CN213507275U - Plating solution mixing arrangement of series connection plating bath - Google Patents
Plating solution mixing arrangement of series connection plating bath Download PDFInfo
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- CN213507275U CN213507275U CN202022416528.0U CN202022416528U CN213507275U CN 213507275 U CN213507275 U CN 213507275U CN 202022416528 U CN202022416528 U CN 202022416528U CN 213507275 U CN213507275 U CN 213507275U
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Abstract
The utility model discloses a plating bath mixing arrangement of series connection plating bath belongs to plating bath mixing technique field, and it includes four electrolysis baths, and the same discharge liquid of the inside fixedly connected with of four electrolysis baths gathers the collecting pipe, the surface that the collecting pipe was gathered to the discharge liquid is provided with four electrolysis bath liquid discharge valves, the right-hand member that the collecting pipe was gathered to the discharge liquid and the left surface fixed connection that the discharge liquid converges the low-order groove. This plating solution mixing arrangement of series connection plating bath, through being provided with second conveyer pipe and overflow mouth collecting pipe connecting tube, the plating solution in the electrolysis trough enters into the discharge liquid through electrolysis trough liquid discharge valve and gathers in the collecting pipe, the plating solution of having modulated flows back to each electrolysis trough in through mixing trough play liquid delivery pump through mixing trough outlet valve door, carry out the plating solution in a plurality of electrolysis troughs and carry out the circulation and mix, thereby make the plating solution misce bene in each electrolysis trough, reduce the detection sample volume, reduce the complex work degree of measurement personnel.
Description
Technical Field
The utility model belongs to the technical field of the plating bath mixes, specifically is a plating bath mixing arrangement of series connection plating bath.
Background
The plating bath is used to contain the solution for zinc plating, copper plating, nickel plating, gold plating, and the like. The cathode moving electroplating bath consists of a bath body made of steel bath lined with soft polyvinyl chloride plastic, a conductive device, a steam heating pipe, a cathode moving device and the like. The tank body can also be made of rigid polyvinyl chloride lined steel frame plastics, the structure of the tank body is selected depending on the properties of electroplating tank liquid, the temperature and other factors, the traditional electroplating tank is used for stirring and mixing the electroplating solution and is circulated by one tank and one pump, the product quality of one station is not uniform, the product quality is influenced, meanwhile, the sampling detection of one tank and one pump is required every day, and the workload of detection and sampling personnel is increased.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the above-mentioned defect of prior art, the utility model provides a plating bath mixing arrangement of series connection plating bath has solved traditional plating bath and has stirred the mixed mode to electroplating solution and be a groove pump circulation, and this product quality who leads to a station is inhomogeneous, influences product quality, need carry out a groove sample detection simultaneously every day, has increased the problem of the work load that detects the sampling personnel.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the plating solution mixing device comprises four electrolytic tanks, wherein the internal parts of the four electrolytic tanks are fixedly connected with the same discharge solution collecting manifold, the outer surface of the discharge solution collecting manifold is provided with four electrolytic tank solution discharge valves, the right end of the discharge solution collecting manifold is fixedly connected with the left side surface of a discharge solution collecting low-level tank, the right side surface of the discharge solution collecting low-level tank is fixedly connected with the left side surface of a low-level tank outlet valve, and the right end of the low-level tank outlet valve is fixedly connected with the input end of a low-level tank liquid outlet delivery pump.
The utility model discloses a low-order groove goes out liquid delivery pump's output fixedly connected with first conveyer pipe, the low-order groove goes out liquid delivery pump's right-hand member and the left surface fixed connection of quenching and tempering mixing tank, the right flank of quenching and tempering mixing tank and the left surface fixed connection of mixing tank outlet valve, the right flank of quenching and tempering mixing tank and the left end fixed connection of mixing tank liquid delivery pump, the right-hand member of mixing tank outlet valve and the input fixed connection of mixing tank liquid delivery pump, the output of mixing tank liquid delivery pump and the end fixed connection that intakes of second conveyer pipe.
As a further aspect of the present invention: the two sides of the upper surfaces of the electrolytic cell, the discharged liquid converging low-level tank and the tempering and mixing tank are fixedly connected with fixing rods, and the inner walls of the fixing rods are fixedly connected with the outer surface of the second conveying pipe.
