CN213341562U - Modular bus capacitor assembly - Google Patents
Modular bus capacitor assembly Download PDFInfo
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- CN213341562U CN213341562U CN202021522559.8U CN202021522559U CN213341562U CN 213341562 U CN213341562 U CN 213341562U CN 202021522559 U CN202021522559 U CN 202021522559U CN 213341562 U CN213341562 U CN 213341562U
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Abstract
The utility model discloses embodiment provides a modular bus-bar capacitor subassembly belongs to high-power electronic device technical field. The bus capacitor assembly comprises a first laminated busbar, a second laminated busbar, a first transition copper bar and a second transition copper bar. The utility model provides a pair of modular generating line electric capacity subassembly is through the mode that adopts the female row of stromatolite and transition copper bar, has realized the interconnect between the female row of a plurality of stromatolites, has adapted to modular generating line electric capacity's structure, has reduced the female production and the assembly cost who arranges of stromatolite.
Description
Technical Field
The utility model relates to a high-power electronic device technical field specifically relates to a modular bus-bar capacitor subassembly.
Background
The bus capacitor is usually connected by a conventional bus bar or a laminated bus bar. The traditional busbar scheme has the defects of multiple installation operations, high error probability, insufficiently compact structure, large stray inductance, short service life and the like. Although the laminated busbar scheme can well solve the defects of the traditional busbar, under the same capacitance scheme and in application of different power levels, a plurality of laminated busbars need to be designed, so that the cost of producing a clamp, a die and the like is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a modular bus-bar capacitor subassembly, this bus-bar capacitor subassembly can adapt to modular bus-bar capacitor structure, reduces female production and the assembly cost who arranges of stromatolite.
In order to achieve the above object, the present invention provides a modular bus capacitor assembly, including:
a first laminated busbar comprising:
at least one first wiring hole;
at least two second wiring holes, the second wiring holes having a larger aperture than the first wiring holes, the number of the second wiring holes being twice as many as the first wiring holes;
at least two third wiring holes and fourth wiring holes, the third wiring holes and the fourth wiring holes being used for connection with the outside, the fourth wiring holes having a larger aperture than the third wiring holes;
the female arranging of second stromatolite, set up in female arranging of first stromatolite and with female arranging coincidence arrangement of first stromatolite includes:
at least one second wiring hole;
the positions of a second wiring hole on the second laminated busbar and a first wiring hole on the first laminated busbar are the same, and the positions of a first wiring hole on the second laminated busbar and a second wiring hole on the first laminated busbar are the same;
at least two third wiring holes and fourth wiring holes;
the first transition copper bar is connected with the third wiring holes or the fourth wiring holes of two adjacent first laminated busbars and comprises at least two first wiring holes and at least two second wiring holes;
the second transition copper bar set up in on the first transition copper bar and with first transition copper bar coincidence is arranged, includes:
at least two first wiring holes;
and the positions of the first wiring hole and the second wiring hole on the second transition copper bar are opposite to the positions of the first wiring hole and the second wiring hole on the first transition copper bar.
Optionally, the second wiring holes are disposed on two sides of each first wiring hole on the first laminated busbar.
Optionally, the bus capacitor assembly further includes a plurality of copper pads, and the negative terminal of the bus capacitor passes through the second wiring hole on the second laminated busbar through the copper pads to be connected to the first wiring hole on the first laminated busbar.
Optionally, a first wiring hole on the second transition copper bar passes through a second wiring hole on the first transition copper bar through the copper pad and is connected with a third wiring hole on the first laminated busbar.
Optionally, the first wiring hole on the first transition copper bar passes through the fourth wiring hole on the first laminated busbar through the copper pad and is connected to the third wiring hole on the second laminated busbar.
Optionally, the bus capacitor further includes a substrate, a positive polarity terminal and a negative polarity terminal, one of the positive polarity terminal and the negative polarity terminal is disposed in a middle portion of the substrate, and the other of the positive polarity terminal and the negative polarity terminal is disposed on both sides of the one on the substrate, and the number of the other is twice as large as the number of the one.
Through the technical scheme, the utility model provides a pair of modular bus-bar capacitor subassembly is through the mode that adopts the female row of stromatolite and transition copper bar, has realized the interconnect between the female row of a plurality of stromatolites, has adapted to modular bus-bar capacitor's structure, has reduced female production and the assembly cost who arranges of stromatolite.
Other features and advantages of embodiments of the present invention will be described in detail in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention, but do not constitute a limitation of the embodiments of the invention. In the drawings:
fig. 1 is a schematic structural view of a modular bus capacitor assembly according to an embodiment of the present invention;
fig. 2 is a top view of a modular laminated busbar according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a laminated busbar according to an embodiment of the present invention;
fig. 4 is an exploded view of a laminated busbar according to an embodiment of the present invention;
fig. 5 is a structural diagram of a bus bar capacitor according to an embodiment of the present invention; and
fig. 6 is a structural diagram of a bus bar capacitor according to an embodiment of the present invention.
