CN213461728U - Packaging architecture for multi-channel phased array units in 5G systems - Google Patents
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- CN213461728U CN213461728U CN201890001606.9U CN201890001606U CN213461728U CN 213461728 U CN213461728 U CN 213461728U CN 201890001606 U CN201890001606 U CN 201890001606U CN 213461728 U CN213461728 U CN 213461728U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/28—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the amplitude
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
- H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
- H01Q3/38—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters the phase-shifters being digital
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention relates to a packaging framework for a multi-channel phased array unit in a 5G system, which is characterized by comprising the following components: an LTCC-based subsystem (1) consisting of chips (6) and an organic-based subsystem (2) consisting of antenna elements; the BGA interface (3) is used for realizing the connection between the LTCC-based subsystem (1) and the organic-based subsystem (2) and the connection between the subsystems (1 and 2) and the main board (5); a cavity (8) formed on the LTCC, a Doherty power amplifier (105) and a chip (6) having functions of a digital phase shifter (101) and a digital attenuator (102) being placed on the cavity (8); ceramic walls (7) separating said cavities (8) from each other and forming insulation between the channels.
Description
Technical Field
The utility model relates to a system architecture in multilayer, scalable and low-cost encapsulation, this system architecture include multi-functional power amplifier and multi-functional digital phase shifter/attenuator MMIC and can be used to the antenna (extensive MIMO) of the RF pre-folding module of 5G communication system.
Background
In the coming years, high-performance communication technology will be used in "smart cities" to improve the quality of life in urban areas. A significant improvement of existing services at low cost and resource utilization would make the connection between users more active. Many applications will be developed for the concept of smart cities, including management of traffic, water, health care and energy services. The 5G communication system used in these applications will provide a critical backbone and infrastructure for data exchange. The high data rates of 5G technology will create new opportunities and applications for smart cities in the coming years, which will improve quality of life and provide new ways to manage valuable assets in a developed way.
It is envisaged that the 5G technique will use the MIMI technique, which has the capability of working with a phased array antenna (massive MIMO) consisting of a large number of antenna elements to form a beam. Massive MIMO, a candidate for 5G technology, offers tremendous advances in wireless data rates and connection reliability due to the fact that it uses a large number of antenna elements (greater than 64) in the base transceiver station. Massive MIMO reduces the power radiated by means of hundreds of antenna elements, since its structure concentrates the energy to the target mobile user by means of precoding techniques. Routing of wireless energy to a target user may reduce both radiated power and interference to other users. This is a very important feature for today's interference limited cellular networks. If and when the features offered by MIMO technology are applicable, the speed of future 5G networks will be higher and they will serve more users through connections with higher reliability and energy efficiency.
Patent application number US2013189935(a1) encountered during technical research relates to an integrated circuit package configuration comprising: an antenna system having an extended antenna element; a substrate having a first side, a second side, and an internal transmission line network continuous from the first side to the second side, wherein the antenna system is coupled to the first side and the second side defines at least one cavity; at least one Monolithic Microwave Integrated Circuit (MMIC) mounted in the at least one cavity defined by the second side, wherein the extended antenna element extends through the transmission line network of the substrate and contacts the MMIC, establishing a transceiver circuit ".
As can be seen from said document, it does not relate to a phased array unit in scalable packaging consisting of 5G application specific digital phase shifters, digital attenuators or Doherty (Doherty) power amplifiers.
In summary, the above drawbacks and the deficiencies of the existing solutions necessitate innovations in the related art.
SUMMERY OF THE UTILITY MODEL
The present invention aims to disclose a structure with different technical specifications, which results in technical innovations in the field, which is different from the existing configurations used in the field.
It is a primary object of the present invention to disclose a system architecture in a multi-layer, scalable and low-cost package, comprising a multifunctional power amplifier and a multifunctional digital phase shifter/attenuator MMIC and an antenna (massive MIMO) usable for RF pre-folding modules of 5G communication systems.
The purpose of the utility model is to develop a high performance RF unit customized for 5G applications.
Another object of the present invention is to use an organic-based material (organic-based material) having a dielectric constant and economic advantages to improve propagation efficiency in an antenna element while using a ceramic base in chip packaging.
