CN213366551U - Ceramic wafer for supporting semiconductor substrate - Google Patents
Ceramic wafer for supporting semiconductor substrate Download PDFInfo
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- CN213366551U CN213366551U CN202022770032.3U CN202022770032U CN213366551U CN 213366551 U CN213366551 U CN 213366551U CN 202022770032 U CN202022770032 U CN 202022770032U CN 213366551 U CN213366551 U CN 213366551U
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- semiconductor substrate
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- plate
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Abstract
The utility model relates to a semiconductor substrate supports and uses potsherd relates to semiconductor substrate tool technical field, and it includes the base, the interval shaping has the support position on the length direction of base, the spacing groove has been seted up on the base, just the spacing groove is located between two adjacent support positions, the spacing groove inlays with the mounting panel on the semiconductor substrate board and establishes the cooperation. The semiconductor substrate board mounting method has the effect of improving the stability of the semiconductor substrate board mounting.
Description
Technical Field
The application relates to the technical field of semiconductor substrate jigs, in particular to a ceramic wafer for supporting a semiconductor substrate.
Background
The semiconductor substrate plate is a raw material for manufacturing the chip, and the semiconductor substrate plate needs to enter a die bonder to be processed in a series of processes in the manufacturing process of the chip; before the semiconductor substrate plate enters the die bonder, the semiconductor substrate plate needs to be punched to remove more than part of the plate on the semiconductor substrate plate, so that a worker can take off the processed chip from the semiconductor substrate plate.
At present, semiconductor substrate can form a plurality of positions of running through at the interval after the punching press is accomplished on the semiconductor substrate board, and integrated into one piece has the mounting panel in running through the position, and the length direction of mounting panel perpendicular to semiconductor substrate board's length direction, and on the staff placed metal support plate with semiconductor substrate usually, in the mounting groove with metal support plate embedding tool again, send into solid brilliant built-in with the tool again at last.
In the related art, the semiconductor substrate is placed on the metal jig, and when the semiconductor substrate is processed in the die bonder, the device in the die bonder may cause relative movement of the semiconductor substrate.
SUMMERY OF THE UTILITY MODEL
In order to improve the stability of mounting of a semiconductor substrate board, the present application provides a ceramic sheet for supporting a semiconductor substrate.
The application provides a semiconductor substrate supports uses potsherd adopts following technical scheme:
the utility model provides a semiconductor substrate supports uses potsherd, includes the base, the interval shaping has the support position on the length direction of base, the spacing groove has been seted up on the base, just the spacing groove is located between two adjacent support positions, the spacing groove inlays with the mounting panel on the semiconductor substrate board and establishes the cooperation.
Through adopting above-mentioned technical scheme, in the actual work, on the staff placed the base with semiconductor substrate board, the rethread removed semiconductor substrate board for mounting panel embedding spacing inslot on the base on the semiconductor substrate board, thereby can reduce the condition emergence that semiconductor substrate board took place to rock, and then help improving the stability of semiconductor substrate board installation.
Preferably, the limiting groove comprises a V-shaped groove.
Through adopting above-mentioned technical scheme, the V-arrangement groove can make the both sides limit on the width direction of mounting panel support tightly with the lateral wall of V-arrangement groove slope to the condition that the clearance appears between reduction mounting panel and the spacing groove takes place, and then helps promoting the stability of semiconductor substrate board installation.
Preferably, the upper side of the supporting portion comprises a frosted surface.
Through adopting above-mentioned technical scheme, the frosting can increase the friction dynamics between base and the semiconductor substrate board to help promoting the stability of semiconductor substrate board installation.
Preferably, guide inclined planes are formed on two side walls of the limiting groove and are positioned at two ends of the limiting groove in the length direction.
Through adopting above-mentioned technical scheme, the guide inclined plane makes the limiting plate embedding spacing inslot on the semiconductor substrate board that the staff can be comparatively easy, helps promoting the convenience of semiconductor substrate board installation.
Preferably, a cushion is fixed on the side wall of the limiting groove.
Through adopting above-mentioned technical scheme, the cushion can be so that the both sides part of the mounting panel on the semiconductor substrate board imbed in the cushion to there is the condition in clearance to take place between reduction mounting panel that can be further and the spacing groove, and then help promoting the stability of semiconductor substrate board installation.
Preferably, a supporting block is formed on the side wall of one side of the limiting groove, and a limiting plate is rotatably connected to one side of the supporting block, which is perpendicular to the length direction of the limiting groove.
By adopting the technical scheme, in actual work, a worker places the semiconductor substrate plate on the base, so that the mounting plate on the semiconductor substrate plate is embedded into the limiting groove; subsequently, the staff rotates the limiting plate for mounting panel butt on limiting plate and the semiconductor substrate board, thereby can reduce the condition emergence that the semiconductor substrate board rocked from top to bottom, and then help promoting the stability of semiconductor substrate board installation.
