CN213497222U - Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer - Google Patents

Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer Download PDF

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Publication number
CN213497222U
CN213497222U CN202022186821.2U CN202022186821U CN213497222U CN 213497222 U CN213497222 U CN 213497222U CN 202022186821 U CN202022186821 U CN 202022186821U CN 213497222 U CN213497222 U CN 213497222U
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base
connecting rod
laser cutting
cylinder
molybdenum
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CN202022186821.2U
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孟亚丽
祝永华
许鑫
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Changzhou Sujiang Electronic Material Co ltd
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Changzhou Sujiang Electronic Material Co ltd
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Abstract

The utility model discloses a molybdenum disk laser cutting sucking disc formula work piece manipulator, the on-line screen storage device comprises a base, the bottom of base is provided with the fixed plate, the vertical pivot that is provided with in inside of base, the top of pivot is provided with movable footstock, the top and the bottom of pivot all overlap and are equipped with the bearing, the middle part of pivot and the position cover that is located between two sets of bearings are equipped with rotary mechanism, the top of base is provided with the head rod, and the bottom of head rod and the interior top of base pass through first cylinder swing joint, the head rod passes through adjustment mechanism swing joint with the second connecting rod, the inside joint of second connecting rod is provided with negative pressure suction means. Has the advantages that: through setting up mobilizable two sets of connecting rods and negative pressure suction means, can realize the nimble rotation of manipulator to utilize the manipulator to replace manual operation, promoted work efficiency greatly, realized the volume production of laser cutting molybdenum disk, and reduced manufacturing cost.

Description

Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer
Technical Field
The utility model relates to a production facility makes technical field, particularly, relates to a molybdenum disk laser cutting sucking disc formula work piece manipulator.
Background
The molybdenum material has high melting point, high physical strength, creep resistance, high elastic modulus, excellent electric and thermal conductivity, and particularly has extremely low thermal expansion coefficient, which is very important for the application of metal-ceramic and metal-semiconductor structures, for example, in the field of LEDs, future V-LEDs regarded as high-power LEDs will use the molybdenum material as a substrate material, namely a molybdenum wafer.
In the trimming process of the molybdenum wafer, a laser cutting method with a high precision effect is generally selected, and because the molybdenum wafer is used in a large amount, at present, when the molybdenum wafer is cut by laser, the uncut molybdenum wafer is firstly placed on a workbench manually, an adsorption gas button is started, the uncut molybdenum wafer is adsorbed on the workbench, the adsorption gas button is closed after the molybdenum wafer is cut, and the molybdenum wafer and leftover materials are taken down manually, so that the operation mode is low in working efficiency and workload of workers.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a molybdenum disk laser cutting sucking disc formula work piece manipulator possesses and utilizes the manipulator to replace the manual work to carry out the advantage of operating, and then solves the problem that manual operation work efficiency is low.
(II) technical scheme
In order to realize the above-mentioned advantage of utilizing the manipulator to replace the manual work to operate, the utility model discloses a specific technical scheme as follows:
the utility model provides a molybdenum disk laser cutting sucking disc formula work piece manipulator, the on-line screen storage device comprises a base, the bottom of base is provided with the fixed plate, the vertical pivot that is provided with in inside of base, the top of pivot and the top that is located the base are provided with movable footstock, the top and the bottom of pivot all overlap and are equipped with the bearing, and the bearing joint is in the inside of base, the middle part of pivot and the position cover that is located between two sets of bearings are equipped with rotary mechanism, the top of base is provided with the head rod, and the bottom of head rod and the interior top of base are through first cylinder swing joint, adjustment mechanism swing joint is passed through at the top of head rod and the top of second connecting rod, the inside joint of second connecting.
Further, in order to realize the nimble rotation that the activity footstock can go on the degree, rotary mechanism includes the gear, the middle part of pivot is located to the gear sleeve, the both sides of gear all are provided with the rack that meshes mutually with it, the top of the rack of gear one side and first telescopic cylinder's output fixed connection, the top of first telescopic cylinder and the inner wall fixed connection of base, the top of the rack of gear opposite side and the output fixed connection of second telescopic cylinder, the bottom of second telescopic cylinder and the inner wall fixed connection of base.
