CN213483737U - Pin type heat sink and power module - Google Patents
Pin type heat sink and power module Download PDFInfo
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- CN213483737U CN213483737U CN202022640127.3U CN202022640127U CN213483737U CN 213483737 U CN213483737 U CN 213483737U CN 202022640127 U CN202022640127 U CN 202022640127U CN 213483737 U CN213483737 U CN 213483737U
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Abstract
The present disclosure relates to a pin heat sink and a power module. The pin type radiator comprises a bottom plate and a plurality of hollow radiating columns arranged on the bottom plate, wherein at least partial areas of the space surrounded by the hollow radiating columns are communicated hollow areas, so that a radiating medium penetrates through the hollow radiating columns from the inside of the space surrounded by the hollow radiating columns through the hollow areas. In this way, by constructing the passage of the heat dissipation medium inside the heat dissipation column, the contact area between the heat dissipation column and the heat dissipation medium is increased, and the heat dissipation performance of the pin type heat sink is improved.
Description
Technical Field
The disclosure relates to the technical field of semiconductor device preparation, in particular to a pin type radiator and a power module.
Background
With the increasing requirement on environmental protection, new energy automobiles are developed vigorously. As a core component of a new energy vehicle controller, an Insulated Gate Bipolar Transistor (IGBT) module is receiving increasing attention. Vehicle-grade IGBT modules of different voltage grades, different current grades, and different packaging forms have been proposed.
With the requirements for miniaturization and light weight of IGBT module packaging and improvement of system efficiency, the current density of a power module is higher and higher, and particularly, the temperature of a chip is higher due to application of a SiC chip. Studies have shown that the lifetime of an electronic device is reduced by half for every 10 c increase in temperature. Therefore, reducing the junction temperature of the chip when the power module operates is an effective way to increase the service life of the power module. In order to improve the heat dissipation of the power module and lower the chip junction temperature, a pin-fin (pin-fin) heat sink is generally used in the power module.
SUMMERY OF THE UTILITY MODEL
The purpose of the present disclosure is to provide a pin type heat sink and a power module with good heat dissipation effects.
In order to achieve the above object, the present disclosure provides a pin heat sink, which includes a bottom plate and a plurality of hollow heat dissipation pillars disposed on the bottom plate, at least a partial region of a space surrounded by each of the hollow heat dissipation pillars is a hollow region that is communicated, so that a heat dissipation medium passes through the hollow heat dissipation pillars from the inside of the space surrounded by the hollow heat dissipation pillars via the hollow region.
Optionally, the hollow heat dissipation column includes a cylindrical portion, and the cylindrical portion has a notch, so that the heat dissipation medium reaches a hollow area surrounded by the cylindrical portion through the notch and passes through the hollow heat dissipation column.
Optionally, the indentation extends in a direction parallel to the base plate or in a direction perpendicular to the base plate.
Optionally, the notch is rectangular.
Optionally, the barrel portion is cylindrical.
Optionally, the notches are arranged in pairs, and a connecting line of each pair of notches passes through a central axis of the cylindrical part and is consistent with a flowing direction of the heat dissipation medium.
Optionally, the hollow heat dissipation column further comprises a cylindrical portion, and the cylindrical portion is disposed inside the cylindrical portion.
Optionally, the hollow heat-dissipating stud comprises a plurality of barrel portions, each barrel portion having a notch.
Optionally, a projection of the cylindrical portion and/or the barrel portion on the base plate comprises a streamlined curve.
The present disclosure also discloses a power module, including the above-mentioned pin type radiator that the present disclosure provided.
