CN213520257U - Double-layer cavity-arrangement structure and combiner - Google Patents

Abstract

The utility model relates to a cavity structure and combiner are arranged to bilayer, and the cavity structure is arranged to bilayer includes: the device comprises a partition plate, a first resonant cavity and a second resonant cavity. The first resonant cavity and the second resonant cavity are respectively arranged on the first side surface and the second side surface of the partition plate. The projection of the first resonant cavity on the partition along the direction perpendicular to the partition is a first projection, and the projection of the second resonant cavity on the partition along the direction perpendicular to the partition is a second projection. The first projection and the second projection are at least partially overlapped or completely overlapped, a coupling through hole is arranged on the partition board corresponding to the overlapped part of the first projection and the second projection, and the first resonant cavity is communicated with the second resonant cavity through the coupling through hole. Any one filtering channel on the first side surface is coupled and distributed on the other side surface in the coupling mode, so that the cavity arrangement difficulty is effectively reduced, and the cavity arrangement flexibility is high. In addition, the cavities can be arranged in the same area of the first side surface and the second side surface, and the miniaturization and low-cost design of products are facilitated.

Description

Double-layer cavity-arrangement structure and combiner

Technical Field

The utility model relates to a mobile communication technology field especially relates to a cavity structure and combiner are arranged to double-deck.

Background

With the development of mobile communication, the multi-system co-construction sharing requires that a plurality of frequency bands of different systems are combined and output through a combiner, and the combining quantity often reaches 10 paths or more. If the conventional single-side cavity arrangement mode is adopted, not only is the combined output difficult to carry out, but also the single-side size is very large and even exceeds the maximum size which can be processed by a machine tool. Therefore, when the number of the passages is large, the cavity arrangement mode with double surfaces is adopted, so that the cavity arrangement difficulty is reduced, and the miniaturization of the device is facilitated.

Traditionally, a double-sided cavity arrangement mode is adopted, and each channel needs to be arranged by selecting different sides according to the requirement of bandwidth allocation of a public port. The disadvantage of this method is that it is easy to make the number of channels arranged on both sides different. For example, the combiner of an embodiment includes 10 filter paths for transmitting different frequency bands, where the 10 filter paths are Path1 (filter Path one), Path2 (filter Path two), Path3, Path4, Path5, Path6, Path7, Path8, Path9, and Path10, respectively. According to the requirement of public port bandwidth allocation, a filter Path for transmitting a high-frequency band is arranged on one side of a double-layer cavity array structure, a filter Path for transmitting a low-frequency band is arranged on the other side of the double-layer cavity array structure, specifically, for example, 6 filter paths including Path1, Path2, Path3, Path4, Path5 and Path6 are arranged on the front side, and the remaining 4 filter paths are arranged on the back side. However, since the number of filter paths arranged on both sides is different, the side with the larger number of filter paths has a larger size, and the side with the smaller number of filter paths has a smaller size, which is not favorable for miniaturization and low-cost design of products.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to overcome the defects of the prior art, and provide a double-layer cavity arrangement structure and a combiner, which can realize double-sided equal-area cavity arrangement, reduce the size of the product, reduce the cavity arrangement difficulty and the processing difficulty, and facilitate the miniaturization and low-cost design of the product.

The technical scheme is as follows: a double-tiered cavity structure, comprising: the first resonant cavity is connected with the first end of the partition plate; the first resonant cavity and the second resonant cavity are respectively arranged on the first side surface and the second side surface of the partition plate; the projection of the first resonant cavity on the partition along the direction perpendicular to the partition is a first projection, and the projection of the second resonant cavity on the partition along the direction perpendicular to the partition is a second projection; at least one part of the first projection and the second projection are overlapped or completely overlapped, a coupling through hole is arranged on the partition board corresponding to the overlapped part of the first projection and the second projection, and the first resonant cavity is communicated with the second resonant cavity through the coupling through hole.

In the double-layer cavity arrangement structure, the first resonant cavity is connected with the second resonant cavity through the coupling through hole, so that coupling energy is transferred between the first resonant cavity on the first side surface and the second resonant cavity on the second side surface. The coupling bandwidth of the first resonant cavity and the second resonant cavity can reach more than 330MHz, the relative bandwidth reaches 18%, and the bandwidth requirement of any single filtering channel is met. Therefore, any one of the filter paths on one side surface can be coupled to the other side surface for arrangement in the coupling mode, the cavity arrangement difficulty is effectively reduced, and the cavity arrangement has great flexibility. In addition, the cavities can be arranged in the same area of the first side surface and the second side surface, the size of a product is reduced, and the product miniaturization and low-cost design are facilitated.

