CN213461923U

CN213461923U - Camera module

Info

Publication number: CN213461923U
Application number: CN202022590005.8U
Authority: CN
Inventors: 邹兵; 陈亮
Original assignee: Kunshan Q Technology Co Ltd
Current assignee: Kunshan Q Technology Co Ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-06-15
Anticipated expiration: 2030-11-10

Abstract

The utility model provides a camera module, including support, sensitization chip and circuit substrate, the bottom of support with the upper surface laminating of sensitization chip is connected, circuit substrate is located the top of sensitization chip, just circuit substrate with the signal of telecommunication turn-on connection between the sensitization chip. The utility model provides a camera module is connected support and sensitization chip through direct, with the position adjustment of circuit substrate to sensitization chip's top simultaneously, has reduced the thickness of camera module, is favorable to the miniaturized design of camera module.

Description

Camera module

Technical Field

The utility model belongs to the technical field of the camera structure technique and specifically relates to a camera module is related to.

Background

Along with cell-phone, camera isoelectron product are towards light, thin direction development, also higher and higher to the requirement of camera module volume, under the prerequisite of guaranteeing camera module height pixel, stable in structure, the volume of camera module is the better for the less.

As shown in fig. 1, a conventional camera module assembly includes: the optical fiber module comprises a lens 34, a support 31, a photosensitive chip 32, a circuit substrate 33 and an optical filter 35, wherein the photosensitive chip 32 is connected to the circuit substrate 33 through glue, electric signal conduction connection between the photosensitive chip 32 and the circuit substrate 33 is achieved through a gold wire 36 synchronously, the support 31 is connected to the circuit substrate 33 through structural glue, the lens 34 and the support 31 are focused through threads to determine the optimal height, the top of the lens 34 is fixed with the top of the support 31 through glue, and the optical filter 35 is attached to the inside of the support 31 through glue and located below the lens 34.

Above each part vertically piles up among the conventional camera module, lead to camera module size thicker, be unfavorable for the miniaturized design of camera module.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a camera module, it is not enough to aim at solving above-mentioned background existence, under the prerequisite of guaranteeing camera module structure and stable performance, reduces the thickness of camera module.

The utility model provides a camera module, including support, sensitization chip and circuit substrate, the bottom of support with the upper surface laminating of sensitization chip is connected, circuit substrate is located the top of sensitization chip, just circuit substrate with the signal of telecommunication turn-on connection between the sensitization chip.

Further, the upper surface of sensitization chip is equipped with sensitization region, non-sensitization region and the signal of telecommunication switches on the region, the sensitization region is located the middle part position of sensitization chip, non-sensitization region encircles the setting and is in around the sensitization region, the signal of telecommunication switches on the region and sets up in the non-sensitization region and be located the edge of sensitization chip one side, the bottom laminating of support is connected to the non-sensitization region of the upper surface of sensitization chip, the laminating of circuit base plate is connected to the upper surface of sensitization chip or the surface of support, the circuit base plate with the signal of telecommunication switches on the connection between the region.

Furthermore, a first step is arranged at the bottom of the bracket at one side close to the electric signal conduction area, and a first accommodating space is formed below the first step.

Furthermore, one end of the circuit substrate extends into the first accommodating space, the circuit substrate is attached to the electric signal conduction region, and the lower surface of the circuit substrate is in electric signal conduction connection with the electric signal conduction region through a conductive material.

Furthermore, the bottom of the support and the non-photosensitive area are fixedly bonded through first glue, and the end portion of the circuit substrate and the side wall of the first step as well as the lower surface of the circuit substrate and the end portion of the photosensitive chip are fixedly bonded through second glue.

Further, the surface of support is equipped with and is used for switching on the circuit base plate with sensitization chip's the circuit that switches on, it follows to switch on the circuit the lower surface via of first step the side surface of first step extends to the bottom of support, the signal of telecommunication switch on regional with the support bottom switch on through the first conducting material signal of telecommunication switch on between the circuit, the one end of circuit base plate stretches into in the first accommodation space, the laminating of circuit base plate is connected to the lower surface of first step, the upper surface of circuit base plate with the first step lower surface switch on through the second conducting material signal of telecommunication switch on between the circuit.

Further, the bottom of the support and the opposite two ends of the photosensitive chip are fixedly bonded through first glue, and the end portion of the circuit substrate and the side wall of the first step as well as the upper surface of the circuit substrate and the side wall of the support are fixedly bonded through second glue.

Further, the surface of support is equipped with and is used for switching on the circuit base plate with sensitization chip's the circuit that switches on, it follows to switch on the circuit the side surface of support via the lower surface of first step with the side surface of first step extends to the bottom of support, the signal of telecommunication switch on regional with the support bottom switch on through first conducting material signal of telecommunication between the circuit, the laminating of circuit base plate is connected to the side surface of support, the surface of circuit base plate one side with the support side surface switch on through second conducting material signal of telecommunication between the circuit.