The utility model relates to an encapsulation framework that is used for multichannel phased array unit in 5G system, include:
LTCC based subsystems made up of chips and organic based subsystems made up of antenna elements,
BGA interface, enabling connection between LTCC-based subsystem and organic-based subsystem and connection of LTCC-based subsystem and organic-based subsystem to main board,
a cavity formed on the LTCC, on which a Doherty power amplifier and a chip having functions of a digital phase shifter and a digital attenuator are placed,
ceramic walls separating the cavities from each other and forming insulation between the channels.
Further, the above-described package architecture for a multi-channel phased array unit in a 5G system includes wires that provide connections for the chips.
Further, the above-mentioned package architecture for the multi-channel phased array unit in the 5G system includes chips connected by a flip chip method.
Further, the above packaging architecture for multi-channel phased array units in a 5G system includes a doherty power amplifier consisting of a conductive path inside a ceramic base for heat dissipation.
Further, the above-described package architecture for a multi-channel phased array unit in a 5G system includes a cavity covered with a cap to protect a chip or a die covered chip.
Further, the above-described package architecture for a multi-channel phased array unit in a 5G system includes an organic-based material having a low dielectric constant, a low loss tangent, and a high production sensitivity to ensure a high radiation efficiency of the antenna.
Further, the above-described packaging architecture for a multi-channel phased array unit in a 5G system includes patch elements providing radiation on an upper surface of an organic-based subsystem and electrical interfaces providing transmission with an LTCC-based subsystem disposed on a lower surface of the organic-based subsystem.
Further, the above packaging architecture for a multi-channel phased array unit in a 5G system includes the following elements to form a single-channel transmit phased array unit element topology;
n-bit digital phase shifters and M-bit digital attenuators that can be digitally controlled in phased array element,
an (N + M) bit-string parallel converter providing control of a digital phase shifter and a digital attenuator in series, and minimizing connection complexity due to an increase in the number of bits,
a doherty power amplifier capable of providing high efficiency under back-off operating conditions,
driver power amplifier and antenna.
Further, the above packaging architecture for a multi-channel phased array unit in a 5G system includes the following elements to form a single-channel transmit phased array unit element topology;
an N-bit digital phase shifter and an M-bit digital attenuator,
an (N + M +2) bit-string parallel converter providing control of a digital phase shifter and a digital attenuator in series and an SPDT switch,
a doherty power amplifier capable of providing high efficiency under back-off operating conditions,
the power amplifier of the driver is then switched on,
a low-noise amplifier, which is capable of,
2 pieces of SPDT switches capable of operating the Doherty power amplifier switch by switching during transmission, and the low noise amplifier switch during the reception process,
delimiter and antenna.
Further, the above-mentioned packaging architecture for multi-channel phased array units in a 5G system includes a circulator, which can be used in a situation where the return loss of the antenna is very high.
Further, the above packaging architecture for a multi-channel phased array unit in a 5G system includes a 2x2 scalable phased array unit, a 2x2 scalable phased array unit:
can be formed by a phased array unit single channel transmission topology,
control in series-parallel-series-parallel configuration,
having series-parallel converters, each of which is directly connected to a digital control transmitted to the package,
the 4 unit cells are assigned by RF dividers located on the signal package, which is transmitted from the RF input with equal phase and same amplitude.
Further, the above packaging architecture for a multi-channel phased array unit in a 5G system includes a 2x2 scalable phased array unit, a 2x2 scalable phased array unit:
can be formed by a phased array unit single channel transmission topology,
control in series-parallel configuration,
having series-parallel converters, each of which is not directly connected to the digital control transmitted to the package,
the 4 unit cells are assigned by RF dividers located on the signal package, which is transmitted from the RF input with equal phase and same amplitude.
Use the technical scheme of the utility model, provide multilayer, scalable and low-cost system architecture in the encapsulation and obtained the high performance RF unit to 5G application customization.
Drawings
The structural and characteristic features of the present invention may be more clearly understood through the following drawings and detailed description with reference to the same; therefore, evaluation needs to be performed in consideration of these figures and detailed description.
FIG. 1, single channel transmission topology-1A of phased array units
FIG. 2 is a single-channel transmission topology-1B of phased array units
FIG. 3 is a diagram of a single-channel transmission topology-1A of phased array units, chip clustering
FIG. 4 shows a single channel receive/transmit topology of a phased array unit-2A
FIG. 5, single channel receive/transmit topology of phased array units-2A, chip clustering
Fig. 6, 2x2 scalable phased array, series-parallel-series-parallel control
Fig. 7, 2x2 scalable phased array, series-parallel control
Fig. 8 shows an LTCC based subsystem consisting of a chip and an organic based subsystem consisting of an antenna element.
