CN213403548U - Thick film heater and household appliance - Google Patents
Thick film heater and household appliance Download PDFInfo
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- CN213403548U CN213403548U CN202021372150.2U CN202021372150U CN213403548U CN 213403548 U CN213403548 U CN 213403548U CN 202021372150 U CN202021372150 U CN 202021372150U CN 213403548 U CN213403548 U CN 213403548U
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- thick film
- film heater
- strip
- conductive heating
- flexible substrate
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Abstract
The utility model relates to a thick film heater, including flexible base member and electrically conductive heating circuit. Wherein, the surface of flexible base member is formed with the recess, and electrically conductive heating circuit is at least partly inlayed and is located in the recess. The groove is formed in the flexible base body, and the conductive heating circuit is at least partially embedded in the groove, so that in the preparation process, the heating material for preparing the conductive heating circuit is positioned at a preset position on the flexible base body, and the conductive heating circuit with a preset pattern is finally formed.
Description
Technical Field
The utility model relates to an electrical heating technical field especially relates to a thick film heater and domestic appliance.
Background
The thick film heater is a heating element in which a conductive heating line is formed of a heating material on a substrate and heat is generated by energization, and the prior art has been less studied to provide such a thick film heater having a good heat generating effect and more excellent flexibility. In the process of preparing the conductive heat-generating circuit of such a thick film heater, it is difficult to position the heat-generating material on the substrate in a predetermined pattern, resulting in an increase in the defective rate of the product.
Therefore, in order to solve the above problems, a new thick film heater and a new household appliance must be designed.
SUMMERY OF THE UTILITY MODEL
In order to achieve the above object, the present invention provides a thick film heater, the thick film heater comprising: the surface of the flexible substrate is provided with a groove; the conductive heating circuit is at least partially embedded in the groove.
As a further improvement of the utility model, the depth of the groove is more than 10 μm and less than 20 μm.
As a further improvement of the utility model, the thickness of the conductive heating circuit is less than 100 μm.
As a further improvement of the present invention, the track shape of the conductive heating line is the same as the track shape of the groove.
As a further improvement of the present invention, the groove includes at least two first strip-shaped groove sections and at least one second strip-shaped groove section, and the number of the second strip-shaped groove sections is one less than that of the first strip-shaped groove sections; the at least two first strip-shaped groove sections are arranged in parallel at intervals, and the at least one second strip-shaped groove section is sequentially connected with the head end and the tail end of the adjacent two first strip-shaped groove sections.
As a further improvement of the present invention, the flexible substrate is rectangular, and the first strip-shaped groove section is parallel to the edge of the flexible substrate.
As a further improvement of the utility model, the conductive heating circuit is provided with a conductive terminal for connecting an external power supply.
As a further improvement of the utility model, conductive terminal is the metal conductive foil paper, the metal conductive foil paper orientation one side on the electrically conductive layer that generates heat is provided with the glue film.
As a further improvement of the utility model, the flexible substrate is a polyimide film, a polyester film or an epoxy plate.
As a further improvement of the present invention, the thick film heater further comprises a flexible encapsulating layer, wherein the flexible encapsulating layer encapsulates the conductive heating circuit on the flexible substrate.
As a further improvement of the present invention, the flexible substrate and the flexible encapsulating layer are bonded by hot pressing, microwave heating, or ultrasonic welding.
The utility model also provides a domestic appliance, including above-mentioned arbitrary thick film heater.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model provides a thick film heater and domestic appliance, through set up the recess on flexible base member to with electrically conductive heating circuit at least part inlay locate the recess in, make in the preparation process, the heating material of preparation electrically conductive heating circuit is located the preset position on flexible base member, with the electrically conductive heating circuit that finally forms predetermined pattern, solved among the prior art heating material and be difficult to according to the problem of predetermined pattern location on the base member, guaranteed the quality of product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of a flexible substrate in a thick film heater according to the present invention;
FIG. 2 is a schematic structural view of a flexible substrate and a baffle during the manufacture of a thick film heater;
1-a flexible substrate; 11-a first edge; 12-a second edge; 2-a groove; 21-a first strip-shaped groove; 22-second strip-shaped grooves; 3-baffle plate.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. However, these embodiments are not intended to limit the present invention, and structural, methodical, or functional changes that may be made by one of ordinary skill in the art based on these embodiments are all included in the scope of the present invention.
