CN213507169U - Film coating device - Google Patents
Film coating device Download PDFInfo
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- CN213507169U CN213507169U CN202021527086.0U CN202021527086U CN213507169U CN 213507169 U CN213507169 U CN 213507169U CN 202021527086 U CN202021527086 U CN 202021527086U CN 213507169 U CN213507169 U CN 213507169U
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Abstract
The utility model discloses a coating device, coating device has the vacuum chamber, in the vacuum chamber, install first target subassembly and second target subassembly respectively in the both sides of substrate support, first target subassembly and second target subassembly set up relatively, can guarantee to treat the first surface and the second surface coating film simultaneously of coating film base plate, improve coating efficiency, and, first magnet has in first target subassembly, second magnet has in the second target subassembly, first magnet sets up with second magnet relatively, can make the sputtering effort on first surface and second surface offset each other, thereby increase the adhesive force of rete, reduce the diaphragm and warp.
Description
Technical Field
The utility model relates to the technical field of coating film, especially, relate to a coating device.
Background
With the continuous development of scientific technology, more and more electronic devices with communication function are widely applied to daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present. Electronic equipment needs to be packaged and protected by a shell and a cover plate which are made of a substrate with a plated film on the surface.
At present, the film coating on the plastic substrate often meets the condition that the adhesive force of the film layer does not reach the standard, and with the coming of the 5G era, the plastic substrate can be applied in a greater quantity.
Therefore, it is an urgent need to solve the problem of how to coat a film with good adhesion on a plastic substrate.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a coating device can improve coating efficiency, increases the adhesive force of rete, reduces the diaphragm and warp.
In order to achieve the above object, the present invention provides the following technical solutions:
a coating device having a vacuum chamber comprising therein:
the substrate support is used for placing a substrate to be coated; the substrate to be coated is provided with a first surface and a second surface which are opposite;
the first target assembly is positioned on the first side of the substrate support and used for placing a first target to coat the first surface;
the second target assembly is positioned on the second side of the substrate support and used for placing a second target to coat the second surface;
wherein the first side and the second side are opposite sides of the substrate support; the first target support is provided with a first magnet, the second target is provided with a second magnet, the first magnet and the second magnet are used for controlling the direction of a magnetic field, and the first magnet and the second magnet are oppositely arranged so that sputtering acting forces of the first surface and the second surface are mutually offset.
Preferably, in the above coating apparatus, the substrate support is a first cylindrical member, a cylindrical side surface of the first cylindrical member has a plurality of fixing windows, and each fixing window is used for mounting one substrate to be coated;
wherein the first target assembly extends through the circular top and bottom surfaces of the first cylindrical member; the second target assembly is located outside the first cylindrical member; the first cylinder member is rotatable based on its axis.
Preferably, in the above-described film deposition apparatus, the first target assembly is a second cylindrical member that is fitted inside the first cylindrical member, and the first magnet is located inside the second cylindrical member;
wherein the first target is a first cylindrical target nested outside a cylindrical side of the second cylindrical member.
In the plating device, the second cylindrical member may be rotatable about an axis thereof, and the first magnet may be fixed.
Preferably, in the above-described film deposition apparatus, the second target assembly is a third cylindrical member, and an axis of the third cylindrical member is parallel to an axis of the second cylindrical member;
wherein the second target is a second cylindrical target nested outside a cylindrical side of the third cylindrical component.
Preferably, in the plating device, the third cylindrical member is rotatable about an axis thereof, and the second magnet is fixed.
Preferably, the plating device further includes: a heating device for heating the vacuum chamber.
Preferably, the plating device further includes: and the cold trap is used for removing water vapor in the vacuum chamber.
Preferably, in the above plating device, the vacuum chamber further includes:
a first anode ion source and a first cathode ion source disposed on the first side, the first anode ion source for providing positive ions that bombard the first surface, the first cathode ion source for providing negative ions that bombard the first surface;
and/or a second anode ion source and a second cathode ion source disposed on the second side, the second anode ion source for providing positive ions for bombarding the second surface, the second cathode ion source for providing negative ions for bombarding the second surface.
Preferably, in the above-described plating apparatus, the first anode ion source, the first cathode ion source, the second anode ion source, and the second cathode ion source are provided at the same time;
wherein the first and second anode ion sources are oppositely disposed; the first cathode ion source and the second cathode ion source are oppositely arranged.
