CN213354276U - Vehicle-mounted refrigerator based on semiconductor refrigeration technology - Google Patents
Vehicle-mounted refrigerator based on semiconductor refrigeration technology Download PDFInfo
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- CN213354276U CN213354276U CN202021859036.2U CN202021859036U CN213354276U CN 213354276 U CN213354276 U CN 213354276U CN 202021859036 U CN202021859036 U CN 202021859036U CN 213354276 U CN213354276 U CN 213354276U
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Abstract
The utility model discloses an on-vehicle refrigerator based on semiconductor refrigeration technology, including on-vehicle refrigerator, on-vehicle refrigerator includes shell body and interior casing, attached insulation material on the inner wall of shell body, the attached connection of outer wall of interior casing insulation material, apron one end is passed through the hinge fastening and is in uncovered side, set up the refrigeration storehouse to sunken division to inside on the one end lateral wall of shell body, the shutter is installed to the outside opening part in refrigeration storehouse, set up the through-hole on the medial surface in refrigeration storehouse, the air conditioning passageway is connected to the medial extremity of through-hole, the air conditioning passageway is leading-in inside the interior casing, embedding installation semiconductor refrigeration piece on square through-hole's the inside casing structure, the refrigeration face orientation of semiconductor refrigeration piece the air conditioning passageway, attached a cold copper of leading on the refrigeration face of semiconductor refrigeration piece. In this way, the utility model discloses can reduce outside volume and weight on the basis of guaranteeing capacity, provide better refrigeration effect.
Description
Technical Field
The utility model relates to a refrigerator field especially relates to an on-vehicle refrigerator based on semiconductor refrigeration technology.
Background
The vehicle-mounted refrigerator is a refrigerated cabinet which can be carried on an automobile, the vehicle-mounted refrigerator is a new generation of refrigerating and cold-storage appliance popular in the international market in recent years, compared with a refrigerator used in a family, the vehicle-mounted refrigerator is smaller in volume and suitable for being carried by hands, the internal refrigerating principle of the vehicle-mounted refrigerator is the same as that of a conventional refrigerator and is a compressor refrigerating principle, the compressor refrigerating mechanism is a mainstream in the field of refrigerators for many years, but the volume and the weight of the compressor are larger, the vehicle-mounted refrigerator pursues lightness and easy carrying, and the defects of the vehicle-mounted refrigerator with the built-in compressor are very obvious: the semiconductor refrigeration chip has the advantages that the semiconductor refrigeration chip is large in size, large in weight and small in relative volume, a novel semiconductor refrigeration chip is sold in the market in recent years, the Peltier effect is the reverse process of the Seebeck effect, when a loop is formed by two different materials, one end of the loop absorbs heat, the other end of the loop emits heat, the semiconductor refrigeration material is small in size, small in occupied space and light in weight, and the vehicle-mounted refrigerator based on the semiconductor refrigeration technology can have humanized design functions.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides an on-vehicle refrigerator based on semiconductor refrigeration technology, can reduce outside volume and weight on the basis of guaranteeing capacity, provides better refrigeration effect.
In order to solve the technical problem, the utility model discloses a technical scheme be: the vehicle-mounted refrigerator based on the semiconductor refrigeration technology comprises a vehicle-mounted refrigerator, wherein the vehicle-mounted refrigerator comprises an outer shell and an inner shell, the outer shell is of a cuboid structure, the corner of the outer shell is designed in an arc structure, the inner shell is arranged in the outer shell, a layer of heat insulation material is attached to the inner wall of the outer shell, the outer wall of the inner shell is attached and connected with the heat insulation material, an opening is formed in the upper end face of the vehicle-mounted refrigerator, the upper end of the opening is covered and connected with a cover plate, one end of the cover plate is fixed to one side end of the opening through a hinge, a refrigeration bin is arranged on the side wall of one end of the outer shell in a concave mode, a shutter is installed at the opening of the outer side of the refrigeration bin, a square through hole is formed in the inner side face of, the utility model discloses a cooling device, including square through hole, semiconductor refrigeration piece, air conditioning channel, attached piece cold copper plate of leading on the refrigeration face of semiconductor refrigeration piece, lead and derive one row of thin copper sheet on the lateral surface of cold copper plate, cold air fan is installed to the outside end of thin copper sheet.
In a preferred embodiment of the present invention, a heat dissipating copper plate is attached to the other end of the semiconductor cooling plate, a row of compact heat dissipating copper sheets is disposed on the outer side of the heat dissipating copper plate, and a heat dissipating fan is installed at the outer end of the heat dissipating copper sheets.
In a preferred embodiment of the present invention, a pair of positive and negative power lines is led out from the upper end of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is powered by a 12V/5A dc power supply.
