CN213515204U - Capillary liquid absorption core and liquid cooling phase change type chip radiator comprising same - Google Patents
Capillary liquid absorption core and liquid cooling phase change type chip radiator comprising same Download PDFInfo
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- CN213515204U CN213515204U CN202022095437.1U CN202022095437U CN213515204U CN 213515204 U CN213515204 U CN 213515204U CN 202022095437 U CN202022095437 U CN 202022095437U CN 213515204 U CN213515204 U CN 213515204U
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Abstract
The utility model discloses a capillary imbibition core and contain liquid cooling phase transition formula chip radiator of this capillary imbibition core, the capillary imbibition core includes stainless steel woven mesh, the stainless steel woven mesh surface is equipped with nanometer barrier layer, compatibility has between the liquid phase transition working medium in nanometer barrier layer and the liquid cooling phase transition formula chip radiator, nanometer barrier layer thickness is 100 ~ 300 nm. The capillary wick in the utility model realizes the thinning and the light weight of the capillary wick by adopting the stainless steel mesh grid, which is beneficial to the development of the heat management of the chip towards the thinning and the light weight; because incompatible condition probably appears in the liquid phase transition working medium among stainless steel woven mesh and the liquid cooling phase transition formula chip radiator, the utility model discloses in through set up nanometer barrier layer through weaving the net surface at the stainless steel and solve above-mentioned problem.
Description
Technical Field
The utility model relates to a capillary imbibition core technical field, concretely relates to capillary imbibition core and contain liquid cooling phase transition formula chip radiator of this capillary imbibition core.
Background
With the commercial operation of the 5G network, electronic consumer products such as smart phones, ipads, notebook computers and the like are iterated rapidly, the light weight, thin thickness and flexible design of the electronic consumer products gradually become objective requirements of user experience, the thin thickness and light weight design also provide higher challenges for chip heat management, and the heat dissipation of the chip not only affects the operation speed and stability of the chip, but also affects the user experience feeling and fatalities of the chip and the service life of the chip. In general, chip heat dissipation management has been developed through key technologies such as metal material heat conduction, heat pipe, graphite material, liquid cooling heat dissipation (two-phase flow latent heat Vapor Chamber), and the like, and especially, the application of the phase change latent heat technology has become the mainstream of the current heat dissipation design. At present, the existing liquid-cooling phase-change chip radiator cannot meet the requirements of thinning and light weight of chip heat management while ensuring the radiating effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects and provide the capillary wick, the thinning and the light weight of the capillary wick are realized by adopting the stainless steel mesh grid, and the development of the heat management of the chip towards the thinning and the light weight is facilitated; because incompatible condition (under long-time operating condition, liquid phase transition working medium in stainless steel woven mesh and the liquid cooling phase transition formula chip radiator can react and influence the latent heat performance of capillary imbibition core) probably appears in the liquid phase transition working medium in the stainless steel woven mesh and the radiator, the utility model discloses in through set up nanometer barrier layer at stainless steel woven mesh surface and solve above-mentioned problem. Furthermore, the utility model provides a liquid cooling phase transition formula chip radiator adopts the chip radiator scheme that utilizes capillary force to promote the working fluid to inhale the capillary imbibition core of thermal cycle in inclosed nonrust steel pipe internal setting, has the higher characteristics of radiating efficiency, and has realized slimming and lightweight simultaneously, helps electronic product such as smart mobile phone, ipad, notebook computer towards slimming and lightweight direction development.
In order to achieve the above object, the utility model provides a capillary imbibition core, including the stainless steel woven mesh, the stainless steel woven mesh surface is equipped with the nanometer barrier layer, compatibility has between the liquid phase transition working medium in nanometer barrier layer and the liquid cooling phase transition formula chip radiator, nanometer barrier layer thickness is 100 ~ 300 nm.
By adopting the technical scheme, the stainless steel in the metal material has the characteristics of light weight and high yield strength, the thinning and the light weight of the capillary wick are realized by adopting the stainless steel mesh grid, and the development of the heat management of the chip towards the thinning and the light weight is facilitated; because incompatible condition (under long-time operating condition, liquid phase transition working medium in stainless steel woven mesh and the liquid cooling phase transition formula chip radiator can react and influence the latent heat performance of capillary imbibition core) probably appears in the liquid phase transition working medium in the stainless steel and the radiator, consequently, the utility model discloses in through set up nanometer barrier layer solution above-mentioned problem at stainless steel woven mesh surface.
