CN213366536U - Chip automatic correction type die bonder - Google Patents

Abstract

The application provides a solid brilliant machine of chip automatic correction formula, including the frame to and install feed mechanism, fixture mechanism, confession brilliant mechanism, rotatory swing arm mechanism and the mechanism of making a video recording in the frame respectively. The rotary swing arm mechanism comprises a rotary seat, a suction nozzle for sucking a chip, a supporting arm for supporting the suction nozzle, a rotary driver for driving the supporting arm to horizontally rotate so that the suction nozzle passes through a die bonding position and a die supply position in a reciprocating mode, and an adjusting unit for driving the suction nozzle to rotate so as to correct the position of the chip. This application is through setting up the mechanism of making a video recording between solid brilliant position and confession brilliant position, and when rotary actuator drove that support arm and suction nozzle reciprocate through solid brilliant position and confession brilliant position, the mechanism of making a video recording can acquire the positional information of the chip on the suction nozzle. If the chip sucked by the suction nozzle is deviated in position, the camera shooting mechanism shoots that the chip is not at the correct position, the adjusting unit drives the suction nozzle to rotate at the moment, and then the position of the chip can be corrected, so that the die bonding precision of the die bonder can be improved.

Description

Chip automatic correction type die bonder

Technical Field

The application belongs to the technical field of die bonding equipment, and particularly relates to an automatic chip correction type die bonding machine.

Background

Die bonding generally comprises the steps of using a dispenser to dispense glue on the position where a chip is installed on a support, then transferring the support to a die bonding position, sucking the chip from a chip feeding platform by a die bonding swing arm, and then placing the chip on the support to realize die bonding. However, the chip feeding platform usually ejects the chip by the ejector pin, and the chip may be shifted in position due to vibration during the ejection process, thereby affecting the die bonding precision.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a die bonder with an automatic chip correction function, so as to solve the problem in the related art that when a chip is ejected by an ejector pin, the position of the chip is shifted, which affects die bonding precision.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

the utility model provides a solid brilliant machine of chip automatic correction formula is provided, includes:

a frame;

the feeding mechanism is arranged on the rack and used for supplying the bracket;

the clamp mechanism is arranged on the frame and used for transferring the bracket conveyed by the feeding mechanism to a die bonding position;

the crystal supply mechanism is arranged on the rack and used for supplying chips to a crystal supply position;

the rotary swing arm mechanism comprises a rotary seat, a suction nozzle for sucking the chip, a support arm for supporting the suction nozzle, a rotary driver for driving the support arm to horizontally rotate so as to enable the suction nozzle to pass through the die bonding position and the die supply position in a reciprocating mode, and an adjusting unit for driving the suction nozzle to rotate so as to correct the position of the chip; the rotary seat is connected with the rotary driver, the rotary driver is installed on the rack, the supporting arm is connected with the rotary seat, the adjusting unit is installed on the supporting arm, and the adjusting unit is connected with the suction nozzle;

and the camera shooting mechanism is arranged on the frame, is positioned between the crystal fixing position and the crystal supplying position and is used for acquiring the position information of the chip on the suction nozzle.

One or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

this application is through setting up the mechanism of making a video recording between solid brilliant position and confession brilliant position, and when rotary actuator drove that support arm and suction nozzle reciprocate through solid brilliant position and confession brilliant position, the mechanism of making a video recording can acquire the positional information of the chip on the suction nozzle. If the chip sucked by the suction nozzle is deviated in position, the camera shooting mechanism shoots that the chip is not at the correct position, the adjusting unit drives the suction nozzle to rotate at the moment, and then the position of the chip can be corrected, so that the die bonding precision of the die bonder can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a die bonder with an automatic chip correction according to an embodiment of the present disclosure;

fig. 2 is a schematic partial structural diagram of a die bonder with an automatic chip correction according to an embodiment of the present disclosure;

FIG. 3 is a partially exploded view of a rotary swing arm mechanism provided in an embodiment of the present application;

FIG. 4 is a schematic diagram of a structure at a support arm location provided by an embodiment of the present application;

FIG. 5 is an exploded view of FIG. 4;

FIG. 6 is an exploded view of the pneumatic clamp and the suction nozzle provided in the embodiments of the present application;

fig. 7 is a schematic structural diagram of a camera mechanism provided in the embodiment of the present application;

FIG. 8 is an exploded view of FIG. 7;

FIG. 9 is a schematic structural diagram of a feeding mechanism provided in an embodiment of the present application;

FIG. 10 is a schematic structural diagram of a clamping mechanism provided in an embodiment of the present application;

fig. 11 is a schematic structural diagram of a clamping base according to an embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a crystal supply mechanism provided in the embodiment of the present application;

fig. 13 is a schematic structural view of a thimble unit according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of a ring feeding mechanism according to an embodiment of the present application;

fig. 15 is a schematic structural diagram of a wafer ring transfer mechanism according to an embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

100-a frame; 101-a solid crystal camera lens; 102-crystal taking camera lens;

1-a feeding mechanism; 11-a cartridge; 12-a support base; 121-a baffle; 122-a first wheel; 123-a first conveyor belt; 124-a first wheel motor; 13-a pushing unit; 131-a bottom plate; 132-a sled; 133-a material pushing cylinder; 134-a pusher bar; 14-a magazine lifting unit; 141-a support frame; 142-a magazine screw; 143-magazine slider; 144-a screw motor;

2-a clamping mechanism; 21-a clamping base; 211-a substrate; 212-a riser; 213-a top-resisting block; 214-a counter motor; 215-a second wheel; 216-a second conveyor belt; 217-connecting shaft; 218-a second wheel motor; 22-a gripper traverse unit; 221-clamp traversing seat; 222-a first electromagnet group; 223-traversing the fixture with the guide rails; 23-a clamp longitudinal moving unit; 231-a clamp longitudinal moving seat; 232-a second electromagnet group; 233-clamp longitudinal movement guide rail;