According to the above description, the utility model provides an among the coating device, the vacuum chamber has, in the vacuum chamber, install first target subassembly and second target subassembly respectively in the both sides of base plate support, first target subassembly and second target subassembly set up relatively, can guarantee that the first surface and the second surface of treating the coating film base plate can the coating film simultaneously, improve coating film efficiency, and, first magnet has in first target subassembly, second magnet has in the second target subassembly, first magnet sets up with second magnet relatively, can make the sputtering effort on first surface and second surface offset each other, thereby increase the adhesive force of rete, reduce the diaphragm and warp.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
The structure, ratio, size and the like shown in the drawings of the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the achievable purpose.
Fig. 1 is a schematic structural diagram of a coating apparatus provided in an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in detail and fully with reference to the accompanying drawings, wherein the description is only for the purpose of illustrating the embodiments of the present invention and not for the purpose of limiting the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Compared with a glass substrate, the film coating on the plastic substrate (a PC board, a PET board, a PMMA board, a PI board and the like) can often meet the condition that the adhesive force of the film layer does not reach the standard, and with the coming of the 5G era, the plastic substrate can be applied in a larger quantity, so that how to coat the film layer with good adhesive force on the plastic substrate becomes the technical bottleneck in the current industry.
Therefore, in order to solve the above problems, the present invention provides a plating apparatus, which has a vacuum chamber, the vacuum chamber comprising:
the substrate support is used for placing a substrate to be coated; the substrate to be coated is provided with a first surface and a second surface which are opposite;
the first target assembly is positioned on the first side of the substrate support and used for placing a first target to coat the first surface;
the second target assembly is positioned on the second side of the substrate support and used for placing a second target to coat the second surface;
wherein the first side and the second side are opposite sides of the substrate support; the first target assembly is provided with a first magnet, the second target assembly is provided with a second magnet, the first magnet and the second magnet are used for controlling the direction of a magnetic field, and the first magnet and the second magnet are oppositely arranged so that sputtering acting forces of the first surface and the second surface are mutually offset.
According to the above description, the utility model provides an among the coating device, the vacuum chamber has, in the vacuum chamber, install first target subassembly and second target subassembly respectively in the both sides of base plate support, first target subassembly and second target subassembly set up relatively, can guarantee that the first surface and the second surface of treating the coating film base plate can the coating film simultaneously, improve coating film efficiency, and, first magnet has in first target subassembly, second magnet has in the second target subassembly, first magnet sets up with second magnet relatively, can make the sputtering effort on first surface and second surface offset each other, thereby increase the adhesive force of rete, reduce the diaphragm and warp.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a coating device according to an embodiment of the present invention, as shown in fig. 1, the coating device has a vacuum chamber, the vacuum chamber includes:
the substrate support 11 is used for placing a substrate to be coated; the substrate to be coated is provided with a first surface and a second surface which are opposite; a first target assembly 12, wherein the first target assembly 12 is located at a first side of the substrate support 11 and is used for placing a first target to coat the first surface; the second target assembly 13 is positioned on the second side of the substrate support 11, and is used for placing a second target to coat the second surface; wherein the first side and the second side are opposite sides of the substrate support 11; the first target assembly 12 has a first magnet 14 therein, the second target assembly 13 has a second magnet 15 therein, the first magnet 14 and the second magnet 15 are used for controlling the magnetic field direction, and the first magnet 14 and the second magnet 15 are disposed opposite to each other, so that the sputtering forces of the first surface and the second surface are cancelled out.
The embodiment of the utility model provides an in, treat the first surface of coating film base plate through first target and carry out the coating film, treat the second surface of coating film base plate through the second target and carry out the coating film, can guarantee to treat the first surface and the second surface of coating film base plate coating film simultaneously, thereby improve coating film efficiency, and, set up first magnet 14 in first target subassembly 12 and second magnet 15 in the second target subassembly 13 relatively, can make the sputtering effort of the first surface of coating film base plate and second surface of treating offset each other, increase the adhesive force of rete, it warp to reduce the diaphragm.
In the embodiment shown in fig. 1, the substrate support 11 is a first cylindrical member, and a cylindrical side surface of the first cylindrical member has a plurality of fixing windows (not shown in fig. 1), and each fixing window is used for mounting one substrate to be coated; wherein the first target assembly 12 extends through the circular top and bottom surfaces of the first cylindrical member; the second target assembly 13 is located outside the first cylindrical member; the first cylinder member is rotatable based on its axis.
The axis is a connecting line of the centers of the circular top surface and the circular bottom surface of the first cylindrical component.
The embodiment of the utility model provides an in, to wait that the coating film base plate is fixed on the fixed window of first drum part, every fixed window can install one and wait the coating film base plate to through rotatory first drum part respectively for waiting on each window the coating film base plate carry out the coating film, first drum part rotates based on its axis, thereby realized a plurality of coating films when waiting the coating film base plate, improve coating film efficiency.
