CN213382620U - Injection mechanism in semiconductor packaging equipment - Google Patents
Injection mechanism in semiconductor packaging equipment Download PDFInfo
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- CN213382620U CN213382620U CN202022175725.8U CN202022175725U CN213382620U CN 213382620 U CN213382620 U CN 213382620U CN 202022175725 U CN202022175725 U CN 202022175725U CN 213382620 U CN213382620 U CN 213382620U
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Abstract
The utility model discloses an injection mechanism in semiconductor package equipment, which comprises a bracket, be equipped with a plurality of hydro-cylinders that injection push pedal and drive injection push pedal go up and down on the support, a plurality of injection device in the injection push pedal, still include the main control board of being connected with the hydro-cylinder electricity, it is equipped with a plurality of pivots to rotate on the support, the outside of each side of injection push pedal all corresponds and is equipped with the pivot, be equipped with a plurality of gears in the pivot, be equipped with a plurality of racks with gear engagement on each side of injection push pedal respectively, the length direction of rack is unanimous with the direction of drive of hydro-cylinder, be equipped with the response piece in the injection push pedal, still be equipped with the induction system who detects response piece position on the. The utility model provides an injection mechanism among the semiconductor package equipment can guarantee to mould plastics the push pedal and reciprocating in-process hydro-cylinder keep in step, makes the injection device that sets up in the push pedal of moulding plastics evenly pour into the plastic envelope material into in to the mould, improves the encapsulation quality of semiconductor product, prevents simultaneously that the hydro-cylinder from damaging.
Description
Technical Field
The utility model relates to a semiconductor package equipment technical field especially relates to an injection mechanism among semiconductor package equipment.
Background
In the field of semiconductor packaging, an injection mechanism is used for injecting a plastic packaging material in a charging barrel into a plastic packaging mold under pressure by using an injection head, and the plastic packaging material enters a cavity through a runner gate of the plastic packaging mold to complete the packaging of a semiconductor chip.
In the prior art, a MGP mould with multiple charging barrels and multiple injection heads is generally adopted, a plurality of injection devices are uniformly distributed on an injection push plate of the mould, two oil cylinders are arranged below the injection push plate, and the oil cylinders drive the injection push plate to move up and down to realize injection. When the two oil cylinders simultaneously control the injection push plate to move up and down, the up-and-down movement speeds of the oil cylinders on the two sides are difficult to adjust to be synchronous, so that the injection push plate cannot be kept horizontal when moving, the injection of the plastic package material is not uniform, and the oil cylinders can be damaged even when the injection push plate is inclined greatly.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: an injection mechanism suitable for a semiconductor packaging apparatus with uniform injection is provided.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides an injection mechanism in semiconductor package equipment, includes the support, be equipped with injection push pedal and drive on the support a plurality of hydro-cylinders that the injection push pedal goes up and down, be equipped with a plurality of injection device in the injection push pedal, still include with the main control board that the hydro-cylinder electricity is connected, it is equipped with a plurality of pivots to rotate on the support, the outside of each side of injection push pedal all corresponds and is equipped with the pivot, be equipped with a plurality of gears in the pivot, be equipped with respectively on each side of injection push pedal a plurality of with gear engagement's rack, the length direction of rack with the direction of drive of hydro-cylinder is unanimous, be equipped with the response piece in the injection push pedal, still be equipped with the detection on the support the induction system of response piece position, induction system with the.
Further, the support comprises a lower base plate, the oil cylinder is fixedly arranged on the lower base plate, a plurality of supporting blocks surrounding the edge of the lower base plate are arranged on the lower base plate at intervals, templates are arranged on the supporting blocks, first long round holes for the injection device to penetrate through are formed in the templates, and through holes for the rotating shaft to penetrate through are further formed in the supporting blocks.
Furthermore, a heat insulation plate is arranged between the supporting block and the template.
Furthermore, one surface of the injection push plate, which is close to the lower backing plate, is provided with a plurality of guide pillars, and the lower backing plate is provided with guide sleeves matched with the guide pillars.
Further, the injection device comprises an injection rod, the injection rod penetrates through the first long round hole, and an injection head is arranged at one end, far away from the injection push plate, of the injection rod.