It should be noted that all the directional indicators (such as upper … … and lower … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The utility model provides a thick film heater, including flexible base member 1, electrically conductive heating circuit and flexible encapsulated layer.
Referring to fig. 1, a groove 2 is formed on the surface of the flexible substrate 1, and the conductive heating circuit is at least partially embedded in the groove 2.
Therefore, the utility model provides a thick film heater is through setting up recess 2 on flexible base member 1 to inlay conductive heating circuit in recess 2 at least part, make in the preparation process, the heating material of preparation conductive heating circuit is located the preset position on flexible base member 1, with the conductive heating circuit that finally forms predetermined pattern, solved among the prior art heating material and be difficult to according to the problem of predetermined pattern location on the base member, guaranteed the quality of product.
Further, since the flexible substrate 1 is generally thin, the depth of the above-mentioned groove 2 is more than 10 μm and less than 20 μm. For example, the depth of the groove 2 may be 12 μm, 14 μm, 16 μm, 18 μm, or the like.
Of course, in the other embodiments of the present invention, the depth of the groove 2 can be adjusted according to the actual product condition of the thick film heater, and the purpose of the present invention can be achieved as long as the effect that at least part of the conductive heating circuit is embedded in the groove 2 is achieved.
The thickness of the conductive heating line is less than 100 μm. For example, the thickness of the conductive heating line may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, or the like.
Alternatively, the thickness of the conductive heating line may be set to be equal to the depth of the groove 2 to ensure the working performance of the conductive heating line; or, the thickness of the conductive heating circuit can be set to be slightly larger than the depth of the groove 2, and the purpose of the utility model can be realized.
In addition, the trace shape of the conductive heating line is the same as that of the groove 2. Specifically, referring to fig. 1, the groove 2 includes at least two first strip-shaped grooves 21 and at least one second strip-shaped groove 22, and the number of the second strip-shaped grooves 22 is one less than that of the first strip-shaped grooves 21; at least two first strip-shaped grooves 21 are arranged in parallel at intervals, and at least one second strip-shaped groove 22 is sequentially connected with the head end and the tail end of two adjacent first strip-shaped grooves 21. Correspondingly, the conductive heating line also comprises at least two first line segments and at least one second line segment, the number of the second line segments is one less than that of the first line segments, the at least two first line segments are arranged in parallel at intervals, and the at least one second line segment is sequentially connected with the head end and the tail end of the adjacent two first line segments.
In one embodiment, the flexible substrate 1 has a rectangular shape, and the first strip-shaped groove 21 is parallel to the edge of the flexible substrate 1. In particular, the edges of the flexible substrate 1 comprise two oppositely arranged first edges 11 and two oppositely arranged second edges 12.
In an alternative embodiment, the first strip-shaped groove 21 segment may be disposed parallel to the first edge 11, and the second strip-shaped groove 22 segment may be disposed parallel to the second edge 12, so as to connect two adjacent first strip-shaped grooves 21. Thereby, the shape of the conductive heating line also corresponds to the shape of the recess 2, i.e. the first line segment is parallel to the first edge 11 of the flexible substrate 1 and the second line segment is parallel to the second edge 12 of the flexible substrate 1 to connect the two first line segments. Of course, in other embodiments, the second strip-shaped groove 22 may be provided in other shapes that are not parallel to the second edge 12, such as a circular arc, and the like, which also achieves the purpose of the present invention.
Or, in another alternative embodiment, the first strip-shaped groove 21 segment may be arranged parallel to the second edge 12, and the second strip-shaped groove 22 segment may be correspondingly arranged parallel to the first edge 11 to connect two adjacent first strip-shaped groove 21 segments. Thereby, the shape of the conductive heating line conforms to the shape of the groove 2, i.e. the first line segment is parallel to the second edge 12 of the flexible substrate 1 and the second line segment is parallel to the first edge 11 of the flexible substrate 1 to connect two adjacent first line segments. Similar to the previous embodiment, the second strip-shaped groove 22 may also be provided with other shapes that are not parallel to the first edge 11, such as circular arc, etc., and the object of the present invention can also be achieved.