3-a crystal supply mechanism; 31-rotating the crystal frame; 32-a carrying seat; 33-a wafer ring rotating unit; 331-crystal ring rotating motor; 332-a belt; 34-a thimble unit; 341-top crystal needle; 342-a thimble lifting driver; 343-ejector pin base; 344-ejector pin traversing driver; 345-a thimble longitudinal movement driver; 35-a wafer ring traversing unit; 351-a transverse moving bearing seat; 352-transverse moving screw rod; 353, transversely moving the sliding block; 354-crystal ring traversing motor; 36-crystal ring longitudinal moving unit; 361-longitudinal moving bearing seat; 362-longitudinal moving screw rod; 363-longitudinal slide block; 364-crystal ring longitudinal movement motor;

4-rotating the swing arm mechanism; 41-a rotating seat; 42-a suction nozzle; 420-a tip hole; 421-an accommodating ring groove; 422-sealing ring; 43-a support arm; 430-lightening holes; 44-a rotary drive; 45-a conditioning unit; 451-driving wheel; 452-a driven wheel; 453-pneumatic clamp; 4530-accommodation hole; 4531-chuck; 454-a synchronous belt; 455-regulating the motor; 456-a support block; 457-induction rod; 458-a detector; 46-a nozzle lifting unit; 461-guide rail; 462-a slide; 463-a voice coil motor; 47-a sensing piece; 48-a sensor; 49-scale grating; 40-grating reading head;

5-a camera mechanism; 51-a camera lens; 52-a fixed seat; 53-camera lift unit; 531-first positioning seat; 532-a first slide rail; 533-first push rod; 534-first grip slipper; 535-first locking lever; 54-a camera pan unit; 541-a second positioning seat; 542-a second slide rail; 543-sliding seat; 544-a second push rod; 545-a second gripper seat; 546-a second lock lever; 547-a second spring; 55-camera panning unit; 551-third positioning seat; 552-a third slide rail; 553 — a third push rod; 554-a third gripper seat; 555-a third lock bar; 556-third spring; 56-a light source; 57-adjusting rod; 58-mirror;

6-a crystal ring feeding mechanism; 61-a feeding frame; 62-a feeding screw rod; 63-a feed slide block; 64-a feed motor; 65-a crystal ring frame;

7-a crystal ring material moving mechanism; 71-a material moving frame; 72-material moving screw rod; 73-a material moving motor; 74-material moving slide block; 75-a material moving seat; 76-lower splint; 77-material clamping motor; 78-Upper jaw.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

For convenience of description, three coordinate axes which are mutually vertical in space are defined as an X axis, a Y axis and a Z axis respectively, and meanwhile, the direction along the X axis is longitudinal, the direction along the Y axis is transverse, and the direction along the Z axis is vertical; the X axis and the Y axis are two coordinate axes which are vertical to each other on the same horizontal plane, and the Z axis is a coordinate axis in the vertical direction; the X axis, the Y axis and the Z axis are positioned in space and are mutually vertical, and three planes are respectively an XY plane, a YZ plane and an XZ plane, wherein the XY plane is a horizontal plane, the XZ plane and the YZ plane are vertical planes, and the XZ plane is vertical to the YZ plane. Three axes in space are an X axis, a Y axis and a Z axis, and the three-axis movement in space refers to the movement along three axes which are vertical to each other in space, in particular to the movement along the X axis, the Y axis and the Z axis in space; the planar motion is a motion in the XY plane.

Referring to fig. 1 to fig. 3, a die bonder with automatic chip correction according to an embodiment of the present application will be described. The chip automatic correction type die bonder comprises a rack 100, and a feeding mechanism 1, a clamp mechanism 2, a die feeding mechanism 3, a rotary swing arm mechanism 4 and a camera shooting mechanism 5 which are respectively arranged on the rack 100. Wherein the feeding mechanism 1 is used for supplying the support; the clamp mechanism 2 is used for receiving the support conveyed by the feeding mechanism 1 and transferring the support to a crystal fixing position; the wafer supply mechanism 3 is used for supplying chips and transferring the chips to a wafer supply position. The rotary swing arm mechanism 4 comprises a rotary base 41, a suction nozzle 42 for sucking the chip, a supporting arm 43 for supporting the suction nozzle 42, a rotary driver 44 for driving the supporting arm 43 to horizontally rotate so as to enable the suction nozzle 42 to pass through a die bonding position and a die supply position in a reciprocating mode, and an adjusting unit 45 for driving the suction nozzle 42 to rotate so as to correct the position of the chip; the rotary base 41 is connected with a rotary driver 44, the rotary driver 44 is mounted on the machine frame 100, the supporting arm 43 is connected with the rotary base 41, the adjusting unit 45 is mounted on the supporting arm 43, and the adjusting unit 45 is connected with the suction nozzle 42. The camera shooting mechanism 5 is arranged between the solid crystal position and the crystal supply position, the suction nozzle 42 forms a rotation track in the horizontal plane, and the camera shooting mechanism 5 is positioned below the rotation track, so that the position of a chip sucked on the suction nozzle 42 can be shot in real time to obtain the position information of the chip. In one embodiment, the rotation driver 44 may be a motor, a rotation cylinder, or the like, and is not limited herein.

The die bonding process of the die bonder is as follows: when the feeding mechanism 1 supplies the support to the clamp mechanism 2, the clamp mechanism 2 transfers the received support to a die bonding position; subsequently, the chip supply mechanism 3 supplies chips to the chip supply site; finally, after the suction nozzle 42 sucks the chip on the die-bonding site, the rotary driver 44 drives the rotary base 41 and the supporting arm 43 to rotate together, so that the suction nozzle 42 can be moved from the die-bonding site to the die-bonding site, thereby realizing die bonding. In the process that the suction nozzle 42 moves from the wafer supply position to the wafer fixing position, the camera mechanism 5 can photograph the position of the chip on the suction nozzle 42. When the chip position on the suction nozzle 42 deviates, the adjusting unit 45 drives the suction nozzle 42 to rotate, so that the position of the chip can be corrected, and the die bonding precision is improved.