Furthermore, the bottom of the support and the two opposite ends of the photosensitive chip are fixedly bonded through first glue.

Furthermore, a second step is arranged at the bottom of the bracket at one side far away from the electric signal conduction area, and a second accommodating space is formed below the second step.

The utility model provides a camera module is connected support and sensitization chip through direct, with the position adjustment of circuit substrate to sensitization chip's top simultaneously, compares in prior art structure that support and circuit substrate laminating are connected (the thickness of circuit substrate plate will generally be thicker than sensitization chip), has reduced the thickness of camera module, is favorable to the miniaturized design of camera module.

Drawings

Fig. 1 is a schematic structural diagram of a camera module in the prior art.

Fig. 2 is a schematic structural view of the camera module according to the first embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a photosensitive chip according to an embodiment of the present invention.

Fig. 4 is a schematic structural view of a camera module according to a second embodiment of the present invention.

Fig. 5 is a schematic structural view of a camera module according to a third embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

The terms "upper, lower, left, right, front, rear, top, bottom, and the like as used in the specification and claims of the present invention are defined by the positions of the structures in the drawings and the positions of the structures relative to each other if there are directional words, and are only for the sake of clarity and convenience in describing the technical solutions. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.

First embodiment

As shown in fig. 2 and fig. 3, the utility model discloses the camera module that the first embodiment provided, including support 1, sensitization chip 2 and circuit substrate 3, the bottom of support 1 is connected with sensitization chip 2's upper surface laminating, and circuit substrate 3 is located sensitization chip 2's top, and the signal of telecommunication turn-on connection between circuit substrate 3 and the sensitization chip 2.

Further, the upper surface of the photosensitive chip 2 is provided with a photosensitive area 21, a non-photosensitive area 22 and an electrical signal conducting area 23, the photosensitive area 21 is located in the middle of the photosensitive chip 2, the non-photosensitive area 22 is arranged around the photosensitive area 21, and the electrical signal conducting area 23 is arranged in the non-photosensitive area 22 and located at the edge of one side of the photosensitive chip 2. The bottom of the bracket 1 is attached to the non-photosensitive area 22 on the upper surface of the photosensitive chip 2, the circuit substrate 3 is attached to the upper surface of the photosensitive chip 2 or the outer surface of the bracket 1, and the circuit substrate 3 is electrically connected to the electrical signal conduction area 23.

Further, the bottom of the bracket 1 near the electric signal conducting area 23 is provided with a first step 12, and a first accommodating space 15 is formed below the first step 12. The bottom of the bracket 1 at the side far away from the electric signal conducting area 23 is provided with a second step 11, and a second accommodating space 14 is formed below the second step 11.

Generally speaking, the width of the bracket 1 is greater than the length of the photosensitive chip 2, and the first step 12 and the second step 11 are respectively arranged at the bottoms of the two opposite sides of the bracket 1, so that the width of the bottom of the bracket 1 is matched with the length of the photosensitive chip 2, and the structure of the connecting part of the bracket 1 and the photosensitive chip 2 is more compact. Simultaneously the below of first step 12 and second step 11 all forms accommodation space 14/15, can hold other components and parts in the accommodation space 14/15, has saved the bottom space of camera module, has realized the miniaturized design of camera module, the whole camera module inner space's of being convenient for design that piles up.

Further, one end of the circuit substrate 3 extends into the first accommodating space 15, the circuit substrate 3 is attached to the electric signal conduction region 23, and the lower surface of the circuit substrate 3 is in electric signal conduction connection with the electric signal conduction region 23 through the conductive material 8.

Preferably, the Conductive material 8 is a solder or ACF (Anisotropic Conductive Film) Conductive Film.

Further, the bottom of the bracket 1 is fixedly bonded with the non-photosensitive area 22 through the first glue 6, and the end of the circuit substrate 3 is fixedly bonded with the side wall of the first step 12 and the lower surface of the circuit substrate 3 is fixedly bonded with the end of the photosensitive chip 2 through the second glue 7.

In this embodiment, although the conductive material 8 also has an adhesive function and plays a certain role in adhesion between the circuit board 3 and the photosensitive chip 2, the second glue 7 is required to further fix the circuit board 3 because the contact area between the circuit board 3 and the photosensitive chip 2 is small.

Preferably, the electrical signal conducting area 23 of the photosensitive chip 2 and the electrical signal conducting area (not shown) on the circuit substrate 3 both adopt a gold finger structure.

Further, a lens 4 is arranged in the support 1, the outer side wall of the lens 4 is in threaded connection with the inner side wall of the support 1, meanwhile, the optimal height of the lens 4 is determined by utilizing thread focusing, and the top of the support 1 is fixedly bonded with the outer side wall of the lens 4 through third glue 9.

