CN213457255U

CN213457255U - Semiconductor chip precision testing device

Info

Publication number: CN213457255U
Application number: CN202022670942.4U
Authority: CN
Inventors: 谢金津
Original assignee: Shenzhen Complus Precision Equipment Co ltd
Current assignee: Shenzhen Complus Precision Equipment Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-06-15
Anticipated expiration: 2030-11-18

Abstract

The utility model discloses a semiconductor chip precision testing device, the on-line screen storage device comprises a base, one side bottom position fixed mounting of base has the mount pad, the mounting hole has been seted up to the upper surface of mount pad, the upper surface central point of base puts and has seted up test groove, the outside that the upper portion of base is located test groove is equipped with the portal frame, the top position placed in the middle of the portal frame runs through there is the lead screw, the bottom of lead screw is connected with the die plate through the axle sleeve rotation, the upper portion fixed mounting of die plate has the slide bar. A semiconductor chip precision testing device, can let test PCB board and stitch seat exert pressure to semiconductor chip's stitch, improve the contact effect of stitch seat and semiconductor chip stitch, guarantee the accurate nature of test result, also portal frame adopts gliding mode simultaneously, can conveniently shift out test groove directly over, conveniently place semiconductor chip, it is more convenient to use.

Description

Semiconductor chip precision testing device

Technical Field

The utility model relates to a testing arrangement field, in particular to semiconductor chip precision testing device.

Background

A chip, also called a microcircuit, belongs to essential main components in electronic equipment, a semiconductor chip belongs to one of the chips, when the semiconductor chip leaves factory, the semiconductor chip needs to be sampled and tested to ensure that the chips leaving factory are all qualified products, the common test mode is to connect pins of the semiconductor chip with pin bases of a test PCB board, and whether the semiconductor chip is qualified is judged by data fed back to a computer by the test PCB board;

firstly, because the pins of the semiconductor chip can not be fixed with the pin seat of the test PCB board in a welding way when the semiconductor chip is tested, a pressing template needs to be used for pressing down to ensure the contact effect of the pins and the pin seat, but the pin seat of the existing testing device does not apply pressure to the pins, and the phenomenon of poor contact still exists, so the testing result of the semiconductor chip is influenced; secondly, do not possess the slip function, because of semiconductor chip in the test, need place the test groove in, and current testing arrangement, the portal frame is fixed directly over the position of test groove, leads to people when placing the chip, and the portal frame has influenced people's operational space, and inconvenient placing semiconductor chip, the result of use is poor.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a semiconductor chip precision testing device, which can effectively solve the background art: when the semiconductor chip is tested, the pins of the semiconductor chip and the pin seat of the test PCB can not be fixed in a welding mode, so that a pressing template is required to be used for pressing down to ensure the contact effect of the pins and the pin seat, but the existing test device has the phenomenon of poor contact property due to the fact that the pin seat does not apply pressure to the pins, and the test result of the semiconductor chip is influenced; secondly, do not possess the slip function, because of semiconductor chip in the test, need place the test groove in, and current testing arrangement, the portal frame is fixed directly over the position of test groove, leads to people when placing the chip, and the portal frame has influenced people's operational space, inconvenient placing semiconductor chip, the poor technical problem of result of use.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor chip precision testing device, includes the base, one side bottom position fixed mounting of base has the mount pad, the mounting hole has been seted up to the upper surface of mount pad, the upper surface central point of base puts and has seted up test groove, the upper portion of base is located the outside of test groove and is equipped with the portal frame, the top position placed in the middle of portal frame runs through there is the lead screw, the bottom of lead screw is connected with the die plate through the axle sleeve rotation, the upper portion fixed mounting of die plate has the slide bar, slide bar and portal frame sliding connection, the inside of base is equipped with the test PCB board, the equal fixed mounting in upper portion both sides position of test PCB board has the stitch seat, be equipped with compensation mechanism between test PCB board and the base, compensation mechanism is including guide post, spring and guide pin bushing, the rear portion of base is equipped with slide mechanism, slide mechanism is including the slide, Support, slider, first dog and second dog.

As a further aspect of the utility model, guide pin bushing fixed mounting is in one side of test PCB board, the guide post runs through the guide pin bushing, and guide post fixed mounting is in the inside of base, spring fixed connection is between the bottom of test PCB board and base.

As a further aspect of the utility model, the spring corresponds with the stitch seat is perpendicular, be equipped with insulating the pad between the top of spring and the test PCB board.

As a further aspect of the utility model, the slide passes through support fixed mounting at the rear portion of base, slider fixed mounting is in the bottom of portal frame, first dog fixed mounting is in the upper portion rear portion position of slide, second dog fixed mounting is in the upper portion front portion position of base.

As a further scheme of the utility model, the spout has all been seted up with the upper surface of slide to the base, the portal frame passes through slider and spout sliding connection.

