CN213459765U - Composite solder strip and photovoltaic module - Google Patents
Composite solder strip and photovoltaic module Download PDFInfo
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- CN213459765U CN213459765U CN202023018083.7U CN202023018083U CN213459765U CN 213459765 U CN213459765 U CN 213459765U CN 202023018083 U CN202023018083 U CN 202023018083U CN 213459765 U CN213459765 U CN 213459765U
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Abstract
The application provides a compound solder strip and photovoltaic module belongs to photovoltaic device technical field. The composite welding strip comprises a large-crystal-domain copper strip, a first welding layer and a second welding layer. The large-domain copper strip is made of large-domain copper with the number of crystal boundaries in a unit area smaller than that of the polycrystalline copper foil, the first welding layer is positioned on the first side of the large-domain copper strip, and the second welding layer is positioned on the second side of the large-domain copper strip. One or both of the interconnecting solder strips and the bus solder strips of the photovoltaic module are the composite solder strips described above. The problems that the copper strip is easy to oxidize and corrode and cracks are easy to generate are effectively solved, so that the conductivity of the welding strip in a long-term use environment is improved.
Description
Technical Field
The application relates to the technical field of photovoltaic devices, in particular to a composite solder strip and a photovoltaic module.
Background
The photovoltaic welding strip is one of main structures of the photovoltaic assembly and is used for collecting and transmitting current of a plurality of battery pieces in the photovoltaic assembly. The current photovoltaic solder strip is generally a structure formed with a solder layer on the surface of a copper strip.
The general service life requirement of photovoltaic module is 20 ~ 30 years, and current photovoltaic solder strip, it is easy under the unusual outdoor harsh climatic condition of cold and hot change oxidation corrosion and produce the crackle. Particularly, in the process of bending deformation treatment in copper strip design, the copper strip can generate 0.8-0.9% deformation during extension, and cracks can be generated on the copper strip. The oxidation corrosion phenomenon and the cracks generated by the copper strip can cause the resistivity of the photovoltaic welding strip to be increased and the conductivity to be deteriorated, and can generate adverse effects on the current output of the photovoltaic assembly.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a composite solder strip and a photovoltaic module, which can effectively improve the problems that a copper strip is easy to oxidize and corrode and cracks are easy to generate, so that the conductivity of the solder strip in a long-term use environment is improved.
The embodiment of the application is realized as follows:
in a first aspect, an embodiment of the present application provides a composite solder strip, which includes a large domain copper strip, a first solder layer, and a second solder layer. The large-domain copper strip is made of large-domain copper with the number of crystal boundaries in a unit area smaller than that of the polycrystalline copper foil, the first welding layer is positioned on the first side of the large-domain copper strip, and the second welding layer is positioned on the second side of the large-domain copper strip.
In the technical scheme, the large-domain copper is used as the copper strip, and the large-domain copper has better anti-oxidation and anti-corrosion performance and anti-cracking performance. The problems that the copper strip is easy to oxidize and corrode and cracks are generated can be effectively solved, and the phenomena that the resistivity of the photovoltaic welding strip is increased and the conductivity is deteriorated due to the problems are effectively avoided, so that the conductivity of the welding strip in use is effectively improved.
In some possible embodiments, the thickness of the large domain copper strip is 0.025-0.075 mm.
In the technical scheme, the large-crystal-domain copper strip with the specific thickness has appropriate strength and is easy to produce, so that the raw material of the large-crystal-domain copper strip is easy to obtain and can better meet the use performance. If the thickness of the large-crystal-domain copper strip is too low, the strength of the large-crystal-domain copper strip is too low, and the subsequent processes of forming a welding layer, cutting the welding strip and the like are not facilitated. If the thickness of the large-domain copper strip is too high, the large-domain copper strip is difficult to produce, and the large-domain copper strip is not favorable for ensuring that the whole large-domain copper strip can better meet the specific domain requirement.
In some possible embodiments, the material of the large domain copper strip is large domain copper with the crystal lattice orientation of one of Cu (111), Cu (110), Cu (211) and Cu (100).
In the technical scheme, the large-domain copper with the specific orientation has better oxidation and corrosion resistance and crack resistance, and can better solve the problems that the copper strip is easy to oxidize and corrode and generate cracks.