Through the technical scheme, in the pin type radiator, at least part of the space surrounded by the hollow radiating column is a communicated hollow area, so that the radiating medium penetrates through the hollow radiating column from the inside of the space surrounded by the hollow radiating column through the hollow area. In this way, by constructing the passage of the heat dissipation medium inside the heat dissipation column, the contact area between the heat dissipation column and the heat dissipation medium is increased, and the heat dissipation performance of the pin type heat sink is improved.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
fig. 1 is a perspective view of a pin type heat sink in the related art;
fig. 2 is a perspective view of a pin heat sink provided by a first embodiment of the present disclosure;
FIG. 3a is a side view of a hollow heat-dissipating stud in the pin heat sink of FIG. 2;
FIG. 3b is a top view of the hollow heat-dissipating stud in the pin heat sink of FIG. 2;
FIG. 4 is a top view of a hollow heat-dissipating stud provided by a second embodiment of the present disclosure;
fig. 5 is a perspective view of a pin heat sink provided by a third embodiment of the present disclosure;
FIG. 6a is a perspective view of a hollow heat-dissipating stud in the pin heat sink of FIG. 5;
FIG. 6b is a top view of the hollow heat-dissipating stud in the pin heat sink of FIG. 5;
fig. 7 is a perspective view of a pin heat sink provided by a fourth embodiment of the present disclosure;
FIG. 8 is a top view of a hollow heat-dissipating stud in the pin heat sink of FIG. 7;
fig. 9 is a perspective view of a pin heat sink provided by a fifth embodiment of the present disclosure;
fig. 10 is a top view of a hollow heat-dissipating stud in the pin heat sink of fig. 9.
Description of the reference numerals
1 bottom plate 11 solid heat radiation column 2 hollow heat radiation column
21 cylindrical part 22 gap 23 cylindrical part
Detailed Description
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
In the present disclosure, the use of orientation words such as "upper and lower" generally refers to the orientation relative to the process of fabricating the pin heat sink without being described to the contrary.
The inventor thinks that under the condition that the volume of the radiator and the number of the radiating columns are not changed, the contact area between the radiating columns and the radiating medium can be increased, so that the radiating capacity of the radiator can be improved, and the performance of the module can be further improved. Therefore, the inventor thought that a new pin-fin heat sink can be manufactured, and the contact area of the heat sink with the heat dissipation medium is increased by constructing a special-shaped structure on the heat dissipation column. In addition, the constraint of the appearance of the solid cylinder of the heat dissipation column can be eliminated, and various shapes which have large contact areas and are easy to demould and manufacture can be constructed.
Fig. 1 is a perspective view of a pin type heat sink in the related art. As shown in fig. 1, the pin heat sink includes a bottom plate 1 and a solid heat-dissipating stud 11, and the solid heat-dissipating stud 11 is a generally cylindrical or truncated cone-shaped solid body, and the contact area with the water flow is only the side surface and the upper top surface of the cylinder (or truncated cone).
The pin type heat radiator can comprise a bottom plate and a plurality of hollow heat radiating columns arranged on the bottom plate, wherein at least partial areas of spaces surrounded by the hollow heat radiating columns are communicated hollow areas, so that a heat radiating medium penetrates through the hollow heat radiating columns from the inside of the spaces surrounded by the hollow heat radiating columns through the hollow areas.
The base plate may be, for example, a Cu base plate, an AlSiC base plate, or a copper molybdenum base plate. For the Cu bottom plate, pin-fin can be manufactured in a hot extrusion mode; for the AlSiC bottom plate, the pin-fin can be molded by a graphite mold and vacuum pressure casting.
In contrast to the hollow heat-dissipating stud in fig. 1, the originally solid interior has a hollow region, and a heat-dissipating medium can pass through the hollow heat-dissipating stud via the hollow region. The contact area between the heat dissipation column and the heat dissipation medium is increased by constructing the passage of the heat dissipation medium in the heat dissipation column, so that the heat dissipation performance of the pin type heat sink is improved.
In addition, on the basis that a plurality of hollow heat dissipation columns are arranged on the bottom plate, one or more solid heat dissipation columns can be arranged on the bottom plate.