With the structure, the camera mechanism 5 is arranged between the die bonding position and the die supplying position, and when the rotary driver 44 drives the supporting arm 43 and the suction nozzle 42 to reciprocate through the die bonding position and the die supplying position, the camera mechanism 5 can acquire the position information of the chip on the suction nozzle 42. If the chip is deviated, the camera mechanism 5 shoots that the chip is not at the correct position, and the adjusting unit 45 drives the suction nozzle 42 to rotate at the moment, so that the position of the chip can be corrected, and the die bonding precision of the die bonder can be improved.

In an embodiment, referring to fig. 1 and fig. 2, the die bonder with automatic correction function further includes a die bonding camera lens 101 disposed opposite to the die bonding position and a die capturing camera lens 102 disposed opposite to the die bonding position. With the structure, the die bonding camera lens 101 can carry out shooting and checking on die bonding operation between the chip and the bracket so as to improve die bonding precision; the crystal-taking camera lens 102 can shoot and verify the position of the chip at the crystal-supplying position, so that the suction nozzle 42 can pick up the chip accurately, and the crystal-fixing precision is further improved. The die attach camera lens 101 may be disposed above the die attach site, and the die pick camera lens 102 may be disposed above the die attach site.

In one embodiment, referring to fig. 3 to 5, the adjusting unit 45 includes a driving wheel 451, a pneumatic clamp 453 for pneumatically disassembling and assembling the suction nozzle 42, a driven wheel 452 sleeved on the pneumatic clamp 453, a timing belt 454 connecting the driving wheel 451 and the driven wheel 452, and an adjusting motor 455 for driving the driving wheel 451 to rotate; the air clamp 453 is rotatably mounted on the support arm 43, the adjusting motor 455 is mounted on the rotary base 41, and the driving wheel 451 is mounted on the spindle of the adjusting motor 455. With the structure, the adjusting motor 455 can drive the pneumatic clamp 453 to rotate through the driving wheel 451, the driven wheel 452 and the synchronous belt 454, so as to drive the suction nozzle 42 to rotate, thereby correcting the position of the chip. The suction nozzle 42 can be clamped and fixed by the pneumatic clamp 453, so that the suction nozzle 42 can be conveniently detached, and the efficiency is improved.

In one embodiment, referring to fig. 6, the pneumatic clamp 453 includes a clamp 4531 rotatably mounted on the supporting arm 43, one end of the clamp 4531 is provided with a receiving hole 4530 for receiving one end of the suction nozzle 42, and the other end of the clamp 4531 is provided with a vent hole (not shown) for connecting an air path for air to enter and exit the receiving hole 4530. With this structure, the suction nozzle 42 can be inserted into the receiving hole 4530 through the receiving hole 4530 to fix the suction nozzle 42 to the collet 4531. When the other end of the collet 4531 is connected to the air path through the vent hole, air may enter and exit the receiving hole 4530, i.e., the vent hole is communicated with the receiving hole 4530, and when the air path is evacuated, a negative pressure may be generated in the suction nozzle 42 to facilitate the suction of the chip. And when the air path supplies air, the chip can be separated from the suction nozzle 42, so as to realize die bonding. When the air path supplies compressed air, the air pressure in the accommodating hole 4530 is low when the air pressure in the nozzle 42 is discharged from the accommodating hole 4530 due to the small tip hole 420 of the nozzle 42, and the nozzle 42 can be pneumatically detached by the air pressure in the accommodating hole 4530.

In one embodiment, referring to fig. 6, the suction nozzle 42 is sleeved with a sealing ring 422, and the suction nozzle 42 is provided with a receiving ring groove 421 for positioning the sealing ring 422. The sealing ring 422 is arranged on the suction nozzle 42, when the suction nozzle 42 is placed in the containing hole 4530, friction force can be increased, the suction nozzle 42 can be better prevented from falling off, the inner wall of the containing hole 4530 and the suction nozzle 42 can be sealed, and negative pressure is generated at the suction nozzle 42 when the air path is conveniently exhausted.

In one embodiment, referring to fig. 4, the support arm 43 is provided with a plurality of lightening holes 430 to lighten the weight of the support arm 43 and facilitate driving the support arm 43 to rotate smoothly.

In one embodiment, referring to fig. 4, the adjusting unit 45 further includes a supporting block 456, the supporting block 456 is mounted on the rotating base 41, and the adjusting motor 455 is mounted on the supporting block 456. The support block 456 is provided to facilitate mounting and fixing the adjustment motor 455, and to facilitate fixing the adjustment motor 455 to the rotary base 41.

In one embodiment, referring to fig. 4 and 5, the adjusting unit 45 further includes an induction bar 457 and a detector 458, the detector 458 is mounted on the supporting block 456, the induction bar 457 is connected to the main shaft of the adjusting motor 455, and the detector 458 is used for detecting the induction bar 457 to determine the rotation angle of the adjusting motor 455, so as to control the rotation angle of the pneumatic clamp 453 to further accurately correct the angle of the chip.

In one embodiment, referring to fig. 4 and 5, a nozzle lifting unit 46 for driving the supporting arm 43 to lift is mounted on the rotary base 41; the support arm 43 is mounted on the nozzle elevating unit 46. With the structure, the lifting of the supporting arm 43 can be driven by the suction nozzle lifting unit 46, so that the die bonding is convenient, and the suction nozzle 42 is convenient to take and place.

In one embodiment, referring to fig. 4 and 5, the nozzle lifting unit 46 includes a guide rail 461, a slider 462 and a voice coil motor 463, wherein the slider 462 is slidably mounted on the guide rail 461, and the slider 462 is guided by the guide rail 461 to move smoothly. The supporting arm 43 is mounted on the sliding base 462, so that the sliding base 462 drives the supporting arm 43 to lift. The slider 462 is connected to a voice coil motor 463 to drive the slider 462 to move up and down by the voice coil motor 463. The voice coil motor 463 is small in size and light in weight, and can accurately drive the sliding seat 462 to move up and down, so that the rotary swing arm mechanism 4 can rotate stably. The voice coil motor 463 and the guide rail 461 are mounted on the rotary base 41 to support the voice coil motor 463 and the guide rail 461. In some embodiments, the guide rails 461 are cross rails to support and guide the movement of the carriage 462.