In some possible embodiments, the composite solder strip further includes a first electroplated copper layer and a second electroplated copper layer. The first electroplated copper layer is located between the large-crystal-domain copper strip and the first welding layer, and the second electroplated copper layer is located between the large-crystal-domain copper strip and the second welding layer.
In the technical scheme, the first electroplated copper layer, the large-domain copper strip and the second electroplated copper layer are used as copper base bands in consideration of the fact that the thickness and the hardness of large-domain copper are usually small. By adding the first copper electroplating layer and the second copper electroplating layer, on one hand, the thickness and the hardness of the copper base band can be increased to proper standards, subsequent processes of forming a welding layer, cutting a welding strip and the like are facilitated, and the yield of the welding strip production is favorably ensured; on the other hand, the cost of the electroplated copper layer is low, the conductivity of the copper base band is guaranteed, and the cost is reasonably controlled.
In some possible embodiments, the total thickness of the first electroplated copper layer, the large domain copper strip and the second electroplated copper layer is 0.1 to 0.5 mm.
Among the above-mentioned technical scheme, this copper baseband of specific thickness has suitable hardness, conveniently carries out subsequent processes such as formation welding layer, cutting solder strip, can guarantee the yield of solder strip production.
In some possible embodiments, the first electroplated copper layer and the second electroplated copper layer are symmetrically disposed along the large domain copper tape.
According to the technical scheme, the first copper electroplating layer and the second copper electroplating layer are symmetrically arranged, so that both sides of the large-crystal-domain copper strip can be well reinforced.
In some possible embodiments, the first solder layer is a tin layer, and/or the second solder layer is a tin layer.
In the technical scheme, the tin layer is used as the welding layer, the matching performance with the existing production process is good, and the composite welding strip is ensured to have better welding performance.
In some possible embodiments, the first solder layer has a thickness of 10 to 30 μm, and/or the second solder layer has a thickness of 10 to 30 μm.
In the technical scheme, the welding layer has proper thickness, so that the composite welding strip is ensured to have better welding performance, and meanwhile, the conductive performance of the composite welding strip can be effectively kept.
In some possible embodiments, the width of the composite solder strip is 0.8-10 mm.
Among the above-mentioned technical scheme, compound solder strip has suitable width, and is good with the matching nature of current production technology, and guarantees can satisfy the performance of current collection and transmission betterly.
In a second aspect, an embodiment of the present application provides a photovoltaic module, including: the battery module comprises a plurality of battery pieces, a plurality of interconnection welding strips for connecting the battery pieces, and a confluence welding strip for connecting the interconnection welding strips. One or both of the interconnect solder strips and the bus solder strips are composite solder strips provided by embodiments of the first aspect.
Among the above-mentioned technical scheme, this compound solder strip can effectively improve the copper strips and easily by the oxidation corrosion and produce the cracked problem, effectively avoids the phenomenon that the resistivity increase of photovoltaic solder strip, electric conductive property worsen that above-mentioned problem leads to effectively improve photovoltaic module's photoelectric conversion efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic structural diagram of a composite solder strip provided in an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a large domain copper strip in a composite solder strip according to an embodiment of the present disclosure;
FIG. 3 is another schematic structural diagram of a large domain copper strip in a composite solder strip according to an embodiment of the present disclosure;
FIG. 4 is an XRD pattern of a large domain copper strip in a composite solder strip provided in an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a composite solder strip provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present application.
Icon: 10-a photovoltaic module; 100-composite solder strip; 110-large domain copper tape; 120-a first solder layer; 130-a second solder layer; 140-a first electroplated copper layer; 150-a second electroplated copper layer; 200-a battery piece; 300-interconnect solder strips; 400-bus solder strip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance. The terms "perpendicular", "parallel" and the like do not require that the components be absolutely perpendicular or parallel, but may be slightly inclined.
In the description of the present application, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Examples
In a first aspect, referring to fig. 1, the present embodiment provides a composite solder strip 100 including a large domain copper strip 110, a first solder layer 120, and a second solder layer 130. The first welding layer 120 is located on a first side of the large domain copper tape 110 and the second welding layer 130 is located on a second side of the large domain copper tape 110.
