CN203746806U - Hand-operated edge searching device of LED wafer - Google Patents
Hand-operated edge searching device of LED wafer Download PDFInfo
- Publication number
- CN203746806U CN203746806U CN201420064446.6U CN201420064446U CN203746806U CN 203746806 U CN203746806 U CN 203746806U CN 201420064446 U CN201420064446 U CN 201420064446U CN 203746806 U CN203746806 U CN 203746806U
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- Prior art keywords
- positioning baffle
- wafer
- rotating shaft
- limit
- bending
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Abstract
The utility model, which relates to the technical field of the auxiliary tool of LED chip manufacturing, discloses a hand-operated edge searching device of an LED wafer. The hand-operated edge searching device comprises a base plate, positioning baffle plates and an edge searching rotating shaft. Two positioning baffle plates are arranged and are fixed at the upper surface of the base plate at an interval, wherein the length of the positioning baffle plate matches the dimension of the chip box for LED chip placing. The edge searching rotating shaft successively passes through the two positioning baffle plates and is connected to a baffle plate shaft. And a wafer contact wheel is arranged at the edge searching rotating shaft between the positioning baffle plates. With the edge searching device, cleavage edges of the wafers can be adjusted to be consistent and the worker can clamp the wafers conveniently without scratching the wafer, thereby improving the LED product quality.
Description
Technical field
The utility model relates to the aid technical field that LED chip is made, and relates in particular to a kind of LED wafer and manually seeks limit device.
Background technology
LED is English light emitting diode(light-emitting diode) abbreviation, be the one of semiconductor diode, electric energy conversion can be become to luminous energy.Light-emitting diode is the same with general-purpose diode to be made up of a PN junction, also has unilateral conduction.When adding after forward voltage to light-emitting diode, be injected into the hole in N district from P district and be injected into the electronics in P district by N district, near PN junction in several microns respectively with the electronics in N district and the hole-recombination in P district, produce the fluorescence of spontaneous radiation.In different semi-conducting materials, electronics is different with the residing energy state in hole.How much different the energy discharging in the time of electronics and hole-recombination is, and the energy discharging is more, and the light wavelength of sending is shorter.Conventional is glows, the diode of green glow or gold-tinted.LED chip in process of production, each wafer can be placed in film magazine, the structure of film magazine as shown in Figure 2, before operation each technique station, need the corresponding wafer of gripping to be put in board, because wafer is placed on the cleavage edge direction inconsistent (wafer as shown in Figure 3) in film magazine, when will causing producing line operation, after gripping chip, cause edge electrodes to occur scuffing in various degree, have a strong impact on chip quality.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of LED wafer and manually seeks limit device, described in seek limit device and the cleavage limit of wafer can be regulated unanimously, facilitate workman's gripping wafer, can not cause scuffing to wafer, improved the quality of LED product.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of LED wafer is manually sought limit device, it is characterized in that: comprise base plate, positioning baffle and seek limit rotating shaft, described positioning baffle is provided with two and keep spacing to be fixed on the upper surface of base plate, the length of described positioning baffle is suitable with film magazine with placement LED wafer, describedly seek limit rotating shaft successively through two positioning baffles being connected with damper shaft, in the rotating shaft of limit, be provided with wafer contact wheel seeking between described positioning baffle.
Preferably, the described limit device of seeking also comprises and is connected to two connecting plates between positioning baffle, described connecting plate is provided with two, be separately positioned on the both sides, front and back of wafer contact wheel, described connecting plate is provided with bending, and the bending on two connecting plates arranges in opposite directions, and bending and wafer contact wheel keep gap to arrange, the length of bending is less than the length of connecting plate, is configured for inserting the socket of film magazine supporting bracket between the left and right edges of bending and positioning baffle and connecting plate.
Preferably, described in seek limit rotating shaft to extend positioning baffle with respect to the other end more in one end, be provided with rotation urging parts at this end.
Preferably, described rotation urging parts are to be fixed on the annulus of seeking limit roller end.
Preferably, described rotation urging parts are to be fixed on the handle of seeking limit roller end.
The beneficial effect that adopts technique scheme to produce is: the film magazine that is placed with wafer is inserted in the socket of manually seeking limit device, limit rotating shaft is sought in rotation, then seeking limit rotating shaft drives wafer contact wheel to rotate, because the cleavage limit on wafer is straight line, be that wafer is the circle with straight line breach, wafer contact wheel rotate process in only to contact with the non-cleavage limit of wafer, cleavage limit is unified down under the drive of wafer contact wheel like this, then be used in conjunction with an onesize empty film magazine, re-use edge guide or manual overturning the cleavage limit unification on wafer can be adjusted to film magazine directly over, convenient product line employee uses the operation of tweezers gripping wafer, facilitate workman's gripping wafer, can not cause scuffing to wafer, improve the quality of LED product.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of film magazine;
Fig. 3 is the plan structure schematic diagram of wafer;
Wherein: 1, base plate 2, positioning baffle 3, seek limit rotating shaft 4, wafer contact wheel 5, connecting plate 6, rotation urging parts 7, bending 8, film magazine supporting bracket 9, socket 10, wafer 11, cleavage limit.
Embodiment
As shown in Figure 1, a kind of LED wafer is manually sought limit device, for the cleavage limit unification of LED wafer is adjusted to a direction, is convenient to produce line employee and uses tweezers gripping, comprises base plate 1, positioning baffle 2 and seeks limit rotating shaft 3.Described positioning baffle 2 is provided with two and keep spacing to be fixed on the upper surface of base plate 1, keeping parallelism setting between positioning baffle 2.The length of described positioning baffle 2 uses film magazine suitable with placing LED wafer, that is to say that two outermost distances of film magazine supporting bracket are consistent with the length of positioning baffle.Describedly seek limit rotating shaft 3 successively through two positioning baffles 2 being connected with damper shaft, seek limit rotating shaft 3 and be positioned at the centre of positioning baffle, in limit rotating shaft 3, be provided with wafer contact wheel 4 seeking of 2 of described positioning baffles.