It should be noted that the structure of the groove 2 is only a few exemplary embodiments of the present invention, and the groove 2 may also adopt other structures besides the above embodiments, such as a spiral shape, a serpentine shape, etc., and the corresponding conductive heating line may also be a spiral shape, a serpentine shape, etc., all within the scope of the present invention, which is not limited herein. Moreover, the flexible substrate 1 may have other shapes besides rectangular, such as circular, etc., and is within the scope of the present invention, which is not limited herein.
In addition, the conductive heating circuit is also provided with a conductive terminal for connecting an external power supply. Specifically, the conductive terminals are metal conductive foil, and one side of the metal conductive foil, which faces the conductive heating layer, is provided with an adhesive layer so as to bond the conductive terminals at specific positions of the conductive heating circuit through the adhesive layer. In one embodiment, the conductive terminals are copper foils. Of course, in other embodiments, the conductive terminal may also be other metal conductive foil, which is not limited herein. In addition, the fixing manner of the conductive terminal and the conductive heating line may also adopt other fixing manners, and is not limited herein.
The utility model provides a flexible base member 1 can be polyimide film (PI membrane), or polyester film (PET membrane) or epoxy board to guarantee that the thick film heater has better compliance. Of course, in other embodiments, the flexible substrate 1 may be made of other materials, and all of them are within the protection scope of the present invention.
The flexible encapsulating layer is used for coating the conductive heating circuit on the flexible substrate 1 so as to protect the conductive heating circuit and further prolong the service life of the conductive heating circuit. Specifically, the flexible substrate 1 and the flexible encapsulating layer are bonded through hot pressing, microwave heating or ultrasonic welding. In this embodiment, the flexible substrate 1 and the flexible encapsulating layer are bonded by hot pressing, so that the flexible substrate 1, the conductive heating circuit and the flexible encapsulating layer are tightly bonded, the sealing performance is good, and the bonding reliability is high. Of course, in other embodiments of the present invention, the connection between the flexible substrate 1 and the flexible encapsulating layer may be realized in other manners, which is not limited herein.
It should be noted that the hot-pressing pressure can be selected according to the material of the flexible substrate 1, so long as the effect of making the flexible substrate 1 and the flexible encapsulating layer adhere compactly is achieved, the purpose of the utility model can be realized. Generally, the pressure of the hot pressing does not exceed 10 MPa. Similarly, the hot-pressing temperature can be selected according to the material of the flexible substrate 1, so long as the effect of bonding the flexible substrate 1 and the flexible encapsulating layer to be compact is achieved, and the purpose of the utility model can be realized. For example, when the flexible substrate 1 is a PI film, the hot pressing temperature does not exceed 200 ℃, and when the flexible substrate 1 is an epoxy board, the hot pressing temperature does not exceed 130 ℃.
In the prior art, in order to realize the close adhesion of the heating material for preparing the conductive heating circuit and the flexible substrate 1 in the preparation process, considering the characteristic that the flexible substrate 1 cannot resist high temperature, one scheme is to additionally arrange a hard carrier on the flexible substrate 1, and then realize the close adhesion of the heating material and the flexible substrate 1 through the sintering temperature of more than 600 ℃, so that the structure is complex, and the adhesion reliability of the flexible substrate 1 and the hard carrier is poor; another solution is to use low temperature sintered exothermic inks to make conductive heating circuits, resulting in thick film heaters that are low powered, provide limited heat, are limited in use, and have poor power consistency and stability. And the utility model provides a hot pressing mode, on the basis of guaranteeing the inseparable bonding of electrically conductive heating circuit and flexible base member 1, both saved the rigid carrier among the prior art, avoided the high temperature sintering of flexible base member 1, the structure is simpler, and power design's flexibility is higher moreover, power control range is wideer.