Wherein the first target assembly 12 is a second cylindrical member nested within the first cylindrical member, and the first magnet 14 is located within the second cylindrical member; wherein the first target is a first cylindrical target nested outside a cylindrical side of the second cylindrical member.
Further, the second cylindrical member is rotatable about its axis, and the first magnet 14 is fixed.
Wherein the second target assembly 13 is a third cylindrical member having an axis parallel to an axis of the second cylindrical member; wherein the second target is a second cylindrical target nested outside a cylindrical side of the third cylindrical component.
Further, the third cylindrical member is rotatable on its axis, and the second magnet 15 is fixed. The first magnet 14 and the second magnet 15 are fixed, so that the relative positions of the two magnets are unchanged, and the sputtering acting forces on the two sides are better counteracted.
It should be noted that the axis of the first cylindrical member and the axis of the second cylindrical member and the axis of the third cylindrical member may be parallel or non-parallel.
In the embodiment of the application, first cylinder part rotates based on its axis, second cylinder part rotates based on its axis, third cylinder part rotates based on its axis, three cylinder parts can be simultaneously to anticlockwise rotation or simultaneously to clockwise rotation, can realize a plurality of coating films when treating the coating film base plate, and, can guarantee to treat the first surface and the second surface coating film of coating film base plate simultaneously, thereby improve coating film efficiency, it is further, first magnet 14 and second magnet 15's relative setting, can balance inside and outside sputtering effort, make the sputtering effort on the first surface and the second surface of treating the coating film base plate offset each other, thereby increase the adhesive force of rete, reduce the diaphragm and warp.
The embodiment of the utility model provides an in, still include: a heating device for heating the vacuum chamber. The heating device can heat the coating device to 80-100 ℃ for removing water vapor on the substrate to be coated.
The embodiment of the utility model provides an in, still include: and the cold trap is used for removing water vapor in the vacuum chamber. After the water vapor on the substrate to be coated is removed by the heating device, the heating is closed, and the water vapor in the coating device and on the substrate to be coated is more fully removed by using a cold trap (below-145 ℃).
In the embodiment of the present invention, the vacuum chamber further comprises: a first anode ion source and a first cathode ion source disposed on the first side, the first anode ion source for providing positive ions for bombarding the first surface, the first cathode ion source for providing negative ions for bombarding the first surface.
And/or a second anode ion source and a second cathode ion source disposed on the second side, the second anode ion source for providing positive ions for bombarding the second surface, the second cathode ion source for providing negative ions for bombarding the second surface.
In the embodiment of the application, the first anode ion source and the first cathode ion source are arranged on the first side of the substrate support at the same time, on one hand, the first anode ion source and the first cathode ion source can be used for emitting positive ions and negative ions towards the first surface of the substrate to be coated, on the other hand, the substrate to be coated is bombarded by the positive ions and the negative ions, the roughness of the first surface of the substrate to be coated can be improved, the inner first surface film layer can be tamped, and the adhesive force of the first surface coating can be increased.
In a similar way, set up second positive pole ion source and second negative pole ion source simultaneously in the second side of base plate support, on the one hand can be used for the second surface emission positive ion and the anion of orientation treating the coating film base plate, on the other hand, bombard treating the coating film base plate through positive ion and anion, can improve the roughness of treating the coating film base plate second surface, second surface rete in can also ramming, increase the adhesive force of second surface coating film, simultaneously can balance inside and outside sputtering effort, make the sputtering effort of treating the first surface of coating film base plate and second surface offset each other, increase the adhesive force of rete, reduce the diaphragm and warp.
Further, the first anode ion source, the first cathode ion source, the second anode ion source and the second cathode ion source may be provided at the same time; wherein the first and second anode ion sources are oppositely disposed; the first cathode ion source and the second cathode ion source are oppositely arranged.
The embodiment of the utility model provides an in, can utilize laser lithography technique to make required texture pattern on treating the coating film base plate earlier, vacuum chamber evacuation in the coating film device again, heat coating film device to 80-100 degrees, will treat the steam on the coating film base plate and get rid of, steam gets rid of the back and closes the heating, utilize the cold-trap (-145 degrees below) to get rid of in the coating film device and treat the steam on the coating film base plate more fully, in the coating film process, open positive pole ion source and negative pole ion source simultaneously and treat the coating film base plate and bombard, can improve the adhesive force of rete, it warp to reduce the diaphragm.