In some embodiments, the nozzle lifting unit 46 is a lead screw-nut mechanism so as to precisely drive the lifting of the support arm 43. In some embodiments, the nozzle lifting unit 46 may be a cam mechanism to quickly drive the supporting arm 43 to lift and lower for quick die bonding.

In one embodiment, referring to fig. 4 and 5, the rotary swing arm mechanism 4 further includes a sensor piece 47 and a sensor 48, the sensor 48 is connected to the voice coil motor 463, the sensor piece 47 is connected to the sliding base 462, and the sensor 48 is used for sensing the sensor piece 47 so as to detect the sensor piece 47 through the sensor 48 to determine the position of the sliding base 462 and ensure the accuracy of the lifting movement of the sliding base 462.

In one embodiment, inductor 48 is mounted on rotating base 41. In some embodiments, the inductor 48 may be fixedly coupled to the voice coil motor 463.

In one embodiment, referring to fig. 4 and 5, the rotary swing arm mechanism 4 further includes a scale grating 49 and a grating reading head 40, the scale grating 49 is mounted on the sliding base 462, and the grating reading head 40 is connected to a voice coil motor 463 to determine the position of the sliding base 462 and ensure the accuracy of the lifting movement of the sliding base 462.

In one embodiment, the grating reader head 40 is mounted on a rotating base 41. In some embodiments, the grating reader 40 may be fixedly coupled to the voice coil motor 463.

In one embodiment, referring to fig. 2, 3 and 5, the number of the suction nozzles 42, the supporting arms 43, the adjusting units 45 and the camera mechanisms 5 are correspondingly arranged; the number of the supporting arms 43 is plural, and the plurality of supporting arms 43 are uniformly distributed on the peripheral side of the rotating base 41. With the structure, the plurality of suction nozzles 42 can realize synchronous operation of chip suction and die bonding, thereby improving die bonding efficiency. In some embodiments, the number of the supporting arms 43 may be one or more, etc., and is not limited herein. For example, when the number of the suction nozzles 42, the support arms 43, the adjusting unit 45, and the camera mechanism 5 is two, one suction nozzle 42 sucks a chip on a wafer-bonding position, and the other suction nozzle 42 can place the sucked chip on a wafer-bonding position to realize wafer bonding; subsequently, the rotary driver 44 drives the rotary base 41 to rotate 180 degrees, so that the positions of the two suction nozzles 42 are exchanged, and the above operation is repeated, thereby effectively improving the die bonding efficiency. By analogy, when the number of the suction nozzles 42, the number of the supporting arms 43, the number of the adjusting units 45, and the number of the camera mechanisms 5 are all three, the angle of the rotary driver 44 driving the rotary base 41 to rotate may be 120 degrees, which is not described in detail herein.

In one embodiment, referring to fig. 7 and 8, the camera mechanism 5 includes a camera lens 51 and a fixing base 52 for supporting the camera lens 51; the camera lens 51 is disposed below the rotation track of the suction nozzle 42, and the fixing base 52 is mounted on the frame 100. With this structure, the camera lens 51 can be supported and fixed by the fixing base 52. By arranging the camera lens 51 below the rotation track of the suction nozzle 42, the position of the chip on the suction nozzle 42 can be clearly photographed, so that the correct judgment of the chip position can be realized. If the position of the chip deviates, the camera mechanism 5 sends an instruction to the adjusting unit 45, and adjusts the position of the suction nozzle 42, so as to adjust the chip to the correct position, which is helpful for improving the die bonding precision.

In an embodiment, referring to fig. 7 and 8, as a specific implementation manner of the die bonder with automatic chip correction provided in the embodiment of the present application, the image capturing mechanism 5 further includes a camera lifting unit 53 for driving the fixing base 52 to lift, a camera traverse unit 54 for driving the camera lifting unit 53 to move laterally, and a camera longitudinal unit 55 for driving the camera traverse unit 54 to move longitudinally; the camera vertical movement unit 55 is mounted on the frame 100, the camera horizontal movement unit 54 is slidably mounted on the camera vertical movement unit 55, the camera elevation unit 53 is slidably mounted on the camera horizontal movement unit 54, and the fixing base 52 is mounted on the camera elevation unit 53. With this configuration, the position adjustment of the camera lens 51 in the three directions of the XYZ axes can be realized by the camera elevation unit 53, the camera lateral-movement unit 54, and the camera longitudinal-movement unit 55.

In one embodiment, referring to fig. 8, the camera lifting unit 53 includes a first positioning seat 531 mounted on the camera traverse unit 54, a first slide rail 532 mounted on the first positioning seat 531, and a first push rod 533 for pushing the fixing seat 52; the fixing base 52 is mounted on the first sliding rail 532, and the first push rod 533 is movably mounted on the first positioning base 531. With this structure, when the length of the first push rod 533 is adjusted, the first push rod 533 can push the fixing base 52 to lift along the first slide rail 532, so as to adjust the position of the camera lens 51 in the Z-axis direction.

In one embodiment, referring to fig. 8, the camera lifting unit 53 further includes a first clamping seat 534 for clamping the first push rod 533 and a first lock rod 535 for controlling the tightness degree of the first clamping seat 534, the first clamping seat 534 is installed on the first positioning seat 531, the first clamping seat 534 is sleeved on the first push rod 533, and the first lock rod 535 is installed on the first clamping seat 534. With this structure, when the first lock lever 535 is opened, the first clamping seat 534 is released, so that the position of the first push rod 533 can be adjusted; when the first lock lever 535 is closed, the first clamping seat 534 clamps, and clamping fixation of the first push rod 533 is realized.

In one embodiment, referring to fig. 8, the camera lifting unit 53 further includes a first spring (not shown) connecting the fixing base 52 and the first positioning base 531. This structure can play certain spacing buffering guard action through first spring.