As a further aspect of the present invention: the water outlet end of the first conveying pipe is located inside the tempering and mixing tank, and the outer surface of the first conveying pipe is fixedly connected to the outer surface of the corresponding fixing rod.
As a further aspect of the present invention: the outer surface of the second conveying pipe is fixedly connected with four branched effluent pipelines, and the outer surfaces of the four branched effluent pipelines are provided with split flow regulating valves.
As a further aspect of the present invention: the right side face of the electrolytic cell is fixedly connected with an overflow port collecting pipe connecting pipeline, and the bottom end of the overflow port collecting pipe connecting pipeline is communicated with the outer surface of the discharge liquid collecting pipe.
(III) advantageous effects
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the plating solution mixing device of the series plating bath is provided with a discharged solution collecting manifold, a low-level tank outlet valve, a low-level tank liquid outlet delivery pump, a mixing tank outlet valve, a mixing tank liquid outlet delivery pump, a second delivery pipe and an overflow port manifold connecting pipeline, plating solution in an electrolytic bath enters the discharged solution collecting manifold through the electrolytic bath liquid outlet valve, is transmitted into a discharged solution collecting manifold through the discharged solution collecting manifold, is transmitted into a discharged solution collecting low-level tank through the low-level tank outlet valve and is transmitted into a tempering mixing tank through the low-level tank liquid outlet delivery pump for modulation, the modulated plating solution flows back into each electrolytic bath through the mixing tank outlet valve through the mixing tank liquid outlet delivery pump and the first delivery pipe, the second delivery pipe and the overflow port manifold connecting pipeline, plating solution in a plurality of electrolytic baths is circularly mixed, and the plating solution in each electrolytic bath is uniformly mixed, reduce and detect the sample volume, reduce the loaded down with trivial details degree of detection personnel's work.
2. This plating bath mixing arrangement of series connection plating bath, through being provided with overflow mouth collecting pipe connecting tube, the plating bath that the modulation is good passes through mixing tank outlet valve through mixing tank play liquid delivery pump and first conveyer pipe, second conveyer pipe and overflow mouth collecting pipe connecting tube flow back in each electrolysis trough, because the liquid level is too high, the plating bath of excessive play can flow back in the discharge liquid collecting pipe through overflow mouth collecting pipe connecting tube, through the liquid level of the interior plating bath of each electrolysis trough of overflow mouth collecting pipe connecting tube control, prevent that the plating bath liquid level from too high leading to the plating bath overflow, thereby improve this plating bath mixing arrangement protecting effect.
3. According to the plating solution mixing device of the series plating tank, the discharged solution collecting manifold and the discharged solution converging low-level tank are arranged, plating solution in each electrolytic tank is suspended and discharged into the discharged solution collecting manifold, so that no power exists in the suspension, naturally discharged plating solution is more uniform, the liquid level of the discharged solution converging low-level tank is controlled to be lower than the outlet of the discharged solution collecting manifold, and therefore no resistance exists when the plating solution in the discharged solution collecting manifold is naturally discharged into the discharged solution converging low-level tank.