It should be noted that, when the anode ion source or the cathode ion source is started alone, in the process of bombarding the tamped film layer, no matter the cathode ion source or the anode ion source is adopted, partial charges are accumulated on the surface of the film layer in a short time in the process of bombarding the surface of the film layer, and the generation of the charges can generate a barrier effect on the continuous deposition of the film layer. Through the mode of opening cathode ion source and anode ion source simultaneously in this application, can let the electric charge of rete surface area accumulation in time disappear, improve heavy membrane rate and heavy membrane quality.
According to the above description, the utility model provides an among the coating device, the vacuum chamber has, in the vacuum chamber, install first target subassembly and second target subassembly respectively in the both sides of base plate support, first target subassembly and second target subassembly set up relatively, can guarantee that the first surface and the second surface of treating the coating film base plate can the coating film simultaneously, improve coating film efficiency, and, first magnet has in first target subassembly, second magnet has in the second target subassembly, first magnet sets up with second magnet relatively, can make the sputtering effort on first surface and second surface offset each other, thereby increase the adhesive force of rete, reduce the diaphragm and warp.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other.
It should be noted that in the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A plating device characterized by having a vacuum chamber comprising:
the substrate support is used for placing a substrate to be coated; the substrate to be coated is provided with a first surface and a second surface which are opposite;
the first target assembly is positioned on the first side of the substrate support and used for placing a first target to coat the first surface;
the second target assembly is positioned on the second side of the substrate support and used for placing a second target to coat the second surface;
wherein the first side and the second side are opposite sides of the substrate support; the first target assembly is provided with a first magnet, the second target assembly is provided with a second magnet, the first magnet and the second magnet are used for controlling the direction of a magnetic field, and the first magnet and the second magnet are oppositely arranged so that sputtering acting forces of the first surface and the second surface are mutually offset.
2. The plating device according to claim 1, wherein the substrate holder is a first cylindrical member having a plurality of fixing windows on a cylindrical side surface thereof, each of the fixing windows being adapted to receive one of the substrates to be plated;
wherein the first target assembly extends through the circular top and bottom surfaces of the first cylindrical member; the second target assembly is located outside the first cylindrical member; the first cylinder member is rotatable based on its axis.
3. The plating device according to claim 2, wherein the first target assembly is a second cylindrical member that is nested within the first cylindrical member, the first magnet being located within the second cylindrical member;
wherein the first target is a first cylindrical target nested outside a cylindrical side of the second cylindrical member.
4. The plating device according to claim 3, wherein the second cylindrical member is rotatable on its axis, and the first magnet is fixed.
5. The plating device according to claim 3, wherein the second target assembly is a third cylindrical member having an axis parallel to an axis of the second cylindrical member;
wherein the second target is a second cylindrical target nested outside a cylindrical side of the third cylindrical component.
6. The plating device according to claim 5, wherein the third cylindrical member is rotatable on its axis, and the second magnet is fixed.
7. The plating device according to claim 1, further comprising: a heating device for heating the vacuum chamber.
8. The plating device according to claim 1, further comprising: and the cold trap is used for removing water vapor in the vacuum chamber.
9. The plating device according to any one of claims 1 to 8, further comprising in the vacuum chamber:
a first anode ion source and a first cathode ion source disposed on the first side, the first anode ion source for providing positive ions that bombard the first surface, the first cathode ion source for providing negative ions that bombard the first surface;
and/or a second anode ion source and a second cathode ion source disposed on the second side, the second anode ion source for providing positive ions for bombarding the second surface, the second cathode ion source for providing negative ions for bombarding the second surface.
10. The plating device according to claim 9, wherein the first anode ion source, the first cathode ion source, the second anode ion source, and the second cathode ion source are provided at the same time;
wherein the first and second anode ion sources are oppositely disposed; the first cathode ion source and the second cathode ion source are oppositely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021527086.0U CN213507169U (en) | 2020-07-28 | 2020-07-28 | Film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021527086.0U CN213507169U (en) | 2020-07-28 | 2020-07-28 | Film coating device |
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| CN213507169U true CN213507169U (en) | 2021-06-22 |
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| CN202021527086.0U Active CN213507169U (en) | 2020-07-28 | 2020-07-28 | Film coating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024107257A1 (en) * | 2022-11-18 | 2024-05-23 | Applied Materials, Inc. | System and methods for depositing material on a substrate |
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2020
- 2020-07-28 CN CN202021527086.0U patent/CN213507169U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024107257A1 (en) * | 2022-11-18 | 2024-05-23 | Applied Materials, Inc. | System and methods for depositing material on a substrate |
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