In one embodiment, referring to fig. 8, the camera traverse unit 54 includes a second positioning seat 541 mounted on the camera longitudinal movement unit 55, a second slide rail 542 mounted on the second positioning seat 541, a sliding seat 543 mounted on the second slide rail 542, and a second push rod 544 for pushing the sliding seat 543 to move; the first positioning seat 531 is mounted on the sliding seat 543, and the second push rod 544 is movably mounted on the second positioning seat 541. With this structure, when the length of the second push rod 544 is adjusted, the second push rod 544 can push the sliding seat 543 to move along the second slide rail 542, so as to drive the camera lifting unit 53 to move along the X-axis direction, thereby implementing the movement of the camera lens 51 along the X-axis direction.

In one embodiment, referring to fig. 8, the camera traverse unit 54 further includes a second clamping seat 545 for clamping the second push rod 544 and a second lock bar 546 for controlling the tightness of the second clamping seat 545, wherein the second clamping seat 545 is installed on the second positioning seat 541, the second clamping seat 545 is sleeved on the second push rod 544, and the second lock bar 546 is installed on the second clamping seat 545. With this structure, when the second lock lever 546 is opened, the second clamp 545 is released, so that the position of the second push rod 544 can be adjusted; when the second lock lever 546 is closed, the second clamping seat 545 clamps, and clamping fixation of the second push rod 544 is achieved.

In one embodiment, referring to fig. 8, the camera traverse unit 54 further includes a second spring 547 connecting the sliding seat 543 and the second positioning seat 541. With the structure, the second spring 547 can play a certain limiting and buffering protection role.

In one embodiment, referring to fig. 8, the camera longitudinal moving unit 55 includes a third positioning seat 551, a third slide rail 552 mounted on the third positioning seat 551, and a third push rod 553 for pushing the second positioning seat 541; the second positioning seat 541 is mounted on the third sliding rail 552, and the third pushing rod 553 is movably mounted on the third positioning seat 551. With this structure, when the length of the third push rod 553 is adjusted, the third push rod 553 can push the second positioning seat 541 to move along the third slide rail 552, so as to drive the camera traverse unit 54 to traverse along the Y-axis direction, thereby realizing the traverse of the camera lens 51 along the Y-axis direction.

In one embodiment, referring to fig. 8, the camera longitudinal moving unit 55 further includes a third clamping seat 554 for clamping the third push rod 553, and a third lock bar 555 for controlling the degree of tightness of the third clamping seat 554, wherein the third clamping seat 554 is installed on the third positioning seat 551, the third clamping seat 554 is sleeved on the third push rod 553, and the third lock bar 555 is installed on the third clamping seat 554. With this structure, when the third locking lever 555 is opened, the third clamping seat 554 is released, which facilitates the adjustment of the position of the third push rod 553; when the third locking lever 555 is closed, the third clamping seat 554 is clamped, and clamping fixation of the third push rod 553 is achieved.

In one embodiment, referring to fig. 8, the camera longitudinal moving unit 55 further includes a third spring 556 connecting the second positioning seat 541 and the third positioning seat 551. This structure can play certain spacing buffering guard action through third spring 556.

In one embodiment, referring to fig. 7 and 8, the image capturing mechanism 5 further includes a light source 56, an adjusting rod 57 mounted on the fixing base 52, and a reflector 58 mounted at the front end of the camera lens 51, wherein the light source 56 is mounted on the adjusting rod 57, and the light source 56 and the camera lens 51 are arranged in an inclined manner at an angle of 45 °. With this configuration, the light source 56 can provide illumination; the adjustment lever 57 can adjust the angle of the light source 56; the reflector 58 may reflect light to a chip location on the suction nozzle 42 to take a picture of the chip location.

In one embodiment, referring to fig. 9, the feeding mechanism 1 includes a magazine 11 for accommodating a support, a support base 12 for supporting the magazine 11, a pushing unit 13 for pushing the support to the fixture mechanism 2, and a magazine lifting unit 14 for driving the support base 12 to lift; the pushing unit 13 is mounted on the frame 100, the magazine lifting unit 14 is mounted on the frame 100, and the magazine lifting unit 14 is connected to the support base 12. With the structure, the support of a plurality of brackets can be realized through the material box 11; the support in the material box 11 can be pushed to the clamp mechanism 2 through the material pushing unit 13; the material box lifting unit 14 can drive the material box 11 to lift, so that the position of the material box 11 can be adjusted.

In one embodiment, referring to fig. 9, two ends of the supporting base 12 are respectively provided with a baffle 121, and the two baffles 121 are arranged in parallel and spaced apart. Each baffle 121 is rotatably mounted with a plurality of first rollers 122, a first belt 123 connecting the plurality of first rollers 122, and a first roller motor 124 for driving one first roller 122 to rotate, one first roller 122 is mounted on a main shaft of the first roller motor 124, and the first roller motor 124 is mounted on the baffle 121. With the structure, when the pushing unit 13 pushes the support out of the magazine 11, the two first conveyor belts 123 can support the two ends of the support, and the support is transferred from the feeding mechanism 1 to the clamping mechanism 2 under the driving of the two first rotary wheel motors 124.

In one embodiment, referring to fig. 9, the pushing unit 13 includes a bottom plate 131 installed on the frame 100, a sliding plate 132 slidably installed on the bottom plate 131, a pushing cylinder 133 for driving the sliding plate 132 to move up and down, and a pushing rod 134 installed on the sliding plate 132; the pushing cylinder 133 is installed on the bottom plate 131, and the pushing cylinder 133 is connected to the sliding plate 132. With the structure, the pushing cylinder 133 can drive the sliding plate 132 to lift, so that the height of the pushing rod 134 can be adjusted. The rack in the magazine 11 can be pushed out by means of the ejector pins 134. Wherein, the material pushing rod 134 can be connected with an air cylinder, an electric cylinder, an oil cylinder and the like.

In one embodiment, referring to fig. 9, the magazine lifting unit 14 includes a support frame 141 mounted on the rack 100, a magazine screw 142 mounted on the support frame 141, a magazine slider 143 mounted on the magazine screw 142, and a screw motor 144 for driving the magazine screw 142 to rotate; the supporting seat 12 is installed on the magazine slider 143, the lead screw motor 144 is installed on the supporting frame 141, and the lead screw motor 144 is connected with the magazine lead screw 142. With the structure, the feed box screw 142 is driven to rotate by the screw motor 144, so that the feed box sliding block 143 and the supporting seat 12 can be driven to lift, and the adjustment precision is high.

