CN213340355U - Insulated gate bipolar transistor - Google Patents

Insulated gate bipolar transistor Download PDF

Info

Publication number
CN213340355U
CN213340355U CN202022622595.8U CN202022622595U CN213340355U CN 213340355 U CN213340355 U CN 213340355U CN 202022622595 U CN202022622595 U CN 202022622595U CN 213340355 U CN213340355 U CN 213340355U
Authority
CN
China
Prior art keywords
bipolar transistor
insulated gate
gate bipolar
heat
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022622595.8U
Other languages
Chinese (zh)
Inventor
周际梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Zhongming Electronics Co ltd
Original Assignee
Shenzhen Zhongming Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Zhongming Electronics Co ltd filed Critical Shenzhen Zhongming Electronics Co ltd
Priority to CN202022622595.8U priority Critical patent/CN213340355U/en
Application granted granted Critical
Publication of CN213340355U publication Critical patent/CN213340355U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses an insulated gate bipolar transistor relates to a semiconductor field. The utility model discloses in, including insulated gate bipolar transistor body and slide, one side of insulated gate bipolar transistor body is provided with the spout, one side of spout is provided with the spring groove, one side fixedly connected with spring in spring groove, the inner wall top in spring groove is provided with the stopper with one side of bottom, the one end fixedly connected with fixed column of spring, the one end surface of fixed column is provided with the fixed block, is provided with the heat-conducting plate, and the heat that gives off absorbs through the heat-conducting plate, gives the fin with its heat transfer simultaneously, and this fin is the latticed of copper, and the cooperation diffuses its heat between a plurality of fin, has protected the safety of insulated gate bipolar transistor body to life has been improved, stitch and ground collision caused the phenomenon of bending damage when avoiding dropping through rubber column and slide setting.