Fig. 2 is a perspective view of a pin heat sink according to a first embodiment of the present disclosure. As shown in fig. 2, the pin heat sink includes a base plate 1 and a plurality of hollow heat-dissipating studs 2 provided on the base plate 1. The hollow heat dissipation column 2 may be a cylindrical hollow region with a diameter smaller than the diameter of the top of the truncated cone, which is dug from the top to the bottom on the basis of the truncated cone-shaped solid, and the sidewall of the hollowed hollow heat dissipation column is opened to have a gap in the direction perpendicular to the bottom plate, thereby constructing a passage for the flow of the heat dissipation medium.
Fig. 3a is a side view of a hollow heat-dissipating stud in the pin heat sink of fig. 2. Fig. 3b is a top view of the hollow heat-dissipating stud in the pin heat sink of fig. 2. The hollow heat-dissipating stud 2 includes a cylindrical portion 21, and the cylindrical portion 21 has a notch 22, so that the heat-dissipating medium reaches a hollow area surrounded by the cylindrical portion 21 through the notch 22 and passes through the hollow heat-dissipating stud 2. In fig. 3b, the direction of the heat dissipation medium flow may be from top to bottom or from bottom to top.
Furthermore, the notches 22 in fig. 3a are rectangular, which makes the mold release easier and the process easier. In other embodiments, various shaped indentations are possible, such as circular holes, elliptical holes.
In fig. 3a, the indentation 22 extends in a direction perpendicular to the base plate 1. In other embodiments the indentations may extend in other directions, for example in a direction parallel to the base plate 1 in the embodiment of fig. 5 below.
In the embodiment of fig. 2, the hollow heat-dissipating stud 2 is hollowed out on the basis of a truncated cone-shaped solid body, or on the basis of a cylindrical solid body. If dug on the basis of a cylindrical solid, the barrel portion 21 is cylindrical (notched).
In order to facilitate the entrance and exit of the heat dissipation medium in the hollow heat dissipation column 2, the notches 22 may be arranged in pairs, and the connecting line of each pair of notches passes through the central axis of the cylindrical portion and is consistent with the flowing direction of the heat dissipation medium. For example, as shown in fig. 3b, the cylindrical portion 21 has two notches 22, i.e., an upper notch and a lower notch, and a line connecting the two notches 22 passes through the central axis of the cylindrical portion and coincides with the flow direction of the heat dissipating medium (the heat dissipating medium flows from top to bottom or from bottom to top in fig. 3 a). Therefore, the flowing of the heat dissipation medium is not hindered, and the flowing speed of the heat dissipation medium is not slowed down. In other embodiments, the number is not limited to two, nor to pairs.
FIG. 4 is a top view of a hollow heat-dissipating stud provided by a second embodiment of the present disclosure. As shown in fig. 4, the hollow heat-dissipating stud includes a columnar portion 23 in addition to the cylindrical portion 21, and the columnar portion 23 is provided inside the cylindrical portion 21. In the specific manufacturing process, a cylindrical hollow area (between the column part and the barrel part 21) can be dug from the top to the bottom of the cylindrical solid hollow heat dissipation column, wherein the barrel part 21 is provided with two notches 22, the notches 22 can be rectangles, and a group of opposite sides of the rectangles are perpendicular to the plane (paper surface) of the bottom plate 1.
Compared with the embodiment of fig. 2, the hollow heat dissipation column of fig. 4 increases the contact area of the side surface and the top surface of the columnar portion 23, and the contact area is further increased, thereby further improving the heat dissipation performance of the pin type heat sink.
Fig. 5 is a perspective view of a pin heat sink provided by a third embodiment of the present disclosure. Fig. 6a is a perspective view of a hollow heat-dissipating stud in the pin heat sink of fig. 5. Fig. 6b is a top view of the hollow heat-dissipating stud in the pin heat sink of fig. 5. The difference between the embodiment of fig. 5 and fig. 4 is that in fig. 4, the two indentations 22 in the cylindrical part 21 extend in a direction perpendicular to the base plate 1. Whereas in fig. 5 the six indentations 22 in the cylindrical part 21 extend in a direction parallel to the base plate 1. In comparison with fig. 5, fig. 4 shows a larger flow velocity of the heat dissipating medium in the hollow portion in the hollow heat dissipating stud of fig. 4, and a larger contact area in the hollow heat dissipating stud of fig. 5. Fig. 4 is easier to demold than the hollow heat-dissipating stud of fig. 5.
