CN213377543U

CN213377543U - Bonding equipment for processing electronic components

Info

Publication number: CN213377543U
Application number: CN202021724307.3U
Authority: CN
Inventors: 蔡天平
Original assignee: Zhangpu Bisu Optoelectronics Technology Co Ltd
Current assignee: Zhangpu Bisu Optoelectronics Technology Co Ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2021-06-08
Anticipated expiration: 2030-08-18

Abstract

The utility model discloses a bonding equipment for electronic components processing, which comprises a bracket, the support below is provided with bonding mechanism, the last feed mechanism that installs of bonding mechanism, bonding mechanism includes a conveying frame, a motor, a conveyer belt, a conveying frame front-mounted has a motor, a conveying frame inboard is provided with a conveyer belt, install on the conveyer belt and place the seat No. one, it is provided with the cylinder to place a seat top, the gluey workbin is installed to the cylinder lower extreme, the head of gluing of electromagnetism is installed to the terminal surface under the gluey workbin. The utility model discloses simple structure, reasonable in design, low in production cost, very big improvement work efficiency uses manpower sparingly simultaneously, has very high practicality.

Description

Bonding equipment for processing electronic components

Technical Field

The utility model relates to an electronic components processing technology field especially relates to a bonding equipment for electronic components processing.

Background

The electronic components are components of electronic elements and small-sized electric machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of some parts in the industries of electric appliances, radio, instruments and the like, such as capacitors, transistors, hairsprings, springs and other sub-devices. Diodes and the like are common.

The electronic component includes: the electronic device comprises a resistor, a capacitor, a potentiometer, an electronic tube, a radiator, an electromechanical element, a connector, a semiconductor discrete device, an electroacoustic device, a laser device, an electronic display device, a photoelectric device, a sensor, a power supply, a switch, a micro special motor, an electronic transformer, a relay, a printed circuit board, an integrated circuit, various circuits, piezoelectricity, crystals, quartz, a ceramic magnetic material, a substrate for a printed circuit, a special material for an electronic functional process, an electronic adhesive (tape) product, an electronic chemical material, a component and the like.

In the electronic components course of working, need carry out bonding treatment, but present many enterprises all are that manual operation accomplishes, waste time and energy, and work efficiency is low, influences the production of enterprise.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a bonding apparatus for processing electronic components to solve the above problems.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

a bonding equipment for electronic components processing, which comprises a bracket, the support below is provided with bonding mechanism, the last feed mechanism of installing of bonding mechanism, bonding mechanism includes a conveying frame, a motor, a conveyer belt, a conveying frame forward-mounted has a motor, a conveying frame inboard is provided with a conveyer belt, install a seat of placing on the conveyer belt, a place a top and be provided with the cylinder, the glue case is installed to the cylinder lower extreme, the head is glued to the electromagnetism under the glue case terminal surface installation.

As a further scheme of the utility model, feed mechanism includes No. two conveying framves, No. two motors, No. two conveyer belts, No. two conveying frame front-mounted have No. two motors, No. two conveying frame inboards are provided with No. two conveyer belts, install No. two on No. two conveyer belts and place the seat, No. two conveying frame belows are provided with the slide rail, install electronic slider on the slide rail, electronic slider up end is provided with an electronic flexible post, be provided with the work or material rest on the electronic flexible post, electric telescopic handle is installed to the work or material rest inboard, electric telescopic handle is last to be provided with splint.

As a further scheme of the utility model, feed mechanism includes No. two conveying framves, No. two motors, No. two conveyer belts, No. two conveying frame front-mounted have No. two motors, No. two conveying frame inboards are provided with No. two conveyer belts, install No. two on No. two conveyer belts and place the seat, No. two conveying frame belows are provided with the slide rail, install the slip table on the slide rail, the slip table side-mounting has No. two electric telescopic columns, the slip table up end is provided with an electric telescopic column, be provided with the work or material rest on the electric telescopic column, electric telescopic handle is installed to the work or material rest inboard, the last splint that is provided with of electric telescopic handle.

As a further scheme of the utility model, place the seat and pass through the bolt and install on the conveyer belt, the workbin passes through the bolt and installs the cylinder lower extreme.

As a further aspect of the present invention, the electromagnetic gluing head is installed through a thread on the lower end face of the glue box, and the number of the electromagnetic gluing heads is 3.