Furthermore, the injection device also comprises an injection seat arranged on the injection push plate, wherein a connecting rod which can move in the vertical direction is arranged on the injection seat, and the connecting rod is connected with the injection rod.
Furthermore, a spring is arranged between the connecting rod and the injection seat.
Furthermore, the injection seat is also provided with a cover plate matched with the connecting rod, and the cover plate is provided with a hole position for the connecting rod to partially extend out.
Furthermore, the sensing device comprises a mounting piece fixedly arranged on the supporting block, a plurality of vertical second long round holes are arranged on the mounting piece in parallel, sensors are respectively arranged in the second long round holes, and the sensors are arranged in the second long round holes in a sliding manner.
The beneficial effects of the utility model reside in that: the utility model provides an injection mechanism among the semiconductor package equipment utilizes the rack everywhere of setting in the injection push pedal to cooperate with the gear that rotates the setting on the support, the gear sets up in the horizontally pivot, it keeps synchronous reciprocating the in-process hydro-cylinder to guarantee to mould plastics the push pedal, make the injection apparatus that sets up in the push pedal of moulding plastics evenly pour into the plastic envelope material into to the mould in, improve the encapsulation quality of semiconductor product, protect the hydro-cylinder simultaneously, prevent the hydro-cylinder damage, the push pedal of moulding plastics monitors its position by induction system at the in-process that goes up and down with the stroke of control push pedal of moulding plastics, and then the injection height when the adjustment uses different moulds, improve the commonality of injection mechanism.
Drawings
Fig. 1 is a front view of an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 2 is a side view of an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 3 is a top view of an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 4 is a front view of a holder in an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 5 is a top view of a support in an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 6 is a front view of a part of the structure of an injection mechanism in a semiconductor package device according to a first embodiment of the present invention;
fig. 7 is a top view of a portion of an injection mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 8 is a schematic structural view of an injection device in an injection mechanism of a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 9 is a schematic structural diagram of a sensing device and a sensing block in an injection mechanism of a semiconductor package device according to a first embodiment of the present invention.
Description of reference numerals:
1. a support; 11. a rotating shaft; 12. a gear; 13. a lower base plate; 14. a support block; 15. a template; 16. a first oblong hole; 17. a through hole; 18. a heat insulation plate; 19. a guide sleeve; 2. injecting a push plate; 21. a rack; 22. an induction block; 23. a guide post; 3. an oil cylinder; 4. an injection device; 41. an injection rod; 42. an injection head; 43. an injection seat; 44. a connecting rod; 45. a spring; 46. a cover plate; 47. hole site; 5. an induction device; 51. mounting a sheet; 52. a sensor; 53. a second oblong hole.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 9, an injection mechanism in a semiconductor packaging apparatus includes a frame 1, the bracket 1 is provided with an injection push plate 2 and a plurality of oil cylinders 3 for driving the injection push plate 2 to lift, the injection push plate 2 is provided with a plurality of injection devices 4 and also comprises a main control plate electrically connected with the oil cylinder 3, a plurality of rotating shafts 11 are rotatably arranged on the bracket 1, the rotating shafts 11 are correspondingly arranged on the outer sides of all the side edges of the injection push plate 2, a plurality of gears 12 are arranged on the rotating shaft 11, a plurality of racks 21 meshed with the gears 12 are respectively arranged on each side edge of the injection push plate 2, the length direction of the rack 21 is consistent with the driving direction of the oil cylinder 3, the injection push plate 2 is provided with an induction block 22, the bracket 1 is also provided with an induction device 5 for detecting the position of the induction block 22, and the induction device 5 is electrically connected with the main control board.