It should be noted that, in the embodiment of the present application, the first side and the second side of the large domain copper tape 110 refer to two opposite sides in the thickness direction, which is the a direction shown in fig. 1.
On the one hand, copper foil is prone to cracking at grain boundaries. On the other hand, trace amounts of residual oxygen or other corrosive gas molecules outside or inside the copper material may undergo corrosion reaction through copper grain boundary diffusion, thereby forming copper oxidation or other corrosion products, which may reduce the corrosion resistance thereof.
The material of the copper strip adopted by the existing photovoltaic welding strip is a polycrystalline copper foil, and a large number of crystal boundaries exist in the copper material, so that the copper strip is easy to oxidize and corrode and has cracks.
Considering the influence of the grain boundary of the copper strip on the oxidation corrosion resistance and the cracking resistance of the copper strip, in the embodiment of the present application, the material of the large domain copper strip 110 is large domain copper with the grain boundary number per unit area smaller than that of the polycrystalline copper foil, and the material of the large domain copper strip 110 is, for example, the copper grain boundary number is less than or equal to 5/cm2As shown in fig. 2 and 3, the large-domain copper has good oxidation and corrosion resistance and crack resistance. The large-domain copper with less copper crystal boundary number is adopted as the copper strip, so that the problems that the copper strip is easy to oxidize and corrode and generate cracks can be effectively solved, the phenomena of resistivity increase and conductivity deterioration of the photovoltaic welding strip caused by the problems are effectively avoided, and the conductivity of the welding strip in a long-term use environment is effectively improved.
In order to ensure the yield of the solder strip in the subsequent production, the material of the large domain copper strip 110 is large domain copper with a hardness of 30 to 50HV, for example, but not limited to, any one of 30HV, 35HV, 40HV, 45HV and 50HV or a range between any two of them.
As a result of research, the copper material has different oxidation and corrosion resistance and cracking resistance due to different crystal lattice orientations. The large-crystal-domain copper material with specific crystal lattice orientation is selected, so that the problems that the copper strip is easy to oxidize and corrode and generate cracks can be better solved.
In some exemplary embodiments, the material of the large domain copper tape 110 is a large domain copper having a lattice orientation of one of Cu (111), Cu (110), Cu (211), and Cu (100).
It is understood that the term "large domain copper with a specific lattice orientation" means that when the large domain copper is sampled and analyzed by X-ray (XRD), the peak intensity of the specific lattice index reaches 3X 103Large domain copper. As shown in FIG. 4, for example, large domain copper with Cu (111) lattice orientation means that a sample is sampled and XRD-dividedWhen analyzed and detected, the crystal face index Cu (111) reaches 3 x 103Large domain copper.
Considering that the large-domain copper strip 110 with a specific thickness has suitable strength and is easy to produce, the raw material of the large-domain copper strip 110 is easy to obtain and can better meet the use performance.
In some exemplary embodiments, the large domain copper tape 110 has a thickness of 0.025 to 0.075mm, such as, but not limited to, any one or a range between any two of 0.025mm, 0.030mm, 0.035mm, 0.040mm, 0.045mm, 0.050mm, 0.055mm, 0.060mm, 0.065mm, 0.070mm, and 0.075 mm. If the thickness of the large-domain copper strip 110 is too low, the strength of the large-domain copper strip 110 is too low, which is not favorable for subsequent processes such as forming a welding layer and cutting the welding strip. If the thickness of the large domain copper tape 110 is too high, the large domain copper tape 110 is difficult to produce, and it is not favorable to ensure that the large domain copper tape 110 can better satisfy the specific domain requirement.
It is understood that in the embodiments of the present application, the first welding layer 120 and the second welding layer 130 are used as functional layers for achieving the welding function of the composite solder strip 100, and the material standard and the thickness standard thereof may be selected according to the requirements known in the art.
In some possible embodiments, the first solder layer 120 is a tin layer, and/or the second solder layer 130 is a tin layer. As an example, the first and second solder layers 120 and 130 are both tin layers.
