CN213400342U - Display panel and flexible circuit board - Google Patents
Display panel and flexible circuit board Download PDFInfo
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- CN213400342U CN213400342U CN202022829512.2U CN202022829512U CN213400342U CN 213400342 U CN213400342 U CN 213400342U CN 202022829512 U CN202022829512 U CN 202022829512U CN 213400342 U CN213400342 U CN 213400342U
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Abstract
The embodiment of the utility model provides a display panel and flexible circuit board, display panel's bonding district has laid first signal line pin, the both sides of first signal line pin laid respectively first test pin and with the first ground connection pin of first test pin short circuit. By the design, a pair of first test pins do not need to be arranged on two sides of the first signal line pin respectively, and the space occupied by the first test pins in the bonding area of the display panel can be reduced. Therefore, even if the size of the flexible circuit board is smaller and smaller, the second signal line pin, the second test pin and the second grounding pin can be arranged in the limited space of the bonding area of the flexible circuit board to be respectively matched with the first signal line pin, the first test pin and the first grounding pin, bonding connection between the display panel and the flexible circuit board is achieved, and bonding process detection between the display panel and the flexible circuit board is achieved.
Description
Technical Field
The utility model belongs to the technical field of show, concretely relates to display panel and flexible circuit board.
Background
Along with display panel's narrow frame demand is higher and higher, and the flexible circuit board size that is used for with display panel bonding is littleer and smaller, is difficult to lay sufficient impedance test pin on flexible circuit board and comes to pair with display panel's impedance test pin, is unfavorable for the bonding technology between display panel and the flexible circuit board to detect.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a display panel and flexible circuit board lays the first test pin and the first ground connection pin of short circuit respectively through the both sides at display panel's first signal line pin, can effectively improve and be difficult to lay sufficient impedance test pin on the flexible circuit board and come to carry out the problem of pairing with display panel's impedance test pin, and the bonding technology between display panel and the flexible circuit board of being convenient for detects.
The embodiment of the utility model provides a first aspect, provides a display panel (100), first signal line pin (11) has been laid in the nation or position area of display panel (100), first test pin (12) and with first ground pin (13) of first test pin (12) short circuit have been laid respectively to the both sides of first signal line pin (11); the first signal line pin (11), the first test pin (12) and the first ground pin (13) are respectively used for being correspondingly bonded and connected with a second signal line pin (21), a second test pin (22) and a second ground pin (23) which are arranged in a bonding area of the flexible circuit board (200).
In an alternative embodiment of the first aspect, first bonding alignment pins (14) are further respectively distributed on two sides of the first signal line pin (11); the first test pin (12) and the first ground pin (13) are located between the first bonding alignment pin (14) and the first signal line pin (11).
In an alternative embodiment of the first aspect, the first test pin (12) is located between the first ground pin (13) and the first bonding alignment pin (14).
In an alternative embodiment of the first aspect, the first test pin (12) is located between the first ground pin (13) and the first signal line pin (11).
In an alternative embodiment of the first aspect, one of the first test pins (12) is located between the first ground pin (13) and the first bonding alignment pin (14), and the other of the first test pins (12) is located between the first ground pin (13) and the first signal line pin (11).
In an alternative embodiment of the first aspect, the first test pin (12) is located on a side of the first ground pin (13) away from the first signal line pin (11), the first test pin (12) also serving as a bonding alignment pin for bonding alignment with the flexible circuit board (200).
In an alternative embodiment of the first aspect, the first test pin (12) comprises a first portion (121) extending in a first direction and a second portion (122) extending in a second direction intersecting the first direction.
A second aspect of the embodiments of the present invention provides a display panel (100), wherein a first signal line pin (11) is disposed in a bonding area of the display panel (100), and a first bonding alignment pin (14) and a first test pin (12) short-circuited with the first bonding alignment pin (14) are disposed on two sides of the first signal line pin (11) respectively; the first signal line pin (11), the first test pin (12) and the first bonding alignment pin (14) are respectively used for corresponding bonding connection with a second signal line pin (21), a second test pin (22) and a second bonding alignment pin (24) of a bonding area of the flexible circuit board (200).