The working principle of the utility model is as follows: the fixed bracket 1 is provided with a plurality of rotating shafts 11 which are rotationally connected with the bracket 1, all the rotating shafts 11 are kept horizontal on the bracket 1, the rotating shafts 11 respectively correspond to the side surfaces of the injection push plate 2, the rotating shafts 11 are provided with a plurality of gears 12, the injection push plate 2 is provided with racks 21 which are meshed with the gears 12, the length direction of the racks 21 is consistent with the lifting direction of the injection push plate 2, when the oil cylinder 3 drives the injection push plate 2 to lift, the racks 21 arranged on the side surfaces of the injection push plate 2 and the gears 12 move relatively, the gears 12 arranged at the two ends of the rotating shafts 11 are kept on the same horizontal position under the action of the rotating shafts 11, the racks 21 which are meshed with the gears 12 are kept on the same horizontal position, and the racks 21 arranged on the same side surface of the injection push plate 2 are kept at the same horizontal height so that the injection push plate 2 is kept horizontal in the lifting process, and the induction blocks 22 arranged on the injection push plate 2 lift, when the injection push plate 2 moves to the set position, the sensing device 5 sends a signal to the main control board to enable the main control board to control the oil cylinder 3 to stop running so as to control the injection height of the injection mechanism.
From the above description, the beneficial effects of the present invention are: the utility model provides an injection mechanism among the semiconductor package equipment can guarantee to mould plastics the push pedal and reciprocate the in-process and keep the level, makes the injection device 4 that sets up in the push pedal of moulding plastics evenly pour into the plastic envelope material into to the mould in, improves the encapsulation quality of semiconductor product, protects hydro-cylinder 3 simultaneously, prevents that hydro-cylinder 3 from damaging, and injection mechanism can with multiple mould looks adaptation, the commonality is strong.
Further, the support 1 includes a lower backing plate 13, the oil cylinder 3 is fixedly disposed on the lower backing plate 13, a plurality of supporting blocks 14 surrounding the edge of the lower backing plate 13 are disposed on the lower backing plate 13 at intervals, a template 15 is disposed on the supporting blocks 14, a first long circular hole 16 for the injection device 4 to pass through is disposed on the template 15, and a through hole 17 for the rotating shaft 11 to pass through is further disposed on the supporting block 14.
As can be seen from the above description, the bracket 1 includes the lower pad 13 for the oil cylinder 3 to be installed, the edge of the lower pad 13 is provided with a plurality of supporting blocks 14 surrounding the injection push plate 2 at intervals, the supporting blocks 14 are provided with through holes 17 for the rotating shaft 11 to be installed, so that the rotating shaft 11 can be arranged surrounding the injection push plate 2, the supporting blocks 14 are further provided with the mold plate 15, and the mold plate 15 is provided with the first long circular hole 16 for the injection device 4 to pass through, so that the injection device 4 extends into the mold to complete the injection of the molding compound.
Further, a heat insulation plate 18 is arranged between the supporting block 14 and the template 15.
As can be seen from the above description, the heat insulation plate 18 is arranged to block the transmission between the supporting block 14 and the mold plate 15, so as to prevent the high-temperature molding compound from being injected into the mold and then the heat is transmitted to other parts of the injection mechanism to melt or deform the molding compound, which may damage the injection mechanism.
Furthermore, one surface of the injection push plate 2, which is close to the lower backing plate 13, is provided with a plurality of guide posts 23, and the lower backing plate 13 is provided with guide sleeves 19 which are matched with the guide posts 23.
As can be seen from the above description, the arrangement of the guide post 23 and the guide sleeve 19 which are matched with each other ensures that the movement track of the injection push plate 2 is a straight line when the injection push plate is lifted, so as to prevent the injection push plate 2 from shaking to affect the service life of the oil cylinder 3.
Further, the injection device 4 comprises an injection rod 41, the injection rod 41 passes through the first oblong hole 16, and an injection head 42 is arranged at one end of the injection rod 41 far away from the injection push plate 2.
Further, the injection device 4 further comprises an injection seat 43 disposed on the injection push plate 2, a connecting rod 44 movable in the vertical direction is disposed on the injection seat 43, and the connecting rod 44 is connected to the injection rod 41.
As can be seen from the above description, the injection device 4 has a modular structure, and the adaptive injection seat 43 can be replaced when injecting different types of molds, so as to further improve the versatility of the injection mechanism.
Further, a spring 45 is arranged between the connecting rod 44 and the injection seat 43.
As can be seen from the above description, the spring 45 provided between the connecting rod 44 and the injection seat 43 maintains the injection device 4 at a stable injection pressure when injecting the molding compound.