Furthermore, in order to enable the second connecting rod to swing and rotate freely in the vertical direction, so as to realize grabbing of molybdenum wafers at any positions, the adjusting mechanism comprises a T-shaped fixing plate, the bottom end of the T-shaped fixing plate is fixedly connected with one side of the top of the first connecting rod, a first rotating motor is horizontally and fixedly arranged on one side of the top of the T-shaped fixing plate, a first L-shaped connecting plate is arranged on the other side of the top of the T-shaped fixing plate, the output end of the first rotating motor penetrates through the top of the T-shaped fixing plate and is fixedly connected with the bottom end of the first L-shaped connecting plate, a second rotating motor is vertically and fixedly arranged at the bottom end of the T-shaped fixing plate, which is far away from the first rotating motor, a second L-shaped connecting plate is arranged at the top end of the T-shaped fixing plate, the output end of the second rotating motor penetrates through the bottom end, be provided with the connecting block between first L type connecting plate and the second L type connecting plate, one side of connecting block and the top swing joint of second L type connecting plate, the top of connecting block pass the top of first L type connecting plate and with the bottom fixed connection of second connecting rod.
Further, in order to realize the effective absorption to the molybdenum disk, negative pressure suction means includes the second cylinder, the top of second cylinder and the interior top fixed connection of second connecting rod, the output connection of second cylinder is provided with rubber piston, the below of rubber piston and the middle part joint that is located the second connecting rod are provided with the closing plate, the middle part of closing plate is run through and is provided with metal collapsible tube, metal collapsible tube's bottom is connected and is provided with the rolling ball, the rolling ball joint is in the bottom of second connecting rod, the bottom connection of rolling ball is provided with the sucking disc, and the through-hole that is linked together with metal collapsible tube is all seted up at the top middle part of rolling ball and sucking disc.
Furthermore, in order to form negative pressure inside the second connecting rod and further realize the suction of the molybdenum wafer, a closed space is formed among the rubber piston, the sealing plate and the middle part of the second connecting rod.
Furthermore, in order to realize automatic control, the first telescopic cylinder, the second telescopic cylinder, the first rotating motor, the second rotating motor and the second cylinder are electrically connected.
(III) advantageous effects
Compared with the prior art, the utility model provides a molybdenum disk laser cutting sucking disc formula work piece manipulator possesses following beneficial effect:
(1) through setting up mobilizable two sets of connecting rods and negative pressure suction means, can realize the nimble rotation of manipulator to utilize the manipulator to replace manual operation, promoted work efficiency greatly, realized the volume production of laser cutting molybdenum disk, and reduced manufacturing cost.
(2) Through setting up the second cylinder to utilize rubber piston and closing plate to make airtight space, thereby realize the operation that the negative pressure was absorb, utilize the air pump to make the negative pressure environment with the tradition and compare, make the manipulator more nimble and be convenient for control.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a molybdenum wafer laser cutting chuck type workpiece manipulator according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a rotating mechanism in a molybdenum wafer laser cutting chuck type workpiece manipulator according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an adjusting mechanism in a molybdenum wafer laser cutting chuck type workpiece manipulator according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a negative pressure suction device in a molybdenum wafer laser cutting sucker type workpiece manipulator according to the embodiment of the present invention.
In the figure:
1. a base; 2. a fixing plate; 3. a rotating shaft; 4. a movable top seat; 5. a bearing; 6. a rotation mechanism; 601. a gear; 602. a rack; 603. a first telescopic cylinder; 604. a second telescopic cylinder; 7. a first connecting rod; 8. a first cylinder; 9. a second connecting rod; 10. an adjustment mechanism; 1001. a T-shaped fixing plate; 1002. a first rotating electric machine; 1003. a first L-shaped connecting plate; 1004. a second rotating electric machine; 1005. a second L-shaped connecting plate; 1006. connecting blocks; 11. a negative pressure suction device; 1101. a second cylinder; 1102. a rubber piston; 1103. a sealing plate; 1104. a metal hose; 1105. rotating the ball; 1106. and (4) sucking discs.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides a sucking disc formula work piece manipulator of molybdenum disk laser cutting.