Further, when the liquid phase change working medium in the liquid cooling phase change type chip radiator is water, the nanoscale barrier layer is a nickel layer or a copper layer; when the liquid phase change working medium in the liquid cooling phase change type chip radiator is potassium, the nanoscale barrier layer is a nickel layer.
Further, the stainless steel woven mesh comprises at least two stainless steel wire mesh layers, each stainless steel wire mesh layer is formed by weaving a plurality of stainless steel wires, and the diameters of the stainless steel wires are different from each other.
By adopting the technical scheme, the capillary liquid absorbing core is formed by weaving at least two metal wire mesh layers, so that the capillary porosity and the water content of the capillary liquid absorbing core are effectively improved, and the equivalent latent heat capacity of the capillary liquid absorbing core is improved; the metal wire mesh layer is woven by metal wires with different wire diameters, so that the capillary force of the capillary liquid absorption core can be obviously improved, and the long-distance capillary reflux design has a good heat exchange effect.
Further, the stainless steel wire is of a flat strip-shaped structure, the width of the stainless steel wire is 20-100 microns, and the aperture of meshes of the stainless steel wire mesh layer is 20-100 microns.
Furthermore, the section of the stainless steel wire is circular, the wire diameter of the stainless steel wire is 20-100 mu m, and the aperture of the meshes of the stainless steel wire mesh layer is 20-100 mu m.
The utility model provides a liquid cooling phase change type chip radiator in a second aspect, which comprises a stainless steel pipe body, a sealing end cover and the capillary wick; the sealing end covers are arranged at two ends of the stainless steel pipe body; the two ends of the stainless steel pipe body in the axial direction are respectively an evaporation end and a condensation end, the evaporation end is in heat transfer connection with the chip, and the condensation end is in heat transfer connection with an external heat dissipation environment; the inner cavity of the stainless steel pipe body is a heat dissipation channel, and the extension direction of the heat dissipation channel is consistent with the axial direction of the stainless steel pipe body; the interior of the heat dissipation channel is in a vacuum state, the heat dissipation channel is provided with a liquid phase change working medium, and the inner wall surface of the heat dissipation channel is provided with the capillary liquid absorption core.
Through adopting above-mentioned technical scheme, have the light and high characteristics of yield strength of quality based on the stainless steel, can assemble through stainless steel body and stainless steel mesh grid and obtain ultra-thin type liquid cooling phase transition chip radiator, make it have the higher characteristics of radiating efficiency simultaneously, make the utility model provides a liquid cooling phase transition chip radiator can wide application in smart mobile phone, ipad, notebook computer etc. improves user experience and feels.
Furthermore, a plurality of radiating fins are arranged on the outer side of the condensation end.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the capillary wick in the utility model realizes the thinning and the light weight of the capillary wick by adopting the stainless steel mesh grid, and is beneficial to the development of the chip heat management towards the thinning and the light weight; because incompatible condition (under long-time operating condition, liquid phase transition working medium in stainless steel woven mesh and the liquid cooling phase transition formula chip radiator can react and influence the latent heat performance of capillary imbibition core) probably appears in the liquid phase transition working medium in the stainless steel woven mesh and the radiator, the utility model discloses in through set up nanometer barrier layer at stainless steel woven mesh surface and solve above-mentioned problem.
2. The utility model provides a liquid cooling phase transition formula chip radiator adopts the chip radiator scheme that utilizes capillary force to promote the working fluid to inhale heat circulation's capillary imbibition core in inclosed nonrust steel pipe is internal, has the higher characteristics of radiating efficiency, and has realized slimming and lightweight simultaneously, helps electronic products such as smart mobile phone, ipad, notebook computer towards slimming and lightweight direction development.
Drawings
FIG. 1 is a schematic diagram of the structure of a capillary wick according to example 1;
FIG. 2 is a schematic structural view of a stainless steel mesh layer in example 1;
FIG. 3 is a schematic structural view of a stainless steel mesh layer in example 2;
fig. 4 is a schematic structural diagram of a liquid-cooled phase-change chip heat sink in embodiment 3;
fig. 5 is a schematic front view of a liquid-cooled phase-change chip heat sink in embodiment 4;
fig. 6 is a schematic side view of the liquid-cooled phase-change chip heat sink in embodiment 4.
The correspondence between each mark and the part name is as follows:
the device comprises a nanoscale barrier layer 1, a stainless steel woven mesh 2, a stainless steel wire mesh layer 3, stainless steel wires 4, a stainless steel tube body 5, an evaporation end 6, a condensation end 7, a sealing end cover 8, a heat dissipation channel 9, a capillary wick 10 and heat dissipation fins 11.