Further, a containing groove 13 is formed in the lower surface of the bracket 1 corresponding to the position of the photosensitive area 21, the optical filter 5 is installed in the containing groove 13, the optical filter 5 is located below the lens 4, and the optical filter 5 and the lower surface of the bracket 1 are fixedly bonded through fourth glue 10.

As shown in fig. 1, a conventional camera module assembly includes: lens 34, support 31, sensitization chip 32, circuit substrate 33 and light filter 35, support 31 adopt the laminating of structure glue to connect on circuit substrate 33, and sensitization chip 32 adopts the glue laminating to connect on circuit substrate 33, realizes through gold thread 36 between sensitization chip 32 and the circuit substrate 33 that signal of telecommunication switch-on is connected, and this camera module leads to camera module size thick owing to each part vertically piles up, is unfavorable for the miniaturized design of camera module.

And the embodiment of the utility model provides a camera module is connected support 1 and sensitization chip 2 through direct, with the position adjustment of circuit substrate 3 to the top position at 2 edges of sensitization chip simultaneously, has reduced the thickness of camera module, is favorable to the miniaturized design of camera module.

Second embodiment

As shown in fig. 4, the camera module provided by the second embodiment of the present invention is substantially the same as the first embodiment, and the difference is that the position of the circuit substrate 3 is different, and the mode of the electrical signal conduction connection between the circuit substrate 3 and the electrical signal conduction region 23 is different.

Specifically, in this embodiment, the outer surface of the support 1 is provided with a conducting line 16 for conducting the circuit substrate 3 and the photosensitive chip 2, the conducting line 16 extends from the lower surface of the first step 12 to the bottom of the support 1 through the side surface of the first step 12, the electrical signal conducting region 23 is in electrical signal conducting connection with the conducting line 16 at the bottom of the support 1 through the first conductive material 17, one end of the circuit substrate 3 extends into the first accommodating space 15, the circuit substrate 3 is attached to the lower surface of the first step 12, and the upper surface of the circuit substrate 3 is in electrical signal conducting connection with the conducting line 16 at the lower surface of the first step 12 through the second conductive material 18.

Preferably, the first conductive material 17 is an ACF conductive adhesive film, and the second conductive material 18 is solder or an ACF conductive adhesive film.

Preferably, the conductive line 16 is manufactured by LDS (Laser Direct Structuring) technology.

Further, the bottom of the support 1 and the two opposite ends of the photosensitive chip 2 are fixedly bonded through first glue 6, and the end of the circuit substrate 3 and the side wall of the first step 12 and the upper surface of the circuit substrate 3 and the side wall of the support 1 are fixedly bonded through second glue 7. Other configurations of this embodiment are the same as those of the first embodiment, and are not described herein.

It should be noted that, the first conductive material 17 may be used for bonding between the bottom of the bracket 1 near the second step 11 and the non-photosensitive region 22 of the photosensitive chip 2, or other glues with the same thickness as the first conductive material 17 may be used for bonding, so as to perform a certain bonding and fixing function on one hand, and on the other hand, to ensure the high level of the left and right sides of the bracket 1 (if the first conductive material 17 is disposed on one side of the bottom of the bracket, and the first conductive material 17 is not disposed on the other side, the high level of the left and right sides of the bracket will be caused, thereby affecting the coaxiality of the optical axis).

Although the second conductive material 18 also has an adhesive effect and plays a certain role in adhesion between the circuit board 3 and the lower surface of the first step 12, the second glue 7 is required to further fix the circuit board 3 because the contact area between the circuit board 3 and the lower surface of the first step 12 is small.

This embodiment sets up the LDS circuit at the surface of support 1, realizes through the LDS circuit that circuit substrate 3 and signal of telecommunication switch on the connection of telecommunication between the region 23, so can be with the position adjustment of circuit substrate 3 to the surface of support 1, reduced the whole thickness of camera module, realized the miniaturized design of camera module. Simultaneously, the position of circuit substrate 3 can also be according to the nimble adjustment of the inside space demand of camera module, the design of piling up of the camera module inner space of being convenient for.

Third embodiment

As shown in fig. 5, the camera module according to the third embodiment of the present invention is basically the same as the second embodiment, and the position of the circuit board 3 is adjusted to the outer surface of the bracket 1, which is different from the position of the circuit board 3.

Specifically, in the present embodiment, the outer surface of the support 1 is provided with a conducting line 16 for conducting the circuit substrate 3 and the photosensitive chip 2, the conducting line 16 extends from the side surface of the support 1 to the bottom of the support 1 through the lower surface of the first step 12 and the side surface of the first step 12, the electrical signal conducting region 23 is in electrical signal conducting connection with the conducting line 16 at the bottom of the support 1 through the first conductive material 17, the circuit substrate 3 is attached to the side surface of the support 1, and the surface on one side of the circuit substrate 3 is in electrical signal conducting connection with the conducting line 16 at the side surface of the support 1 through the second conductive material 18.

