frequency, the antenna distance is smaller and smaller, and the space size of the whole active array surface is smaller and smaller. The traditional modes of interconnecting a planar microwave circuit, a discrete wave control module, a power supply module, a cable assembly and the like occupy a large number of transverse sizes and longitudinal sizes of an antenna array surface, great troubles are brought to the design of the antenna array surface, the complexity of a system is improved, and the reliability is poor. Therefore, the integrated interconnection design of the T/R component, the wave control, the power supply and the antenna is one of the key technologies for designing the 5G millimeter wave phased array antenna.
The traditional millimeter wave phased array antenna framework is designed independently by adopting antenna units, T/R components, wave control modules, power modules and other systems, and the interconnection among all the subsystems is realized by means of gold wire bonding, connectors, cable components, passive distribution networks and the like. Due to the limitation of the transverse size, only the longitudinal size of the array surface can be utilized, but due to the fact that the millimeter wave band frequency is high, the unit size is small, the precision requirement is high, the interconnection interface is small, the assembly difficulty of the interconnection structure of each component is increased, and the precision of the radio frequency interconnection interface is difficult to guarantee.
Therefore, the millimeter wave phased array antenna framework formed by the traditional discrete network, the electric connector and the cable assembly interconnection mode has the problems of large feed network size, heavy weight, low reliability, large loss, poor consistency, poor maintainability and the like, and is not beneficial to debugging and maintaining the antenna array surface.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: by adopting the integrated design of the patch antenna and the comprehensive motherboard, the radio frequency leadless interconnection of the component antenna is realized, the radio frequency loss is reduced, the longitudinal size of the array surface is effectively reduced, and the cost of the array surface is greatly reduced.
The technical scheme of the application is as follows: an integrated millimeter wave phased array antenna integration architecture is provided, the architecture comprising: the antenna comprises an antenna unit, a radio frequency power distribution winding layer, a power control network distribution layer and a module layer; the antenna unit is provided with a rectangular patch and a slot coupling feed layer, the rectangular patch is used for receiving and/or sending an antenna signal, and the slot coupling feed layer is used for feeding the antenna unit; an active power division network and a winding network are arranged in the radio frequency power division winding layer, two ends of the power division network are respectively connected to a radio frequency main port and an assembly main port, two ends of the winding network are respectively connected to a T/R assembly and an antenna unit, and the T/R assembly is connected to the assembly main port; a plurality of groups of power supply networks are arranged in the power control network distribution layer and are used for providing an electric connection network for the module layer; the module layer comprises a radio frequency main port, a T/R component and a power supply low-frequency mixed main port, wherein the power supply low-frequency mixed main port is used for receiving a differential control signal and a primary power supply, and the primary power supply is used for supplying power.
In any one of the above technical solutions, further, the module layer further includes a transceiver power module, a wave-controlled power module, and a wave-controlled module, and the multiple power supply networks include: a first power supply network, a second power supply network, a third power supply network; two ends of the first power supply network are respectively connected to the power low-frequency hybrid main port and the transceiving power module so as to provide 12V voltage for the transceiving power module; two ends of the second power supply network are respectively connected to the power low-frequency hybrid main port and the wave control power module so as to provide 12V voltage for the wave control power module; and two ends of the third power supply network are respectively connected with the wave control power supply module and the wave control module so as to provide 3.3V voltage for the wave control module.
In any one of the above technical solutions, further, the multiple sets of power supply networks further include: a fourth power supply network, a differential signal network, a single-ended signal control network; two ends of the fourth power supply network are respectively connected to the power supply ends of the transceiving power module and the T/R component so as to supply power to the T/R component; two ends of the differential signal network are respectively connected to the power supply low-frequency hybrid main port and the wave control module so as to provide differential control signals for the wave control module; and two ends of the single-ended signal control network are respectively connected to the wave control module and the control end of the T/R component so as to send a control signal to the T/R component.
In any one of the above technical solutions, further, a cavity digging through hole is provided on the power control network distribution layer, a radio frequency main port is provided in the cavity digging through hole, and the radio frequency main port is welded on the radio frequency power distribution winding layer.