The invention will now be further described with reference to the accompanying drawings and specific embodiments, as shown in figures 1-4, the suction disc type workpiece manipulator for laser cutting of the molybdenum wafer comprises a base 1, a fixed plate 2 is arranged at the bottom end of the base 1, a rotating shaft 3 is vertically arranged in the base 1, a movable top seat 4 is arranged at the top end of the rotating shaft 3 and above the base 1, bearings 5 are sleeved at the top and the bottom of the rotating shaft 3, the bearings 5 are clamped in the base 1, the rotating mechanism 6 is sleeved in the middle of the rotating shaft 3 and between the two sets of bearings 5, the top of the base 1 is provided with a first connecting rod 7, and the bottom of the first connecting rod 7 is movably connected with the inner top end of the base 1 through a first air cylinder 8, the top of the first connecting rod 7 is movably connected with the top of the second connecting rod 9 through an adjusting mechanism 10, and a negative pressure suction device 11 is clamped inside the second connecting rod 9.
By means of the above scheme, through setting up mobilizable two sets of connecting rods and negative pressure suction device 11, can realize the nimble rotation of manipulator to utilize the manipulator to replace manual operation, promoted work efficiency greatly, realized the volume production of laser cutting molybdenum disk, and reduced manufacturing cost.
In one embodiment, the rotating mechanism 6 includes a gear 601, the gear 601 is sleeved in the middle of the rotating shaft 3, both sides of the gear 601 are provided with racks 602 engaged therewith, the top end of the rack 602 on one side of the gear 601 is fixedly connected with the output end of the first telescopic cylinder 603, the top end of the first telescopic cylinder 603 is fixedly connected with the inner wall of the base 1, the top end of the rack 602 on the other side of the gear 601 is fixedly connected with the output end of the second telescopic cylinder 604, and the bottom end of the second telescopic cylinder 604 is fixedly connected with the inner wall of the base 1, so that the movable top base 4 can flexibly rotate by 360 degrees.
In one embodiment, the adjusting mechanism 10 comprises a T-shaped fixing plate 1001, the bottom end of the T-shaped fixing plate 1001 is fixedly connected with one side of the top of the first connecting rod 7, one side of the top of the T-shaped fixing plate 1001 is horizontally and fixedly provided with a first rotating motor 1002, the other side of the top of the T-shaped fixing plate 1001 is provided with a first L-shaped connecting plate 1003, the output end of the first rotating motor 1002 passes through the top of the T-shaped fixing plate 1001 and is fixedly connected with the bottom end of the first L-shaped connecting plate 1003, the bottom end of the T-shaped fixing plate 1001 on the side away from the first rotating motor 1002 is vertically and fixedly provided with a second rotating motor 1004, the top end of the T-shaped fixing plate 1001 on the side away from the first rotating motor 1002 is provided with a second L-shaped connecting plate 1005, the output end of the second rotating motor 1004 passes through the bottom end of the T-shaped fixing plate 1001 and is fixedly connected with, one side of connecting block 1006 and the top swing joint of second L type connecting plate 1005, the top of connecting block 1006 pass first L type connecting plate 1003 and with the bottom fixed connection of second connecting rod 9, can make second connecting rod 9 carry out arbitrary swing and rotation on vertical direction like this to the realization snatchs the molybdenum disk of optional position.
In one embodiment, the negative pressure suction device 11 includes a second cylinder 1101, a top end of the second cylinder 1101 is fixedly connected with an inner top portion of the second connecting rod 9, an output end of the second cylinder 1101 is connected and provided with a rubber piston 1102, a sealing plate 1103 is clamped and arranged below the rubber piston 1102 and in the middle of the second connecting rod 9, a metal hose 1104 penetrates through the middle of the sealing plate 1103, a rotating ball 1105 is connected and arranged at a bottom end of the metal hose 1104, the rotating ball 1105 is clamped and connected at a bottom portion of the second connecting rod 9, a suction cup 1106 is connected and arranged at a bottom end of the rotating ball 1105, and through holes communicated with the metal hose 1104 are formed in middle portions of top ends of the rotating ball 1105 and the suction cup 1106, so that the molybdenum wafer can be sucked by using the operation of the second cylinder 1101 and the.