In the technical scheme, the tin layer is used as the welding layer, the matching performance with the existing production process is good, and the composite welding strip 100 is ensured to have better welding performance. Of course, in other embodiments, the materials of the first and second solder layers 120 and 130 may be selected from other metals or alloys such as indium metal and tin-lead alloy.
In some possible embodiments, the first solder layer 120 has a thickness of 10 to 30 μm, and/or the second solder layer 130 has a thickness of 10 to 30 μm. As an example, the first and second solder layers 120, 130 have the same thickness, such as, but not limited to, any one of 10 μm, 15 μm, 20 μm, 25 μm, and 30 μm, or a range between any two.
In the above technical solution, the welding layer has a suitable thickness, so as to ensure that the composite welding strip 100 has a better welding performance, and at the same time, the conductive performance of the composite welding strip 100 can be effectively maintained.
Considering that the thickness of the large domain copper of a specific copper grain boundary number is usually 0.025-0.075 mm and the hardness is usually 30-50 HV, the thickness and hardness of the large domain copper of the specific copper grain boundary number are small compared with the subsequent processing requirement. In the subsequent production process, the steps of forming a welding layer, cutting the welding strip and the like are required to be performed on the composite welding strip 100, so that the thickness and hardness of the copper strip are properly improved under the condition of ensuring the electrical conductivity of the copper strip, the subsequent processing is facilitated, and the yield of the production of the welding strip is ensured.
Referring to fig. 5, in some exemplary embodiments, the composite solder strip 100 further includes a first electroplated copper layer 140 and a second electroplated copper layer 150. The first electroplated copper layer 140 is located between the large domain copper tape 110 and the first solder layer 120, and the second electroplated copper layer 150 is located between the large domain copper tape 110 and the second solder layer 130.
In the above technical solution, the first copper electroplating layer 140 and the second copper electroplating layer 150 are added, and the whole of the first copper electroplating layer 140, the large domain copper tape 110 and the second copper electroplating layer 150 is used as a copper base tape. On one hand, the hardness of the thickness of the copper base band can be increased to a proper standard, and subsequent processes of forming a welding layer, cutting the welding band and the like are facilitated; on the other hand, the cost of the electroplated copper layer is low, the conductivity of the copper base band is guaranteed, and the cost is reasonably controlled.
In some possible embodiments, the total thickness of the first electroplated copper layer 140, the large domain copper strip 110, and the second electroplated copper layer 150 is 0.1-0.5 mm, such as but not limited to any one of 0.1mm, 0.2mm, 0.3mm, 0.4mm, and 0.5mm or a range between any two. The total thickness of the copper base band is controlled within the range, so that the hardness of the copper base band reaches the moderate hardness standard of 45-60 HV, and subsequent processes of forming a welding layer, cutting the welding band and the like are facilitated.
As an example, the first electroplated copper layer 140 and the second electroplated copper layer 150 are symmetrically disposed along the large domain copper tape 110, so that both sides of the large domain copper tape 110 can be better strengthened. It is understood that the first electroplated copper layer 140 and the second electroplated copper layer 150 are symmetrically disposed, which means that the positions of the two are symmetrical and the structural features such as the thickness are the same.
It should be noted that, the composite solder strip 100 provided in the embodiments of the present application may be prepared according to a process known in the art.
As an example, the first copper electroplating layer 140 is formed on one side surface of the large domain copper tape 110 by electroplating, and the second copper electroplating layer 150 is formed on the other side surface of the large domain copper tape 110 by electroplating.
As an example, the first and second welding layers 120 and 130 are formed on both sides of the copper base tape by plating or hot dip coating, respectively. It can be understood that in the embodiment where the composite solder strip 100 is composed of the large domain copper strip 110, the first solder layer 120 and the second solder layer 130 are formed on two surfaces of the large domain copper strip 110, respectively; in the embodiment where the composite solder strip 100 further includes the first copper electroplating layer 140 and the second copper electroplating layer 150, the first solder layer 120 is formed on the surface of the first copper electroplating layer 140, and the second solder layer 130 is formed on the surface of the second copper electroplating layer 150.