Further, the injection seat 43 is further provided with a cover plate 46 matched with the connecting rod 44, and the cover plate 46 is provided with a hole 47 for the connecting rod 44 to partially extend.
As will be understood from the above description, the connecting rod 44 of the injection device 4 is pressed against the injection seat 43 by the cover plate 46, so that the components such as the injection head 42 are kept stable during the pushing process by the injection push plate 2.
Further, the sensing device 5 includes a mounting piece 51 fixedly disposed on the supporting block 14, a plurality of vertical second oblong holes 53 are disposed in parallel on the mounting piece 51, sensors 52 are respectively disposed in the second oblong holes 53, and the sensors 52 are slidably disposed in the second oblong holes 53.
As can be seen from the above description, the position of the sensor 52 is adjusted by sliding the sensor 52 in the second oblong hole 53, so that the position of the sensor 52 triggered by the sensing block 22 is changed, and further, the stroke of the injection push plate 2 is adjusted, so that the injection height of the injection mechanism is adapted to the current mold.
Example one
Referring to fig. 1 to 9, a first embodiment of the present invention is: an injection mechanism in semiconductor packaging equipment is used for injecting plastic packaging materials into a plastic packaging mold, and enabling the plastic packaging materials to enter a cavity through a runner sprue of the plastic packaging mold to complete packaging of a semiconductor chip.
As shown in fig. 1 to 3, injection mechanism in the semiconductor packaging equipment includes that support 1 and liftable set up injection push pedal 2 on the support 1, the interval is equipped with a plurality of injection device 4 on the injection push pedal 2, be equipped with the drive on the support 1 a plurality of hydro-cylinders 3 of injection push pedal 2, it is equipped with a plurality of pivots 11 still to rotate on the support 1, the setting of pivot 11 level is in on the support 1, the outside of each side of injection push pedal 2 all corresponds and is equipped with pivot 11, be equipped with a plurality of gears 12 on the pivot 11, be equipped with respectively on each side of injection push pedal 2 with the rack 21 of gear 12 meshing, the length direction of rack 21 with the direction of drive of hydro-cylinder 3 is promptly the direction of rise of injection push pedal 2 is unanimous.
Specifically, when the oil cylinder 3 drives the injection push plate 2 to lift, the gear 12 and the rack 21 move relatively and are located at the same position on the rotating shaft 11, the gear 12 rotates synchronously, so that the gear 12 located on the same position on the rotating shaft 11 is always located at the same horizontal height, and further the rack 21 is also located at the same height, so that the injection push plate 2 keeps horizontal in the lifting process, the oil cylinder 3 is prevented from driving the injection push plate 2 to lift, the injection push plate 2 is prevented from inclining, and the injection mechanism in the semiconductor packaging equipment is favorable for uniformly injecting molding compound into a mold.
Optionally, the injection molding machine further comprises a main control board for controlling the oil cylinder 3, the side surface of the support 1 is further provided with an induction device 5, the induction device 5 is electrically connected with the main control board, the injection push plate 2 is provided with an induction block 22 matched with the induction device 5, when the oil cylinder 3 drives the injection push plate 2 to lift, the induction block 22 moves along with the injection push plate 2, when the induction block 22 moves to a corresponding position and triggers the induction device 5, the induction device 5 sends a signal to the main control board, the main control board stops the operation of the oil cylinder 3 after receiving the signal of the induction device 5, further controls the movement stroke of the injection push plate 2 on the support 1, so as to control the position of the injection device 4 extending into the mold and adjust the injection height of the injection mechanism in the semiconductor packaging equipment, so that the injection mechanism in the semiconductor packaging equipment can be used for molds with different glue consumption amounts, the versatility of the injection mechanism in the semiconductor packaging apparatus is improved.
As shown in fig. 4 and 5, the bracket 1 includes a lower cushion plate 13, a plurality of supporting blocks 14 are arranged on the lower cushion plate 13 at intervals, the supporting blocks 14 are arranged around the edge of the lower cushion plate 13, through holes 17 for the rotating shaft 11 to pass through are arranged on the supporting blocks 14, a template 15 is further arranged on the supporting blocks 14, and a plurality of first oblong holes 16 for the injection device 4 to pass through are arranged on the template 15.