In any one of the above technical solutions, further, the architecture further includes: the copper paste sintering layer comprises a vertical transition hole, a first back drilling hole and a first copper paste sintering layer; the lower end of the vertical transition hole is connected to the bottom layer of the radio frequency power dividing winding layer, and the upper end of the vertical transition hole is connected to the top layer of the antenna unit; the first back drilling hole is formed in the bottom layer of the radio frequency power dividing winding layer, the lower end of the vertical transition hole penetrates through the first back drilling hole, and the first back drilling hole is used for feeding power to the antenna unit through the radio frequency power dividing winding layer; the first copper paste sintering layer is arranged on the top layer of the radio frequency power distribution winding layer, and the vertical transition hole penetrates through the first copper paste sintering layer.
In any one of the above technical solutions, further, the architecture further includes: the vertical via hole, the second back drilling hole and the second copper paste sintering layer are formed; the lower end of the vertical through hole is connected to the T/R component, and the upper end of the vertical through hole is connected to the top layer of the radio frequency power dividing winding layer; the second back drilling hole is formed in the top layer of the radio frequency power dividing winding layer, the upper end of the vertical through hole penetrates through the second back drilling hole, and the second back drilling hole is used for transmitting signals of the T/R assembly through the radio frequency power dividing winding layer; the second copper paste sintering layer is arranged at the bottom of the radio frequency power distribution winding layer, and the vertical through hole penetrates through the second copper paste sintering layer.
In any one of the above technical solutions, further, the antenna unit further includes: a metallized shielding hole and a metal shielding ground; the metallized shielding hole is arranged on the right side of the framework, the metallized shielding ground is arranged between the antenna unit and the radio frequency power distribution winding layer, a resonant cavity is formed by the metallized shielding hole and the metallized shielding ground, and the resonant cavity is used for feeding the rectangular patch on the antenna unit through the gap coupling feeding layer.
The beneficial effect of this application is:
according to the technical scheme, the traditional mode of independent design of subsystems is abandoned, the patch antenna and the integrated design of the integrated motherboard are adopted, and the components, the wave control module and the power supply module are welded on the integrated motherboard by adopting discrete chips, so that the use of interconnection connectors, interconnection cables and other module printed boards is omitted, the radio-frequency leadless interconnection of the component antenna can be realized, the radio-frequency loss is reduced, the longitudinal size of the array surface is effectively reduced, and the array surface cost is greatly reduced.
The integrated design is adopted, the grounds of the antenna, the assembly, the wave control module and the power module are interconnected through the multilayer large-area copper sheets of the integrated motherboard, the antenna resonance caused by the discontinuity of the grounds among the modules is avoided, and the interconnection consistency of the phased array antenna array surface is effectively ensured.
The integrated level is high, compact structure, and the reliability is good, is fit for communicating the millimeter wave band and uses.
1. The integrated level is high, compact structure, and light in weight: the integrated design is carried out on the antenna unit, the T/R component, the wave control module and the power supply module, the multilayer printed board is adopted for lamination, the interconnection of a radio frequency network, a wave control network and a power supply network in the printed board is realized through the technologies of vertical transition, blind holes, back drilling, buried resistance, copper paste sintering and the like, and the component chip, the wave control chip and the power supply chip are welded on the printed board in a surface pasting mode, so that the integrated millimeter wave phased array antenna integrated framework has the characteristics of small size and light weight.
2. The reliability is high: the integrated millimeter wave phased array antenna structure saves cable components and connectors among modules, the array surface wiring is tidy due to the interconnection in the board, a leadless array surface is realized, the assembly is simple, and the reliability of the system is improved.
3. The consistency is good, and the method is suitable for millimeter wave band use: the integrated millimeter wave phased-array antenna integrated framework adopts inter-board radio frequency interconnection, has high processing precision and simple form, removes inconsistency caused by blind-mate interconnection and a connector, and ensures that the electrical property consistency of a system is good.
Drawings
The advantages of the above and/or additional aspects of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a bottom view of an integrated millimeter wave phased array antenna integration architecture according to one embodiment of the present application;
FIG. 2 is a top view of an integrated millimeter wave phased array antenna integration architecture according to one embodiment of the present application;
fig. 3 is a cross-sectional view of a component antenna feed structure of a unified millimeter wave phased array antenna integration architecture according to one embodiment of the present application.