In one embodiment, a first resonant column is arranged on the bottom wall of the first resonant cavity, and a first tuning rod is arranged on the top wall of the first resonant cavity; the first resonant column is provided with a first concave part, and the first tuning rod is arranged opposite to the first concave part; a second resonant column is arranged on the bottom wall of the second resonant cavity, and a second tuning rod is arranged on the top wall of the second resonant cavity; the second resonant column is provided with a second recess, and the second tuning rod is arranged opposite to the second recess.

In one embodiment, when the first projection and the second projection are completely overlapped, the axis of the first resonant column and the axis of the second resonant column are on the same straight line.

In one embodiment, when the first projection and the second projection are partially overlapped, the axis of the first resonant column and the axis of the second resonant column are staggered.

In one embodiment, the coupling via is circular, rectangular, oval or triangular in shape; the number of the coupling through holes is more than one.

In one embodiment, silver layers or copper layers are arranged on the cavity wall of the first resonant cavity, the outer wall of the first resonant column, the outer wall of the first tuning rod, the cavity wall of the second resonant cavity, the outer wall of the second resonant column, the outer wall of the second tuning rod and the first side surface and the second side surface of the partition plate; the first resonant cavity, the first resonant column, the first tuning rod, the second resonant cavity, the second resonant column, the second tuning rod and the partition plate are all metal pieces.

A combiner comprises the double-layer cavity-row structure.

In the combiner, the first resonant cavity and the second resonant cavity are connected through the coupling through hole, so that coupling energy is transferred between the first resonant cavity on the first side surface and the second resonant cavity on the second side surface. The coupling bandwidth of the first resonant cavity and the second resonant cavity can reach more than 330MHz, the relative bandwidth reaches 18%, and the bandwidth requirement of any single filtering channel is met. Therefore, any one of the filter paths on one side surface can be coupled to the other side surface for arrangement in the coupling mode, the cavity arrangement difficulty is effectively reduced, and the cavity arrangement has great flexibility. In addition, the cavities can be arranged in the same area of the first side surface and the second side surface, the size of a product is reduced, and the product miniaturization and low-cost design are facilitated.

In one embodiment, the combiner includes a plurality of first filter paths disposed on the first side surface, a plurality of second filter paths disposed on the second side surface, and at least one third filter path disposed on the second side surface; the combiner further comprises a first primary shared resonant cavity and a plurality of first secondary shared resonant cavities which are arranged on the first side surface, and the output ends of the first secondary shared resonant cavities are connected to the input end of the first primary shared resonant cavity in parallel; at least one first secondary shared resonant cavity is used as the first resonant cavity, a tail end resonant cavity of the third filtering path is used as the second resonant cavity, and the input end of the first secondary shared resonant cavity is correspondingly connected with the output ends of more than one first filtering path; the combiner further comprises a second primary shared resonant cavity and a plurality of second secondary shared resonant cavities which are arranged on the second side surface, the output ends of the plurality of second secondary shared resonant cavities are connected to the input end of the second primary shared resonant cavity in parallel, and the input end of the second secondary shared resonant cavity is correspondingly connected with the output end of more than one second filtering channel.

In one embodiment, the combiner includes a plurality of first filter paths disposed on the first side surface, a plurality of second filter paths disposed on the second side surface, and at least one third filter path; the combiner further comprises a first primary shared resonant cavity and a plurality of first secondary shared resonant cavities which are arranged on the first side surface, and the output ends of the first secondary shared resonant cavities are connected to the input end of the first primary shared resonant cavity in parallel; at least one first secondary shared resonant cavity is correspondingly coupled and connected with a tail end resonant cavity of at least one third filtering channel, and the input end of the first secondary shared resonant cavity is correspondingly connected with the output end of more than one first filtering channel; the combiner further comprises a second primary shared resonant cavity and a plurality of second secondary shared resonant cavities which are arranged on the second side surface, the output ends of the plurality of second secondary shared resonant cavities are connected to the input end of the second primary shared resonant cavity in parallel, and the input end of the second secondary shared resonant cavity is correspondingly connected with the output ends of more than one second filtering path; the third filtering path includes a plurality of three-level resonant cavities arranged in series, wherein more than one of the three-level resonant cavities is disposed on the first side surface, the rest of the three-level resonant cavities are disposed on the second side surface, one of the three-level resonant cavities located on the first side surface is the first resonant cavity, and one of the three-level resonant cavities located on the second side surface is the second resonant cavity.