Preferably, a heat insulation plate 18 is further disposed between the mold plate 15 and the supporting block 14, the heat insulation plate 18 blocks heat transfer between the mold plate 15 and the supporting block 14, so that heat of a mold located above the mold plate 15 is prevented from being transferred from the mold to each component of an injection mechanism in the semiconductor packaging device after molten plastic package adhesive is injected into the mold, each component of the injection mechanism in the semiconductor packaging device is prevented from being melted or deformed by heating, and the injection mechanism in the semiconductor packaging device is prevented from being damaged.
Referring to fig. 6 and 7, in this embodiment, the lower backing plate 13 is rectangular, two support blocks 14 are respectively disposed at intervals on each side edge of the lower backing plate 13, eight support blocks 14 are disposed around the edge of the lower backing plate 13, two oil cylinders 3 are respectively disposed at two ends of the lower backing plate 13, the oil cylinders 3 are disposed in the region surrounded by the support blocks 14, the injection pushing plate 2 is lifted in the region surrounded by the support blocks 14, the support blocks 14 are respectively provided with the through holes 17, the through holes 17 on the two support blocks 14 on the same side edge are aligned, the same rotating shaft 11 penetrates through the two support blocks 14 on the same side edge, the rotating shaft 11 is disposed around the injection pushing plate 2, the gears 12 are disposed at two ends of the rotating shaft 11, the racks 21 matched with the gears 12 are disposed at two ends of each side surface of the injection pushing plate 2, the injection push plate 2 is provided with eight racks 21 on the side, and the racks 21 and the gears 12 are arranged in a one-to-one correspondence manner, so that the injection push plate 2 is integrally kept on the same horizontal plane in the lifting process.
Furthermore, one surface of the injection push plate 2, which is close to the lower backing plate 13, is provided with a plurality of vertical guide posts 23, the lower backing plate 13 is provided with guide sleeves 19 which are matched with the guide posts 23, and when the injection push plate 2 is lifted in a direction perpendicular to the lower backing plate 13, the guide posts 23 and the guide sleeves 19 slide relatively, so that the movement direction of the injection push plate 2 is kept on a straight line perpendicular to the lower backing plate 13, and the injection push plate 2 is prevented from shaking in the horizontal direction in the lifting process to cause negative influence on the service life of the oil cylinder 3.
Referring to fig. 8, the injection device 4 includes an injection seat 43 disposed on the injection push plate 2, a plurality of connecting rods 44 movable in a vertical direction are disposed on the injection seat 43, an injection rod 41 connected to the connecting rods 44 is disposed on the connecting rods 44, the injection rod 41 passes through the first long circular hole 16, and an injection head 42 for injecting molding compound is disposed at one end of the injection rod 41 away from the injection seat 43. Preferably, a spring 45 is arranged between the injection seat 43 and the connecting rod 44, so that the injection device 4 keeps stable injection pressure when injecting the molding compound, and the injection mechanism in the semiconductor packaging equipment is favorable for keeping the molding compound to be uniformly injected when injecting the molding compound.
Specifically, still be equipped with apron 46 on the injection seat 43, be equipped with on the apron 46 a plurality of with connecting rod 44 matched with hole site 47, connecting rod 44 part passes through hole site 47, apron 46 will connecting rod 44 compress tightly to injection seat 43, make injection pole 41 and injection head 42 remain stable when being promoted by injection push pedal 2, and injection device 4 adopts the modular design, when injection mechanism in the semiconductor package equipment installs on the mould of different specifications, the change with the injection seat 43 of mould looks adaptation can, realize quick replacement, improved the commonality of injection mechanism in the semiconductor package equipment.
As shown in fig. 9, the sensing device 5 includes a mounting piece 51 fixedly disposed on the supporting block 14, a plurality of vertical second oblong holes 53 are disposed in parallel on the mounting piece 51, sensors 52 are respectively disposed in the second oblong holes 53, the sensors 52 are slidably disposed in the second oblong holes 53, the position of the sensor 52 triggered by the sensing block 22 is changed by adjusting the position of the sensor 52 in the second oblong hole 53, and further the stroke of the injection push plate 2 is adjusted, so that the injection mechanism in the semiconductor packaging apparatus is adapted to a mold with different injection amounts, and the injection height of the injection mechanism in the semiconductor packaging apparatus can be adjusted by adjusting the stroke of the injection push plate 2, which is convenient to adjust and has strong versatility.