In an alternative embodiment of the second aspect, the first test pin (12) is located between the first signal line pin (11) and the first bonding alignment pin (14).
In an alternative embodiment of the second aspect, a first ground pin (13) is further disposed on each of two sides of the first signal line pin (11); the first ground pin (13) is located between the first signal line pin (11) and the first test pin (12).
In a third aspect of the embodiments of the present invention, a flexible circuit board (200) is provided, where the flexible circuit board (200) is used for bonding connection with the display panel (100) of the first aspect or the second aspect; bonding area of flexible circuit board (200) be provided with the first aspect display panel (100) first signal line pin (11), first test pin (12) and first ground connection pin (13) correspond bonding connection's second signal line pin (21), second test pin (22) and second ground connection pin (23) respectively, or be provided with the second aspect display panel (100) first signal line pin (11), first test pin (12) and first bonding counterpoint pin (14) correspond bonding connection's second signal line pin (21), second test pin (22) and second bonding counterpoint pin (24) respectively.
To sum up, compare in prior art, the embodiment of the utility model provides a display panel and flexible circuit board, first signal line pin has been laid in display panel's nation fixed area, first test pin has been laid respectively to the both sides of first signal line pin and with the first ground connection pin of first test pin short circuit. By the design, a pair of first test pins do not need to be arranged on two sides of the first signal line pin respectively, and the space occupied by the first test pins in the bonding area of the display panel can be reduced. Therefore, even if the size of the flexible circuit board is smaller and smaller, the second signal line pin, the second test pin and the second grounding pin can be arranged in the limited space of the bonding area of the flexible circuit board to be respectively matched with the first signal line pin, the first test pin and the first grounding pin, bonding connection between the display panel and the flexible circuit board is achieved, and therefore bonding process detection between the display panel and the flexible circuit board is facilitated.
Drawings
Fig. 1 is a schematic diagram of pin layout of a conventional display panel.
Fig. 2 is a schematic diagram of a first pin layout of a display panel according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a second pin layout of a display panel according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a third pin layout of a display panel according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a fourth pin layout of a display panel according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a fifth pin layout of a display panel according to an embodiment of the present invention.
Fig. 7 is a schematic flow chart of a bonding process detection method according to an embodiment of the present invention.
Icon:
100-a display panel;
11-a first signal line pin; 12-a first test pin; 13-a first ground pin; 14-a first bonding alignment pin;
200-a flexible circuit board;
21-a second signal line pin; 22-a second test pin; 23-a second ground pin; 24-second bond alignment pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner" and "outer" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Further, when an element is referred to as being "formed on" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.
Fig. 1 illustrates a schematic partial structure of a common display panel 100, where two "U" -shaped test portions exist in a bonding area of the display panel 100, and each test portion is formed by shorting two pairs of first test pins 12, the first test pins 12 occupy a larger space in the bonding area of the display panel 100, and due to space limitation, it is difficult to arrange enough pins matching with the pins in the bonding area of the display panel 100 in the bonding area of the flexible circuit board, for example, it is difficult to arrange second test pins paired with the first test pins 12 in the bonding area of the flexible circuit board, which is not convenient for implementing detection of the bonding process of the display panel 100 and the flexible circuit board.
Consequently, in order to ensure that the bonding process of realizing flexible circuit board and display panel under the prerequisite of laying less test pin at flexible circuit board's bonding district detects, the embodiment of the utility model provides a display panel and flexible circuit board. The embodiment of the present invention provides a display panel, which has the following general inventive concept: the number of test pins is cut down. Based on this inventive concept, two embodiments are exemplarily proposed.
In a first embodiment, a test pin is shorted to a ground pin for bond process detection.
In a second embodiment, a test pin is shorted to a bonding alignment pin for bonding process detection.