In one embodiment, the combiner further includes a combining output interface, a plurality of first band input interfaces, a plurality of second band input interfaces, and a third band input interface; the first primary common resonant cavity and the second primary common resonant cavity are both connected with the combiner output interface; the input end of the first filtering channel is correspondingly connected with the plurality of first frequency band input interfaces, the input end of the second filtering channel is correspondingly connected with the second frequency band input interfaces, and the input end of the third filtering channel is correspondingly connected with the third frequency band input interfaces.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a view structural diagram of a double-layer cavity array structure according to an embodiment of the present invention;

fig. 2 is a top view structural diagram of a double-layer cavity arrangement structure according to an embodiment of the present invention;

FIG. 3 is a cross-sectional view of FIG. 2 at P-P;

fig. 4 is a view structural diagram of a double-layer cavity array structure according to another embodiment of the present invention;

fig. 5 is a top view structural diagram of a double-layer cavity arrangement structure according to another embodiment of the present invention;

FIG. 6 is a cross-sectional view taken at Q-Q of FIG. 5;

fig. 7 is a view structural diagram of a combiner according to an embodiment of the present invention;

fig. 8 is a layout structure diagram on the first side surface of the combiner according to an embodiment of the present invention;

fig. 9 is a layout structure diagram on the second side surface of the combiner according to an embodiment of the present invention;

fig. 10 is a layout structure view on a first side surface of a combiner according to another embodiment of the present invention;

fig. 11 is a layout structure diagram on the second side surface of the combiner according to another embodiment of the present invention;

fig. 12 is a layout structure view on a first side surface of a combiner according to still another embodiment of the present invention;

fig. 13 is a layout structure view on the second side surface of the combiner according to still another embodiment of the present invention;

fig. 14 is a simulation diagram of the coupling bandwidth of the first resonant cavity and the second resonant cavity of the double-layer cavity arrangement structure according to an embodiment of the present invention.

10. A partition plate; 11. a first side surface; 12. a second side surface; 13. a coupling via; 20. a first resonant cavity; 21. a first resonant column; 211. a first recess; 22. a first tuning rod; 30. a second resonant cavity; 31. a second resonant column; 311. a second recess; 32. a second tuning rod; 40. a combined output interface; 50. a first frequency band input interface; 60. a second frequency band input interface; 70. and a third frequency band input interface.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1 to 3, fig. 1 illustrates a view structure diagram of a double-layer cavity structure according to an embodiment of the present invention, fig. 2 illustrates a top view structure diagram of a double-layer cavity structure according to an embodiment of the present invention, and fig. 3 illustrates a cross-sectional view of fig. 2 at a P-P position. An embodiment of the utility model provides a pair of double-deck row's chamber structure, double-deck row's chamber structure includes baffle 10, first resonant cavity 20 and second resonant cavity 30. The first resonant cavity 20 and the second resonant cavity 30 are respectively disposed on the first side surface 11 and the second side surface 12 of the partition board 10. The projection of the first resonant cavity 20 on the partition wall 10 along the direction perpendicular to the partition wall 10 is a first projection, and the projection of the second resonant cavity 30 on the partition wall 10 along the direction perpendicular to the partition wall 10 is a second projection. The first projection and the second projection are at least partially overlapped or completely overlapped, a coupling through hole 13 is arranged on the partition board 10 corresponding to the overlapped part of the first projection and the second projection, and the first resonant cavity 20 is communicated with the second resonant cavity 30 through the coupling through hole 13.

It should be noted that, when the first resonant cavity 20 is located at the upper layer of the partition wall 10, the second resonant cavity 30 is correspondingly located at the lower layer of the partition wall 10; when the first resonant cavity 20 is located at the lower layer of the partition wall 10, the second resonant cavity 30 is correspondingly located at the upper layer of the partition wall 10.

