CN213340417U - LED packaging adhesive forming structure - Google Patents
LED packaging adhesive forming structure Download PDFInfo
- Publication number
- CN213340417U CN213340417U CN202022668350.9U CN202022668350U CN213340417U CN 213340417 U CN213340417 U CN 213340417U CN 202022668350 U CN202022668350 U CN 202022668350U CN 213340417 U CN213340417 U CN 213340417U
- Authority
- CN
- China
- Prior art keywords
- template
- led
- transverse plate
- threaded rod
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 230000006978 adaptation Effects 0.000 claims description 2
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000007493 shaping process Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a LED packaging adhesive forming structure, which comprises a template, an LED substrate, a sliding chute, a threaded rod, an elastic mechanism and a push plate, wherein the threaded rod is rotated by a rotating handle, under the screw-thread fit of the threaded rod and a first transverse plate, the first transverse plate is driven to move downwards along the first sliding rod, and the elastic mechanism is driven to enable a press plate to move downwards to be contacted with the top of the LED substrate, so as to extrude and fix the LED substrate, under the elastic fit of a spring, a second sliding rod shrinks towards the inside of a sleeve at the same time, so as to prevent an operator from excessively rotating the rotating handle to enable the press plate to excessively extrude the LED substrate, after the LED substrate is fixed, the packaging adhesive is filled into a filling groove, the push plate is moved by a handle, meanwhile, a sliding block slides along the inner wall of the sliding chute, and then a U-shaped scraper blade is driven to move towards the other side of, and then taking the LED substrate out of the placing groove on the template, thereby completing the filling and forming of the packaging adhesive.
Description
Technical Field
The utility model relates to an illumination field specifically is a LED encapsulation glues forming structure.
Background
LEDs, i.e. light emitting diodes, can radiate visible light when electrons and holes recombine, and can therefore be used to produce light emitting diodes, as indicator lights in circuits and instruments, or to form text or digital displays, gallium arsenide diodes emitting red light, gallium phosphide diodes emitting green light, silicon carbide diodes emitting yellow light, gallium nitride diodes emitting blue light, and organic light emitting diodes OLEDs and inorganic light emitting diodes LEDs, because of their chemical nature.
At present when filling LED base plate encapsulation glue, the LED base plate is placed on the workstation directly mostly, because do not press from both sides tight fixed to the LED base plate, leads to it to produce easily and removes for the deviation takes place easily when filling LED base plate encapsulation glue, consequently needs to carry out further improvement to it.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a shaping structure is glued in LED encapsulation to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a LED packaging adhesive forming structure comprises a template, wherein a placing groove is formed in the template, an LED substrate is placed in the placing groove, the LED substrate is matched with the placing groove, a plurality of filling grooves are formed in the LED substrate at equal intervals, two pressing mechanisms are symmetrically arranged at the top of the template and comprise a threaded rod, a first sliding rod, an elastic mechanism, a first transverse plate, a second transverse plate, a rotating handle and a pressing plate, the first transverse plate is arranged above the template, the second transverse plate is arranged above the first transverse plate, the threaded rod penetrates through the first transverse plate in a threaded sleeve mode, the bottom end of the threaded rod is rotatably connected with the top of the template, the top end of the threaded rod penetrates through the second transverse plate and then is fixedly connected with the bottom end of the rotating handle, the threaded rod is rotatably connected with the second transverse plate, the first sliding rod is slidably sleeved on the first transverse plate, and the bottom end of the first sliding rod is fixedly connected with, the top end of the first sliding rod is fixedly connected with the bottom of the second transverse plate, and the pressing plate is arranged above the LED substrate.
As a further aspect of the present invention: the LED base plate top one side is provided with the push pedal, the lateral wall fixedly connected with U type scraper blade of push pedal, the bilateral symmetry fixedly connected with slider of push pedal, the spout with slider looks adaptation is seted up to the inboard of template, the inner wall sliding connection of slider and spout.