In addition, it should be noted that those whose specific conditions are not specified in the examples were performed according to the conventional conditions or the conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially. The large-domain copper of the present application refers to a copper material having a smaller number of grain boundaries per unit area than that of the polycrystalline copper foil, and may be any existing copper material satisfying the above requirements, such as a single crystal copper material or a low-grain boundary copper material having a number of grain boundaries close to that of the single crystal copper material. The large-crystal domain copper can be obtained by directly purchasing a copper material according to a specific standard and can also be obtained by screening after being prepared according to the existing preparation process of the large-crystal domain copper.
As an example, the large domain copper strip 110 of the embodiment of the present application may be obtained by annealing a multi-grain oxygen-free copper strip after heat treatment, and then screening according to the requirements of the number of copper grain boundaries, lattice orientation, hardness, and the like.
Optionally, the method for preparing the large domain copper tape 110 includes:
s1, carrying out oxygen-free copper strip on an original polycrystalline boundary (the mark is C10200, the thickness is 25-75um, and the number of crystal boundaries is more than 10000/cm)2) Entering a low-tension roll-to-roll annealing device, and introducing N2And an inert gas such as Ar or He.
S2, when the annealing equipment reaches 800-2And a reducing gas such as CO, to start the annealing process.
And S3, after the annealing is finished, continuously introducing inert gas into annealing equipment, and cooling the copper strip to room temperature to obtain the copper strip material with low crystal boundary number and large-size crystal domains.
And S4, screening the copper strip materials meeting the performance requirements of the number of copper crystal boundaries, the crystal lattice orientation, the peak intensity of single crystal domains, the hardness and the like in the batch to serve as the large-domain copper strip 110.
Test examples
A method of making a composite solder strip 100, comprising:
s1, carrying out low-tension reel-to-reel electroplating copper thickening treatment on the copper strip, and then drying and cutting to obtain the copper base band consisting of the first electroplating copper layer 140, the copper strip and the second electroplating copper layer 150. Wherein the current density of the electroplated copper is 0.3-4 ASD, and the thickness of the copper base band is 45-60 HV.
S2, washing and baking the copper base band, and then forming a first welding layer 120 and a second welding layer 130 on the surfaces of the two sides of the copper base band by adopting a low-tension roll-to-roll hot dip coating or electroplating process; and then slitting is carried out according to the width requirement to obtain the composite welding strip 100. The width direction of the composite solder strip 100 is the direction b as shown in fig. 1.
The performance parameters of the copper baseband of the test example of the present application were measured as follows.
(1) Detecting the number of crystal boundaries: and observing by a metallographic microscope, and randomly taking the number of the grain boundaries within the range of 250 x 400 mm.
(2) Hardness: GB-T-4340.1.
(3) Conductivity: GB-T-351.
(4) And (3) detecting the purity and the oxygen content of copper: GB/T5121.
In the present application, the performance parameters of the copper strip and the copper baseband of each test example are shown in table 1. In the copper base band of each test example, the copper band of each example is a large domain copper band 110, and the material of the copper band of each comparative example is a polycrystalline copper band.
TABLE 1 Performance parameters of copper baseband
As can be seen from table 1, in the composite welding strip 100 provided in the embodiment of the present application, the specific large domain copper strip 110 is adopted as the copper strip, so that the conductivity of the copper strip is good, and the conductivity of the composite welding strip 100 can be effectively improved; and the copper base band has a moderate hardness range, so that the subsequent processing is facilitated.
Considering that the photovoltaic solder ribbon is generally divided into an interconnection solder ribbon 300 (shown in fig. 6) and a bus solder ribbon 400 (shown in fig. 6) according to the application, the interconnection solder ribbon 300 is used for connecting the battery pieces 200 (shown in fig. 6), and the bus solder ribbon 400 is used for connecting and merging a plurality of interconnection solder ribbons 300 and then connecting the interconnection solder ribbons 300 with the junction box.
To better meet the current collection and transmission performance of the composite solder strip 100 under service conditions, and to better match existing production processes, the composite solder strip 100 optionally has a suitable width.
In some possible embodiments, the width of the composite solder strip 100 is 0.8-10 mm, such as but not limited to any one or a range between any two of 0.8mm, 0.9mm, 1mm, 1.5mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm and 10mm, and the composite solder strip 100 has a suitable width and is well-matched to existing manufacturing processes.