Referring to fig. 14, fig. 14 illustrates a simulation diagram of the coupling bandwidth of the first resonant cavity 20 and the second resonant cavity 30 of the double-layer cavity-arrangement structure according to an embodiment of the present invention, and as can be seen from fig. 14, the coupling bandwidth of the first resonant cavity 20 and the second resonant cavity 30 can reach over 330MHz, and the relative bandwidth reaches 18%, so as to meet the bandwidth requirement of any single filtering channel. In the double-layer cavity array structure, the first resonant cavity 20 and the second resonant cavity 30 are connected through the coupling through hole 13, so that coupling energy is transferred between the first resonant cavity 20 located on the first side surface 11 and the second resonant cavity 30 located on the second side surface 12. Therefore, any one of the filter paths on one side surface can be coupled to the other side surface for arrangement in the coupling mode, the cavity arrangement difficulty is effectively reduced, and the cavity arrangement has great flexibility. In addition, the cavities can be arranged in the same area of the first side surface 11 and the second side surface 12, the size of the product is reduced, and the miniaturization and low-cost design of the product are facilitated.

It should be noted that, in the general cavity array mode, the size of the first side surface 11 is relatively large, and a filter path far from the common port needs to use a multi-stage common resonant cavity to perform energy coupling with the common port. However, the cavity arrangement method provided by the embodiment can reduce the size of the single-sided cavity arrangement, so that the number of shared resonant cavities can be reduced, the insertion loss of the filter can be reduced, the product performance can be improved, and the debugging difficulty can be reduced. In order to reduce the overall size of the product, one or more filter passages in the side surface with large size can be coupled to the other side surface arrangement in a mode of hole coupling, so that double-sided equal-area cavity array is realized.

Specifically, when the number of the filter paths on the first side surface 11 is relatively large, the size of the occupied area of the resonant cavities of the filter paths is large, and at this time, the coupling through holes 13 may be formed in the partition plate 10, so that all or part of the first resonant cavities 20 of any one filter path on the first side surface 11 are transferred to the second side surface 12 for arrangement in the coupling manner, and thus, the difficulty in cavity arrangement can be effectively reduced, and the cavity arrangement has great flexibility; of course, when the number of filter paths on the second side surface 12 is relatively large and the occupied area size is large, all or a part of the number of the second resonant cavities 30 of any one filter path on the second side surface 12 may also be transferred to the first side surface 11 for layout in such a coupling manner, so as to effectively reduce the cavity discharge area on the first side surface 11 and reduce the overall size of the device. In conclusion, the combiner adopting the cavity-arranging technology has the advantages of small insertion loss, small volume, convenience in processing and the like.

Referring to fig. 1 to 3, further, a first resonant column 21 is disposed on a bottom wall of the first resonant cavity 20, and a first tuning rod 22 is disposed on a top wall of the first resonant cavity 20. The first resonant column 21 is provided with a first recess 211, and the first tuning rod 22 is disposed opposite to the first recess 211. A second resonant column 31 is arranged on the bottom wall of the second resonant cavity 30, and a second tuning rod 32 is arranged on the top wall of the second resonant cavity 30. The second resonant column 31 is provided with a second recess 311, and the second tuning rod 32 is disposed opposite to the second recess 311.

Referring to fig. 1 to 3, in one embodiment, when the first projection and the second projection are completely overlapped, the axis of the first resonant beam 21 and the axis of the second resonant beam 31 are on the same straight line. In this way, the end surface of the first resonant column 21 away from the first tuning rod 22 and the end surface of the second resonant column 31 away from the second tuning rod 32 are opposite to each other.

Referring to fig. 4 to 6, fig. 4 illustrates a view structure diagram of a double-layer cavity structure according to another embodiment of the present invention, fig. 5 illustrates a top view structure diagram of a double-layer cavity structure according to another embodiment of the present invention, and fig. 6 illustrates a cross-sectional view of fig. 5 at a position Q-Q. In another embodiment, when the first projection and the second projection are partially overlapped, the axis of the first resonant column 21 and the axis of the second resonant column 31 are offset from each other. Thus, it is also possible that the end surface of the first resonant column 21 away from the first tuning rod 22 and the end surface of the second resonant column 31 away from the second tuning rod 32 are offset from each other.

In one embodiment, the coupling through-hole 13 is circular, rectangular, oval or triangular in shape; the number of the coupling through holes 13 is more than one. In this manner, the coupling via 13 enables the transfer of coupling energy between the first resonant cavity 20 located on the first side surface 11 and the second resonant cavity 30 located on the second side surface 12.

Alternatively, when the size of the opening area of the coupling through hole 13 is increased, the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be increased; on the contrary, when the size of the opening area of the coupling through hole 13 is reduced, the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be reduced. Referring to fig. 5, specifically, when the coupling via 13 is square as shown in fig. 5, the length and width of the coupling via 13 are defined as L and W, respectively, and when one of L and W is increased, the opening area of the coupling via 13 is increased, so as to increase the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30; conversely, when one of L and W is decreased, the aperture area of the coupling via 13 is decreased, so that the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be decreased.