As a further aspect of the present invention: the first slide bars are arranged in two numbers, and the two first slide bars are symmetrically arranged on two sides of the threaded rod.
As a further aspect of the present invention: the elastic mechanisms are arranged at the bottom of the first transverse plate at equal intervals.
As a further aspect of the present invention: the elastic mechanism comprises a second sliding rod, a spring and a sleeve, the top end of the sleeve is fixedly connected with the bottom of the first transverse plate, the second sliding rod is sleeved in the sleeve in a sliding mode, the bottom end of the second sliding rod stretches out of the sleeve and then is fixedly connected with the top of the pressing plate, the spring is sleeved on the outer side of the second sliding rod, the top end of the spring is fixedly connected with the bottom end of the sleeve, and the bottom end of the spring is fixedly connected with the top of the pressing plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the threaded rod is rotated through the rotating handle, under the threaded fit of the threaded rod and the first transverse plate, the first transverse plate is driven to move downwards along the first sliding rod, the pressing plate is driven to move downwards to be in contact with the top of the LED substrate through the elastic mechanism, the LED substrate is extruded and fixed, the LED substrate is prevented from moving when the filling groove is filled with the packaging glue, meanwhile, the second sliding rod is retracted into the sleeve through the elastic fit of the spring, the situation that the pressing plate is excessively extruded to the LED substrate through the rotation of the rotating handle by an operator is prevented, and the risk that the LED substrate is crushed due to the fact that the pressing plate is excessively extruded is reduced.
2. Remove the push pedal through the handle, the slider slides along the inner wall of spout simultaneously, and then drives U type scraper blade and remove to the opposite side of LED base plate, strikes off protrusion unnecessary encapsulation glue outside filling the recess through U type scraper blade, makes things convenient for operating personnel to strike off unnecessary encapsulation glue on with the LED base plate.
Drawings
Fig. 1 is a schematic structural diagram of an LED package adhesive molding structure.
Fig. 2 is a side view of an LED package glue molding structure.
Fig. 3 is a top view of an LED package molding structure.
Shown in the figure: the LED module comprises a template 1, an LED substrate 2, a filling groove 3, a sliding groove 4, a threaded rod 5, a first sliding rod 6, an elastic mechanism 7, a second sliding rod 8, a spring 9, a sleeve 10, a first transverse plate 11, a second transverse plate 12, a rotating handle 13, a pressing mechanism 14, a pressing plate 15, a sliding block 16, a U-shaped scraping plate 17, a handle 18 and a pushing plate 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, in the embodiment of the present invention, an LED package adhesive molding structure includes a mold plate 1, a placement groove is formed on the mold plate 1, an LED substrate 2 is placed in the placement groove, the LED substrate 2 is adapted to the placement groove, a plurality of filling grooves 3 are equidistantly formed on the LED substrate 2, a push plate 19 is disposed on one side of the top of the LED substrate 2, a U-shaped scraper 17 is fixedly connected to a side wall of the push plate 19, sliders 16 are symmetrically and fixedly connected to two sides of the push plate 19, a sliding groove 4 adapted to the slider 16 is formed on the inner side of the mold plate 1, the slider 16 is slidably connected to an inner wall of the sliding groove 4, two pressing mechanisms 14 are symmetrically disposed on the top of the mold plate 1, each pressing mechanism 14 includes a threaded rod 5, a first sliding rod 6, an elastic mechanism 7, a first transverse plate 11, a second transverse plate 12, a rotating handle 13, the first transverse plate 11 is arranged above the template 1, the second transverse plate 12 is arranged above the first transverse plate 11, the threaded rod 5 penetrates through the threaded sleeve and is arranged on the first transverse plate 11, the bottom end of the threaded rod 5 is rotatably connected with the top of the template 1, the top end of the threaded rod 5 penetrates through the second transverse plate 12 and is fixedly connected with the bottom end of the rotating handle 13, the threaded rod 5 is rotatably connected with the second transverse plate 12, two first slide bars 6 are symmetrically arranged at two sides of the threaded rod 5, the first slide bars 6 are slidably sleeved on the first transverse plate 11, the bottom end of the first slide bars 6 is fixedly connected with the top of the template 1, the top end of the first slide bars 6 is fixedly connected with the bottom of the second transverse plate 12, three elastic mechanisms 7 are arranged at equal intervals at the bottom of the first transverse plate 11, each elastic mechanism 7 comprises a second slide bar 8, a spring 9 and a sleeve 10, the LED lamp is characterized in that the top end of the sleeve 10 is fixedly connected with the bottom of the first transverse plate 11, the second slide bar 8 is sleeved in the sleeve 10 in a sliding mode, the bottom end of the second slide bar 8 extends out of the sleeve 10 and then is fixedly connected with the top of the pressing plate 15, the spring 9 is sleeved on the outer side of the second slide bar 8, the top end of the spring 9 is fixedly connected with the bottom end of the sleeve 10, the bottom end of the spring 9 is fixedly connected with the top of the pressing plate 15, and the pressing plate 15 is arranged above the LED substrate 2.