It can be understood that, with the above two embodiments, the space occupied by the test pins in the bonding area of the display panel can be reduced. Therefore, even if the size of the flexible circuit board is smaller and smaller, the pins matched with various pins of the display panel can be arranged in the limited space of the bonding area of the flexible circuit board, bonding connection between the display panel and the flexible circuit board is achieved, and bonding process detection between the display panel and the flexible circuit board is achieved. Alternative embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
For the first embodiment, as shown in fig. 2, the first signal line pin 11 may be disposed in the bonding region of the display panel 100, and then the first test pin 12 and the first ground pin 13 shorted with the first test pin 12 may be disposed on two sides of the first signal line pin 11. The first signal line pin 11, the first test pin 12, and the first ground pin 13 are respectively used for being correspondingly bonded to a second signal line pin 21, a second test pin 22, and a second ground pin 23 disposed in a bonding area of the flexible circuit board 200.
With such a design, compared to fig. 1, one first test pin 12 can be removed from each of two sides of the first signal line pin 11, so as to reduce the space occupied by the first pin in the bonding area of the display panel 100, and thus, the corresponding second pin can be arranged in the bonding area of the flexible circuit board 200, and further used for performing bonding process detection after the display panel 100 and the flexible circuit board 200 are bonded.
It is understood that the first test pin 12 may also be used as a bonding alignment pin, or a bonding alignment pin may be additionally disposed. Referring to fig. 2, if bonding alignment pins are additionally disposed, first bonding alignment pins 14 may be disposed on two sides of the first signal line pin 11. The first test pin 12 and the first ground pin 13 are located between the first bonding alignment pin 14 and the first signal line pin 11. Further, first test pin 12 may be located between first ground pin 13 and first bonding alignment pin 14.
In some examples, as shown in fig. 3, the first test pin 12 may also be located between the first ground pin 13 and the first signal line pin 11. In other examples, as shown in fig. 4, one of the first test pins 12 (right side) may be located between the first ground pin 13 and the first bonding alignment pin 14, and the other first test pin 12 (left side) may be located between the first ground pin 13 and the first signal line pin 11. Thus, the relative positions of the first test leads 12 and the other leads can be flexibly selected according to the actual process requirements.
It is to be understood that fig. 2, 3 and 4 show various arrangements among the first signal line pin 11, the first test pin 12, the first ground pin 13 and the first bonding alignment pin 14, which can be flexibly selected in practical applications. Accordingly, the layout manner of the second pins in the bonding region of the flexible circuit board 200 may be correspondingly matched with the layout manner of the first pins in the bonding region of the display panel 100, which is not described herein again.
In an alternative embodiment, if the first test pin 12 is used as a bonding alignment pin or the first test pin 12 is replaced by a bonding alignment pin, please refer to fig. 5, the first test pin 12 may be disposed on a side of the first ground pin 13 away from the first signal line pin 11. By such a design, the space occupied by the first pins in the bonding area of the display panel 100 can be further reduced, and meanwhile, the bonding alignment between the display panel 100 and the flexible circuit board 200 can be realized through the first test pins 12.
For example, in order to implement the function of the first test pin 12 for bonding alignment with the flexible circuit board 200, the first test pin 12 may further include a first portion 121 extending in a first direction D1 and a second portion 122 extending in a second direction D2 intersecting the first direction. As such, the shape formed by the intersection of first portion 121 and second portion 122 may be used to achieve a bonding alignment with flexible circuit board 200. Accordingly, the layout manner of the second pins in the bonding region of the flexible circuit board 200 may be matched with the layout manner of the first pins in the bonding region of the display panel 100, which is not described herein again.
For the second embodiment, as shown in fig. 6, a first signal line pin 11 may be disposed in a bonding region of the display panel 100, and a first bonding alignment pin 14 and a first test pin 12 short-circuited with the first bonding alignment pin 14 may be disposed on two sides of the first signal line pin 11, respectively. The first signal line pin 11, the first test pin 12, and the first bonding alignment pin 14 are respectively used for being correspondingly bonded and connected to the second signal line pin 21, the second test pin 22, and the second bonding alignment pin 24 of the bonding area of the flexible circuit board 200.