In addition, the larger the number of the coupling through holes 13, the larger the opening area of the coupling through holes 13 can be, i.e. the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be increased. In addition, the distance between the axis of the first resonant cavity 20 and the axis of the second resonant cavity 30 is X, and when the distance X between the axis of the first resonant cavity 20 and the axis of the second resonant cavity 30 becomes smaller, the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be increased; conversely, when the distance X between the axis of the first resonant cavity 20 and the axis of the second resonant cavity 30 becomes larger, the coupling bandwidth between the first resonant cavity 20 and the second resonant cavity 30 can be reduced.

It should be noted that the coupling through hole 13 may have other shapes than the above-mentioned circular, rectangular, oval, or triangular shape, and the details are not repeated herein, and the specific shape of the coupling through hole 13 is not limited, and may be set according to the actual situation.

Further, silver layers or copper layers are respectively arranged on the cavity wall of the first resonant cavity 20, the outer wall of the first resonant column 21, the outer wall of the first tuning rod 22, the cavity wall of the second resonant cavity 30, the outer wall of the second resonant column 31, the outer wall of the second tuning rod 32, and the first side surface 11 and the second side surface 12 of the partition board 10. Therefore, the loss can be reduced as much as possible, and the product performance is improved. In addition, the first resonant cavity 20, the first resonant column 21, the first tuning rod 22, the second resonant cavity 30, the second resonant column 31, the second tuning rod 32 and the partition plate 10 are all metal pieces.

It should be noted that, in infringement comparison, the "first resonant cavity 20 and the" second resonant cavity 30 "may be a" part of the partition 10 ", that is, the" first resonant cavity 20 and the "second resonant cavity 30" are integrally manufactured with "other parts of the partition 10"; or a separate member that can be separated from the rest of the partition 10, i.e., the first resonant cavity 20 and the second resonant cavity 30 can be manufactured separately and then combined with the rest of the partition 10 into a whole.

It should be noted that, in infringement comparison, the "first resonant column 21 and the first tuning rod 22" may be "a part of the first resonant cavity 20", that is, the "first resonant column 21 and the first tuning rod 22" are integrally manufactured with "the other part of the first resonant cavity 20"; or a separate member that can be separated from the other parts of the first resonant cavity 20, i.e., "the first resonant column 21 and the first tuning rod 22" can be manufactured separately and then combined with the other parts of the first resonant cavity 20 "into a whole.

It should be noted that, in infringement comparison, the "second resonant column 31 and the second tuning rod 32" may be "a part of the second resonant cavity 30", that is, the "second resonant column 31 and the second tuning rod 32" are integrally formed with "the other part of the second resonant cavity 30"; or a separate member that can be separated from the other part of the second resonant cavity 30, i.e., "the second resonant column 31 and the second tuning rod 32" can be manufactured separately and then combined with the other part of the second resonant cavity 30 "into a whole.

Referring to fig. 7 to 9, fig. 7 illustrates a view structure diagram of the combiner according to an embodiment of the present invention, fig. 8 illustrates a layout structure diagram of the combiner on the first side surface 11, fig. 9 illustrates a layout structure diagram of the combiner on the second side surface 12 according to an embodiment of the present invention. In one embodiment, a combiner includes the double-layer cavity array structure of any of the above embodiments.

In the combiner, the first resonant cavity 20 and the second resonant cavity 30 are connected through the coupling through hole 13, so that coupling energy is transferred between the first resonant cavity 20 on the first side surface 11 and the second resonant cavity 30 on the second side surface 12. The coupling bandwidth of the first resonant cavity 20 and the second resonant cavity 30 can reach more than 330MHz, and the relative bandwidth reaches 18%, so that the bandwidth requirement of any single filtering channel is met. Therefore, any one of the filter paths on one side surface can be coupled to the other side surface for arrangement in the coupling mode, the cavity arrangement difficulty is effectively reduced, and the cavity arrangement has great flexibility. In addition, the cavities can be arranged in the same area of the first side surface 11 and the second side surface 12, the size of the product is reduced, and the miniaturization and low-cost design of the product are facilitated.

Referring to fig. 8 and 9, in one embodiment, the combiner includes a plurality of first filtering paths disposed on the first side surface 11, a plurality of second filtering paths disposed on the second side surface 12, and at least one third filtering path disposed on the second side surface 12.

