CN213437679U

CN213437679U - Reflow soldering equipment for electronic component

Info

Publication number: CN213437679U
Application number: CN202021674853.0U
Authority: CN
Inventors: 林林
Original assignee: Asteelflash Electronics Suzhou Co ltd
Current assignee: Asteelflash Electronics Suzhou Co ltd
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2021-06-15
Anticipated expiration: 2030-08-12

Abstract

The utility model relates to an electronic component processing equipment technical field just discloses a reflow soldering equipment for electronic component, comprising a base plate, the middle part fixed mounting at bottom plate top has the carriage, the top fixed mounting of carriage has the reflow oven, the fixed cover in front side of reflow oven top one side has been met thermocouple metal sleeve, the groove of accomodating has been seted up to one side of reflow oven bottom. This reflow soldering equipment for electronic component, the distance between the top of bottom to reflow oven inner chamber through thermocouple metal sleeve is one hundred ten centimetres, it has increased ninety centimetres enough to compare current thermocouple metal sleeve's downwardly extending length for the change of induction oven intracavity temperature that thermocouple metal sleeve can be timely, the inside heating module of reflow oven is in time fed back, effective heat compensation is provided, the extreme condition that has pasted high heat-absorbing element on a plurality of area metal carriers and product has been solved effectively and has been crossed the stove simultaneously, the insufficient problem of heat compensation.

Description

Reflow soldering equipment for electronic component

Technical Field

The utility model relates to an electronic component processing equipment technical field specifically is a reflow soldering equipment for electronic component.

Background

The reflow oven is a device required by the SMT process in the electronic technology industry, the reflow oven process realizes the soldering of mechanical and electrical connection between the soldering terminal or pin of the surface-mounted component and the printed board pad by re-melting the paste soft solder pre-distributed on the printed board pad, the reflow oven is the last key process of the SMT (surface mounting technology), is a real-time process control, has complex process change and relates to a plurality of process parameters, wherein the setting of a temperature curve is most important, and the reflow soldering quality is directly determined.

The length of the thermocouple metal sleeve used in the existing reflow soldering equipment for the electronic element is fixed, and the existing thermocouple metal sleeve is exposed in a suspension mode by 20 cm, so that the thermocouple metal sleeve cannot feed back an internal heating module in time, effective heat compensation is provided, and the thermocouple metal sleeve is not convenient for workers to use.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a reflow soldering equipment for electronic component possesses the change that can make the timely induction furnace intracavity temperature of heat detecting head, and the inside heating module of timely feedback provides effectual heat compensation's advantage, has solved the problem that proposes among the above-mentioned background art.

The utility model provides a following technical scheme: the utility model provides a reflow soldering equipment for electronic component, includes the bottom plate, the middle part fixed mounting at bottom plate top has the carriage, the top fixed mounting of carriage has the backward flow stove, the fixed coupling of front side of backward flow furnace top one side has thermocouple metal casing, the groove of accomodating has been seted up to one side of backward flow stove bottom, the inner chamber activity of accomodating the groove has cup jointed the baffle.

Carefully, the removal that is located the reflow oven below is seted up at the top of bottom plate leads to the groove, one side fixed mounting that removes the groove inner chamber has the three section cylinder, the one end fixed mounting of three section cylinder has the movable block, the top fixed mounting of movable block has the movable plate, there is the motor one side at movable plate top through frame fixed mounting, the fixed swivel mount that has cup jointed of output shaft of motor, all there is splint through telescopic link fixed mounting the inboard front and back side of swivel mount, the outside activity of telescopic link has cup jointed the spring, the both ends of spring fixed mounting respectively has swivel mount and splint.

Carefully, the quantity of splint is two, two splint are the symmetry and distribute respectively in the inboard front and back side of swivel mount, the rear side of splint is through the inboard fixed connection of three telescopic link and three spring and swivel mount, the whole of swivel mount is the U font form, one side of swivel mount is fixed to be cup jointed on the output shaft of motor.

And carefully selecting, wherein the distance from the bottom of the thermocouple metal sleeve to the top of the inner cavity of the reflow furnace is one hundred and ten centimeters.

The auxiliary plates are fixedly mounted on two sides of the bottom of the baffle, the number of the auxiliary plates is two, the two auxiliary plates are symmetrically distributed on two sides of the baffle, the whole auxiliary plate is L-shaped, and one side of the auxiliary plate, far away from the baffle, is arc-shaped.