Preferably, a screw is fixedly welded on the supporting block, one end of the limiting plate penetrates through the screw, and a nut is connected to the end of the screw in a threaded manner.
Through adopting above-mentioned technical scheme, in the actual work, the staff establishes the limiting plate cover on the screw rod, and the rethread revolves the nut and makes the nut support tight limiting plate to fix the limiting plate on the supporting shoe, and then help promoting the stability of limiting plate installation.
Preferably, both ends of the base in the length direction are formed with embedding slopes.
Through adopting above-mentioned technical scheme, embedding inclined plane makes in the staff can be comparatively easy installs the mounting groove of tool with the base, helps promoting the convenience of base installation.
In summary, the present application includes at least one of the following beneficial technical effects:
through the embedding cooperation of establishing of the mounting panel on spacing groove and the semiconductor substrate board, can reduce the condition emergence that the semiconductor substrate board took place to rock to help improving the stability of semiconductor substrate board installation.
Through the guide inclined plane on the both sides wall of spacing groove for the staff can be comparatively easy with the limiting plate embedding spacing inslot on the semiconductor substrate board, help promoting the convenience of semiconductor substrate board installation.
Drawings
FIG. 1 is an isometric view of a ceramic wafer generally embodying the support for a semiconductor substrate in one embodiment;
FIG. 2 is a diagram of a base structure according to an embodiment;
FIG. 3 is an enlarged view of a portion A of FIG. 2, which mainly shows the structure of the limiting groove;
FIG. 4 is an isometric view of a ceramic wafer for supporting a semiconductor substrate according to a second embodiment of the present invention;
fig. 5 is a structure mainly embodying the base in the second embodiment;
fig. 6 is an enlarged view of a portion B in fig. 5, mainly showing the structure of the stopper plate.
Reference numerals: 1. a base; 11. a support location; 2. a semiconductor substrate board; 21. mounting a plate; 3. a support plate; 31. a support block; 32. enclosing plates; 4. a limiting groove; 5. a guide ramp; 6. a limiting plate; 7. a screw; 71. a nut; 8. embedding the inclined plane.
Detailed Description
The present application is described in further detail below with reference to figures 1-6.
The embodiment of the application discloses a ceramic sheet for supporting a semiconductor substrate.
The first embodiment is as follows:
referring to fig. 1 and 2, the semiconductor substrate processing device includes a base 1, a plurality of support portions 11 are formed on the base 1, the plurality of support portions 11 are arranged at intervals along a length direction of the base 1, and the support portions 11 are used for supporting a semiconductor substrate 2.
Referring to fig. 2 and 3, a supporting plate 3 is fixed on a substrate 1, the length direction of the supporting plate 3 is perpendicular to the length direction of the substrate 1, supporting blocks 31 are fixed on one side of the width direction of the supporting plate 3, the number of the supporting blocks 31 is three along the length direction of the supporting plate 3 at intervals, a surrounding plate 32 is vertically formed on one side of the supporting plate 3, which is far away from the supporting blocks 31, an embedded groove is formed between the surrounding plate 32 and the supporting block 31, and a mounting plate 21 on a semiconductor substrate plate 2 is embedded into the limiting groove 4. The semiconductor substrate 2 is stably mounted on the base 1 by fitting the mounting plate 21 of the semiconductor substrate 2 into the stopper groove 4.
Referring to fig. 2 and 3, the cross section of the limiting groove 4 is in a V shape, the length direction of the limiting groove 4 is parallel to the length direction of the base 1, two sides of the limiting groove 4 in the length direction are open, the limiting groove 4 is provided with a plurality of limiting grooves along the length direction of the base 1, and each limiting groove 4 is located between two adjacent supporting portions 11. The two side walls in the width direction of the limiting groove 4 are obliquely arranged, so that the two sides in the width direction of the mounting plate 21 are tightly abutted to the two side walls of the limiting groove 4, and the semiconductor substrate plate 2 is further stably mounted on the base 1.
Referring to fig. 2 and 3, the upper side of the supporting portion 11 on the base 1 is a frosted surface. The frosted surface can increase the frictional force between the base 1 and the semiconductor substrate sheet 2, thereby allowing the semiconductor substrate sheet 2 to be stably mounted on the base 1. Guide inclined planes 5 are formed on two side walls of the limiting groove 4, and the guide inclined planes 5 are positioned at two ends of the limiting groove 4 in the length direction. The guide slope 5 can make the staff more convenient imbed the mounting panel 21 on the semiconductor substrate board 2 in the spacing groove 4 on base 1. Soft pads are adhered and fixed on the two side walls of the limit groove 4. The cushion can reduce the clearance between mounting panel 21 and the both sides wall of spacing groove 4 to make semiconductor substrate board 2 more stable the installation on base 1.