The antenna comprises an antenna unit 1, a radio frequency power distribution layer 2, a power control network distribution layer 3, a module layer 4, a radio frequency main port 5, a power low frequency mixing main port 6, a rectangular patch 7, a vertical via hole 9, a metalized shielding hole 10, a metal shielding ground 11, a T/R component 12, a transmitting and receiving power module 15, a wave control power module 16, a wave control module 17, a vertical transition hole 19, a first back drilling hole 20, a first copper paste sintering layer 21, a second back drilling hole 22 and a second copper paste sintering layer 23.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.
As shown in fig. 1 to 2, the present embodiment provides an integrated millimeter wave phased array antenna integrated architecture, which includes: the antenna comprises an antenna unit 1, a radio frequency power distribution wire layer 2, a power control network distribution layer 3 and a module layer 4, wherein the module layer 4 comprises modules such as components, wave control modules, power supplies and the like.
The integrated structure in this embodiment is laminated for 2 times, and the antenna unit 1 is formed by laminating three core boards through prepregs with a relative dielectric constant of 2.8 and a thickness of 0.12, and the overall thickness of the antenna unit is 1 mm. The three core plates are respectively: the first core plate has a relative dielectric constant of 6.15 and a thickness of 0.254 mm; the second core plate has a relative dielectric constant of 2.2 and a thickness of 0.127 mm; and the third core plate has a relative dielectric constant of 10.2 and a thickness of 0.254 mm. The radio frequency power dividing winding layer 2 is formed by laminating two fourth core plates with the relative dielectric constant of 2.94 and the thickness of 0.239mm through prepregs with the relative dielectric constant of 2.8 and the thickness of 0.12, and the whole thickness of the radio frequency power dividing winding layer is 0.683 mm. The power control network distribution layer 3 was divided into 10 layers in total, laminated with M5 material, and had a thickness of 1.44 mm. The antenna unit 1, the radio frequency power distribution winding layer 2 and the power control network distribution layer 3 are formed by laminating prepregs with a relative dielectric constant of 2.7 and a thickness of 0.09 and a copper paste sintering process, and the total thickness of the integrated framework of the integrated millimeter wave phased array antenna is 3.3mm after lamination.
The antenna unit 1 is provided with a rectangular patch 7 and a slot coupling feed layer, wherein the rectangular patch 7 is used for receiving and/or sending an antenna signal, and the slot coupling feed layer is used for feeding the antenna unit 1; the module layer 4 comprises a radio frequency port 5, a T/R component 12 and a power low frequency hybrid port 6, wherein the power low frequency hybrid port 6 is used for receiving a differential control signal and a primary power supply, and the primary power supply is used for supplying power.
Specifically, as shown in fig. 1 to 2, the architecture includes 256 antenna units 1, 64T/R components 12, 8 transceiver power modules 15, 1 wave control power module 16, 1 wave control module 17, 8 radio frequency ports 5, and 1 power control hybrid port 6, each transceiver power module supplies power to 8 components, each T/R component 12 feeds power to 4 antenna units 1 through a power distribution winding layer 2, and 8 radio frequency ports and 1 power control hybrid port are interconnected with the outside through a cable component.
Further, an active power division network and a winding network are arranged in the radio frequency power division winding layer 2, two ends of the power division network are respectively connected to the radio frequency main port 5 and the component main port, two ends of the winding network are respectively connected to the T/R component 12 and the antenna unit 1, and the T/R component 12 is connected to the component main port; the power control network distribution layer 3 is provided with a plurality of groups of power supply networks, the plurality of groups of power supply networks are used for providing an electric connection network for the module layer 4, wherein the power control network distribution layer 3 is provided with a cavity digging through hole, a radio frequency main port 5 is arranged in the cavity digging through hole, and the radio frequency main port 5 is welded on the radio frequency power distribution winding layer 2.
Specifically, the power wave control main port 6 in the module layer 4 is welded on the lower surface of the integrated architecture, i.e., on the power control network distribution layer 3, by using a low-frequency hybrid connector, and the power and control signals are input to the transceiver power module 15, the wave control power module 16 and the wave control module 17 through the power control network distribution layer 3.