It should be noted that, the plurality of first filtering paths specifically correspond to, for example, the Path1 filtering Path, the Path2 filtering Path, the Path3 filtering Path, the Path5 filtering Path, and the Path6 filtering Path illustrated in fig. 8, but specific structures of the Path1 filtering Path, the Path2 filtering Path, the Path3 filtering Path, the Path5 filtering Path, and the Path6 filtering Path are not illustrated in fig. 8. The plurality of second filtering paths specifically correspond to, for example, the Path7 filtering Path, the Path8 filtering Path, the Path9 filtering Path, and the Path10 filtering Path illustrated in fig. 9, but specific structures of the Path7 filtering Path, the Path8 filtering Path, the Path9 filtering Path, and the Path10 filtering Path are not illustrated in fig. 9. The third filter Path specifically corresponds to, for example, the Path4 filter Path illustrated in fig. 9, and the Path4 filter Path specifically includes, for example, a three-stage resonant cavity D1 to a three-stage resonant cavity D10 arranged in series.

In addition, the combiner further includes a first primary common resonant cavity a and a plurality of first secondary common resonant cavities B disposed on the first side surface 11. The output ends of the first secondary shared resonant cavities B are connected in parallel to the input end of the first primary shared resonant cavity A. At least one of the first two-stage shared resonant cavities B serves as the first resonant cavity 20, and at least one of the first two-stage shared resonant cavities B is further connected to a tail end resonator of the first filter Path (e.g., tail end resonator C of Path3 filter Path (as shown in fig. 8)). The tail resonator (corresponding to the three-stage resonator D1 illustrated in fig. 9) of the third filter path serves as the second resonator 30. The input end of the first and second-stage shared resonant cavities B is correspondingly connected with the output ends of more than one first filtering channel. The combiner further includes a second primary common resonator (not shown) and a plurality of second secondary common resonators (not shown) disposed on the second side surface 12. The output ends of the second secondary common resonant cavities are connected to the input end of the second primary common resonant cavity in parallel, and the input end of the second secondary common resonant cavity is correspondingly connected with the output ends of more than one second filtering channel.

Referring to fig. 10 to 13, fig. 10 illustrates a layout structure diagram on the first side surface 11 of the combiner according to another embodiment of the present invention, fig. 11 illustrates a layout structure diagram on the second side surface 12 of the combiner according to another embodiment of the present invention, fig. 12 illustrates a layout structure diagram on the first side surface 11 of the combiner according to yet another embodiment of the present invention, and fig. 13 illustrates a layout structure diagram on the second side surface 12 of the combiner according to yet another embodiment of the present invention. In another embodiment, the combiner includes a plurality of first filter paths disposed on the first side surface 11, a plurality of second filter paths disposed on the second side surface 12, and at least one third filter path.

Similarly, the plurality of first filtering paths specifically correspond to, for example, the Path1 filtering Path, the Path2 filtering Path, the Path3 filtering Path, the Path5 filtering Path, and the Path6 filtering Path illustrated in fig. 10 or fig. 12, but specific structures of the Path1 filtering Path, the Path2 filtering Path, the Path3 filtering Path, the Path5 filtering Path, and the Path6 filtering Path are not illustrated in fig. 10 or fig. 12. The plurality of second filtering paths specifically correspond to, for example, the Path7 filtering Path, the Path8 filtering Path, the Path9 filtering Path, and the Path10 filtering Path illustrated in fig. 11 or fig. 13, but specific structures of the Path7 filtering Path, the Path8 filtering Path, the Path9 filtering Path, and the Path10 filtering Path are not illustrated in fig. 11 or fig. 13. The third filter Path specifically corresponds to, for example, the Path4 filter Path illustrated in fig. 11 or 13, and the Path4 filter Path specifically includes, for example, three stages of resonator cavities D1 to D10 arranged in series.