The implementation principle of the ceramic wafer for supporting the semiconductor substrate in the embodiment of the application is as follows: in actual work, the staff places semiconductor substrate board 2 on base 1, and the rethread removes semiconductor substrate board 2 for mounting panel 21 on the semiconductor substrate board 2 imbeds in the spacing groove 4 on the base 1, thereby makes the stable installation of semiconductor substrate board 2 on base 1.
Example two:
the difference from the first embodiment is that:
referring to fig. 4 and 5, the semiconductor substrate 2 is provided on the base 1, and the semiconductor chips on the semiconductor substrate 2 correspond one-to-one to the supporting portions 11 on the base 1.
Referring to fig. 5 and 6, the supporting blocks 31 on both sides of the supporting plate 3 in the length direction are rotatably connected with the limiting plates 6, the limiting plates 6 are located on two side surfaces of the two supporting blocks 31 close to each other, and one side surface of the limiting plate 6 close to the base 1 abuts against the limiting plate 6 on the semiconductor substrate 2. On the base 1 was placed with semiconductor substrate board 2 to the staff for mounting panel 21 on the semiconductor substrate board 2 imbeds the spacing groove 4, rotates limiting plate 6 again, makes limiting plate 6 and mounting panel 21 butt, thereby makes the stable installation of semiconductor substrate board 2 on the base 1.
Referring to fig. 5 and 6, a screw 7 is welded and fixed on the supporting block 31, the length direction of the screw 7 is parallel to the length direction of the limiting groove 4, one end of the limiting plate 6 in the length direction penetrates through the screw 7, one end of the screw 7, which is away from the supporting block 31, is in threaded connection with a nut 71, and one side surface of the nut 71, which is close to the supporting block 31, abuts against one side surface of the limiting plate 6, which is away from the supporting block 31. The staff wears to establish the one end of limiting plate 6 on screw rod 7, and the rethread is rotated nut 71 and is made nut 71 support tight limiting plate 6 to make the stable installation of limiting plate 6 on screw rod 7.
Referring to fig. 4, both ends of the base 1 in the length direction are formed with insertion slopes 8. The embedding inclined plane 8 enables a worker to easily install the base 1 into the installation groove of the jig.
The implementation principle of the ceramic wafer for supporting the semiconductor substrate in the embodiment of the application is as follows: in actual work, a worker places the semiconductor substrate plate 2 on the base 1; then, the worker moves the semiconductor substrate plate 2, so that the mounting plate 21 on the semiconductor substrate plate 2 is embedded into the limiting groove 4 on the base 1; finally, the worker rotates the limit plate 6 on the support block 31, so that the limit plate 6 abuts against the mounting plate 21 on the semiconductor substrate plate 2, thereby completing the mounting and positioning operation of the semiconductor substrate plate 2.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A ceramic wafer for supporting a semiconductor substrate, comprising a base (1), characterized in that: the interval shaping has support position (11) on the length direction of base (1), spacing groove (4) have been seted up on base (1), just spacing groove (4) are located between two adjacent support position (11), mounting panel (21) on spacing groove (4) and semiconductor substrate board (2) inlay and establish the cooperation.
2. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 1, wherein: the limiting groove (4) comprises a V-shaped groove.
3. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 1, wherein: the upper side of the supporting part (11) comprises a frosting surface.
4. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 2, wherein: guide inclined planes (5) are formed on two side walls of the limiting groove (4), and the guide inclined planes (5) are located at two ends of the limiting groove (4) in the length direction.
5. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 2, wherein: and a cushion is fixed on the side wall of the limiting groove (4).
6. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 2, wherein: the side wall of one side of the limiting groove (4) is provided with a supporting block (31), and the supporting block (31) is rotatably connected with a limiting plate (6) on one side perpendicular to the length direction of the limiting groove (4).
7. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 6, wherein: the supporting block (31) is fixedly welded with a screw rod (7), one end of the limiting plate (6) penetrates through the screw rod (7), and the end part of the screw rod (7) is connected with a nut (71) in a threaded mode.
8. The ceramic sheet for supporting a semiconductor substrate as claimed in claim 1, wherein: embedding inclined planes (8) are formed at two ends of the base (1) in the length direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022770032.3U CN213366551U (en) | 2020-11-25 | 2020-11-25 | Ceramic wafer for supporting semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022770032.3U CN213366551U (en) | 2020-11-25 | 2020-11-25 | Ceramic wafer for supporting semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213366551U true CN213366551U (en) | 2021-06-04 |
Family
ID=76137028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022770032.3U Active CN213366551U (en) | 2020-11-25 | 2020-11-25 | Ceramic wafer for supporting semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213366551U (en) |
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2020
- 2020-11-25 CN CN202022770032.3U patent/CN213366551U/en active Active
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