As a further scheme of the utility model, an electronic flexible post passes through the bolt to be installed electronic slider up end, electronic slider with slide rail sliding connection, move the work or material rest with electronic flexible post passes through bolted connection No. one.

As a further scheme of the utility model, the slip table slidable mounting be in on the slide rail, No. two electronic flexible posts pass through the bolt and install the slip table side.

Compared with the prior art, the beneficial effects of the utility model are that: through setting up bonding mechanism and feed mechanism, very big improvement work efficiency, use manpower sparingly simultaneously, have very high practicality.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a perspective view of an embodiment 1 of the bonding apparatus for processing electronic components according to the present invention;

fig. 2 is a front view of an embodiment 1 of the bonding apparatus for electronic component processing according to the present invention;

fig. 3 is a left side view of an embodiment 1 of the bonding apparatus for electronic component processing according to the present invention;

fig. 4 is a schematic structural diagram of a material moving frame according to embodiment 1 of the bonding apparatus for processing electronic components according to the present invention;

fig. 5 is a schematic diagram of a feeding mechanism in embodiment 2 of the bonding apparatus for processing electronic components according to the present invention.

The reference numerals are explained below:

1. an adhesive mechanism; 2. a feeding mechanism; 3. a support; 101. a first conveying frame; 102. a first motor; 103. a first conveyor belt; 104. a first placing seat; 105. a cylinder; 106. a glue box; 107. electromagnetic gluing heads; 201. a second conveying frame; 202. a second motor; 203. a second conveyor belt; 204. a second placing seat; 205. a slide rail; 206. an electric slider; 207. a first electric telescopic column; 208. a material moving frame; 209. an electric telescopic rod; 210. a splint; 211. a sliding table; 212. no. two electronic flexible posts.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be further explained with reference to the accompanying drawings.

Example 1

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the utility model provides a technical solution: a bonding equipment for electronic components processing, which comprises a

bracket

3, 3 below on the support is provided with bonding mechanism 1, the last feed mechanism 2 of installing of bonding mechanism 1, bonding mechanism 1 includes a transport frame 101, a motor 102, a conveyer belt 103, a transport frame 101 forward-mounted has a motor 102, a transport frame 101 inboard is provided with a conveyer belt 103, install on a conveyer belt 103 and place a seat 104, place a seat 104 top and be provided with the cylinder 105, glue case 106 is installed to cylinder 105 lower extreme, the terminal surface is installed electromagnetism head 107 of gluing under glue case 106.

On the basis of the above-described embodiment: the feeding mechanism 2 comprises a second conveying frame 201, a second motor 202 and a second conveying belt 203, the second motor 202 is mounted at the front part of the second conveying frame 201, the second conveying belt 203 is arranged on the inner side of the second conveying frame 201, a second placing seat 204 is mounted on the second conveying belt 203, a sliding rail 205 is arranged below the second conveying frame 201, an electric sliding block 206 is mounted on the sliding rail 205, a first electric telescopic column 207 is arranged on the upper end face of the electric sliding block 206, a material moving frame 208 is arranged on the first electric telescopic column 207, an electric telescopic rod 209 is mounted on the inner side of the material moving frame 208, and a clamping plate 210 is arranged on the electric telescopic rod 209; the first placing seat 104 is installed on the first conveyor belt 103 through bolts, and the glue box 106 is installed at the lower end of the air cylinder 105 through bolts; the electromagnetic gluing heads 107 are arranged on the lower end face of the glue box 106 through threads, and the number of the electromagnetic gluing heads 107 is 3; no. one electronic flexible post 207 passes through the bolt and installs at electronic slider 206 up end, electronic slider 206 and slide rail 205 sliding connection, move the material frame 208 and pass through bolted connection with electronic flexible post 207.