Referring to fig. 6, the first test pin 12 may be located between the first signal line pin 11 and the first bonding alignment pin 14, the first ground pin 13 is further disposed on each of two sides of the first signal line pin 11, and the first ground pin 13 is located between the first signal line pin 11 and the first test pin 12. It can be understood that, with the second embodiment, the number of the first test pins 12 can also be reduced, so as to reduce the space occupied by the first pins in the bonding region of the display panel 100, and thus, the corresponding second pins can be arranged in the bonding region of the flexible circuit board 200, and then the bonding process detection is performed after the display panel 100 and the flexible circuit board 200 are bonded.
On the basis of the above, the embodiment of the present invention further provides a flexible circuit board 200, where the flexible circuit board 200 can be used for bonding connection with the display panel 100 corresponding to the first embodiment or the second embodiment.
For example, referring to fig. 2, the bonding area of the flexible circuit board 200 is provided with a second signal line pin 21, a second test pin 22 and a second ground pin 23 which are correspondingly connected to the first signal line pin 11, the first test pin 12 and the first ground pin 13 of the display panel 100, respectively. For another example, referring to fig. 6, the bonding area of the flexible circuit board 200 is provided with a second signal line pin 21, a second test pin 22 and a second bonding alignment pin 24, which are correspondingly connected to the first signal line pin 11, the first test pin 12 and the first bonding alignment pin 14 of the display panel 100.
In the above embodiments, the first signal line pin 11, the first test pin 12, the first ground pin 13, the first bonding alignment pin 14, the second signal line pin 21, the second test pin 22, the second ground pin 23, and the second bonding alignment pin 24 may be made of the same material. Further, an Anisotropic Conductive Film (ACF) may be used to bond the display panel 100 and the flexible circuit board 200 in a press-fit manner, so as to achieve electrical conduction of the corresponding pins.
For example, after the display panel 100 and the flexible circuit board 200 are bonded by pressing, the first signal line pin 11 is conducted with the second signal line pin 21, the first test pin 12 is conducted with the second test pin 22, the first ground pin 13 is conducted with the second ground pin 23, and the first bonding alignment pin 14 is conducted with the second bonding alignment pin 24. As such, the bonding process of the display panel 100 and the flexible circuit board 200 may be detected through an impedance test.
When the pin layout of the display panel 100 is performed in the first embodiment, the impedance test can be performed through the second test pin 22 and the second ground pin 23. If the pin layout of the display panel 100 is performed according to the second embodiment, the impedance test can be performed by the second test pin 22 and the second bonding alignment pin 24.
Optionally, the embodiment of the utility model provides a bonding technology detection method is still provided for display panel 100 and flexible circuit board 200 to the above-mentioned bonding connection of accomplishing carry out bonding technology and detect, whether up to standard with the bonding technology of judging display panel 100 and flexible circuit board 200. Referring to fig. 2 and 7, the bonding process detecting method may include the following steps S71-S74.
In step S71, the test impedance between the second test pin 22 and the second ground pin 23 is obtained.
As shown in fig. 7, after the display panel 100 and the flexible circuit board 200 are bonded by the ACF pressure bonding, a test impedance between the second test pin 22 and the second ground pin 23 may be collected using a multimeter.
Step S72, determining whether the test impedance exceeds a preset impedance, if yes, turning to step S73, otherwise, turning to step S74.
In this embodiment, the preset impedance may be selected according to an actual product model or a process requirement, and is not limited herein.
In step S73, it is determined that the bonding process between the display panel 100 and the flexible circuit board 200 does not meet the standard.
Step S74, it is determined that the bonding process between the display panel 100 and the flexible circuit board 200 is up to standard.
In this way, by reducing the number of the first test pins 12 of the display panel 100, the space occupied by the first test pins 12 can be reduced, so that the corresponding second test pins 22 are arranged on the flexible circuit board 200 to ensure that the subsequent impedance test can be smoothly performed, thereby effectively detecting whether the bonding process between the display panel 100 and the flexible circuit board 200 reaches the standard.