As a further proposal of the utility model, when the portal frame contacts with the second stopper, the die pressing plate vertically corresponds to the test groove.

Compared with the prior art, the utility model discloses following beneficial effect has: in the utility model, through setting up the compensation mechanism, when the die plate presses on semiconductor chip's upper portion, press the contact of semiconductor chip's stitch on the stitch seat of test PCB board, exert pressure for test PCB board and stitch seat simultaneously, make the test PCB board move down perpendicularly to the direction through guide pin bushing and guide post, test PCB board compression spring contracts, make the spring keep the expansion force continuously, the expansion force promotes the stitch seat and compresses tightly semiconductor chip's stitch, the contact nature of stitch seat and stitch can be guaranteed, avoid stitch seat and semiconductor chip stitch bad contact to lead to the phenomenon of influencing the test result, make whole testing arrangement more stable;

through setting up slide mechanism, slide the portal frame in the spout of base and slide upper surface through the slider, make portal frame contact first dog, at this moment, the top of test groove is accessible obstacle and is sheltered from, people can place semiconductor chip in the test groove, then pass through the slider with the portal frame and reset, make portal frame and second dog contact, can in time remove the portal frame when placing and taking out semiconductor chip, avoid the portal frame to shelter from influencing people's operation, make testing arrangement use more convenient.

Drawings

Fig. 1 is a schematic view of the overall structure of a semiconductor chip precision testing apparatus of the present invention;

FIG. 2 is a side view of a semiconductor chip precision testing apparatus of the present invention;

fig. 3 is a demonstration diagram of the pressing template pressing back of the semiconductor chip precision testing device of the present invention.

In the figure: 1. a base; 2. a mounting seat; 3. mounting holes; 4. a test slot; 5. a gantry; 6. a screw rod; 7. pressing the template; 8. a shaft sleeve; 9. a slide bar; 10. testing the PCB; 11. a stitch base; 12. a compensation mechanism; 13. a guide post; 14. a spring; 15. a guide sleeve; 16. a sliding mechanism; 17. a slide base; 18. a support; 19. a slider; 20. a first stopper; 21. a second stop.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-3, a semiconductor chip precision testing device comprises a base 1, a mounting seat 2 is fixedly installed at the bottom of one side of the base 1, a mounting hole 3 is formed in the upper surface of the mounting seat 2, a test slot 4 is formed in the center of the upper surface of the base 1, a portal frame 5 is arranged on the upper portion of the base 1 and located outside the test slot 4, a lead screw 6 penetrates through the center of the top of the portal frame 5, a press plate 7 is rotatably connected to the bottom end of the lead screw 6 through a shaft sleeve 8, a slide bar 9 is fixedly installed on the upper portion of the press plate 7, the slide bar 9 is slidably connected with the portal frame 5, a test PCB 10 is arranged inside the base 1, pin bases 11 are fixedly installed at both sides of the upper portion of the test PCB 10, a compensation mechanism 12 is arranged between the test PCB 10 and the base 1, the compensation mechanism 12 comprises a guide column 13, a spring 14 and a guide sleeve, the sliding mechanism 16 comprises a sliding seat 17, a bracket 18, a sliding block 19, a first stop 20 and a second stop 21;

the guide sleeve 15 is fixedly arranged at one side of the test PCB 10, the guide column 13 penetrates through the guide sleeve 15, the guide column 13 is fixedly arranged inside the base 1, and the spring 14 is fixedly connected between the bottom of the test PCB 10 and the base 1; the spring 14 vertically corresponds to the pin base 11, an insulating pad is arranged between the top end of the spring 14 and the test PCB 10, and the insulating pad can play an insulating role; the sliding base 17 is fixedly arranged at the rear part of the base 1 through a bracket 18, the sliding block 19 is fixedly arranged at the bottom part of the portal frame 5, the first stop block 20 is fixedly arranged at the upper rear part of the sliding base 17, and the second stop block 21 is fixedly arranged at the upper front part of the base 1; the upper surfaces of the base 1 and the sliding seat 17 are both provided with sliding grooves, the portal frame 5 is in sliding connection with the sliding grooves through the sliding blocks 19, and the sliding grooves can play a role of sliding in cooperation with the sliding blocks 19; when the portal frame 5 contacts the second stop block 21, the die pressing plate 7 vertically corresponds to the test slot 4.