Further, the module layer 4 further includes a transceiver power module 15, a wave control power module 16, and a wave control module 17, and the multiple power supply networks include: a first power supply network, a second power supply network, a third power supply network; the two ends of the first power supply network are respectively connected with the power low-frequency hybrid main port 6 and the transceiving power module 15 so as to provide 12V voltage for the transceiving power module 15; the two ends of the second power supply network are respectively connected to the power low-frequency hybrid main port 6 and the wave control power module 16 so as to provide 12V voltage for the wave control power module 16; the two ends of the third power supply network are respectively connected to the wave control power module 16 and the wave control module 17 to provide 3.3V voltage for the wave control module 17.
In a preferred implementation of this embodiment, the multiple sets of power supply networks further include: a fourth power supply network, a differential signal network, a single-ended signal control network; two ends of the fourth power supply network are respectively connected to the transceiving power module 15 and the power supply end of the T/R component 12 to supply power to the T/R component 12; two ends of the differential signal network are respectively connected to the power low-frequency hybrid main port 6 and the wave control module 17 so as to provide differential control signals for the wave control module 17; two ends of the single-ended signal control network are respectively connected to the wave control module 17 and the control end of the T/R component 12, so as to send a control signal to the T/R component 12.
Specifically, the power control network distribution layer 3 includes a 12V power supply network (first power supply network) from the power low-frequency hybrid bus 6 to the transceiver module 15, and a 12V power supply network (second power supply network) from the transceiver module 15 to the T/R module 12, and 2.5V and 1.8V power supplies (fourth power supply network) from the transceiver module 15 to the T/R module 12, and 3.3V power supplies (third power supply network) from the transceiver module 16 to the wave control module 17, and also includes a differential signal input (differential signal network) from the power low-frequency hybrid bus 6 to the wave control module 17, and a single-ended signal control network from the wave control module 17 to the T/R module 12.
Further, as shown in fig. 3, the architecture further includes: a vertical transition hole 19, a first back-drilled hole 20, and a first copper paste sintered layer 21; the lower end of the vertical transition hole 19 is connected to the bottom layer of the radio frequency power dividing winding layer 2, and the upper end of the vertical transition hole 19 is connected to the top layer of the antenna unit 1; the first back drilling hole 20 is arranged at the bottom layer of the radio frequency power dividing winding layer 2, the lower end of the vertical transition hole 19 passes through the first back drilling hole 20, and the first back drilling hole 20 is used for feeding power to the antenna unit 1 through the radio frequency power dividing winding layer 2; the first copper paste sintering layer 21 is disposed on the top layer of the rf power dividing winding layer 2, and the vertical transition hole 19 passes through the first copper paste sintering layer 21.
Further, the architecture further comprises: the vertical via hole 9, the second back drilled hole 22 and the second copper paste sintering layer 23; the lower end of the vertical via hole 9 is connected to the T/R component 12, and the upper end of the vertical via hole 9 is connected to the top layer of the radio frequency power dividing winding layer 2; the second back-drilled hole 22 is disposed on the top layer of the radio frequency power division winding layer 2, the upper end of the vertical via hole 9 passes through the second back-drilled hole 22, and the second back-drilled hole 22 is used for transmitting a signal of the T/R component 12 through the radio frequency power division winding layer 2; the second copper paste sintering layer 23 is arranged at the bottom of the radio frequency power distribution winding layer 2, and the vertical through hole 9 penetrates through the second copper paste sintering layer 23.
On the basis of the above embodiments, this embodiment further illustrates an implementation manner of a resonant cavity, where the antenna unit 1 further includes: a metallized shielding hole 10 and a metal shielding ground 11; the metallized shielding hole 10 is arranged on the right side of the framework, the metal shielding ground 11 is arranged between the antenna unit 1 and the radio frequency power distribution winding layer 2, the metallized shielding hole 10 and the metal shielding ground 11 form a resonant cavity, and the resonant cavity is used for feeding the rectangular patch 7 on the antenna unit 1 through a gap coupling feed layer.