Preferably, the conductive line 16 is fabricated by LDS technology.

Further, the bottom of the bracket 1 and the two opposite ends of the photosensitive chip 2 are fixedly bonded through the first glue 6. Other configurations of this embodiment are the same as those of the second embodiment, and are not described herein.

It should be noted that, because the contact area between the sidewall of the circuit substrate 3 and the sidewall of the bracket 1 is large, the second conductive material 18 is enough to support the connection and fixation between the circuit substrate 3 and the bracket 1, so that additional glue fixation is not needed, and of course, whether to glue the circuit substrate or not may be determined according to actual situations.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a camera module, includes support (1), sensitization chip (2) and circuit substrate (3), its characterized in that, the bottom of support (1) with the upper surface laminating of sensitization chip (2) is connected, circuit substrate (3) are located the top of sensitization chip (2), just circuit substrate (3) with signal of telecommunication turn-on connection between sensitization chip (2).

2. The camera module as claimed in claim 1, wherein the upper surface of the photosensitive chip (2) is provided with a photosensitive area (21), a non-photosensitive area (22) and an electrical signal conducting area (23), the photosensitive area (21) is positioned in the middle of the photosensitive chip (2), the non-photosensitive area (22) is arranged around the photosensitive area (21), the electric signal conducting area (23) is arranged in the non-photosensitive area (22) and is positioned at the edge of one side of the photosensitive chip (2), the bottom of the bracket (1) is attached to a non-photosensitive area (22) of the upper surface of the photosensitive chip (2), the circuit substrate (3) is attached to the upper surface of the photosensitive chip (2) or the outer surface of the bracket (1), the circuit substrate (3) is in electric signal conduction connection with the electric signal conduction area (23).

3. The camera module according to claim 2, wherein the bracket (1) is provided with a first step (12) at a bottom portion of a side close to the electric signal conducting region (23), and a first accommodating space (15) is formed below the first step (12).

4. The camera module according to claim 3, wherein one end of the circuit substrate (3) extends into the first accommodating space (15), the circuit substrate (3) is attached to the electrical signal conducting region (23), and the lower surface of the circuit substrate (3) is electrically connected to the electrical signal conducting region (23) through the conductive material (8).

5. The camera module according to claim 4, wherein the bottom of the bracket (1) and the non-photosensitive region (22) are bonded and fixed by a first glue (6), and the end of the circuit substrate (3) and the side wall of the first step (12) and the lower surface of the circuit substrate (3) and the end of the photosensitive chip (2) are bonded and fixed by a second glue (7).

6. The camera module according to claim 3, characterized in that the outer surface of the bracket (1) is provided with a conducting circuit (16) for conducting the circuit substrate (3) and the photosensitive chip (2), the conductive line (16) extends from the lower surface of the first step (12) to the bottom of the bracket (1) via the side surface of the first step (12), the electric signal conducting area (23) is in electric signal conducting connection with the conducting circuit (16) at the bottom of the bracket (1) through a first conducting material (17), one end of the circuit substrate (3) extends into the first accommodating space (15), the circuit substrate (3) is attached to the lower surface of the first step (12), and the upper surface of the circuit substrate (3) is in electric signal conduction connection with the conducting circuit (16) on the lower surface of the first step (12) through a second conducting material (18).

7. The camera module according to claim 6, wherein the bottom of the bracket (1) and the two opposite ends of the photosensitive chip (2) are fixed by a first glue (6), and the end of the circuit substrate (3) and the side wall of the first step (12) and the upper surface of the circuit substrate (3) and the side wall of the bracket (1) are fixed by a second glue (7).

8. The camera module according to claim 3, characterized in that the outer surface of the bracket (1) is provided with a conducting circuit (16) for conducting the circuit substrate (3) and the photosensitive chip (2), the conductive line (16) extends from a side surface of the bracket (1) to a bottom of the bracket (1) via a lower surface of the first step (12) and a side surface of the first step (12), the electric signal conducting area (23) is in electric signal conducting connection with the conducting circuit (16) at the bottom of the bracket (1) through a first conducting material (17), the circuit substrate (3) is attached to the side surface of the bracket (1), the surface of one side of the circuit substrate (3) is in electric signal conduction connection with the conducting circuit (16) on the side surface of the bracket (1) through a second conducting material (18).

9. The camera module according to claim 8, wherein the bottom of the bracket (1) and the two opposite ends of the photosensitive chip (2) are fixed by bonding with a first glue (6).

10. The camera module according to claim 2, wherein the bottom of the bracket (1) on the side away from the electrical signal conducting area (23) is provided with a second step (11), and a second accommodating space (14) is formed below the second step (11).