It should be noted that, when the precision testing device for semiconductor chips of the present invention is used, firstly, the portal frame 5 slides in the sliding grooves on the upper surfaces of the base 1 and the sliding seat 17 through the sliding block 19, so that the portal frame 5 contacts the first stop 20, at this time, no obstacle is covered above the test groove 4, people can place the semiconductor chip in the test groove 4, then the portal frame 5 is reset through the sliding block 19, so that the portal frame 5 contacts the second stop 21, the lead screw 6 is rotated, the lead screw 6 moves through the screw action, because the lead screw 6 is rotatably connected with the press mold plate 7 through the shaft sleeve 8, when the lead screw 6 moves, the press mold plate 7 is vertically pressed down through the sliding effect between the sliding rod 9 and the portal frame 5, when the press mold plate 7 is pressed on the upper portion of the semiconductor chip, the pins of the semiconductor chip are pressed on the pin base 11 of the test PCB 10, meanwhile, pressure is applied to the test PCB 10 and the stitch holder 11, so that the test PCB 10 moves down vertically under the guidance of the guide sleeve 15 and the guide post 13, the test PCB 10 compresses the spring 14 to contract, the spring 14 continuously maintains the expansion force, the expansion force pushes the stitch holder 11 to press the stitch of the semiconductor chip, after contact, the test PCB 10 feeds back the working condition of the semiconductor chip to an external computer, and people judge whether the semiconductor chip is qualified or not through the external computer.

The utility model discloses a set up compensation mechanism 12, when die plate 7 presses on semiconductor chip's upper portion, press the contact with semiconductor chip's stitch on test PCB board 10's stitch seat 11, exert pressure for test PCB board 10 and stitch seat 11 simultaneously, make test PCB board 10 move down perpendicularly to the direction through guide pin bushing 15 and guide post 13, test PCB board 10 compression spring 14 contracts, make spring 14 keep the expansion force continuously, the expansion force promotes stitch seat 11 and compresses tightly semiconductor chip's stitch, can guarantee the contact nature of stitch seat 11 and stitch, avoid stitch seat 11 and semiconductor stitch chip contact failure to lead to the phenomenon that influences the test result, make whole testing arrangement more stable; through setting up slide mechanism 16, slide portal frame 5 in the spout of base 1 and slide 17 upper surface through slider 19, make portal frame 5 contact first dog 20, at this moment, the top of test groove 4 is accessible and is sheltered from, people can place semiconductor chip in test groove 4, then reset portal frame 5 through slider 19 again, make portal frame 5 and second dog 21 contact, can in time remove portal frame 5 when placing and taking out semiconductor chip, avoid portal frame 5 to shelter from the influence people's operation, make testing arrangement use more convenient.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A semiconductor chip precision testing device is characterized in that: the device comprises a base (1), a mounting seat (2) is fixedly mounted at the bottom of one side of the base (1), a mounting hole (3) is formed in the upper surface of the mounting seat (2), a test slot (4) is formed in the center of the upper surface of the base (1), a portal frame (5) is arranged on the upper portion of the base (1) and located on the outer side of the test slot (4), a lead screw (6) penetrates through the top center of the portal frame (5), the bottom end of the lead screw (6) is rotatably connected with a compression die plate (7) through a shaft sleeve (8), a slide bar (9) is fixedly mounted at the upper portion of the compression die plate (7), the slide bar (9) is slidably connected with the portal frame (5), a test PCB (10) is arranged inside the base (1), pin bases (11) are fixedly mounted at both sides of the upper portion of the test PCB (10), and a compensation mechanism (12) is arranged between the test PCB (10) and the base (, the compensation mechanism (12) comprises a guide column (13), a spring (14) and a guide sleeve (15), a sliding mechanism (16) is arranged at the rear part of the base (1), and the sliding mechanism (16) comprises a sliding seat (17), a support (18), a sliding block (19), a first stop block (20) and a second stop block (21).

2. The precision testing apparatus for semiconductor chips according to claim 1, wherein: the guide sleeve (15) is fixedly installed on one side of the test PCB (10), the guide column (13) penetrates through the guide sleeve (15), the guide column (13) is fixedly installed inside the base (1), and the spring (14) is fixedly connected between the bottom of the test PCB (10) and the base (1).

3. The precision testing apparatus for semiconductor chips according to claim 1, wherein: the spring (14) vertically corresponds to the pin base (11), and an insulating pad is arranged between the top end of the spring (14) and the test PCB (10).

4. The precision testing apparatus for semiconductor chips according to claim 1, wherein: the gantry crane is characterized in that the sliding seat (17) is fixedly installed at the rear part of the base (1) through a support (18), the sliding block (19) is fixedly installed at the bottom of the gantry frame (5), the first stop block (20) is fixedly installed at the rear part of the upper part of the sliding seat (17), and the second stop block (21) is fixedly installed at the front part of the upper part of the base (1).

5. The precision testing apparatus for semiconductor chips according to claim 1, wherein: the sliding grooves are formed in the upper surfaces of the base (1) and the sliding seat (17), and the portal frame (5) is connected with the sliding grooves in a sliding mode through the sliding blocks (19).

6. The precision testing apparatus for semiconductor chips according to claim 1, wherein: when the portal frame (5) is in contact with the second stop block (21), the die pressing plate (7) vertically corresponds to the test slot (4).