Detailed Description
The following describes in detail embodiments of the present invention with reference to the accompanying drawings. It is to be understood that the description herein is merely for purposes of illustration and explanation and is not intended to limit the embodiments of the present invention.
In the embodiments of the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, top, and bottom" is generally used with respect to the orientation shown in the drawings or the positional relationship between the components in the vertical, or gravitational direction.
In addition, if there is a description in the embodiments of the present invention referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments can be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a modular bus capacitor assembly according to an embodiment of the present invention. In fig. 1, the bus bar capacitor assembly may include a first laminated bus bar 10, a second laminated bus bar 20, a first transition copper bar 30, and a second transition copper bar 40.
As shown in fig. 2, which is a plan view of the first laminated busbar 10 and the first transition copper bar 30, the first laminated busbar 10 may include at least one first wiring hole 11, at least two second wiring holes 12, at least two third wiring holes 13, and a fourth wiring hole 14. The second wiring hole 12 has a larger diameter than the first wiring hole 11, and the number of the second wiring holes 12 may be twice as many as the first wiring holes 11. At least two third wiring holes 13 and fourth wiring holes 14. The third and fourth wiring holes 13 and 14 may be used for connection with the outside, and the fourth wiring hole 14 may have a larger aperture than the third wiring hole 13. The second laminated busbar 20 may be disposed under the first laminated busbar 10 and arranged in a manner of being overlapped with the first laminated busbar 10, and includes at least one second wiring hole 12, at least two second wiring holes 11, at least two third wiring holes 13, and a fourth wiring hole 14. The positions of the second wiring hole 12 on the second laminated busbar 20 and the first wiring hole 11 on the first laminated busbar 10 are the same, and the positions of the first wiring hole 11 on the second laminated busbar 20 and the second wiring hole 12 on the first laminated busbar 10 are the same.
The first transition copper bar 30 may be connected to the third wiring holes 13 or the fourth wiring holes 14 of two adjacent first laminated busbars 20, and includes at least two first wiring holes 11 and at least two second wiring holes 12. The second transition copper bar 40 may be disposed on the first transition copper bar 30 and arranged in a manner of being overlapped with the first transition copper bar 30, and includes at least two first wiring holes 11 and at least two second wiring holes 12. The positions of the first wiring hole 11 and the second wiring hole 12 on the second transition copper bar 40 are opposite to the positions of the first wiring hole 11 and the second wiring hole 12 on the first transition copper bar 30.
In one embodiment of the present invention, in order to adapt to the structure of the bus bar capacitor 50, as shown in fig. 2, second wiring holes 12 are provided on both sides of each first wiring hole 11 on the first laminated busbar 10.
In one embodiment of the present invention, to facilitate connection, the bus capacitor assembly may further include a plurality of copper pads 60, as shown in fig. 3. In fig. 3, the negative terminal 52 of the bus capacitor 50 is connected to the first wiring hole 11 of the first laminated bus bar 10 through the second wiring hole 12 of the second laminated bus bar 20 via the copper pad 60.
Correspondingly, as shown in fig. 4, the first wiring hole 11 on the second transition copper bar 20 may pass through the second wiring hole 12 on the first transition copper bar 10 through the copper pad 60 to be connected to the third wiring hole 13 on the first laminated bus bar 10. The first wiring hole 11 on the first transition copper bar 10 can pass through the fourth wiring hole 14 on the first laminated busbar 10 through the copper pad 60 to be connected with the third wiring hole 13 on the second laminated busbar 20.
In one embodiment of the present invention, in order to facilitate the connection between the copper bars, the back surfaces of the third and fourth wiring holes 13 and 14 may be provided with press-fit nuts.
In the embodiment of the present invention, the bus capacitor 50 may have a structure as shown in fig. 5. In fig. 5, the bus capacitor 30 may include a substrate 53, a positive terminal 51, and a negative terminal 52. Both the positive terminal 51 and the negative terminal 52 may be disposed on the substrate 53. One of the positive polarity terminal 51 and the negative polarity terminal 52 may be twice as many as the other, and the one may be uniformly distributed at both sides of the other. In fig. 5, since the conventional single polarity terminal is split into a plurality of polarity terminals, the single capacitor is also equivalent to a plurality of capacitors connected in parallel, which makes the parasitic inductance greatly reduced (by 50%) relative to the single capacitor when a voltage overshoot is generated instantaneously by a switching device connected to the first laminated busbar 10 or the second laminated busbar 20 after the dc bus (the first laminated busbar 10 or the second laminated busbar 20) is connected. Therefore, the structure as shown in fig. 3 can reduce the parasitic inductance between the capacitor of the dc bus and the switching device greatly.