Detailed Description
In order to make the technical means of the implementation of the present invention, for making the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below, and it is clear and completely described the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to be referred must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1, the embodiment discloses a capillary wick, which includes a stainless steel woven mesh 2, a nanoscale barrier layer 1 is arranged on the surface of the stainless steel woven mesh 2, the nanoscale barrier layer 1 and a liquid phase change working medium in a liquid-cooled phase change chip radiator have compatibility, and the thickness of the nanoscale barrier layer 1 is 100-300 nm.
Specifically, when the liquid phase change working medium in the liquid-cooled phase change chip radiator in the embodiment is water, the nanoscale barrier layer 1 is a nickel layer or a copper layer; when the liquid phase change working medium in the liquid cooling phase change type chip radiator is potassium, the nanoscale barrier layer 1 is a nickel layer. It should be noted that the liquid phase change working medium and the nanoscale blocking layer 1 in this embodiment are not limited to the above selection, and those skilled in the art can reasonably select the nanoscale blocking layer 1 according to the type of the liquid phase change working medium.
Specifically, the stainless steel mesh grid 2 in this embodiment includes a stainless steel mesh grid layer 3, the metal mesh grid layer is formed by weaving a plurality of stainless steel wires 4, and the wire diameters of the plurality of stainless steel wires 4 are different from each other. The metal wire mesh layer is woven by metal wires with different wire diameters, so that the capillary force of the capillary liquid absorption core 10 can be obviously improved, and the long-distance capillary reflux design has a good heat exchange effect. Wherein, the stainless steel wires 4 are arranged in parallel or staggered.
Specifically, referring to fig. 2, the stainless steel wire 4 in this embodiment is a flat strip structure, the width of the stainless steel wire 4 is 20 to 100 μm, and the aperture of the mesh of the stainless steel mesh layer 3 is 20 to 100 μm. Based on the above, the width of the stainless steel wire 4 of the present solution may be preferably 20 μm or 60 μm or 100 μm.
It should be noted that the capillary wick in this embodiment may also be formed by weaving multiple metal wire mesh layers, and the capillary porosity and the water content of the capillary wick 10 can be effectively improved by the multiple metal wire mesh layers, so that the equivalent latent heat capacity of the capillary wick 10 is increased.
Further, the nano-scale barrier layer 1 in the present embodiment is obtained by any one of vacuum coating, water plating, electrolytic plating, and chemical plating, and it should be noted that the method for forming the nano-scale barrier layer 1 on the surface of the stainless woven mesh 2 is not limited to the above-mentioned process method.
Stainless steel in the metal material has the characteristics of light weight and high yield strength, and the thinning and light weight of the capillary wick are realized by adopting the stainless steel mesh grid 2 in the embodiment, so that the development of heat management of the chip towards thinning and light weight is facilitated; because the stainless steel woven mesh 2 and the liquid phase change working medium in the liquid cooling phase change type chip radiator may appear incompatible circumstances (under long-time operating condition, the liquid phase change working medium in stainless steel and the radiator can react and influence the latent heat performance of capillary wick), consequently, solve above-mentioned problem through set up nanometer barrier layer 1 on stainless steel woven mesh 2 surface in this embodiment.
Example 2
The present embodiment discloses a capillary wick, and the structure of the capillary wick in the present embodiment is different from that of the capillary wick in embodiment 1 in that: the cross section of the stainless steel wire 4 in this embodiment is circular (see fig. 3), the wire diameter of the stainless steel wire 4 is 20 to 100 μm, and the aperture of the mesh of the stainless steel mesh layer 3 is 20 to 100 μm. Based on the above scheme, the wire diameter of the stainless steel wire 4 in this embodiment is 20 μm or 60 μm or 100 μm.
Example 3
Referring to fig. 4, the present embodiment discloses a liquid-cooled phase-change chip heat sink, which includes a stainless steel tube 5 and a sealing end cap 8, and further includes a capillary wick 10 disclosed in embodiment 1; the sealing end covers 8 are arranged at two ends of the stainless steel pipe body 5; the two ends of the stainless steel pipe body 5 in the axial direction are respectively an evaporation end 6 and a condensation end 7, the evaporation end 6 is in heat transfer connection with the chip, and the condensation end 7 is in heat transfer connection with an external heat dissipation environment; the inner cavity of the stainless steel tube body 5 is a heat dissipation channel 9, and the extension direction of the heat dissipation channel 9 is consistent with the axial direction of the stainless steel tube body 5; the interior of the heat dissipation channel 9 is in a vacuum state, the heat dissipation channel 9 is provided with a liquid phase change working medium, and the inner wall surface of the heat dissipation channel 9 is provided with a capillary liquid absorption core 10.