To sum up, the embodiment of the present invention provides a display panel 100 and a flexible circuit board 200, which do not need to set a pair of first testing pins 12 on the two sides of the first signal line pin 11, and can reduce the space occupied by the first testing pins 12 in the bonding area of the display panel 100. Thus, even though the size of the flexible circuit board 200 is smaller, the second signal line pin 21, the second test pin 22 and the second ground pin 23 may be arranged in a limited space of the bonding area of the flexible circuit board 200 to be respectively paired with the first signal line pin 11, the first test pin 12 and the first ground pin 13, so as to achieve bonding connection between the display panel 100 and the flexible circuit board 200, and further achieve bonding process detection between the display panel 100 and the flexible circuit board 200.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A display panel (100) is characterized in that a bonding area of the display panel (100) is provided with a first signal line pin (11), and two sides of the first signal line pin (11) are respectively provided with a first test pin (12) and a first grounding pin (13) which is in short circuit with the first test pin (12);
the first signal line pin (11), the first test pin (12) and the first ground pin (13) are respectively used for being correspondingly bonded and connected with a second signal line pin (21), a second test pin (22) and a second ground pin (23) which are arranged in a bonding area of the flexible circuit board (200).
2. The display panel (100) of claim 1, wherein the first signal line pin (11) is further respectively provided with a first bonding alignment pin (14) on two sides;
the first test pin (12) and the first ground pin (13) are located between the first bonding alignment pin (14) and the first signal line pin (11).
3. The display panel (100) of claim 2,
the first test pin (12) is located between the first ground pin (13) and the first bonding alignment pin (14);
or
The first test pin (12) is located between the first ground pin (13) and the first signal line pin (11).
4. The display panel (100) of claim 2, wherein one of the first test pins (12) is located between the first ground pin (13) and the first bonding pair pin (14), and the other of the first test pins (12) is located between the first ground pin (13) and the first signal line pin (11).
5. The display panel (100) of claim 1, wherein the first test pin (12) is located on a side of the first ground pin (13) away from the first signal line pin (11), the first test pin (12) also serving as a bonding alignment pin for bonding alignment with the flexible circuit board (200).
6. The display panel (100) according to claim 5, wherein the first test pin (12) comprises a first portion (121) extending in a first direction and a second portion (122) extending in a second direction intersecting the first direction.
7. A display panel (100) is characterized in that a first signal line pin (11) is distributed in a bonding area of the display panel (100), and a first bonding alignment pin (14) and a first test pin (12) which is in short connection with the first bonding alignment pin (14) are distributed on two sides of the first signal line pin (11) respectively;
the first signal line pin (11), the first test pin (12) and the first bonding alignment pin (14) are respectively used for corresponding bonding connection with a second signal line pin (21), a second test pin (22) and a second bonding alignment pin (24) of a bonding area of the flexible circuit board (200).
8. The display panel (100) of claim 7, wherein the first test pin (12) is located between the first signal line pin (11) and the first bonding alignment pin (14).
9. The display panel (100) according to claim 8, wherein a first ground pin (13) is further disposed on each of two sides of the first signal line pin (11); the first ground pin (13) is located between the first signal line pin (11) and the first test pin (12).
10. A flexible circuit board (200), characterized in that the flexible circuit board (200) is used for bonding connection with a display panel (100) according to claim 1 or 7;
the bonding area of the flexible circuit board (200) is provided with a second signal line pin (21), a second test pin (22) and a second ground pin (23) which are respectively connected with the display panel (100) of claim 1 and correspond to the first signal line pin (11), the first test pin (12) and the first ground pin (13), or is provided with a second signal line pin (21), a second test pin (22) and a second bonding alignment pin (24) which are respectively connected with the first signal line pin (11), the first test pin (12) and the first bonding alignment pin (14) of the display panel (100) of claim 7 and correspond to the bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022829512.2U CN213400342U (en) | 2020-11-30 | 2020-11-30 | Display panel and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022829512.2U CN213400342U (en) | 2020-11-30 | 2020-11-30 | Display panel and flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213400342U true CN213400342U (en) | 2021-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022829512.2U Active CN213400342U (en) | 2020-11-30 | 2020-11-30 | Display panel and flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213400342U (en) |
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- 2020-11-30 CN CN202022829512.2U patent/CN213400342U/en active Active
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