Drawings
Fig. 1 is a schematic structural view of a front view section of the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1;
FIG. 3 is a schematic structural view of a front section of the tempering and mixing tank of the present invention;
in the figure: the device comprises an electrolytic tank 1, an electrolytic tank liquid discharge valve 2, a liquid discharge collecting manifold 3, a liquid discharge converging low-level tank 4, a low-level tank outlet valve 5, a low-level tank liquid outlet delivery pump 6, a conditioning mixing tank 7, a mixing tank outlet valve 8, a mixing tank liquid outlet delivery pump 9, a first delivery pipe 10, a second delivery pipe 11, a overflow port collecting pipe connecting pipeline 12, a liquid discharge pipeline 13, a flow distribution regulating valve 14 and a fixing rod 15.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
As shown in fig. 1-3, the utility model provides a technical solution: a plating solution mixing device of a series connection plating bath comprises four electrolytic baths 1, wherein the insides of the four electrolytic baths 1 are fixedly connected with the same discharge liquid collecting manifold 3, the outer surface of the discharge liquid collecting manifold 3 is provided with four electrolytic bath liquid discharge valves 2, the right end of the discharge liquid collecting manifold 3 is fixedly connected with the left side of a discharge liquid collecting low-level tank 4, the right side of the discharge liquid collecting low-level tank 4 is fixedly connected with the left side of a low-level tank outlet valve 5, the liquid level of the discharge liquid collecting low-level tank 4 is controlled to be lower than the outlet of the discharge liquid collecting manifold 3 by arranging the discharge liquid collecting low-level tank 4, so that plating solution in the discharge liquid collecting manifold 3 is naturally discharged into the discharge liquid collecting low-level tank 4 without resistance, the right end of the low-level tank outlet valve 5 is fixedly connected with the input end of a low-level tank liquid delivery pump 6, and the discharge liquid collecting manifold 3 is arranged, the plating solution in each electrolytic tank 1 is suspended and discharged into the discharged solution collecting manifold 3, and the suspension is without power, so that the naturally discharged plating solution is more uniform.
The first conveyer pipe 10 of output fixedly connected with of low level groove liquid output delivery pump 6, the right-hand member of low level groove liquid output delivery pump 6 and the left surface fixed connection of quenching and tempering mixing tank 7, the right flank of quenching and tempering mixing tank 7 and the left surface fixed connection of mixing tank outlet valve 8, the right flank of quenching and tempering mixing tank 7 and the left end fixed connection of mixing tank liquid output delivery pump 9, the right-hand member of mixing tank outlet valve 8 and the input fixed connection of mixing tank liquid output delivery pump 9, the output of mixing tank liquid output delivery pump 9 and the end fixed connection that intakes of second conveyer pipe 11.
Specifically, as shown in fig. 2 and 3, the electrolytic cell 1, the equal fixedly connected with dead lever 15 in both sides of discharge solution confluence low position groove 4 and quenching and tempering mixing tank 7 upper surface, the inner wall of dead lever 15 is connected with the external fixed surface of second conveyer pipe 11, fix second conveyer pipe 11 through being provided with dead lever 15, improve the stability of second conveyer pipe 11, the water outlet end of first conveyer pipe 10 is located the inside of quenching and tempering mixing tank 7, the external fixed surface of first conveyer pipe 10 is connected at the surface that corresponds dead lever 15, the external fixed surface of second conveyer pipe 11 is connected with four branch effluent liquid pipelines 13, the surface of four branch effluent liquid pipelines 13 all is provided with reposition of redundant personnel governing valve 14, through being provided with reposition of redundant personnel governing valve 14, through adjusting reposition of redundant personnel governing valve 14 steerable how much to every electrolytic cell 1 reposition of redundant personnel plating bath.
Specifically, as shown in fig. 2, right flank fixedly connected with overflow mouth collecting pipe connecting pipeline 12 of electrolysis trough 1, the bottom of overflow mouth collecting pipe connecting pipeline 12 is linked together with the surface of discharge liquid collecting pipe 3 that gathers, through being provided with overflow mouth collecting pipe connecting pipeline 12, because the liquid level is too high, the plating bath of excessive play can flow back into discharge liquid collecting pipe 3 in through overflow mouth collecting pipe connecting pipeline 12, through the liquid level of the interior plating bath of overflow mouth collecting pipe connecting pipeline 12 control each electrolysis trough 1, prevent that the plating bath liquid level is too high to lead to the plating bath overflow, thereby improve this plating bath mixing arrangement protecting effect.