In this embodiment, the transceiver power module 15 and the wave control power module 16 are all welded on the lower surface of the integrated template in a QFN manner by using discrete power devices, the T/R components 12 and the wave control module 17 are powered by the power control network distribution layer 3, the wave control module 17 is welded on the lower surface of the integrated framework in a BGA ball manner by using discrete control chips, the T/R components 12 are distributed and transmitted by the power control network distribution layer 3, the radio frequency header 5 distributes radio frequency signals with equal amplitude and the like to the T/R components 12 by using the radio frequency power distribution winding layer 2, and the antenna unit 1 is fed by the radio frequency ports of the T/R components 12 through the radio frequency winding layer and the vertical via hole 9.
When the architecture in this embodiment is in a transmitting operation, a transmitting signal enters the architecture from 8 radio frequency bus ports 5, is distributed to 64T/R components 12 with equal amplitude and equal phase through the radio frequency power division winding layer 2, provides an excitation signal for the components, and feeds power to the antenna unit 1 through the radio frequency power division winding layer 2 after the excitation signal is subjected to delay amplification by the components; the differential control signal and the primary power supply enter the framework through the power supply low-frequency mixing main port 6, the power supply control network distribution layer 3 provides signals and power supply input for the wave control and power supply module, and then the power supply and control signals required by the component are provided for the component through the power supply control network distribution layer 3.
When the antenna unit is in receiving operation, the antenna unit 1 sends a received radio frequency signal into the T/R component 12 through the vertical interconnection via 9 and the winding layer, and the radio frequency signal is amplified and synthesized by the T/R component 12, then sent into the frequency division winding layer 2 for synthesis and sent into respective receiving channels.
The technical solution of the present application is described in detail above with reference to the accompanying drawings, and the present application provides an integrated millimeter wave phased array antenna integrated architecture, which includes: the antenna unit is provided with a rectangular patch and a slot coupling feed layer, the rectangular patch is used for receiving and/or sending an antenna signal, and the slot coupling feed layer is used for feeding the antenna unit; an active power division network and a winding network are arranged in the radio frequency power division winding layer, two ends of the power division network are respectively connected to a radio frequency main port and an assembly main port, two ends of the winding network are respectively connected to an assembly and an antenna unit, and the assembly is connected to the assembly main port; a plurality of groups of power supply networks are arranged in the power control network distribution layer and are used for providing an electric connection network for the module layer; the module layer comprises a radio frequency main port, a component and a power low-frequency mixed main port, wherein the power low-frequency mixed main port is used for receiving a differential control signal and a primary power supply, and the primary power supply is used for supplying power. Through the technical scheme in the application, the radio frequency leadless interconnection of the component antenna is realized, and the radio frequency loss is reduced.
In the present application, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The shapes of the various elements in the drawings are illustrative and do not preclude the existence of certain differences from the actual shapes, and the drawings are used for the purpose of illustrating the principles of the present application and are not intended to limit the present application.
Although the present application has been disclosed in detail with reference to the accompanying drawings, it is to be understood that such description is merely illustrative and not restrictive of the application of the present application. The scope of the present application is defined by the appended claims and may include various modifications, adaptations, and equivalents of the subject application without departing from the scope and spirit of the present application.
Claims (7)
1. An integrated millimeter wave phased array antenna integration architecture, the architecture comprising: the antenna comprises an antenna unit (1), a radio frequency power distribution winding layer (2), a power control network distribution layer (3) and a module layer (4);
the antenna unit (1) is provided with a rectangular patch (7) and a slot coupling feed layer, the rectangular patch (7) is used for receiving and/or sending an antenna signal, and the slot coupling feed layer is used for feeding the antenna unit (1);
a power distribution network and a winding network are arranged in the radio frequency power distribution winding layer (2), two ends of the power distribution network are respectively connected to a radio frequency main port (5) and an assembly main port, two ends of the winding network are respectively connected to a T/R assembly (12) and the antenna unit (1), and the T/R assembly (12) is connected to the assembly main port;
a plurality of groups of power supply networks are arranged in the power control network distribution layer (3), and the plurality of groups of power supply networks are used for providing an electric connection network for the module layer (4);
the module layer (4) comprises the radio frequency main port (5), the T/R component (12) and a power supply low-frequency hybrid main port (6), wherein the power supply low-frequency hybrid main port (6) is used for receiving a differential control signal and a primary power supply, and the primary power supply is used for supplying power.