The working principle is as follows: the lower workpiece is placed on the first placing seat 104, the first motor 102 drives the first conveyor belt 103 to rotate and convey the lower workpiece, the upper workpiece is placed on the second placing seat 204, the second motor 202 drives the second conveyor belt 203 to rotate and convey the lower workpiece, when the first placing seat 104 is placed under the electromagnetic gluing head 107, the air cylinder 105 drives the electromagnetic gluing head 107 to descend and place the lower workpiece on, then the electromagnetic gluing head 107 is opened, glue in the glue box 106 is dripped on the lower workpiece through the electromagnetic gluing head 107, the first electric telescopic column 207 drives the material moving frame 208 to descend, the electric telescopic rod 209 drives the clamping plate 210 to clamp the upper workpiece, the electric slide block 206 drives the material moving frame 205 to move leftwards along the slide rail 205, when the first electric telescopic column 207 drives the material moving frame 208 to descend, the upper workpiece frame is pressed on the lower workpiece, and bonding is completed.

Example 2

As shown in fig. 5, the difference between the embodiment 2 and the embodiment 1 is that the feeding mechanism 2 includes a second conveying frame 201, a second motor 202, and a second conveying belt 203, the second motor 202 is installed at the front portion of the second conveying frame 201, the second conveying belt 203 is arranged on the inner side of the second conveying frame 201, a second placing seat 204 is installed on the second conveying belt 203, a sliding rail 205 is arranged below the second conveying frame 201, a sliding table 211 is installed on the sliding rail 205, a second electric telescopic column 212 is installed on the side surface of the sliding table 211, a first electric telescopic column 207 is arranged on the upper end surface of the sliding table 211, a material moving frame 208 is arranged on the first electric telescopic column 207, an electric telescopic rod 209 is installed on the inner side of the material moving frame 208, and a clamping plate 210 is arranged on the electric.

The electric sliding block 206 drives the material moving frame 208 to move along the sliding rail 205, and the sliding table 211 is driven to move along the sliding rail 205 by the expansion and contraction of the second electric expansion column 212.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. A bonding equipment for electronic components processing, including the support, its characterized in that: the support below is provided with adhesive device, the last feed mechanism that installs of adhesive device, adhesive device includes a conveying frame, a motor, a conveyer belt, a conveying frame forward-mounted has a motor, a conveying frame inboard is provided with a conveyer belt, install on the conveyer belt and place the seat No. one, it is provided with the cylinder to place a top, the glue case is installed to the cylinder lower extreme, the head of gluing on the electromagnetism is installed to the terminal surface under the glue case.

2. The bonding apparatus for electronic component processing according to claim 1, wherein: feed mechanism includes No. two conveying framves, No. two motors, No. two conveyer belts, No. two conveying frame forward-mounted have No. two motors, No. two conveying frame inboards are provided with No. two conveyer belts, install No. two on No. two conveyer belts and place the seat, No. two conveying frame belows are provided with the slide rail, install electric sliding block on the slide rail, the electric sliding block up end is provided with an electric telescopic column, be provided with the work or material rest on the electric telescopic column, electric telescopic handle is installed to the work or material rest inboard, electric telescopic handle is last to be provided with splint.

3. The bonding apparatus for electronic component processing according to claim 1, wherein: feed mechanism includes No. two conveying framves, No. two motors, No. two conveyer belts, No. two conveying frame front-mounted have No. two motors, No. two conveying frame inboards are provided with No. two conveyer belts, install No. two on No. two conveyer belts and place the seat, No. two conveying frame belows are provided with the slide rail, install the slip table on the slide rail, the slip table side-mounting has No. two electric telescopic columns, the slip table up end is provided with electric telescopic column No. one, be provided with the work or material rest on the electric telescopic column, electric telescopic handle is installed to the work or material rest inboard, electric telescopic handle is last to be provided with splint.

4. The bonding apparatus for electronic component processing according to claim 1, wherein: a place the seat through the bolt install No. one the conveyer belt is last, the workbin passes through the bolt and installs the cylinder lower extreme.

5. The bonding apparatus for electronic component processing according to claim 1, wherein: the electromagnetic gluing heads are installed on the lower end face of the glue box through threads, and the number of the electromagnetic gluing heads is 3.

6. The bonding apparatus for electronic component processing according to claim 2, wherein: the first electric telescopic column is installed on the upper end face of the electric sliding block through a bolt, the electric sliding block is connected with the sliding rail in a sliding mode, and the material moving frame is connected with the first electric telescopic column through a bolt.

7. The bonding apparatus for electronic component processing according to claim 3, wherein: the sliding table is slidably mounted on the sliding rail, and the second electric telescopic column is mounted on the side face of the sliding table through a bolt.