And carefully selecting, wherein one side of the inner cavity of the movable through groove is fixedly provided with three telescopic plates positioned above the three cylinders, and one end of each of the three telescopic plates is fixedly arranged on one side of the movable block.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this reflow soldering equipment for electronic component, the distance between the top of bottom to reflow oven inner chamber through thermocouple metal sleeve is one hundred ten centimetres, it has increased ninety centimetres enough to compare current thermocouple metal sleeve's downwardly extending length for the change of induction oven intracavity temperature that thermocouple metal sleeve can be timely, the inside heating module of reflow oven is in time fed back, effective heat compensation is provided, the extreme condition that has pasted high heat-absorbing element on a plurality of area metal carriers and product has been solved effectively and has been crossed the stove simultaneously, the insufficient problem of heat compensation.

2. This reflow soldering equipment for electronic component, inboard through the swivel mount is equipped with the telescopic link respectively, spring and splint, be the symmetric distribution between two splint of rethread, be convenient for with electronic component's front and back side card in between the inner chamber on two splint, be convenient for fix electronic component and carry out reflow soldering at the top of movable plate, the operation through the motor can drive the rotation of swivel mount, thereby it is rotatory to have driven the electronic component between two splint, make this equipment can carry out reflow soldering to electronic component's another side.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the metal sleeve of the thermocouple of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the movable through groove of the present invention;

FIG. 4 is a schematic view of the three-dimensional structure of the rotating frame of the present invention;

fig. 5 is a schematic view of the three-dimensional structure of the auxiliary plate of the present invention.

In the figure: 1. a base plate; 2. a support frame; 3. a reflow oven; 4. a thermocouple metal bushing; 5. a receiving groove; 6. a baffle plate; 7. moving the through groove; 8. three sections of cylinders; 9. a moving block; 10. moving the plate; 11. a motor; 12. a rotating frame; 13. a telescopic rod; 14. a spring; 15. a splint; 16. an auxiliary plate; 17. three-section expansion plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a reflow soldering apparatus for electronic components includes a bottom plate 1, a moving through slot 7 disposed below a reflow oven 3 is disposed at the top of the bottom plate 1, three cylinders 8 are fixedly mounted at one side of an inner cavity of the moving through slot 7, a moving block 9 is fixedly mounted at one end of each of the three cylinders 8, a moving plate 10 is fixedly mounted at the top of the moving block 9, a motor 11 is fixedly mounted at one side of the top of the moving plate 10 through a frame, a rotating frame 12 is fixedly secured to an output shaft of the motor 11, clamping plates 15 are fixedly mounted at front and rear sides of an inner side of the rotating frame 12 through an expansion link 13, a spring 14 is movably secured to an outer side of the expansion link 13, a rotating frame 12 and a clamping plate 15 are fixedly mounted at two ends of the spring 14 respectively, the rotating frame 12 is driven to rotate by the operation of the motor 11, thereby driving the electronic, the number of the clamping plates 15 is two, the two clamping plates 15 are symmetrically distributed on the front side and the rear side of the inner side of the rotating frame 12 respectively, the rear side of the clamping plates 15 is fixedly connected with the inner side of the rotating frame 12 through three telescopic rods 13 and three springs 14, the whole rotating frame 12 is in a U-shaped shape, one side of the rotating frame 12 is fixedly sleeved on an output shaft of the motor 11, the telescopic rods 13, the springs 14 and the clamping plates 15 are respectively arranged on the inner side of the rotating frame 12, the front side and the rear side of an electronic element are conveniently clamped between inner cavities on the two clamping plates 15 through symmetrical distribution between the two clamping plates 15, one side of the inner cavity of the movable through groove 7 is fixedly provided with three-section telescopic plates 17 positioned above the three-section air cylinders 8, one end of the three-section telescopic plates 17 is fixedly arranged on one side of the movable block 9, the three-section telescopic plates 17 are arranged above the three-, the service life of the three-section air cylinder 8 is prolonged, the middle part of the top of the bottom plate 1 is fixedly provided with the supporting frame 2, the top of the supporting frame 2 is fixedly provided with the reflow oven 3, the front side of one side of the top of the reflow oven 3 is fixedly sleeved with the thermocouple metal sleeve 4, the distance from the bottom of the thermocouple metal sleeve 4 to the top of the inner cavity of the reflow oven 3 is one hundred and ten centimeters, and the distance from the bottom of the thermocouple metal sleeve 4 to the top of the inner cavity of the reflow oven 3 is one hundred and ten centimeters, compared with the existing thermocouple metal sleeve 4, the downward extension length is increased by ninety centimeters enough, so that the thermocouple metal sleeve 4 can timely sense the temperature change in the oven cavity and timely feed back a heating module in the reflow oven 3, effective heat compensation is provided, and the problem that when a plurality of metal carriers with the metal and products are pasted with high heat absorption elements under the extreme condition of simultaneously, the thermal compensation is insufficient, the thermocouple metal sleeve 4 is arranged at the position of a hot air backflow low-temperature layer of each temperature zone, one side of the bottom of the backflow furnace 3 is provided with an accommodating groove 5, a baffle plate 6 is movably sleeved in the inner cavity of the accommodating groove 5, two auxiliary plates 16 are fixedly arranged on two sides of the bottom of the baffle plate 6, the two auxiliary plates 16 are symmetrically distributed on two sides of the baffle plate 6, the whole auxiliary plates 16 are L-shaped, one side of the auxiliary plates 16, far away from the baffle plate 6, is arc-shaped, two auxiliary plates 16 are respectively arranged on two sides of the baffle plate 6, one side of the auxiliary plates 16, far away from the baffle plate 6, is arc-shaped, the whole auxiliary plates 16 are L-shaped, when the moving block 9 and the rotating frame 12 move to be in contact with the auxiliary plates 16, the direction of the rotating frame 12, which is opposite to the baffle plate 6, is changed, so that the baffle plate 6 is pushed into the, so that the moving block 9 and the rotating frame 12 can enter the inner cavity of the reflow oven 3.