2. The integrated millimeter wave phased array antenna integration architecture of claim 1, wherein the module layer (4) further comprises a transceiver power module (15), a wave-controlled power module (16), a wave-controlled module (17), the multiple sets of power supply networks comprising: a first power supply network, a second power supply network, a third power supply network;
the two ends of the first power supply network are respectively connected with the power low-frequency hybrid main port (6) and the transceiving power supply module (15) so as to provide 12V voltage for the transceiving power supply module (15);
the two ends of the second power supply network are respectively connected with the power low-frequency hybrid main port (6) and the wave-controlled power supply module (16) so as to provide 12V voltage for the wave-controlled power supply module (16);
and two ends of the third power supply network are respectively connected to the wave control power supply module (16) and the wave control module (17) so as to provide 3.3V voltage for the wave control module (17).
3. The integrated millimeter-wave phased array antenna integration architecture of claim 2, wherein the multiple sets of power supply networks further comprise: a fourth power supply network, a differential signal network, a single-ended signal control network;
the two ends of the fourth power supply network are respectively connected with the transceiving power supply module (15) and the power supply end of the T/R component (12) so as to supply power to the T/R component (12);
two ends of the differential signal network are respectively connected to the power low-frequency mixing main port (6) and the wave control module (17) so as to provide the differential control signal for the wave control module (17);
and two ends of the single-ended signal control network are respectively connected to the wave control module (17) and the control end of the T/R component (12) so as to send a control signal to the T/R component (12).
4. The integrated millimeter wave phased-array antenna architecture according to claim 1, wherein a cavity-digging through hole is formed in the power control network distribution layer (3), the radio frequency main port (5) is formed in the cavity-digging through hole, and the radio frequency main port (5) is welded on the radio frequency power distribution winding layer (2).
5. The integrated millimeter-wave phased array antenna integration architecture of claim 1, further comprising: a vertical transition hole (19), a first back-drilled hole (20), and a first copper paste sintered layer (21);
the lower end of the vertical transition hole (19) is connected to the bottom layer of the radio frequency power dividing and winding layer (2), and the upper end of the vertical transition hole (19) is connected to the top layer of the antenna unit (1);
the first back drilling hole (20) is disposed at a bottom layer of the radio frequency power division winding layer (2), a lower end of the vertical transition hole (19) passes through the first back drilling hole (20), and the first back drilling hole (20) is used for feeding power to the antenna unit (1) through the radio frequency power division winding layer (2);
the first copper paste sintering layer (21) is arranged on the top layer of the radio frequency power dividing winding layer (2), and the vertical transition hole (19) penetrates through the first copper paste sintering layer (21).
6. The integrated millimeter-wave phased array antenna integration architecture of claim 5, further comprising: a vertical via hole (9), a second back-drilled hole (22), and a second copper paste sintered layer (23);
the lower end of the vertical via hole (9) is connected to the T/R component (12), and the upper end of the vertical via hole (9) is connected to the top layer of the radio frequency power dividing winding layer (2);
the second back-drilled hole (22) is disposed at a top layer of the radio frequency power division winding layer (2), an upper end of the vertical via hole (9) passes through the second back-drilled hole (22), and the second back-drilled hole (22) is used for transmitting a signal of the T/R component (12) through the radio frequency power division winding layer (2);
the second copper paste sintering layer (23) is arranged at the bottom layer of the radio frequency power dividing winding layer (2), and the vertical through hole (9) penetrates through the second copper paste sintering layer (23).
7. The integrated millimeter wave phased array antenna architecture of any one of claims 1 to 6, wherein the antenna unit (1) further comprises: a metallized shielding hole (10) and a metal shielding ground (11);
the metallized shielding hole (10) is arranged at the right side of the framework, the metal shielding ground (11) is arranged between the antenna unit (1) and the radio frequency power dividing winding layer (2),
the metallized shielding hole (10) and the metal shielding ground (11) form a resonant cavity, and the resonant cavity is used for coupling a feeding layer through the gap and feeding the rectangular patch (7) on the antenna unit (1).
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| CN202023009004.6U CN213520281U (en) | 2020-12-14 | 2020-12-14 | Integrated millimeter wave phased array antenna integrated framework |
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| CN202023009004.6U CN213520281U (en) | 2020-12-14 | 2020-12-14 | Integrated millimeter wave phased array antenna integrated framework |
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