The utility model discloses a theory of operation does:
s1, when the plating solution mixing device is used, the plating solution is transmitted into a discharged solution converging low-level tank 4 through a discharged solution converging collecting pipe 3, then transmitted into a tempering and mixing tank 7 through a low-level tank outlet valve 5 and a low-level tank liquid outlet delivery pump 6 for modulation, and the modulated plating solution flows back into each electrolytic tank 1 through a mixing tank outlet valve 8 and a mixing tank liquid outlet delivery pump 9 and a first delivery pipe 10, a second delivery pipe 11 and an overflow port collecting pipe connecting pipeline 12 to circularly mix the plating solution in a plurality of electrolytic tanks 1;
s2, after the well-prepared plating solution flows back into each electrolytic tank 1 through a mixing tank liquid outlet delivery pump 9, a first delivery pipe 10, a second delivery pipe 11 and an overflow port collecting pipe connecting pipeline 12 through a mixing tank outlet valve 8, the excessive plating solution flows back into a discharge solution collecting pipe 3 through the overflow port collecting pipe connecting pipeline 12 due to overhigh liquid level, and the liquid level of the plating solution in each electrolytic tank 1 is controlled through the overflow port collecting pipe connecting pipeline 12.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (5)
1. A plating solution mixing arrangement of series connection plating bath, includes four electrolysis trough (1), its characterized in that: the four electrolytic tanks (1) are internally and fixedly connected with the same discharged liquid collecting manifold (3), the outer surface of the discharged liquid collecting manifold (3) is provided with four electrolytic tank liquid discharging valves (2), the right end of the discharged liquid collecting manifold (3) is fixedly connected with the left side surface of a discharged liquid collecting low-level tank (4), the right side surface of the discharged liquid collecting low-level tank (4) is fixedly connected with the left side surface of a low-level tank outlet valve (5), and the right end of the low-level tank outlet valve (5) is fixedly connected with the input end of a low-level tank liquid outlet conveying pump (6);
the utility model discloses a low-order groove liquid delivery pump, including low-order groove liquid delivery pump (6), the first conveyer pipe of output fixedly connected with (10) of low-order groove liquid delivery pump (6), the right-hand member of low-order groove liquid delivery pump (6) and the left surface fixed connection of quenching and tempering mixing tank (7), the right flank of quenching and tempering mixing tank (7) and the left surface fixed connection of mixing tank outlet valve (8), the right-hand member of quenching and tempering mixing tank outlet valve (8) and the input fixed connection of mixing tank liquid delivery pump (9), the output of mixing tank liquid delivery pump (9) and the end fixed connection of intaking of second conveyer pipe (11).
2. The plating solution mixing device of claim 1, wherein the plating solution mixing device comprises: fixing rods (15) are fixedly connected to the two sides of the upper surfaces of the electrolytic cell (1), the discharged liquid confluence low-level tank (4) and the tempering mixing tank (7), and the inner walls of the fixing rods (15) are fixedly connected with the outer surface of the second conveying pipe (11).
3. The plating solution mixing device of claim 2, wherein the plating solution mixing device comprises: the water outlet end of the first conveying pipe (10) is positioned in the tempering and mixing tank (7), and the outer surface of the first conveying pipe (10) is fixedly connected to the outer surface of the corresponding fixing rod (15).
4. The plating solution mixing device of claim 1, wherein the plating solution mixing device comprises: the outer surface of the second conveying pipe (11) is fixedly connected with four branch effluent pipelines (13), and the outer surfaces of the four branch effluent pipelines (13) are provided with branch regulating valves (14).
5. The plating solution mixing device of claim 1, wherein the plating solution mixing device comprises: the right side face of the electrolytic cell (1) is fixedly connected with an overflow port collecting pipe connecting pipeline (12), and the bottom end of the overflow port collecting pipe connecting pipeline (12) is communicated with the outer surface of the discharge liquid collecting pipe (3).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022416528.0U CN213507275U (en) | 2020-10-27 | 2020-10-27 | Plating solution mixing arrangement of series connection plating bath |
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| CN202022416528.0U CN213507275U (en) | 2020-10-27 | 2020-10-27 | Plating solution mixing arrangement of series connection plating bath |
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| CN213507275U true CN213507275U (en) | 2021-06-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082492A1 (en) * | 2022-10-18 | 2024-04-25 | 重庆金美新材料科技有限公司 | Electroplating bath having side wall plating solution drainage function and electroplating production line |
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2020
- 2020-10-27 CN CN202022416528.0U patent/CN213507275U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082492A1 (en) * | 2022-10-18 | 2024-04-25 | 重庆金美新材料科技有限公司 | Electroplating bath having side wall plating solution drainage function and electroplating production line |
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