In some embodiments, the magazine lifting unit 14 may also employ a linear slide motor, a lifting motor, or the like. In some embodiments, the magazine lifting unit 14 may also be an air cylinder, an electric cylinder, an oil cylinder, etc. to directly drive the support base 12 to lift.

In one embodiment, referring to fig. 10, the gripper mechanism 2 includes a gripping base 21 for supporting the rack, a gripper traverse unit 22 for driving the gripping base 21 to traverse, and a gripper longitudinal movement unit 23 for driving the gripper traverse unit 22 to longitudinally move; the clamp base 21 is mounted on the clamp traverse unit 22, the clamp traverse unit 22 is mounted on the clamp longitudinal moving unit 23, and the clamp longitudinal moving unit 23 is mounted on the rack 100. With the structure, the feeding mechanism 1 can convey the bracket to the clamping base 21 to realize supporting; the fixture transverse moving unit 22 and the fixture longitudinal moving unit 23 can realize the movement of the support along the XY axis direction, and further realize the adjustment of the position of the support.

In one embodiment, referring to fig. 11, the clamping base 21 includes a substrate 211, risers 212 installed at two ends of the substrate 211, two abutting blocks 213 installed on the substrate 211 at intervals, and an abutting motor 214 for driving each abutting block 213 to move up and down, wherein each abutting motor 214 is installed on the substrate 211, and each abutting motor 214 is connected to a corresponding abutting block 213. A plurality of second rotating wheels 215 and a second conveyor belt 216 connected with the plurality of second rotating wheels 215 are rotatably mounted on each vertical plate 212. A second wheel 215 on one riser 212 is connected to a corresponding second wheel 215 on the other riser 212 by a connecting shaft 217; a second wheel motor 218 is mounted to one of the risers 212, and the second wheel motor 218 is coupled to a second wheel 215 via a gear assembly. With this structure, the second rotating wheel motors 218 can drive the second rotating wheels 215 to rotate, so as to drive the second conveyor belt 216 to rotate. The rack conveyed from the feeding mechanism 1 is transferred onto the two second conveyors 216, and the two second conveyors 216 support both ends of the rack. When the two second conveyors 216 move, the rack can be moved to the die bonding position. The propping block 213 is driven to lift by the propping motor 214, so that the height of the bracket can be adjusted.

In one embodiment, referring to fig. 10, the jig traverse unit 22 includes a jig traverse base 221 installed on the jig traverse unit 23, a first electromagnet group 222 installed on the jig traverse base 221, jig traverse rails 223 installed at both ends of the jig traverse base 221, and a first magnet block (not shown) installed at the bottom of the substrate 211, the first electromagnet group 222 being disposed between the two jig traverse rails 223, and the substrate 211 being installed on the two jig traverse rails 223. With the structure, the first electromagnet group 222 is matched with the first magnet block, so that the clamping base 21 can be driven to reciprocate along the direction of the transverse moving guide rail 223 of the clamp, and the support can be driven to move along the X-axis direction.

In one embodiment, referring to fig. 10, the clamp longitudinally moving unit 23 includes a clamp longitudinally moving base 231 mounted on the frame 100, a second electromagnet group 232 mounted on the clamp longitudinally moving base 231, clamp longitudinally moving guide rails 233 mounted at both ends of the clamp longitudinally moving base 231, and a second magnet block (not shown) mounted at the bottom of the clamp transversely moving base 221, wherein the second electromagnet group 232 is disposed between the two clamp longitudinally moving guide rails 233, and the clamp transversely moving base 221 is mounted on the two clamp longitudinally moving guide rails 233. With this structure, the second electromagnet group 232 is engaged with the second magnet block, so that the holder traverse moving base 221 can be driven to reciprocate along the holder longitudinal moving guide rail 233, and the holder can be driven to move along the Y-axis direction.

In some embodiments, the clamp traverse unit 22 and the clamp longitudinal moving unit 23 may also be a screw driving mechanism, a cylinder pushing mechanism, an electric cylinder pushing mechanism, or an oil cylinder pushing mechanism, etc., which are not limited herein.

In an embodiment, referring to fig. 11 and 12, the wafer supplying mechanism 3 includes a rotating frame 31 for carrying a wafer ring, a carrying seat 32 for supporting the rotating frame 31, a wafer ring rotating unit 33 for driving the rotating frame 31 to rotate, an ejector pin unit 34 for ejecting out a chip on the wafer ring, a wafer ring traversing unit 35 for driving the carrying seat 32 to traverse, and a wafer ring longitudinally moving unit 36 for driving the carrying seat 32 to longitudinally move; the rotary crystal frame 31 is rotatably mounted on the bearing seat 32, the thimble unit 34 is mounted on the frame 100, the crystal ring rotating unit 33 is mounted on the bearing seat 32, the crystal ring rotating unit 33 is connected with the rotary crystal frame 31, the bearing seat 32 is connected with the crystal ring transverse moving unit 35, and the crystal ring transverse moving unit 35 is mounted on the crystal ring longitudinal moving unit 36. With the structure, the crystal ring rotating unit 33 drives the rotating crystal frame 31 to rotate, and the crystal ring transverse moving unit 35 is matched with the crystal ring longitudinal moving unit 36, so that the position of the crystal ring can be adjusted, and the ejector pin unit 34 can eject chips at different positions on the crystal ring.

In one embodiment, referring to fig. 12, the wafer ring rotating unit 33 includes a wafer ring rotating motor 331 installed on the carrier 32 and a belt 332 connecting the rotating frame 31 and a spindle of the wafer ring rotating motor 331. With this structure, the wafer ring rotating motor 331 can drive the rotating wafer frame 31 to rotate on the carrying seat 32 through the belt 332. The outer peripheral surface of the rotary crystal frame 31 is provided with a saw-toothed structure to increase the friction force with the belt 332 and prevent slipping.