In one embodiment, a sealed space is formed between the rubber piston 1102, the sealing plate 1103 and the middle portion of the second connecting rod 9, so that a negative pressure can be formed inside the second connecting rod 9 by the second cylinder 1101.
In one embodiment, the first telescopic cylinder 603, the second telescopic cylinder 604, the first cylinder 8, the first rotating motor 1002, the second rotating motor 1004 and the second cylinder 1101 are electrically connected, so that automatic control can be realized.
For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.
In practical application, the working principle of the rotating mechanism 6 is as follows: by simultaneously starting the first telescopic cylinder 603 and the second telescopic cylinder 604 to extend, the left rack 602 can move upwards, the right rack 602 moves downwards and drives the gear 601 to rotate clockwise, so that the gear 601 drives the rotating shaft 3 and the movable top seat 4 to rotate clockwise by 360 degrees, and similarly, when the second telescopic cylinder 604 and the first telescopic cylinder 603 are started to contract, the movable top seat 4 rotates anticlockwise by 360 degrees; the first cylinder 8 is started to enable the first connecting rod 7 to swing in the vertical direction; the working principle of the adjusting mechanism 10 is as follows: starting the first rotating motor 1002, the first L-shaped connecting plate 1003 can drive the connecting block 1006 and the second connecting rod 9 to swing in the vertical direction, and starting the second rotating motor 1004 can drive the second L-shaped connecting plate 1005 to drive the connecting block 1006 and the second connecting rod 9 to rotate; the working principle of the negative pressure suction device 11 is as follows: when the bottom surface of the sucking disc 1106 contacts the molybdenum wafer, the second cylinder 1101 is started to contract, negative pressure is formed among the rubber piston 1102, the metal hose 1104 and the inside of the sucking disc 1106 at the moment, so that the molybdenum wafer is sucked, the second cylinder 1101 is started to extend out when the molybdenum wafer is conveyed to a specified position by utilizing the action of the rotating mechanism 6 and the adjusting mechanism 10, the molybdenum wafer is put down by the sucking disc 1106, so that the molybdenum wafer can be seen, manual operation is replaced by a mechanical arm, the working efficiency is greatly improved, the mass production of the laser cutting molybdenum wafer is realized, and the production cost is reduced.
In summary, with the aid of the technical solution of the present invention, by arranging the two movable sets of connecting rods and the negative pressure suction device 11, the flexible rotation of the manipulator can be realized, so that the manipulator replaces manual operation, the working efficiency is greatly improved, the mass production of laser cutting molybdenum wafers is realized, and the production cost is reduced; through setting up second cylinder 1101 to utilize rubber piston 1102 and closing plate 1103 to make airtight space, thereby realize the operation of negative pressure absorption, compare with the tradition and utilize the air pump to make the negative pressure environment, make the manipulator more nimble and be convenient for control.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a molybdenum disk laser cutting sucking disc formula work piece manipulator, a serial communication port, including base (1), the bottom of base (1) is provided with fixed plate (2), the inside of base (1) is vertical to be provided with pivot (3), the top of pivot (3) just is located the top of base (1) is provided with movable footstock (4), the top and the bottom of pivot (3) all overlap and are equipped with bearing (5), just bearing (5) joint in the inside of base (1), the middle part of pivot (3) just is located two sets of position cover between bearing (5) is equipped with rotary mechanism (6), the top of base (1) is provided with head rod (7), just the bottom of head rod (7) with the interior top of base (1) is through first cylinder (8) swing joint, the top of head rod (7) and the top of second connecting rod (9) are passed through adjustment mechanism (10) and are alive The movable connection is realized, and a negative pressure suction device (11) is clamped inside the second connecting rod (9).