In addition, the combiner further includes a first primary common resonant cavity a and a plurality of first secondary common resonant cavities B disposed on the first side surface 11. The output ends of the first secondary shared resonant cavities B are connected in parallel to the input end of the first primary shared resonant cavity A. At least one first secondary shared resonant cavity B is correspondingly coupled with a tail end resonant cavity (corresponding to the tertiary resonant cavity D1 illustrated in fig. 11 or fig. 12) of at least one third filtering path, and an input end of the first secondary shared resonant cavity B is correspondingly connected with an output end of more than one first filtering path. The combiner further includes a second primary common resonator and a plurality of second secondary common resonators disposed on the second side surface 12. The output ends of the second secondary common resonant cavities are connected to the input end of the second primary common resonant cavity in parallel, and the input end of the second secondary common resonant cavity is correspondingly connected with the output ends of more than one second filtering channel. The third filtering path includes a plurality of three-level resonators (e.g., three-level resonators D1 through D10 as illustrated in fig. 10 through 13, respectively) arranged in series. More than one of the three-level resonant cavities are disposed on the first side surface 11, the remaining three-level resonant cavities are disposed on the second side surface 12, one of the three-level resonant cavities on the first side surface 11 is a first resonant cavity 20, and one of the three-level resonant cavities on the second side surface 12 is a second resonant cavity 30.

Specifically, referring to fig. 10 and 11, fig. 10 illustrates that the three-level resonant cavity D1 is disposed on the first side surface 11, the three-level resonant cavity D1 is the first resonant cavity 20, fig. 11 illustrates that the three-level resonant cavity D2 to the three-level resonant cavity D10 are disposed on the second side surface 12, and the three-level resonant cavity D2 is the second resonant cavity 30.

Referring to fig. 12 and 13 again, fig. 12 illustrates that the three-level resonant cavity D1 and the three-level resonant cavity D2 are disposed on the first side surface 11, the three-level resonant cavity D2 is the first resonant cavity 20, fig. 13 illustrates that the three-level resonant cavity D3 to the three-level resonant cavity D10 are disposed on the second side surface 12, and the three-level resonant cavity D3 is the second resonant cavity 30.

Similarly, the three-level resonant cavity D1 to the three-level resonant cavity D3 may be disposed on the first side surface 11, and the three-level resonant cavity D3 is the first resonant cavity 20, which is not described herein or limited, and is set according to actual requirements.

Further, the combiner further includes a combining output interface 40, a plurality of first band input interfaces 50, a plurality of second band input interfaces 60, and a third band input interface 70. The first primary common resonant cavity and the second primary common resonant cavity are both connected with the combining output interface 40. The input of the first filter path is connected to a plurality of first band input interfaces 50, the input of the second filter path is connected to a second band input interface 60, and the input of the third filter path is connected to a third band input interface 70.

It should be noted that the first band input interface 50 and the third band input interface 70 are used for accessing high-frequency signals, and the second band input interface 60 is used for accessing low-frequency signals. Alternatively, the first band input interface 50 and the third band input interface 70 are used for accessing low frequency signals, and the second band input interface 60 is used for accessing high frequency signals.

In one embodiment, a cavity array method of the combiner in any of the above embodiments includes the following steps:

when the number of filter paths on the first side surface 11 is greater than the number of filter paths on the second side surface 12, or when the total cavity row area of the resonant cavities on the first side surface 11 is greater than the total cavity row area of the resonant cavities on the second side surface 12, at least a part of the resonant cavities of the filter paths on the first side surface 11 are distributed to the second side surface 12.

According to the cavity arrangement method of the combiner, any one filtering channel on one side surface can be coupled to the other side surface for arrangement in the coupling mode, the cavity arrangement difficulty is effectively reduced, and the cavity arrangement has great flexibility. In addition, the cavities can be arranged in the same area of the first side surface 11 and the second side surface 12, the size of the product is reduced, and the miniaturization and low-cost design of the product are facilitated.

In one embodiment, the cavity array method of the combiner further comprises the following steps:

when the coupling bandwidth of the first resonant cavity 20 and the second resonant cavity 30 needs to be adjusted, the coupling bandwidth is adjusted by adjusting the size of the opening area of the coupling through hole 13, and/or by controlling the number of the coupling through holes 13, and/or by adjusting the distance X between the axis of the first resonant column 21 and the axis of the second resonant column 31.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Claims (10)

1. A double-layer row cavity structure is characterized in that the double-layer row cavity structure comprises:

the first resonant cavity is connected with the first end of the partition plate; the first resonant cavity and the second resonant cavity are respectively arranged on the first side surface and the second side surface of the partition plate; the projection of the first resonant cavity on the partition along the direction perpendicular to the partition is a first projection, and the projection of the second resonant cavity on the partition along the direction perpendicular to the partition is a second projection; at least one part of the first projection and the second projection are overlapped or completely overlapped, a coupling through hole is arranged on the partition board corresponding to the overlapped part of the first projection and the second projection, and the first resonant cavity is communicated with the second resonant cavity through the coupling through hole.