Fig. 9 shows a design of a four-channel phased array unit on a ceramic base.
Fig. 10 is a view of the AA' portion of fig. 9.
Fig. 11 is a view of the AA' portion of fig. 9 using a flip chip method.
The drawings are not necessarily to scale and details, which are not necessary for an understanding of the present invention, may be omitted. Also, elements that are substantially the same or have substantially the same function are shown with the same number.
Description of the reference parts
1. LTCC-based subsystem
2. Organic-based subsystems
BGA interface
5. Main board
6. Chip and method for manufacturing the same
7. Ceramic wall
8. Hollow cavity
9. Conducting wire
10. Flip chip
15. Matching network
16. Conducting wire circuit
25. Electrical interface
200. Patch element
101. Digital phase shifter
102. Digital attenuator
103. Series-parallel converter
104. Drive power amplifier
105. Doherty power amplifier
106. Circulator
107. Terminal device
108. Low noise amplifier
SPDT switch
110. Delimiters (delimiter)
120. Antenna with a shield
Detailed Description
The preferred embodiments of the configurations of the present invention described herein are disclosed as non-limiting descriptions of the invention and are intended only for a better understanding of the subject matter.
Single channel cell element RF topology
Single channel topology-1
The phased array unit of the topology consists of a digitally controllable N-bit digital phase shifter 101, an M-bit digital attenuator 102, an (N + M) bit-string parallel converter 103 that implements serial control of the digital phase shifter 101 and the digital attenuator 102, a doherty power amplifier 105 that provides high efficiency under back-off work condition, a driver power amplifier 104 and an antenna 120. Fig. 1 shows a single channel transmit phased array element topology 1A. The digital phase shifter 101 and the digital attenuator 102 enable more than one antenna 120 element in a massive MIMO structure to be patterned by adjusting the phase and magnitude values of the signals transmitted to the antenna 120. The series-parallel converter 103 serves to minimize complexity that may be caused by an increase in the number of bits. The positions of the digital phase shifter 101 and the digital attenuator 102 may vary in linearity and additional drive power amplifiers 104 may be utilized in the RF strip. If the return loss of the antenna 120 is very high, the circulator 106 may be used as shown in FIG. 2. Each MMIC element used in the RF strip may be designed in a separate chip 6 or on a cluster. Fig. 3 shows an example of a cluster of chips 6.
Single channel topology-2
The phased array unit of this topology consists of a digitally controllable N-bit digital phase shifter 101, an M-bit digital attenuator 102, an (N + M +2) bit-string parallel converter 103 that implements serial control of the digital phase shifter 101 and the digital attenuator 102 and the SPDT switch 109, a doherty power amplifier 105 that provides high efficiency under back-off operating conditions, a driver power amplifier 104, a 2-piece SPDT switch 109, a delimiter 110, a low noise amplifier 108 and an antenna 120. Figure 4 shows a single channel receiver/transmit phased array element topology. The digital phase shifter 101 and the digital attenuator 102 enable more than one antenna 120 element in a massive MIMO structure to be patterned by adjusting the phase and magnitude values of the signals transmitted to and received by the antenna 120. The SPDT switch 109 operates the doherty power amplifier 105 switch by switching during transmission and operates the low noise amplifier 108 switch during reception. The SPDT switch 109 may be used as a reflective or an absorptive type. The series-parallel converter 103 serves to minimize complexity that may be caused by an increase in the number of bits. The positions of the digital phase shifter 101 and the digital attenuator 102 may vary in linearity and additional drive power amplifiers 104 may be utilized in the RF strip. Also, the circulator 106 before the antenna 120 may be used for the return loss of the antenna 120. Each MMIC element used in the RF strip may be designed in a separate chip 6 or on a cluster. Fig. 5 shows an example of a cluster of chips 6.
4-channel phased array
The 4-piece single channel topology discussed under the heading "single channel element RF topology" can be combined to form a 2x2 scalable phased array.
4-channel topology-1
A 2X2 scalable phased array formed by using a phased array element single channel transmission topology-1A (unit cells 1-4) is shown in fig. 6. The series-parallel converter 103 of each cell is directly connected to the digital control, which is transmitted to the package as a series-parallel-series-parallel control in this configuration. The signal transmitted through the RF input is distributed into 4 unit cells by the RF distributor in equal phase and with the same amplitude.