The utility model discloses a theory of operation is:
when the LED base plate pressing device is used, the template 1 is fixed on a workbench, the LED base plate 2 is correspondingly placed in a placing groove on the template 1, the threaded rod 5 is rotated through the rotating handle 13, the first transverse plate 11 is driven to move downwards along the first sliding rod 6 under the threaded fit of the threaded rod 5 and the first transverse plate 11, the elastic mechanism 7 is further driven to enable the pressing plate 15 to move downwards to be in contact with the top of the LED base plate 2, the LED base plate 2 is further extruded and fixed, the second sliding rod 8 contracts inwards the sleeve 10 under the elastic fit of the spring 9, the situation that the pressing plate 15 is excessively extruded by the pressing plate 15 due to the rotation of the rotating handle 13 by an operator is further prevented, the risk that the LED base plate 2 is crushed due to the excessive extrusion of the pressing plate 15 is further reduced, after the LED base plate 2 is fixed, the packaging adhesive is filled into the filling groove 3, and after the filling of the packaging adhesive is finished, the rotating handle 13 is rotated reversely, so that the pressing plate 15 does not compress, and then move the push pedal 19 through the handle 18, the slider 16 slides along the inner wall of spout 4 simultaneously, and then drives U type scraper blade 17 and remove to the opposite side of LED base plate 2, strikes off the unnecessary encapsulation glue of protrusion outside filling recess 3 through U type scraper blade 17, takes out LED base plate 2 from the standing groove on template 1 again, and then has accomplished the filling shaping of encapsulation glue.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (5)
1. The utility model provides a LED encapsulation glues forming structure, includes template (1), its characterized in that: the LED template comprises a template (1), a placing groove is formed in the template (1), an LED substrate (2) is placed in the placing groove, the LED substrate (2) is matched with the placing groove, a plurality of filling grooves (3) are equidistantly formed in the LED substrate (2), two pressing mechanisms (14) are symmetrically arranged at the top of the template (1), each pressing mechanism (14) comprises a threaded rod (5), a first sliding rod (6), an elastic mechanism (7), a first transverse plate (11), a second transverse plate (12), a rotating handle (13) and a pressing plate (15), the first transverse plate (11) is arranged above the template (1), the second transverse plate (12) is arranged above the first transverse plate (11), the threaded rod (5) is sleeved on the first transverse plate (11) in a penetrating manner, the bottom end of the threaded rod (5) is rotatably connected with the top of the template (1), the top end of the threaded rod (5) is fixedly connected with the bottom end of the rotating handle (13) after penetrating through the second transverse plate (12), threaded rod (5) rotate with second diaphragm (12) and are connected, first slide bar (6) sliding sleeve is located on first diaphragm (11), first slide bar (6) bottom and template (1) top fixed connection, first slide bar (6) top and second diaphragm (12) bottom fixed connection, clamp plate (15) set up in the top of LED base plate (2).