In one embodiment, referring to fig. 12, the wafer ring traversing unit 35 includes a traversing receiving base 351 mounted on the wafer ring traversing unit 36, a traversing screw 352 mounted on the traversing receiving base 351, a traversing slider 353 mounted on the traversing screw 352, and a wafer ring traversing motor 354 for driving the traversing screw 352 to rotate; the wafer ring traversing motor 354 is arranged on the traversing bearing seat 351, the wafer ring traversing motor 354 is connected with the traversing lead screw 352, and the bearing seat 32 is arranged on the traversing slide block 353. With the structure, when the wafer ring traversing motor 354 drives the traversing screw rod 352 to rotate, the traversing slider 353 can be driven to reciprocate along the X-axis direction, so as to drive the bearing seat 32 and the wafer ring to move along the X-axis direction, and the movement reliability and the precision are good.

In one embodiment, referring to fig. 12, the wafer ring longitudinal movement unit 36 includes a longitudinal movement receptacle 361 installed on the frame 100, a longitudinal movement screw 362 installed on the longitudinal movement receptacle 361, a longitudinal movement slider 363 installed on the longitudinal movement screw 362, and a wafer ring longitudinal movement motor 364 driving the longitudinal movement screw 362 to rotate; the wafer ring longitudinal movement motor 364 is installed on the longitudinal movement bearing seat 361, the wafer ring longitudinal movement motor 364 is connected with the longitudinal movement screw rod 362, and the transverse movement bearing seat 351 is installed on the longitudinal movement sliding block 363. With the structure, when the wafer ring longitudinal movement motor 364 drives the longitudinal movement screw 362 to rotate, the longitudinal movement slider 363 can be driven to reciprocate along the Y-axis direction, so as to drive the wafer ring transverse movement unit 35 and the wafer ring to move along the Y-axis direction, and the movement reliability and the precision are good.

In one embodiment, referring to fig. 13, the thimble unit 34 includes a thimble 341, a thimble lifting driver 342 connected to the thimble 341, a thimble base 343 supporting the thimble lifting driver 342, and a thimble traversing driver 344 and a thimble longitudinally moving driver 345 respectively mounted on the thimble base 343. With the structure, the ejector pin 341 can be driven to ascend and descend by the ejector pin ascending and descending driver 342, so that chips at different positions on the wafer ring can be ejected. The needle lifting driver 342, the needle traversing driver 344, and the needle longitudinally moving driver 345 may be motors.

In one embodiment, referring to fig. 1, the die bonder with automatic correction for chips further includes a ring feeding mechanism 6 for feeding a ring and a ring transferring mechanism 7 for transferring the ring from the ring feeding mechanism 6 to the ring feeding mechanism 3; the crystal ring feeding mechanism 6 and the crystal ring transferring mechanism 7 are respectively installed on the frame 100, and the crystal ring transferring mechanism 7 is arranged between the crystal ring feeding mechanism 6 and the crystal supply mechanism 3. This structure moves material mechanism 7 through brilliant ring feed mechanism 6 and brilliant ring and can realize the brilliant ring of automatic supply, can replace the operation of artifical manual supply brilliant ring, labour saving and time saving, the cost of labor is low.

In one embodiment, referring to fig. 14, the ring feeding mechanism 6 includes a feeding frame 61 mounted on the frame 100, a feeding screw 62 mounted on the feeding frame 61, a feeding slide 63 mounted on the feeding screw 62, a feeding motor 64 for driving the feeding screw 62 to rotate, and a ring frame 65 connected to the feeding slide 63; the feeding motor 64 is installed on the feeding frame 61, and the feeding motor 64 is connected with the feeding screw 62. In this structure, the wafer ring holder 65 is used for accommodating a plurality of wafer rings; the feeding motor 64 drives the feeding screw rod 62 to rotate, and can drive the feeding slide block 63 and the crystal ring frame 65 to lift, so that the height of each crystal ring can be changed, and the crystal ring moving mechanism 7 can pick up the crystal rings conveniently.

In one embodiment, referring to fig. 15, the die ring transferring mechanism 7 includes a transferring frame 71 mounted on the frame 100, a transferring screw 72 mounted on the transferring frame 71, a transferring motor 73 for driving the transferring screw 72 to rotate, a transferring slider 74 mounted on the transferring screw 72, a transferring base 75 mounted on the transferring slider 74, a lower clamping plate 76 mounted on the transferring base 75, a clamping motor 77 mounted on the transferring base 75, and an upper clamping plate 78 connected to the clamping motor 77; the material moving motor 73 is arranged on the material moving frame 71, and the material moving motor 73 is connected with the material moving screw rod 72. With the structure, the material clamping motor 77 can drive the upper clamping plate 78 to move, so that the upper clamping plate 78 can be close to or far away from the lower clamping plate 76, and the wafer ring can be clamped and released. The material moving motor 73 drives the material moving screw rod 72 to rotate, and can drive the material moving slide block 74 and the material moving seat 75 to move together, so that the crystal rings can be moved from the crystal ring feeding mechanism 6 to the crystal feeding mechanism 3.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. Chip automatic correction formula solid brilliant machine, its characterized in that includes:

a frame (100);

the feeding mechanism (1) is arranged on the rack (100) and is used for supplying a bracket;

the clamp mechanism (2) is arranged on the rack (100) and is used for transferring the bracket conveyed by the feeding mechanism (1) to a die bonding position;

the crystal supply mechanism (3) is arranged on the rack (100) and is used for supplying chips to a crystal supply position;

the rotary swing arm mechanism (4), the rotary swing arm mechanism (4) comprises a rotary base (41), a suction nozzle (42) for sucking the chip, a supporting arm (43) for supporting the suction nozzle (42), a rotary driver (44) for driving the supporting arm (43) to horizontally rotate so that the suction nozzle (42) passes through the die bonding position and the die supply position in a reciprocating manner, and an adjusting unit (45) for driving the suction nozzle (42) to rotate so as to correct the position of the chip; the rotating base (41) is connected with the rotating driver (44), the rotating driver (44) is installed on the rack (100), the supporting arm (43) is connected with the rotating base (41), the adjusting unit (45) is installed on the supporting arm (43), and the adjusting unit (45) is connected with the suction nozzle (42);

and the camera shooting mechanism (5) is arranged on the rack (100), is positioned between the die bonding position and the die supplying position, and is used for acquiring the position information of the chip on the suction nozzle (42).