4-channel topology-2
A 2X2 scalable phased array formed by using a phased array element single channel transmission topology-1A (unit cells 1-4) is shown in fig. 7. The serial-parallel converter 103 of each cell is not directly connected to the digital control, which is transmitted to the package as a series-parallel control in this configuration. The signal transmitted through the RF input is distributed into 4 unit cells by the RF distributor in equal phase and with the same amplitude.
Packaging design
LTCC (low temperature co-fired ceramic) technology provides a system-in-package platform for microwave and millimeter wave frequencies. Exemplary LTCC circuits can be obtained by combining more than one ceramic layer under pressure and then firing at high temperatures. The ceramic layers are electrically connected. Millimeter wave package designs based on this technology provide reliable and high level performance through the use of gold, silver or copper conductive thick film metals on ceramic substrates with low dielectric losses. Furthermore, the coefficient of thermal expansion in the ceramic base material and the compliance of the semiconductor material enable the chip to be placed on the LTCC.
The utility model provides a new encapsulation framework that is arranged in multichannel phased array unit that 5G system used. Implementing all elements in the packaging structure of the system by LTCC results in disadvantages in terms of performance and cost. Organic-based materials having a low dielectric constant and economic advantages in view of increasing the propagation efficiency in the antenna element may be used, while the chip package requires a ceramic base for the reasons described above.
As shown in fig. 8, the system disclosed in the present invention comprises an LTCC based subsystem 1 consisting of a chip and an organic based subsystem 2 consisting of an antenna element. The connection between the subsystems 1, 2 is established by a BGA interface 3. The subsystems 1, 2 thus integrated are connected to a motherboard 5 via a BGA interface 3.
Fig. 9 shows a design of a four-channel phased array unit on a ceramic base. A doherty power amplifier 105 and a chip 6 having functions of a digital phase shifter 101 and a digital attenuator 102 on each array are arranged on a cavity 8 formed on the LTCC. These cavities 8 are separated from each other by ceramic walls 7 which act as insulators between the channels.
FIG. 10 shows the AA' portion of the view shown in FIG. 9. Solder or conductive epoxy is used for mounting of the chip 6. The arranged chip may be connected to the wires 9 as shown in fig. 10, or may be realized by means of a flip chip 10 as shown in fig. 11. Since the connection length of the wire 9 is particularly important in millimeter wave frequencies, it has been tightly connected to the base region of the chip to ensure that it will have a short length. Matching networks 15 may be used in these areas if desired. Flip chip 10 mounting can improve production efficiency, but heat dissipation can be limited. The ceramic base is made up of a conductive path 16 for heat dissipation from the doherty power amplifier 105. The cavity 8 may be closed with a lid to protect the chip 6, or the chip 6 may be covered with a mold. Multilayer LTCC technology can integrate passive components such as resistors and capacitors. By doing so, the structure providing the power divider/combiner function can be arranged between the ceramic layers.
As shown in fig. 8, the microstrip patches arranged in the 5G phased architecture should be selected from a base material having a low dielectric constant, a low loss tangent, and a high production sensitivity, so that the antenna 120 has a high radiation efficiency. For this reason, the antenna 120 is designed using an organic-based material. The upper surface of the antenna subsystem 2 consists of the patch element 200 that will provide radiation, while the lower surface consists of the electrical interface 25 that provides transmission with the LTCC based subsystem 1.
The resulting 5G phased array unit is suitable for forming larger arrays by multiplexing.
Claims (12)
1. A packaging architecture for a multi-channel phased array unit in a 5G system, comprising:
LTCC based subsystems made up of chips and organic based subsystems made up of antenna elements,
a BGA interface enabling connection between the LTCC based subsystem and the organic based subsystem and connection of the LTCC based subsystem and the organic based subsystem to a motherboard,
a cavity formed on the LTCC, on which a Doherty power amplifier and a chip having functions of a digital phase shifter and a digital attenuator are placed,
ceramic walls separating the cavities from each other and forming insulation between the channels.
2. The packaging architecture for a multi-channel phased array unit of claim 1, comprising wires providing connections for the chips.
3. The packaging architecture for a multi-channel phased array unit of claim 1, comprising the chips connected by a flip-chip method.
4. The packaging architecture for a multi-channel phased array unit of claim 1, comprising the doherty power amplifier consisting of a conductive path inside a ceramic base for heat dissipation.