2. The LED packaging adhesive molding structure of claim 1, wherein: LED base plate (2) top one side is provided with push pedal (19), the lateral wall fixedly connected with U type scraper blade (17) of push pedal (19), the bilateral symmetry fixedly connected with slider (16) of push pedal (19), spout (4) with slider (16) looks adaptation are seted up to the inboard of template (1), the inner wall sliding connection of slider (16) and spout (4).
3. The LED packaging adhesive molding structure of claim 1, wherein: the two first sliding rods (6) are arranged, and the two first sliding rods (6) are symmetrically arranged on two sides of the threaded rod (5).
4. The LED packaging adhesive molding structure of claim 1, wherein: the number of the elastic mechanisms (7) at the bottom of the first transverse plate (11) is three at equal intervals.
5. The LED packaging adhesive molding structure of claim 1, wherein: elastic mechanism (7) include second slide bar (8), spring (9) and sleeve (10), sleeve (10) top and first diaphragm (11) bottom fixed connection, sleeve (10) is located to second slide bar (8) slip cap, second slide bar (8) bottom stretch out sleeve (10) outer back and clamp plate (15) top fixed connection, the outside of second slide bar (8) is located to spring (9) cover, spring (9) top and sleeve (10) bottom fixed connection, spring (9) bottom and clamp plate (15) top fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022668350.9U CN213340417U (en) | 2020-11-17 | 2020-11-17 | LED packaging adhesive forming structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022668350.9U CN213340417U (en) | 2020-11-17 | 2020-11-17 | LED packaging adhesive forming structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213340417U true CN213340417U (en) | 2021-06-01 |
Family
ID=76077443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022668350.9U Expired - Fee Related CN213340417U (en) | 2020-11-17 | 2020-11-17 | LED packaging adhesive forming structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213340417U (en) |
-
2020
- 2020-11-17 CN CN202022668350.9U patent/CN213340417U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103111842A (en) | Automated assembly device of light-emitting diode (LED) finger lamps | |
| CN103700652A (en) | Spiral LED package lamp filament | |
| CN213340417U (en) | LED packaging adhesive forming structure | |
| CN203659854U (en) | Spiral LED packaging lamp filament | |
| CN208712095U (en) | A kind of batch-type glue-injection machine | |
| CN207962272U (en) | A kind of LED illumination lamp easy to repair | |
| CN107742669B (en) | A kind of process equipment of LED chip | |
| CN109551073B (en) | LED chip soldering device | |
| CN214081697U (en) | Cutting device for LED touch screen | |
| CN208093587U (en) | A kind of LED silica gel chip packaging mould | |
| CN204895997U (en) | LED lamps and lanterns encapsulation equipment | |
| CN212943759U (en) | Glue filling device for high-power LED packaging | |
| CN216054763U (en) | Encapsulation platform of LED's production and processing usefulness | |
| CN208879585U (en) | Foot cut device is used in a kind of production of high efficient LED | |
| CN211964813U (en) | Dispensing equipment for processing light-emitting diode | |
| CN210107124U (en) | Novel LED illuminating lamp | |
| CN213735924U (en) | Work bench convenient for packaging for lamp decoration batching | |
| CN203746806U (en) | Hand-operated edge searching device of LED wafer | |
| CN218190677U (en) | Adhesive deposite device based on processing of semiconductor lighting device | |
| CN202018963U (en) | Integrated LED bracket | |
| CN221427764U (en) | Packaging structure of light-emitting diode | |
| CN216120347U (en) | Light-emitting diode lead frame | |
| CN215184036U (en) | LED light-emitting module aluminum substrate assembly | |
| CN210668324U (en) | Support for LED packaging | |
| CN103618039A (en) | Method for packaging LED light source with 360-degree light-emitting angle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210601 |