Fig. 7 is a perspective view of a pin heat sink according to a fourth embodiment of the present disclosure. Fig. 8 is a top view of a hollow heat-dissipating stud in the pin heat sink of fig. 7. In contrast to the embodiment of fig. 4, the hollow heat-dissipating stud of fig. 7 has a cylindrical portion 23 that is not cylindrical, nor does the cylindrical portion 21 thereof be formed by a cylindrical cutout 22. But the projections of its cylindrical portion 23 and cylindrical portion 21 on the base plate 1 comprise streamline curves. Specifically, the cross section of the heat dissipation medium can be designed to be round at the front and sharp at the back, and the heat dissipation medium is more streamlined like water drops and is more suitable for water flow (the flowing direction of the heat dissipation medium is from right to left in fig. 8). The indentation 22 in fig. 7 may be rectangular with a set of opposite sides perpendicular to the plane of the base plate 1. Through designing the column part 23 and the tube-shaped part 21 into streamline, when the heat dissipation medium flows through the inside and the outside of the hollow heat dissipation column 2, the side walls of the inside and the outside of the hollow heat dissipation column are more attached to the flow of the heat dissipation medium, so that the flow speed of the heat dissipation medium is accelerated, and the heat dissipation effect is better. In other embodiments, it is also possible to design one of the cylindrical portion 23 and the cylindrical portion 21 to be streamlined.
In the embodiment of fig. 4, the hollow heat-dissipating stud 2 includes a cylindrical portion and a columnar portion. The hollow heat-dissipating stud 2 may further include a plurality of cylindrical portions each having a notch. Fig. 9 is a perspective view of a pin heat sink provided in a fifth embodiment of the present disclosure. Fig. 10 is a top view of a hollow heat-dissipating stud in the pin heat sink of fig. 9. In the embodiment of fig. 9, the hollow heat-dissipating stud 2 comprises two cylindrical portions 21 and one cylindrical portion 23, and there are four rectangular notches 22 evenly distributed in each cylindrical portion 21 and extending in a direction perpendicular to the base plate. By arranging the two cylindrical parts 21, the contact area between the hollow radiating column and the radiating medium is further increased, and the radiating effect is improved.
The present disclosure also provides a power module including the pin heat sink provided by the present disclosure.
The inventor finds that the heat transfer area is increased in the direction perpendicular to the radiator bottom plate compared with the direction parallel to the radiator bottom plate through thermal simulation design, and the heat dissipation efficiency of the power module is improved more effectively. The following are simulation experiment results for the heat dissipation effects of the respective embodiments.
First, the total contact area of the bottom plate with the water flow in the embodiment of FIG. 1 was measured to be 4234.2mm2。
In the first experiment, 100W of power is applied to each SiC chip, the water temperature is 60 ℃, a Cu bottom plate is used, solder is used for welding the bottom plate, and Ag sintering technology is used for other mutual connection positions, so that the chip junction temperature simulation is carried out, and the highest junction temperature is 140.09 ℃.
Under the condition of same size of the bottom plate and the height and the number of the heat dissipation columns, the total contact area of the radiator shown in the figure 2 and the water is 5884.4mm2. And performing chip junction temperature simulation under the same condition to obtain the highest junction temperature of 137.53 ℃. Analysis can obtain that the contact surface area is increased by 39.0 percent, and the highest junction temperature is reduced by 2.5 ℃.
Experiment two, under the condition of same bottom plate size and height and number of heat dissipation columns, the total contact area with water is 7486.6mm by using the radiator shown in figure 52. And carrying out chip junction temperature simulation under the same condition to obtain the highest junction temperature of 134.3 ℃. Analysis can obtain that the heat dissipation surface area is increased by 76.8 percent, and the highest junction temperature is reduced by 5.5 ℃.