To sum up, the utility model provides an injection mechanism among the semiconductor packaging equipment removes steadily, injection equipment injecting glue evenly at the in-process injection push pedal that the injection plastic envelope was glued, has improved the encapsulation quality of semiconductor product, has effectively avoided the injection push pedal to remove the hydro-cylinder damage that leads to unstably, and the injection mechanism among the semiconductor packaging equipment can adjust according to the mould of different models, and it is convenient to adjust, and the commonality is strong.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (9)
1. The utility model provides an injection mechanism in semiconductor package equipment, includes the support, be equipped with injection push pedal and drive on the support a plurality of hydro-cylinders that the injection push pedal goes up and down, be equipped with a plurality of injection device on the injection push pedal, still include with the main control board that the hydro-cylinder electricity is connected, its characterized in that: the injection push plate is characterized in that a plurality of rotating shafts are arranged on the support in a rotating mode, the outer sides of the side edges of the injection push plate are correspondingly provided with the rotating shafts, a plurality of gears are arranged on the rotating shafts, a plurality of racks meshed with the gears are arranged on the side edges of the injection push plate respectively, the length direction of the racks is consistent with the driving direction of the oil cylinder, an induction block is arranged on the injection push plate, an induction device for detecting the position of the induction block is further arranged on the support, and the induction device is electrically connected with the main control plate.
2. The injection mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the support comprises a lower base plate, the oil cylinder is fixedly arranged on the lower base plate, a plurality of supporting blocks surrounding the edge of the lower base plate are arranged on the lower base plate at intervals, a template is arranged on the supporting blocks, a first long round hole for the injection device to penetrate through is formed in the template, and a through hole for the rotating shaft to penetrate through is further formed in the supporting blocks.
3. The injection mechanism in a semiconductor packaging apparatus according to claim 2, wherein: and a heat insulation plate is also arranged between the supporting block and the template.
4. The injection mechanism in a semiconductor packaging apparatus according to claim 2, wherein: the injection push plate is provided with a plurality of guide posts on one surface close to the lower backing plate, and the lower backing plate is provided with a guide sleeve matched with the guide posts.
5. The injection mechanism in a semiconductor packaging apparatus according to claim 2, wherein: the injection device comprises an injection rod, the injection rod penetrates through the first long round hole, and an injection head is arranged at one end, far away from the injection push plate, of the injection rod.
6. The injection mechanism in a semiconductor packaging apparatus according to claim 5, wherein: the injection device is characterized by further comprising an injection seat arranged on the injection push plate, wherein a connecting rod which can move in the vertical direction is arranged on the injection seat, and the connecting rod is connected with the injection rod.
7. The injection mechanism in a semiconductor packaging apparatus according to claim 6, wherein: a spring is arranged between the connecting rod and the injection seat.
8. The injection mechanism in a semiconductor packaging apparatus according to claim 6, wherein: the injection seat is also provided with a cover plate matched with the connecting rod, and the cover plate is provided with a hole position for the connecting rod to partially extend out.
9. The injection mechanism in a semiconductor packaging apparatus according to claim 2, wherein: the induction device comprises an installation piece fixedly arranged on the supporting block, a plurality of vertical second long round holes are arranged on the installation piece in parallel, sensors are arranged in the second long round holes respectively, and the sensors are arranged in the second long round holes in a sliding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022175725.8U CN213382620U (en) | 2020-09-28 | 2020-09-28 | Injection mechanism in semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022175725.8U CN213382620U (en) | 2020-09-28 | 2020-09-28 | Injection mechanism in semiconductor packaging equipment |
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| Publication Number | Publication Date |
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| CN213382620U true CN213382620U (en) | 2021-06-08 |
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| CN202022175725.8U Active CN213382620U (en) | 2020-09-28 | 2020-09-28 | Injection mechanism in semiconductor packaging equipment |
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| CN (1) | CN213382620U (en) |
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