The described limit device of seeking also comprises and is connected to two connecting plates 5 between positioning baffle 2, and described connecting plate 5 is provided with two, is separately positioned on the both sides, front and back of wafer contact wheel 4.Described connecting plate 5 is provided with bending 7, and bending and connecting plate are perpendicular, and bending 7 keeps gap to arrange with wafer contact wheel 4, and the length of bending 7 is less than the length of connecting plate 5.Bending 7 on two connecting plates 5 arranges in opposite directions, between the left and right edges of bending 7 and positioning baffle 2 and connecting plate 5, be configured for inserting the socket 9 of film magazine supporting bracket 8, in the time that described film magazine supporting bracket is put into described socket, the top side of described wafer contact wheel 4 can contact with the round edge of wafer, can not contact with the cleavage limit of wafer.In order to facilitate hand rotation to seek limit rotating shaft, described in seek limit rotating shaft 3 to extend positioning baffle 2 with respect to the other end more in one end, be provided with rotation urging parts 6 at this end, the form of described rotation urging parts 6 has a variety of, such as annulus, handle or crank etc.
In use, the film magazine that is placed with wafer is inserted in the socket of manually seeking limit device, limit rotating shaft is sought in rotation, then seeking limit rotating shaft drives wafer contact wheel to rotate, because the cleavage limit on wafer is straight line, be that wafer is the circle with straight line breach, wafer contact wheel rotate process in only to contact with the non-cleavage limit of wafer, cleavage limit is unified down under the drive of wafer contact wheel like this, then be used in conjunction with an onesize empty film magazine, re-use edge guide or manual overturning the cleavage limit unification on wafer can be adjusted to film magazine directly over, convenient product line employee uses the operation of tweezers gripping wafer, facilitate workman's gripping wafer, can not cause scuffing to wafer, improve the quality of LED product.
Applied specific case herein principle of the present utility model and execution mode thereof are set forth, the explanation of above embodiment is just with helping understand method of the present utility model and core concept thereof.It should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not depart from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (5)
1. a LED wafer is manually sought limit device, it is characterized in that: comprise base plate (1), positioning baffle (2) and seek limit rotating shaft (3), described positioning baffle (2) is provided with two and keep spacing to be fixed on the upper surface of base plate (1), the length of described positioning baffle (2) is suitable with film magazine with placement LED wafer, describedly seek limit rotating shaft (3) successively through two positioning baffles (2) being connected with damper shaft, in limit rotating shaft (3), be provided with wafer contact wheel (4) seeking between described positioning baffle (2).
2. LED wafer according to claim 1 is manually sought limit device, it is characterized in that: described in seek limit device and also comprise the connecting plate (5) being connected between two positioning baffles (2), described connecting plate (5) is provided with two, be separately positioned on the both sides, front and back of wafer contact wheel (4), described connecting plate (5) is provided with bending (7), bending (7) on two connecting plates (5) arranges in opposite directions, bending (7) keeps gap to arrange with wafer contact wheel (4), the length of bending (7) is less than the length of connecting plate (5), between the left and right edges of bending (7) and positioning baffle (2) and connecting plate (5), be configured for inserting the socket (9) of film magazine supporting bracket (8).
3. LED wafer according to claim 1 is manually sought limit device, it is characterized in that: described in seek limit rotating shaft (3) to extend positioning baffle (2) with respect to the other end more in one end, be provided with rotation urging parts (6) at this end.
4. LED wafer according to claim 3 is manually sought limit device, it is characterized in that: described rotation urging parts (6) are for being fixed on the annulus of seeking limit rotating shaft (3) end.
5. LED wafer according to claim 3 is manually sought limit device, it is characterized in that: described rotation urging parts (6) are for being fixed on the handle of seeking limit rotating shaft (3) end.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420064446.6U CN203746806U (en) | 2014-02-13 | 2014-02-13 | Hand-operated edge searching device of LED wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420064446.6U CN203746806U (en) | 2014-02-13 | 2014-02-13 | Hand-operated edge searching device of LED wafer |
Publications (1)
Publication Number | Publication Date |
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CN203746806U true CN203746806U (en) | 2014-07-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420064446.6U Expired - Fee Related CN203746806U (en) | 2014-02-13 | 2014-02-13 | Hand-operated edge searching device of LED wafer |
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CN (1) | CN203746806U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104555517A (en) * | 2014-12-26 | 2015-04-29 | 合肥彩虹蓝光科技有限公司 | Multifunctional automatic edge finder for LED (Light Emitting Diode) chip |
CN117889750A (en) * | 2024-03-15 | 2024-04-16 | 大连保税区金宝至电子有限公司 | Automatic edge finding detection device for reducing product size detection error |
-
2014
- 2014-02-13 CN CN201420064446.6U patent/CN203746806U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104555517A (en) * | 2014-12-26 | 2015-04-29 | 合肥彩虹蓝光科技有限公司 | Multifunctional automatic edge finder for LED (Light Emitting Diode) chip |
CN117889750A (en) * | 2024-03-15 | 2024-04-16 | 大连保税区金宝至电子有限公司 | Automatic edge finding detection device for reducing product size detection error |
CN117889750B (en) * | 2024-03-15 | 2024-05-14 | 大连保税区金宝至电子有限公司 | Automatic edge finding detection device for reducing product size detection error |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 Termination date: 20150213 |
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EXPY | Termination of patent right or utility model |