The working principle is as follows: when in use, the front side and the rear side of the electronic element are respectively clamped in the inner cavities of the two clamping plates 15, the three-section air cylinder 8 contracts to drive the moving block 9 to move towards the inner cavity of the reflow oven 3, thereby driving the rotary frame 12 to move towards the inner cavity of the reflow oven 3, when passing through the baffle 6, the auxiliary plate 16 can be pressed by the auxiliary plate 16, thereby driving the baffle 6 to move upwards, stopping the operation of the three-section air cylinder 8 when the electronic component moves into the inner cavity of the reflow oven 3, then the operation of the reflow furnace 3 is started, the change of the temperature in the furnace cavity can be sensed through the metal sleeve 4 of the thermocouple arranged on the reflow furnace 3, the internal heating module can be fed back in time to provide effective heat compensation, when the other side of the electronic element needs to be welded, the electronic element on the clamping plate 15 can be turned over and welded by rotating the motor 11 for one hundred eighty degrees.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Reflow soldering apparatus for electronic components, comprising a base plate (1), characterized in that: the middle part fixed mounting at bottom plate (1) top has carriage (2), the top fixed mounting of carriage (2) has reflow oven (3), the fixed cover of the front side of reflow oven (3) top one side has thermocouple metal casing (4), one side of reflow oven (3) bottom has been seted up and has been accomodate groove (5), baffle (6) have been cup jointed in the inner chamber activity of accomodating groove (5).

2. A reflow soldering apparatus for electronic parts according to claim 1, wherein: the top of bottom plate (1) is seted up and is located the removal of reflow oven (3) below and lead to groove (7), one side fixed mounting that removes the inner chamber of leading to groove (7) has three section cylinder (8), the one end fixed mounting of three section cylinder (8) has movable block (9), the top fixed mounting of movable block (9) has movable plate (10), there is motor (11) one side at movable plate (10) top through frame fixed mounting, swivel mount (12) have been cup jointed to the output shaft of motor (11) fixed, all there are splint (15) through telescopic link (13) fixed mounting in the inboard front and back side of swivel mount (12), spring (14) have been cup jointed in the outside activity of telescopic link (13), the both ends of spring (14) fixed mounting respectively have swivel mount (12) and splint (15).

3. A reflow soldering apparatus for electronic parts according to claim 2, wherein: the quantity of splint (15) is two, two splint (15) are the symmetry and distribute respectively in the inboard front and back side of swivel mount (12), the inboard fixed connection of three telescopic link (13) and three spring (14) and swivel mount (12) is passed through to the rear side of splint (15), the whole of swivel mount (12) is the U word shape, one side of swivel mount (12) is fixed to be cup jointed on the output shaft of motor (11).

4. A reflow soldering apparatus for electronic parts according to claim 1, wherein: the distance between the bottom of the thermocouple metal sleeve (4) and the top of the inner cavity of the reflow furnace (3) is one hundred and ten centimeters.

5. A reflow soldering apparatus for electronic parts according to claim 1, wherein: auxiliary plates (16) are fixedly mounted on two sides of the bottom of the baffle plate (6), the number of the auxiliary plates (16) is two, the two auxiliary plates (16) are symmetrically distributed on two sides of the baffle plate (6), the whole auxiliary plate (16) is L-shaped, and one side, away from the baffle plate (6), of each auxiliary plate (16) is arc-shaped.

6. A reflow soldering apparatus for electronic parts according to claim 2, wherein: and three sections of telescopic plates (17) positioned above the three sections of cylinders (8) are fixedly installed on one side of the inner cavity of the movable through groove (7), and one ends of the three sections of telescopic plates (17) are fixedly installed on one side of the movable block (9).