2. The double-layer cavity array structure according to claim 1, wherein a first resonant column is arranged on a bottom wall of the first resonant cavity, and a first tuning rod is arranged on a top wall of the first resonant cavity; the first resonant column is provided with a first concave part, and the first tuning rod is arranged opposite to the first concave part; a second resonant column is arranged on the bottom wall of the second resonant cavity, and a second tuning rod is arranged on the top wall of the second resonant cavity; the second resonant column is provided with a second recess, and the second tuning rod is arranged opposite to the second recess.

3. The double-layer cavity array structure as claimed in claim 2, wherein when the first projection and the second projection are completely overlapped, the axis of the first resonant column and the axis of the second resonant column are on the same line.

4. The double-layer cavity array structure as claimed in claim 2, wherein when the first projection and the second projection are partially overlapped, the axis of the first resonant column and the axis of the second resonant column are staggered.

5. The double-layer cavity array structure as claimed in any one of claims 1 to 4, wherein the coupling through holes are circular, rectangular, oval or triangular in shape; the number of the coupling through holes is more than one.

6. The double-layer cavity array structure according to any one of claims 2 to 4, wherein the wall of the first resonant cavity, the outer wall of the first resonant column, the outer wall of the first tuning rod, the wall of the second resonant cavity, the outer wall of the second resonant column, the outer wall of the second tuning rod, and the first side surface and the second side surface of the partition are all provided with silver layers or copper layers; the first resonant cavity, the first resonant column, the first tuning rod, the second resonant cavity, the second resonant column, the second tuning rod and the partition plate are all metal pieces.

7. A combiner comprising the double-layered cavity bank structure of any one of claims 1 to 6.

8. The combiner of claim 7, comprising a number of first filter paths disposed on the first side surface, a number of second filter paths disposed on the second side surface, and at least one third filter path disposed on the second side surface; the combiner further comprises a first primary shared resonant cavity and a plurality of first secondary shared resonant cavities which are arranged on the first side surface, and the output ends of the first secondary shared resonant cavities are connected to the input end of the first primary shared resonant cavity in parallel; at least one first secondary shared resonant cavity is used as the first resonant cavity, a tail end resonant cavity of the third filtering path is used as the second resonant cavity, and the input end of the first secondary shared resonant cavity is correspondingly connected with the output ends of more than one first filtering path; the combiner further comprises a second primary shared resonant cavity and a plurality of second secondary shared resonant cavities which are arranged on the second side surface, the output ends of the plurality of second secondary shared resonant cavities are connected to the input end of the second primary shared resonant cavity in parallel, and the input end of the second secondary shared resonant cavity is correspondingly connected with the output end of more than one second filtering channel.

9. The combiner of claim 8, comprising a number of first filter paths disposed on the first side surface, a number of second filter paths disposed on the second side surface, and at least one third filter path; the combiner further comprises a first primary shared resonant cavity and a plurality of first secondary shared resonant cavities which are arranged on the first side surface, and the output ends of the first secondary shared resonant cavities are connected to the input end of the first primary shared resonant cavity in parallel; at least one first secondary shared resonant cavity is correspondingly coupled and connected with a tail end resonant cavity of at least one third filtering channel, and the input end of the first secondary shared resonant cavity is correspondingly connected with the output end of more than one first filtering channel; the combiner further comprises a second primary shared resonant cavity and a plurality of second secondary shared resonant cavities which are arranged on the second side surface, the output ends of the plurality of second secondary shared resonant cavities are connected to the input end of the second primary shared resonant cavity in parallel, and the input end of the second secondary shared resonant cavity is correspondingly connected with the output ends of more than one second filtering path; the third filtering path includes a plurality of three-level resonant cavities arranged in series, wherein more than one of the three-level resonant cavities is disposed on the first side surface, the rest of the three-level resonant cavities are disposed on the second side surface, one of the three-level resonant cavities located on the first side surface is the first resonant cavity, and one of the three-level resonant cavities located on the second side surface is the second resonant cavity.

10. The combiner of claim 8 or 9, further comprising a combined output interface, a plurality of first band input interfaces, a plurality of second band input interfaces, and a third band input interface; the first primary common resonant cavity and the second primary common resonant cavity are both connected with the combiner output interface; the input end of the first filtering channel is correspondingly connected with the plurality of first frequency band input interfaces, the input end of the second filtering channel is correspondingly connected with the second frequency band input interfaces, and the input end of the third filtering channel is correspondingly connected with the third frequency band input interfaces.

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