Further, when designing the structure shown in fig. 5, the utility model has found that the parasitic inductance can be further reduced if the positive polarity terminal 51 and the negative polarity terminal 52 in the structure shown in fig. 6 are connected correspondingly. Therefore, the utility model discloses the structure of bus capacitor 50 as shown in fig. 6. In fig. 4, the other one, half the number of which is one, is connected to each other, and the positive polarity terminal 51 or the negative polarity terminal 52 positioned on both sides of the other one are connected to each other, respectively.
Through the technical scheme, the utility model provides a pair of modular bus-bar capacitor subassembly is through the mode that adopts the female row of stromatolite and transition copper bar, has realized the interconnect between the female row of a plurality of stromatolites, has adapted to modular bus-bar capacitor's structure, has reduced female production and the assembly cost who arranges of stromatolite.
The above describes in detail optional embodiments of the present invention with reference to the accompanying drawings, however, the embodiments of the present invention are not limited to the details of the above embodiments, and the technical concept of the embodiments of the present invention can be within the scope of the present invention, and can be modified in a variety of ways, and these simple modifications all belong to the protection scope of the embodiments of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention do not separately describe various possible combinations.
In addition, various different embodiments of the present invention can be combined arbitrarily, and the embodiments of the present invention should be considered as disclosed in the embodiments of the present invention as long as the embodiments do not depart from the spirit of the embodiments of the present invention.
Claims (6)
1. A modular bus capacitor assembly, comprising:
a first laminated busbar comprising:
at least one first wiring hole;
at least two second wiring holes, the second wiring holes having a larger aperture than the first wiring holes, the number of the second wiring holes being twice as many as the first wiring holes;
at least two third wiring holes and fourth wiring holes, the third wiring holes and the fourth wiring holes being used for connection with the outside, the fourth wiring holes having a larger aperture than the third wiring holes;
the female arranging of second stromatolite, set up in female arranging of first stromatolite and with female arranging coincidence arrangement of first stromatolite includes:
at least one second wiring hole;
the positions of a second wiring hole on the second laminated busbar and a first wiring hole on the first laminated busbar are the same, and the positions of a first wiring hole on the second laminated busbar and a second wiring hole on the first laminated busbar are the same;
at least two third wiring holes and fourth wiring holes;
the first transition copper bar is connected with the third wiring holes or the fourth wiring holes of two adjacent first laminated busbars and comprises at least two first wiring holes and at least two second wiring holes;
the second transition copper bar set up in on the first transition copper bar and with first transition copper bar coincidence is arranged, includes:
at least two first wiring holes;
and the positions of the first wiring hole and the second wiring hole on the second transition copper bar are opposite to the positions of the first wiring hole and the second wiring hole on the first transition copper bar.
2. The bus bar capacitor assembly according to claim 1, wherein the second wiring holes are provided on both sides of each of the first wiring holes on the first laminated busbar.
3. The bus capacitor assembly of claim 2 further comprising a plurality of copper pads, wherein the negative terminal of the bus capacitor is connected to the first terminal aperture on the first laminated busbar through the copper pads via the second terminal apertures on the second laminated busbar.
4. The bus capacitor assembly according to claim 3, wherein the first wiring hole on the second transition copper bar is connected to the third wiring hole on the first laminated bus bar through the copper pad passing through the second wiring hole on the first transition copper bar.
5. The bus bar capacitor assembly as recited in claim 3, wherein the first wiring hole on the first transition copper bar is connected to the third wiring hole on the second laminated bus bar through the copper pad passing through the fourth wiring hole on the first laminated bus bar.
6. The bus capacitor assembly according to claim 1, wherein the bus capacitor further comprises a substrate, a positive polarity terminal and a negative polarity terminal, one of the positive polarity terminal and the negative polarity terminal being disposed in a middle portion of the substrate, the other of the positive polarity terminal and the negative polarity terminal being disposed on both sides of the one on the substrate, the other being twice as many as the one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021522559.8U CN213341562U (en) | 2020-07-28 | 2020-07-28 | Modular bus capacitor assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021522559.8U CN213341562U (en) | 2020-07-28 | 2020-07-28 | Modular bus capacitor assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213341562U true CN213341562U (en) | 2021-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021522559.8U Active CN213341562U (en) | 2020-07-28 | 2020-07-28 | Modular bus capacitor assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213341562U (en) |
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2020
- 2020-07-28 CN CN202021522559.8U patent/CN213341562U/en active Active
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Address after: 201114 Room 101, building 23, No. 588, Xinjun Ring Road, Minhang District, Shanghai Patentee after: Zhizhan Technology (Shanghai) Co.,Ltd. Address before: Room 207.208, East District, building 1, 68 xiupu Road, Pudong New Area, Shanghai, 201315 Patentee before: Zhizhan Technology (Shanghai) Co.,Ltd. |