Experiment III, under the condition of the same size of the bottom plate and the heights and the number of the heat dissipation columns, the total contact area with water is 8262.4mm by using the radiator shown in figure 72. Performing chip junction under the same conditionsAnd (4) performing temperature simulation to obtain the highest junction temperature of 132.76 ℃. Analysis can obtain that the contact surface area is increased by 95 percent, and the highest junction temperature is reduced by 7.3 ℃.
Experiment four, under the condition of same bottom plate size and height and number of radiating columns, the radiator shown in figure 9 is applied, and the total contact area with water is measured to be 10262mm2. And performing chip junction temperature simulation under the same condition to obtain the highest junction temperature of 129.56 ℃. Analysis can obtain that the heat dissipation surface area is increased by 146.8 percent, and the highest junction temperature is reduced by 10.5 ℃.
Simulation results show that the larger the contact surface area is, the lower the highest junction temperature of the chip is. Under the precondition of ensuring the water flow passing capacity, reducing the demoulding difficulty and the like, the junction temperature can be effectively reduced by increasing the contact area of the hollow heat dissipation column and the water flow as much as possible. The simulation results of the above experiments are summarized in table 1 below.
| Examples of the invention | Solid heat dissipation column | Experiment one | Experiment two | Experiment three | Experiment four |
| Contact surface area (mm)2) | 4234.2 | 5884.4 | 7486.6 | 8262.4 | 10262 |
| Highest junction temperature (DEG C) | 140.09 | 137.53 | 134.4 | 132.76 | 129.56 |
| Maximum junction temperature difference (. degree. C.) | 2.5 | 5.6 | 7.3 | 10.5 | |
| Difficulty of demoulding | Easy | Easy | Is difficult to | Is easier to be | Is easier to be |
TABLE 1
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, various possible combinations will not be separately described in this disclosure.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (10)
1. The pin type heat radiator is characterized by comprising a bottom plate and a plurality of hollow heat radiating columns arranged on the bottom plate, wherein at least partial areas of spaces surrounded by the hollow heat radiating columns are communicated hollow areas, so that a heat radiating medium passes through the hollow heat radiating columns from the inside of the spaces surrounded by the hollow heat radiating columns through the hollow areas.
2. The pin heat sink according to claim 1, wherein the hollow heat dissipation post comprises a cylindrical portion having a notch such that a heat dissipation medium reaches a hollow area surrounded by the cylindrical portion through the notch and passes through the hollow heat dissipation post.
3. The pin heat sink of claim 2, wherein the notch extends in a direction parallel to the base plate or in a direction perpendicular to the base plate.
4. The pin heat sink of claim 3, wherein the notch is rectangular.
5. The pin heat sink of claim 2, wherein the barrel portion is cylindrical.
6. The pin heat sink according to claim 5, wherein the notches are arranged in pairs, and a line connecting each pair of notches passes through a central axis of the cylindrical portion and coincides with a flow direction of the heat dissipating medium.
7. The pin heat sink according to claim 2, wherein the hollow heat dissipating pin further comprises a cylindrical portion disposed inside the cylindrical portion.
8. The pin heat sink of claim 7, wherein the hollow heat-dissipating stud comprises a plurality of barrel portions, each barrel portion having a notch.
9. The pin heat sink according to claim 7, wherein a projection of the pillar portion and/or the barrel portion on the base plate comprises a streamlined curve.
10. A power module comprising the pin heat sink of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022640127.3U CN213483737U (en) | 2020-11-13 | 2020-11-13 | Pin type heat sink and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022640127.3U CN213483737U (en) | 2020-11-13 | 2020-11-13 | Pin type heat sink and power module |
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| Publication Number | Publication Date |
|---|---|
| CN213483737U true CN213483737U (en) | 2021-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022640127.3U Active CN213483737U (en) | 2020-11-13 | 2020-11-13 | Pin type heat sink and power module |
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| CN (1) | CN213483737U (en) |
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