5. The packaging architecture for a multi-channel phased array unit of claim 1, comprising the cavity covered with a lid to protect the chip or the chip covered with a mold.
6. The packaging architecture for multi-channel phased array units according to claim 1, characterized in that it comprises organic-based materials with low dielectric constant, low loss tangent and high production sensitivity to ensure high radiation efficiency of the antenna.
7. The packaging architecture for a multi-channel phased array unit of claim 1, comprising patch elements providing radiation on an upper surface of the organic-based subsystem and electrical interfaces providing transmission with the LTCC-based subsystem disposed on a lower surface of the organic-based subsystem.
8. The packaging architecture for a multi-channel phased array unit of claim 1, comprising the following elements to form a single channel transmit phased array unit element topology;
n-bit digital phase shifters and M-bit digital attenuators that can be digitally controlled in phased array element,
an (N + M) -bit-string parallel converter providing control of the digital phase shifter and the digital attenuator in series and minimizing connection complexity due to an increase in the number of bits,
the doherty power amplifier capable of providing high efficiency under back-off operating conditions,
driver power amplifier and antenna.
9. The packaging architecture for a multi-channel phased array unit of claim 1, comprising the following elements to form a single channel transmit phased array unit element topology;
an N-bit digital phase shifter and an M-bit digital attenuator,
an (N + M +2) bit-string parallel converter providing control of the digital phase shifter and the digital attenuator in series and the SPDT switch,
the doherty power amplifier capable of providing high efficiency under back-off operating conditions,
the power amplifier of the driver is then switched on,
a low-noise amplifier, which is capable of,
2 pieces of SPDT switches capable of operating the Doherty power amplifier switch by switching during transmission, and the low noise amplifier switch during the reception process,
delimiter and antenna.
10. The packaging architecture for a multi-channel phased array unit according to claim 1, 8 or 9, characterized in that it comprises a circulator, which can be used in case the return loss of the antenna is very high.
11. The packaging architecture for multi-channel phased array units of claim 1, comprising 2x2 scalable phased array units, the 2x2 scalable phased array units:
can be formed by a phased array unit single channel transmission topology,
control in series-parallel-series-parallel configuration,
having series-parallel converters, each of which is directly connected to a digital control transmitted to the package,
the 4 unit cells are assigned by an RF divider located on the signal package that is transmitted from the RF input with equal phase and same amplitude.
12. The packaging architecture for multi-channel phased array units of claim 1, comprising 2x2 scalable phased array units, the 2x2 scalable phased array units:
can be formed by a phased array unit single channel transmission topology,
control in series-parallel configuration,
having series-parallel converters, each of which is not directly connected to the digital control transmitted to the package,
the 4 unit cells are assigned by an RF divider located on the signal package that is transmitted from the RF input with equal phase and same amplitude.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/TR2018/050129 WO2019190417A1 (en) | 2018-03-30 | 2018-03-30 | Phased array unit for 5g |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213461728U true CN213461728U (en) | 2021-06-15 |
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| CN201890001606.9U Active CN213461728U (en) | 2018-03-30 | 2018-03-30 | Packaging architecture for multi-channel phased array units in 5G systems |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR200495754Y1 (en) |
| CN (1) | CN213461728U (en) |
| DE (1) | DE212018000411U1 (en) |
| WO (1) | WO2019190417A1 (en) |
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| KR102437848B1 (en) | 2021-05-28 | 2022-08-30 | 주식회사 웨이브트랙 | Patch array antennas of milimeter wave |
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| US6815739B2 (en) * | 2001-05-18 | 2004-11-09 | Corporation For National Research Initiatives | Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
| US8269671B2 (en) * | 2009-01-27 | 2012-09-18 | International Business Machines Corporation | Simple radio frequency integrated circuit (RFIC) packages with integrated antennas |
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- 2018-03-30 KR KR2020207000061U patent/KR200495754Y1/en active IP Right Grant
- 2018-03-30 WO PCT/TR2018/050129 patent/WO2019190417A1/en active Application Filing
- 2018-03-30 DE DE212018000411.0U patent/DE212018000411U1/en active Active
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| Publication number | Publication date |
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| KR200495754Y1 (en) | 2022-08-11 |
| KR20200002684U (en) | 2020-12-09 |
| WO2019190417A1 (en) | 2019-10-03 |
| DE212018000411U1 (en) | 2020-11-03 |
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