In a second aspect, please refer to fig. 6, an embodiment of the present application provides a photovoltaic module 10, including: a plurality of battery pieces 200, a plurality of interconnection solder strips 300 connecting the plurality of battery pieces 200, and a bus solder strip 400 connecting the plurality of interconnection solder strips 300. One or both of the interconnect solder strip 300 and the bus solder strip 400 are the composite solder strips 100 provided in the embodiments of the first aspect.
As an example, in the photovoltaic module 10, the number of the cell pieces 200 is 16, the number of the interconnection solder strips 300 is 8, and the number of the bus solder strips 400 is 2. Wherein, every 4 battery slices 200 form a battery string, and form 4 battery strings arranged side by side. The interconnection welding strips 300 are spaced apart in the side-by-side direction of the battery strings, and the battery cells 200 in each battery string are connected by 2 interconnection welding strips 300, respectively. Wherein 1 of the bus solder strips 400 is connected to one end of 8 of the interconnection solder strips 300 for bus, and wherein the other 1 of the bus solder strips 400 is connected to one end of 8 of the interconnection solder strips 300 for bus.
It is understood that in the photovoltaic module 10, the soldering is performed by the first soldering layer 120 and the second soldering layer 130, and the thickness direction of the composite solder strip 100 refers to the direction perpendicular to the surface of the cell sheet 200; the length direction and the width direction of the composite welding strip 100 both refer to directions parallel to the surface of the battery piece 200, wherein the extension length of the composite welding strip 100 in the width direction is smaller than the extension length of the composite welding strip 100 in the length direction.
According to the photovoltaic module 10 provided by the embodiment of the application, the composite solder strip 100 used in the photovoltaic module can effectively improve the problems that a copper strip is easily oxidized and corroded and cracks are generated, and effectively avoids the phenomena of resistivity increase and conductivity deterioration of the photovoltaic solder strip caused by the problems, so that the photoelectric conversion efficiency of the photovoltaic module 10 is effectively improved.
Since the composite solder strip 100 provided by the embodiment of the present application can effectively improve the problem that the copper strip is easily oxidized and corroded and cracks are generated, as an example, the interconnection solder strip 300 and the bus solder strip 400 are both the composite solder strips 100 provided by the embodiments of the first aspect.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A composite weld strip, comprising:
the large-crystal-domain copper strip is made of large-crystal-domain copper with the number of crystal boundaries in unit area smaller than that of the polycrystalline copper foil;
the first welding layer is positioned on the first side of the large-crystal-domain copper strip; and
and the second welding layer is positioned on the second side of the large-crystal-domain copper strip.
2. The composite solder strip of claim 1, in which the large domain copper strip has a thickness of 0.025 to 0.075 mm.
3. The composite solder strip of claim 1, wherein the material of the large domain copper strip is large domain copper with one of Cu (111), Cu (110), Cu (211) and Cu (100) in lattice orientation.
4. The composite weld bead according to any one of claims 1 to 3, further comprising:
the first electroplated copper layer is positioned between the large-crystal-domain copper strip and the first welding layer; and
and the second electroplated copper layer is positioned between the large-crystal-domain copper strip and the second welding layer.
5. The composite solder strip of claim 4, wherein the first electroplated copper layer, the large domain copper strip and the second electroplated copper layer have a total thickness of 0.1-0.5 mm.
6. The composite solder strip of claim 5, in which the first and second electroplated copper layers are symmetrically disposed along the large domain copper strip.
7. The composite solder strip of claim 1, wherein the first solder layer is a tin layer and/or the second solder layer is a tin layer.
8. The composite solder strip of claim 1 or 7, wherein the thickness of the first solder layer is 10 to 30 μm and/or the thickness of the second solder layer is 10 to 30 μm.
9. The composite solder strip of claim 1, wherein the width of the composite solder strip is 0.8-10 mm.
10. A photovoltaic module comprising a plurality of cells, a plurality of interconnecting solder strips connecting the plurality of cells, and a bus solder strip connecting the plurality of interconnecting solder strips, wherein one or both of the interconnecting solder strips and the bus solder strips are the composite solder strips of any one of claims 1 to 9.
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