The utility model discloses a thick film heater's concrete preparation process does: firstly, designing a routing track of a conductive heating line and the size of a flexible substrate 1 according to a use environment and a scene, etching a groove 2 on the flexible substrate 1 according to the designed track of the conductive heating line, and manufacturing a mask plate according to the track of the conductive heating line so as to prepare a baffle 3 with the same track by using the mask plate, as shown in fig. 2; then, the baffle 3 is placed on the flexible matrix 1 and aligned, and meanwhile, the heating material for preparing the conductive heating circuit is made into a solution by adopting alcohol or other solvents with lower boiling points, and the solution is sprayed or brushed into the groove 2 of the flexible matrix 1, or powder of the heating material is directly sprayed into the groove 2 of the flexible matrix 1; then drying, taking down the baffle 3 after drying, and forming the conductive heating circuit; and finally, tightly bonding the flexible encapsulating layer and the flexible substrate 1 loaded with the conductive heating circuit in a hot-pressing mode.
The utility model discloses a mode that the material that generates heat can adopt low boiling point solution to make liquid, or direct dry powder to carry out spraying or brush in the preparation process has cancelled the complicated technology that the material that generates heat need be prepared into the paste by solid powder and organic solvent through the rolling misce bene of three-roller among the prior art, and the utility model discloses well recess 2's setting has also restricted the flow of above-mentioned liquid form or powder form heating material better.
Furthermore, the utility model also provides a domestic appliance, including above-mentioned thick film heater, this domestic appliance can be water heater, electric blanket etc. and domestic appliance has realized the heating function through above-mentioned thick film heater.
To sum up, the utility model provides a thick film heater is through setting up recess 2 on flexible base member 1 to inlay conductive heating circuit in recess 2 with at least part, make in the preparation process, the heating material of preparation conductive heating circuit is located the preset position on flexible base member 1, with the conductive heating circuit of final formation predetermined pattern, has solved among the prior art heating material and has been difficult to according to the problem of predetermined pattern location on the base member, has guaranteed the quality of product.
It should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art will be able to make the description as a whole, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The above detailed description of a series of embodiments is only for the purpose of illustration, and is not intended to limit the scope of the invention, which is intended to include all equivalent embodiments or modifications that do not depart from the spirit of the invention.
Claims (11)
1. A thick film heater, comprising:
the surface of the flexible substrate is provided with a groove;
the conductive heating circuit is at least partially embedded in the groove;
the thick film heater further includes a flexible encapsulant layer encapsulating the conductive heating circuit on the flexible substrate.
2. The thick film heater of claim 1, wherein: the depth of the groove is greater than 10 μm and less than 20 μm.
3. The thick film heater of claim 1, wherein: the thickness of the conductive heating line is less than 100 μm.
4. The thick film heater of claim 1, wherein: the trace shape of the conductive heating line is the same as that of the groove.
5. The thick film heater of claim 4, wherein: the groove comprises at least two first strip-shaped groove sections and at least one second strip-shaped groove section, and the number of the second strip-shaped groove sections is one less than that of the first strip-shaped groove sections; the at least two first strip-shaped groove sections are arranged in parallel at intervals, and the at least one second strip-shaped groove section is sequentially connected with the head end and the tail end of the adjacent two first strip-shaped groove sections.
6. The thick film heater of claim 5, wherein: the flexible substrate is rectangular, and the first strip groove section is parallel to the edge of the flexible substrate.
7. The thick film heater of claim 1, wherein: and the conductive heating circuit is provided with a conductive terminal for connecting an external power supply.
8. The thick film heater of claim 7, wherein: the conductive terminals are metal conductive foil paper, and an adhesive layer is arranged on one side, facing the conductive heating circuit, of the metal conductive foil paper.
9. The thick film heater of claim 1, wherein: the flexible substrate is a polyimide film, a polyester film or an epoxy plate.
10. The thick film heater of claim 1, wherein: the flexible substrate and the flexible encapsulating layer are bonded through hot pressing, microwave heating or ultrasonic welding.
11. An electrical domestic appliance comprising a thick film heater as claimed in any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021372150.2U CN213403548U (en) | 2020-07-13 | 2020-07-13 | Thick film heater and household appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021372150.2U CN213403548U (en) | 2020-07-13 | 2020-07-13 | Thick film heater and household appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213403548U true CN213403548U (en) | 2021-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021372150.2U Active CN213403548U (en) | 2020-07-13 | 2020-07-13 | Thick film heater and household appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213403548U (en) |
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2020
- 2020-07-13 CN CN202021372150.2U patent/CN213403548U/en active Active
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