In a preferred embodiment of the present invention, the cooling surface and the heating surface of the semiconductor cooling plate are coated with heat-conducting silicone grease.
The utility model has the advantages that: the utility model discloses a novel technology supported's on-vehicle refrigerator of car, it is bulky owing to receive the compressor restriction and cause to have improved traditional on-vehicle refrigerator, shortcoming that weight is big, its inside refrigerating element has utilized semiconductor material's Peltier effect to produce the refrigeration effect, and the other end that generates heat has also designed corresponding effectual heat radiation structure, whole on-vehicle refrigerator and traditional compressor driven refrigerator contrast, have bigger space under equal outward appearance volume and remove storage article, and have lighter weight, the transport of being convenient for more.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
FIG. 1 is a schematic structural diagram of a preferred embodiment of the vehicular refrigerator based on semiconductor refrigeration technology of the present invention;
the parts in the drawings are numbered as follows: 1. a vehicle-mounted refrigerator; 2. an outer housing; 3. an inner housing; 4. a thermal insulation material; 5. opening the mouth; 6. a cover plate; 7. a refrigeration bin; 8. a blind window; 9. a square through hole; 10. a cold air passage; 11. a semiconductor refrigeration sheet; 12. a cold conducting copper plate; 13. a thin copper sheet; 14. a cold air fan; 15. a heat-dissipating copper plate; 16. a heat dissipation copper sheet; 17. a heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention includes:
a vehicle-mounted refrigerator based on a semiconductor refrigeration technology comprises a vehicle-mounted refrigerator 1, wherein the vehicle-mounted refrigerator 1 comprises an outer shell 2 and an inner shell 3, the outer shell 2 is of a cuboid structure, the corner of the outer shell 2 is designed in a circular arc structure, the inner shell 3 is arranged inside the outer shell 2, a layer of heat insulation material 4 is attached to the inner wall of the outer shell 2, the outer wall of the inner shell 3 is attached and connected with the heat insulation material 4, an opening 5 is formed in the upper end face of the vehicle-mounted refrigerator 1, the upper end of the opening 5 is covered with a connecting cover plate 6, one end of the cover plate 6 is fixed to one side end of the opening 5 through a hinge, a refrigeration bin 7 is formed in a manner that the side wall of one end of the outer shell 2 is inwards sunken, a blind window 8 is installed at the opening of the outer side of the refrigeration bin 7, a square through hole, air conditioning passageway 10 is leading-in inside the interior casing 3, embedding installation semiconductor refrigeration piece 11 on square through hole 9's the inside casing structure, the refrigeration face orientation of semiconductor refrigeration piece 11 air conditioning passageway 10, attached cold copper plate 12 is led to one on the refrigeration face of semiconductor refrigeration piece 11, lead and derive one row of thin copper sheet 13 on the lateral surface of cold copper plate 12, cold air fan 14 is installed to the outside end of thin copper sheet 13.
In addition, a heat dissipation copper plate 15 is attached to the other end heating surface of the semiconductor refrigeration piece 11, a row of compact heat dissipation copper sheets 16 are arranged on the outer side surface of the heat dissipation copper plate 15, and a heat dissipation fan 17 is installed at the outer end of each heat dissipation copper sheet 16.
In addition, a pair of positive and negative power lines are led out from the upper end of the semiconductor refrigeration piece 11, and the semiconductor refrigeration piece 11 is powered by a 12V/5A direct current power supply.
In addition, heat-conducting silicone grease is coated on the refrigerating surface and the heating surface of the semiconductor refrigerating sheet 11.
The utility model discloses an operating principle is that on-vehicle refrigerator 1 includes shell body 2 and interior casing 3, shell body 2 is the cuboid structure, the circular arc structural design is taken to the corner of shell body 2, interior casing 3 is located inside shell body 2, attached one deck insulation material 4 on the inner wall of shell body 2, the attached insulation material 4 of connecting of the outer wall of interior casing 3, uncovered 5 is seted up to on-vehicle refrigerator 1's up end, uncovered 5 upper end covers connection cover plate 6, 6 one ends of apron are passed through the hinge fastening and are being uncovered 5 sides.
A refrigeration bin 7 is arranged on the side wall of one end of the outer shell 2 and is recessed inwards, a shutter 8 is installed at an opening of the outer side of the refrigeration bin 7, a square through hole 9 is formed in the inner side face of the refrigeration bin 7, the inner side end of the square through hole 9 is connected with a cold air channel 10, the cold air channel 10 is guided into the inner shell 3, and when the refrigerator is in a working state, cold air can be released from the cold air channel 10 and guided into the vehicle-mounted refrigerator.