Specifically speaking, have the light and high characteristics of yield strength of quality based on the stainless steel, can assemble through stainless steel body 5 and stainless steel mesh grid 2 and obtain ultra-thin type liquid cooling phase transition chip radiator, make it have the higher characteristics of radiating efficiency simultaneously, make the utility model provides a liquid cooling phase transition chip radiator can wide application in smart mobile phone, ipad, notebook computer etc. improves user experience and feels.
When the liquid-cooled phase-change chip radiator in the embodiment is used, the capillary wick 10 is filled with a liquid phase-change working medium, when the evaporation end 6 is heated, working fluid in the capillary wick 10 is evaporated and gasified to form steam, the steam flows to the condensation end 7 under the action of a small pressure difference, the steam is condensed into the liquid phase-change working medium in the process of flowing to the condensation end 7 to release heat, and the liquid phase-change working medium flows back to the evaporation end 6 along the capillary wick 10 under the action of capillary force generated by the combination of the capillary wick 10 and liquid, so that heat dissipation is realized through circulation.
Example 4
The present embodiment discloses a liquid-cooled phase-change chip radiator, and as shown in fig. 5 and fig. 6, the structural differences between the liquid-cooled phase-change chip radiator in the present embodiment and the liquid-cooled phase-change chip radiator in embodiment 3 are as follows: the condensation end 7 in this embodiment is provided with a plurality of heat dissipation fins 11 on the outside. When the liquid cooling phase change type chip radiator in the embodiment is used, heat is continuously transferred to the condensation end 7 from the evaporation end 6 of the stainless steel tube body 5, and the heat transferred to the condensation end 7 is transferred to the radiating fins 11, so that the rapid dissipation of the heat is realized.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Capillary imbibition core for liquid cooling phase transition formula chip radiator, its characterized in that includes the stainless steel mesh grid woven, the stainless steel mesh grid woven surface is equipped with the nanometer barrier layer, compatibility has between the liquid phase transition working medium in nanometer barrier layer and the liquid cooling phase transition formula chip radiator, nanometer barrier layer thickness is 100 ~ 300 nm.
2. The capillary wick according to claim 1, wherein when the liquid phase change working medium in the liquid-cooled phase-change chip heat sink is water, the nanoscale barrier layer is a nickel layer or a copper layer; when the liquid phase change working medium in the liquid cooling phase change type chip radiator is potassium, the nanoscale barrier layer is a nickel layer.
3. A capillary wick according to claim 1, wherein said woven stainless steel mesh comprises at least two layers of stainless steel mesh, said stainless steel mesh being woven from a plurality of stainless steel wires having different wire diameters.
4. A capillary wick according to claim 3, wherein the stainless steel wires are in the form of flat strips, the stainless steel wires have a width of 20 to 100 μm, and the apertures of the meshes of the stainless steel mesh layer are 20 to 100 μm.
5. A capillary wick according to claim 3, wherein the stainless steel wires are circular in cross-section, the stainless steel wires have a wire diameter of 20 to 100 μm, and the mesh openings of the stainless steel mesh layer have a pore diameter of 20 to 100 μm.
6. A liquid-cooled phase-change chip heat sink comprising a stainless steel tube and end caps, and further comprising a capillary wick according to any one of claims 1-5; the sealing end covers are arranged at two ends of the stainless steel pipe body; the two ends of the stainless steel pipe body in the axial direction are respectively an evaporation end and a condensation end, the evaporation end is in heat transfer connection with the chip, and the condensation end is in heat transfer connection with an external heat dissipation environment; the inner cavity of the stainless steel pipe body is a heat dissipation channel, and the extension direction of the heat dissipation channel is consistent with the axial direction of the stainless steel pipe body; the interior of the heat dissipation channel is in a vacuum state, the heat dissipation channel is provided with a liquid phase change working medium, and the inner wall surface of the heat dissipation channel is provided with the capillary liquid absorption core.
7. The liquid-cooled phase-change chip heat sink of claim 6, wherein a plurality of fins are disposed outside said condensation end.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022095437.1U CN213515204U (en) | 2020-09-22 | 2020-09-22 | Capillary liquid absorption core and liquid cooling phase change type chip radiator comprising same |
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| CN202022095437.1U CN213515204U (en) | 2020-09-22 | 2020-09-22 | Capillary liquid absorption core and liquid cooling phase change type chip radiator comprising same |
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| CN213515204U true CN213515204U (en) | 2021-06-22 |
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