2. The suction cup type workpiece manipulator for laser cutting of molybdenum wafers as claimed in claim 1, wherein the rotating mechanism (6) comprises a gear (601), the gear (601) is sleeved on the middle portion of the rotating shaft (3), racks (602) engaged with the gear (601) are arranged on two sides of the gear (601), the top end of the rack (602) on one side of the gear (601) is fixedly connected with the output end of a first telescopic cylinder (603), the top end of the first telescopic cylinder (603) is fixedly connected with the inner wall of the base (1), the top end of the rack (602) on the other side of the gear (601) is fixedly connected with the output end of a second telescopic cylinder (604), and the bottom end of the second telescopic cylinder (604) is fixedly connected with the inner wall of the base (1).
3. The suction cup type workpiece manipulator for laser cutting of molybdenum wafers as claimed in claim 2, wherein the adjusting mechanism (10) comprises a T-shaped fixing plate (1001), the bottom end of the T-shaped fixing plate (1001) is fixedly connected with one side of the top of the first connecting rod (7), one side of the top of the T-shaped fixing plate (1001) is horizontally and fixedly provided with a first rotating motor (1002), the other side of the top of the T-shaped fixing plate (1001) is provided with a first L-shaped connecting plate (1003), the output end of the first rotating motor (1002) penetrates through the top of the T-shaped fixing plate (1001) and is fixedly connected with the bottom end of the first L-shaped connecting plate (1003), the bottom end of the side of the T-shaped fixing plate (1001) far away from the first rotating motor (1002) is vertically and fixedly provided with a second rotating motor (1004), and the top end of the side of the T-shaped fixing plate (1001) far away from the first rotating motor (1002) is provided with a second L- 1005) The output end of the second rotating motor (1004) penetrates through the bottom end of the T-shaped fixing plate (1001) and is fixedly connected with the bottom end of the second L-shaped connecting plate (1005), a connecting block (1006) is arranged between the first L-shaped connecting plate (1003) and the second L-shaped connecting plate (1005), one side of the connecting block (1006) is movably connected with the top of the second L-shaped connecting plate (1005), and the top end of the connecting block (1006) penetrates through the top of the first L-shaped connecting plate (1003) and is fixedly connected with the bottom end of the second connecting rod (9).
4. The suction cup type workpiece manipulator for laser cutting of molybdenum discs as claimed in claim 3, wherein the negative pressure suction device (11) comprises a second cylinder (1101), the top end of the second cylinder (1101) is fixedly connected with the inner top of the second connecting rod (9), the output end of the second cylinder (1101) is connected with a rubber piston (1102), a sealing plate (1103) is clamped below the rubber piston (1102) and located in the middle of the second connecting rod (9), a metal hose (1104) penetrates through the middle of the sealing plate (1103), a rotating ball (1105) is connected to the bottom end of the metal hose (1104), the rotating ball (1105) is clamped to the bottom of the second connecting rod (9), a suction cup (1106) is connected to the bottom end of the rotating ball (1105), and the rotating ball (1105) and the middle of the top end of the suction cup (1106) are both communicated with the metal hose (1104) Of (3) a through-hole.
5. The molybdenum disc laser cutting sucker-type workpiece manipulator as claimed in claim 4, wherein a closed space is formed among the rubber piston (1102), the sealing plate (1103) and the middle part of the second connecting rod (9).
6. The molybdenum wafer laser cutting sucker type workpiece manipulator as claimed in claim 4, wherein the first telescopic cylinder (603), the second telescopic cylinder (604), the first cylinder (8), the first rotating motor (1002), the second rotating motor (1004) and the second cylinder (1101) are electrically connected.
CN202022186821.2U 2020-09-29 2020-09-29 Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer Active CN213497222U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022186821.2U CN213497222U (en) 2020-09-29 2020-09-29 Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022186821.2U CN213497222U (en) 2020-09-29 2020-09-29 Sucking disc type workpiece manipulator for laser cutting of molybdenum wafer

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113602617A (en) * 2021-07-27 2021-11-05 浙江中烟工业有限责任公司 Full-automatic cigarette bale breaker
CN113772421A (en) * 2021-08-09 2021-12-10 晟光科技股份有限公司 Screen production equipment and method of LCD display screen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113602617A (en) * 2021-07-27 2021-11-05 浙江中烟工业有限责任公司 Full-automatic cigarette bale breaker
CN113772421A (en) * 2021-08-09 2021-12-10 晟光科技股份有限公司 Screen production equipment and method of LCD display screen

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