A semiconductor refrigerating sheet 11 is embedded and mounted on an inner frame structure of a square through hole 9, a pair of positive and negative power lines are led out from the upper end of the semiconductor refrigerating sheet 11, the semiconductor refrigerating sheet 11 is powered by a 12V/5A direct current power supply, the semiconductor refrigerating sheet 11 is a plate-shaped chip made of semiconductor materials, the outer part of the semiconductor refrigerating sheet is packaged by plastic, the semiconductor refrigerating sheet 11 utilizes the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, the purpose of refrigeration can be achieved, and the refrigeration technology capable of generating negative thermal resistance is characterized by being free of moving parts and high in reliability.
Two smooth surfaces around semiconductor refrigeration piece 11 establishes altogether, one side is the refrigeration face, the opposite side is the face that generates heat, the refrigeration face of semiconductor refrigeration piece 11 is towards air conditioning passageway 10, attached a cold copper plate 12 of leading on the refrigeration face of semiconductor refrigeration piece 11, lead out a row of thin copper sheet 13 on the lateral surface of cold copper plate 12, cold air fan 14 is installed to the outside end of thin copper sheet 13, attached a heat dissipation copper 15 on the other end face that generates heat of semiconductor refrigeration piece 11, be equipped with a row of inseparable heat dissipation copper sheet 16 on the lateral surface of heat dissipation copper 15, a radiator fan 17 is installed to the outer end of heat dissipation copper sheet 16, heat dissipation copper 15 is the same with the structure of cold copper plate 12 of leading, its effect all is with the inside or the outside of refrigerator of the transmission of the air conditioning and the heat that semiconductor refrigeration piece 11 both.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (4)
1. A vehicle-mounted refrigerator based on a semiconductor refrigeration technology comprises the vehicle-mounted refrigerator and is characterized by comprising an outer shell and an inner shell, wherein the outer shell is of a cuboid structure, the corner of the outer shell is designed in a circular arc structure, the inner shell is arranged in the outer shell, a layer of heat insulation material is attached to the inner wall of the outer shell, the outer wall of the inner shell is attached and connected with the heat insulation material, an opening is formed in the upper end face of the vehicle-mounted refrigerator, a connecting cover plate covers the upper end of the opening, one end of the cover plate is fixed to one side end of the opening through a hinge, a refrigeration bin is arranged on the side wall of one end of the outer shell in a concave manner, a shutter is installed at the opening of the outer side of the refrigeration bin, a square through hole is formed in the inner side face of the refrigeration bin, the inner side, the utility model discloses a cooling device, including square through hole, semiconductor refrigeration piece, air conditioning channel, attached piece cold copper plate of leading on the refrigeration face of semiconductor refrigeration piece, lead and derive one row of thin copper sheet on the lateral surface of cold copper plate, cold air fan is installed to the outside end of thin copper sheet.
2. The vehicle-mounted refrigerator based on the semiconductor refrigeration technology as claimed in claim 1, wherein a heat dissipation copper plate is attached to the other end of the semiconductor refrigeration sheet, a row of compact heat dissipation copper sheets are arranged on the outer side face of the heat dissipation copper plate, and a heat dissipation fan is installed at the outer end of each heat dissipation copper sheet.
3. The vehicle-mounted refrigerator based on the semiconductor refrigeration technology as claimed in claim 1, wherein a pair of positive and negative power lines are led out from the upper end of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is powered by a 12V/5A direct current power supply.
4. The vehicle-mounted refrigerator based on the semiconductor refrigeration technology as claimed in claim 1, wherein heat-conducting silicone grease is coated on both the refrigerating surface and the heating surface of the semiconductor refrigeration sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021859036.2U CN213354276U (en) | 2020-08-31 | 2020-08-31 | Vehicle-mounted refrigerator based on semiconductor refrigeration technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021859036.2U CN213354276U (en) | 2020-08-31 | 2020-08-31 | Vehicle-mounted refrigerator based on semiconductor refrigeration technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213354276U true CN213354276U (en) | 2021-06-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021859036.2U Active CN213354276U (en) | 2020-08-31 | 2020-08-31 | Vehicle-mounted refrigerator based on semiconductor refrigeration technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213354276U (en) |
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2020
- 2020-08-31 CN CN202021859036.2U patent/CN213354276U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221207 Address after: No. 15, Caomiao Village, Weiji Town, Juning County, Xuzhou City, Jiangsu Province, 221,200 Patentee after: Sun Yanchun Patentee after: Wang Guojun Address before: 214000 No. 1101, 43 xuexiyuan, Binhu District, Wuxi City, Jiangsu Province Patentee before: Chen Yan |