2. The die bonder with automatic correction according to claim 1, wherein: the adjusting unit (45) comprises a driving wheel (451), a pneumatic clamp (453) used for pneumatically disassembling and assembling the suction nozzle (42), a driven wheel (452) sleeved on the pneumatic clamp (453), a synchronous belt (454) connected with the driving wheel (451) and the driven wheel (452), and an adjusting motor (455) used for driving the driving wheel (451) to rotate; the pneumatic clamp (453) is rotatably mounted on the supporting arm (43), the adjusting motor (455) is mounted on the rotating base (41), and the driving wheel (451) is mounted on a main shaft of the adjusting motor (455).

3. The die bonder with automatic correction according to claim 1, wherein: the camera shooting mechanism (5) comprises a camera lens (51) and a fixed seat (52) for supporting the camera lens (51); the camera lens (51) is arranged below the rotation track of the suction nozzle (42), and the fixed seat (52) is arranged on the rack (100).

4. The die bonder with automatic correction according to claim 3, wherein: the camera shooting mechanism (5) further comprises a camera lifting unit (53) used for driving the fixed seat (52) to lift, a camera transverse moving unit (54) used for driving the camera lifting unit (53) to transversely move, and a camera longitudinal moving unit (55) used for driving the camera transverse moving unit (54) to longitudinally move; the camera longitudinal moving unit (55) is installed on the rack (100), the camera transverse moving unit (54) is installed on the camera longitudinal moving unit (55), the camera lifting unit (53) is installed on the camera transverse moving unit (54), and the fixing seat (52) is installed on the camera lifting unit (53).

5. The die bonder with automatic correction according to any one of claims 1 to 4, wherein: the feeding mechanism (1) comprises a material box (11) for accommodating the support, a supporting seat (12) for supporting the material box (11), a material pushing unit (13) for pushing the support to the clamp mechanism (2) and a material box lifting unit (14) for driving the supporting seat (12) to lift; the material pushing unit (13) is installed on the rack (100), the material box lifting unit (14) is installed on the rack (100), and the supporting seat (12) is installed on the material box lifting unit (14).

6. The die bonder with automatic correction according to any one of claims 1 to 4, wherein: the clamp mechanism (2) comprises a clamping base (21) for supporting the bracket, a clamp transverse moving unit (22) for driving the clamping base (21) to transversely move and a clamp longitudinal moving unit (23) for driving the clamp transverse moving unit (22) to longitudinally move; the clamping base (21) is arranged on the clamp transverse moving unit (22), the clamp transverse moving unit (22) is arranged on the clamp longitudinal moving unit (23), and the clamp longitudinal moving unit (23) is arranged on the rack (100).

7. The die bonder with automatic correction according to any one of claims 1 to 4, wherein: the crystal supply mechanism (3) comprises a rotary crystal frame (31) for bearing a crystal ring, a bearing seat (32) for supporting the rotary crystal frame (31), a crystal ring rotating unit (33) for driving the rotary crystal frame (31) to rotate, an ejector pin unit (34) for ejecting a chip on the crystal ring, a crystal ring transverse moving unit (35) for driving the bearing seat (32) to transversely move, and a crystal ring longitudinal moving unit (36) for driving the bearing seat (32) to longitudinally move; the rotary crystal frame (31) is rotatably arranged on the bearing seat (32), the thimble unit (34) is arranged on the rack (100), the crystal ring rotating unit (33) is arranged on the bearing seat (32), the crystal ring rotating unit (33) is connected with the rotary crystal frame (31), the bearing seat (32) is arranged on the crystal ring transverse moving unit (35), and the crystal ring transverse moving unit (35) is arranged on the crystal ring longitudinal moving unit (36).

8. The die bonder with automatic correction according to any one of claims 1 to 4, wherein: the chip automatic correction type die bonder further comprises a die ring feeding mechanism (6) for supplying die rings and a die ring transferring mechanism (7) for transferring the die rings on the die ring feeding mechanism (6) to the die feeding mechanism (3); the crystal ring feeding mechanism (6) and the crystal ring moving mechanism (7) are respectively arranged on the rack (100), and the crystal ring moving mechanism (7) is arranged between the crystal ring feeding mechanism (6) and the crystal supply mechanism (3).

9. The die bonder with automatic correction according to claim 8, wherein: the crystal ring feeding mechanism (6) comprises a feeding frame (61) arranged on the rack (100), a feeding screw rod (62) arranged on the feeding frame (61), a feeding slide block (63) arranged on the feeding screw rod (62), a feeding motor (64) used for driving the feeding screw rod (62) to rotate and a crystal ring frame (65) connected with the feeding slide block (63); the feeding motor (64) is installed on the feeding frame (61), and the feeding motor (64) is connected with the feeding screw rod (62).

10. The die bonder with automatic correction according to claim 8, wherein: the crystal ring material moving mechanism (7) comprises a material moving frame (71) arranged on the rack (100), a material moving screw rod (72) arranged on the material moving frame (71), a material moving motor (73) used for driving the material moving screw rod (72) to rotate, a material moving sliding block (74) arranged on the material moving screw rod (72), a material moving seat (75) arranged on the material moving sliding block (74), a lower clamping plate (76) arranged on the material moving seat (75), an upper clamping plate (78) used for clamping the crystal ring in a matching way with the lower clamping plate (76), and a material clamping motor (77) used for driving the upper clamping plate (78) to be close to or far away from the lower clamping plate (76); the material moving motor (73) is installed on the material moving frame (71), the material moving motor (73) is connected with the material moving screw rod (72), the material clamping motor (77) is installed on the material moving seat (75), and the material clamping motor (77) is connected with the upper clamping plate (78).

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