Description

Insulated gate bipolar transistor
Technical Field
The utility model relates to a semiconductor field specifically is an insulated gate bipolar transistor.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of a semiconductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products, such as computers, mobile phones or digital recorders, have very close association with the semiconductor, the range of the electronic products includes very wide, and an insulated gate bipolar transistor is provided.
However, the existing insulated gate bipolar transistor is not enough, when people need to research and develop products or perform experiments, the transistor is easy to take up and slide due to the small size, the pin of the transistor collides with the ground, bending damage is caused, follow-up operation is inconvenient, and a large amount of heat can be generated during long-term use.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide an insulated gate bipolar transistor to solve the problems in the background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides an insulated gate bipolar transistor, includes insulated gate bipolar transistor body and slide, one side of insulated gate bipolar transistor body is provided with the spout, one side of spout is provided with the spring groove, one side fixedly connected with spring in spring groove, one side of the inner wall top in spring groove and one side of bottom are provided with the stopper, the one end fixedly connected with fixed column of spring, the one end surface of fixed column is provided with the fixed block, one side fixedly connected with slider of slide, one side of slider is provided with the fixed slot, the bottom of insulated gate bipolar transistor body is provided with the heat-conducting plate, the bottom of heat-conducting plate is provided with the fin, the one end fixedly connected with rubber post of slide, the front surface of insulated gate bipolar transistor body is provided with the stitch.
As a further aspect of the present invention: the insulated gate bipolar transistor comprises an insulated gate bipolar transistor body, and is characterized in that sliding grooves are formed in two sides of the insulated gate bipolar transistor body, spring grooves are formed in one sides of the sliding grooves and are matched with springs, fixing columns are matched with the spring grooves, the sliding grooves are matched with sliding blocks, and 2 fixing grooves are symmetrically formed in one sides of the sliding blocks.
As a further aspect of the present invention: the fixing groove is semicircular and matched with the fixing column.
As a further aspect of the present invention: the radiating fin is made of copper materials and is in a grid shape.
As a further aspect of the present invention: the bottom fixedly connected with a plurality of fin of heat-conducting plate, the heat-conducting plate is the graphite alkene heat-conducting plate.
As a further aspect of the present invention: the length sum of the sliding plate and the rubber column is longer than the length of the pin.
Compared with the prior art, the beneficial effects of the utility model are that: this insulated gate bipolar transistor is provided with the heat-conducting plate in its bottom, this heat-conducting plate is the graphite alkene heat-conducting plate, it is fast to have the heat absorption as novel material, the good advantage of heat conduction, the heat that gives off insulated gate bipolar transistor body absorbs through the heat-conducting plate, give the fin with its heat transfer simultaneously, this fin is the latticed of copper, the cooperation diffuses its heat between a plurality of fin, because the fin is latticed, increased with the flow of outside air, further improved the radiating efficiency, the safety of insulated gate bipolar transistor body has been protected, thereby the life has been improved, stitch and ground collision caused the phenomenon of crooked damage when avoiding dropping through rubber column and slide setting, its vibrations of further buffering of rubber column, the safety of protection stitch, the falling resistance has been improved, be favorable to staff's subsequent operation.
Drawings
Fig. 1 is a schematic structural diagram of an insulated gate bipolar transistor.
Fig. 2 is a schematic diagram of a rear cross-sectional structure of an insulated gate bipolar transistor.
Fig. 3 is an enlarged structural diagram of a in an insulated gate bipolar transistor.
Fig. 4 is a schematic diagram of a heat sink structure in an insulated gate bipolar transistor.
The labels in the figure are: 1. an insulated gate bipolar transistor body; 2. a slide plate; 3. a stitch; 4. a rubber column; 5. a chute; 6. a heat conducting plate; 7. a slider; 8. fixing grooves; 9. fixing a column; 10. a heat sink; 11. a spring slot; 12. a spring; 13. a fixed block; 14. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-4, in the embodiment of the present invention, an insulated gate bipolar transistor, including an insulated gate bipolar transistor body 1 and a sliding plate 2, one side of the insulated gate bipolar transistor body 1 is provided with a sliding groove 5, one side of the sliding groove 5 is provided with a spring groove 11, one side fixedly connected with spring 12 of the spring groove 11, an inner wall top of the spring groove 11 is provided with a stopper 14 with one side of the bottom, one end fixedly connected with fixed column 9 of the spring 12, one end surface of the fixed column 9 is provided with a fixed block 13, one side fixedly connected with slider 7 of the sliding plate 2, one side of the slider 7 is provided with a fixed groove 8, a bottom of the insulated gate bipolar transistor body 1 is provided with a heat conducting plate 6, a bottom of the heat conducting plate 6 is provided with a heat sink 10, one end fixedly connected with rubber column 4.
Referring to fig. 1 to 3, sliding grooves 5 are disposed on both sides of an igbt body 1, spring grooves 11 are disposed on one sides of the sliding grooves 5, the spring grooves 11 are adapted to springs 12, fixing posts 9 are adapted to the spring grooves 11, the sliding grooves 5 are adapted to a slider 7, and 2 fixing grooves 8 are symmetrically disposed on one side of the slider 7, so that the slider 2 is more stably fixed.
Referring to fig. 1 to 3, the fixing groove 8 is semicircular, and the fixing groove 8 is adapted to the fixing post 9, so that the sliding plate 2 can slide and fix on two sides of the igbt body 1.
Referring to fig. 2 and 4, the heat sink 10 is made of copper material, and the heat sink 10 is in a grid shape, so that the fluidity with the outside air is increased, thereby better dissipating heat.
Referring to fig. 1, 2 and 4, the bottom of the heat conducting plate 6 is fixedly connected with a plurality of heat dissipation fins 10, and the heat conducting plate 6 is a graphene heat conducting plate.
Referring to fig. 1 and 2, the length sum of the sliding plate 2 and the rubber column 4 is longer than the length of the pin 3, and when the sliding plate falls, the rubber column 4 firstly contacts with the ground to buffer, so that the safety of the pin 3 is protected.
The utility model discloses a theory of operation is: when the insulated gate bipolar transistor is used, a worker takes the insulated gate bipolar transistor out to a position needing to be installed, when the insulated gate bipolar transistor accidentally falls off from a hand in the taking process and falls on the ground, at the moment, the length of the added sliding plate 2 and the rubber column 4 is longer than that of the pin 3, so that the sliding plate 2 is firstly contacted with the rubber column 4 when the insulated gate bipolar transistor falls on the ground, the rubber column 4 buffers the rubber column 3, the safety of the pin 3 is protected, the phenomenon that the pin 3 collides with the ground to cause bending damage when the pin 3 falls off is avoided, when the insulated gate bipolar transistor is installed, the sliding plate 2 applies force to enable the spring 12 to stretch, the spring 12 stretches to enable the fixed column 9 to be separated from the fixed groove 8 at the top of the sliding block 7, the sliding block 7 is moved until the fixed groove 8 at the bottom of the sliding block 7 is matched with the fixed column 9, the fixed column is fixed through the restoring force of the spring 12, a limiting, when the insulated gate bipolar transistor is used for a long time, a large amount of heat can be generated, the heat conducting plate 6 is arranged at the bottom of the insulated gate bipolar transistor, the heat conducting plate 6 is a graphene heat conducting plate and has the advantages of being fast in heat absorption, good in heat conduction and the like, the heat emitted by the insulated gate bipolar transistor body 1 is absorbed through the heat conducting plate 6, meanwhile, the heat is transferred to the radiating fins 10, the radiating fins 10 are in a copper grid shape, and the heat is diffused through the cooperation of the plurality of radiating fins 10.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (6)

1. An insulated gate bipolar transistor comprising an insulated gate bipolar transistor body (1) and a runner (2), characterized in that: one side of the insulated gate bipolar transistor body (1) is provided with a sliding chute (5), a spring groove (11) is arranged at one side of the sliding groove (5), a spring (12) is fixedly connected at one side of the spring groove (11), a limiting block (14) is arranged on one side of the top and the bottom of the inner wall of the spring groove (11), one end of the spring (12) is fixedly connected with a fixed column (9), a fixed block (13) is arranged on the surface of one end of the fixed column (9), one side of the sliding plate (2) is fixedly connected with a sliding block (7), one side of the sliding block (7) is provided with a fixed groove (8), the bottom of the insulated gate bipolar transistor body (1) is provided with a heat conducting plate (6), the bottom of the heat conducting plate (6) is provided with a radiating fin (10), one end of the sliding plate (2) is fixedly connected with a rubber column (4), the front surface of the insulated gate bipolar transistor body (1) is provided with pins (3).
2. An insulated gate bipolar transistor according to claim 1, wherein: the insulated gate bipolar transistor is characterized in that sliding grooves (5) are formed in two sides of the insulated gate bipolar transistor body (1), spring grooves (11) are formed in one sides of the sliding grooves (5), the spring grooves (11) are matched with springs (12), fixing columns (9) are matched with the spring grooves (11), the sliding grooves (5) are matched with sliding blocks (7), and 2 fixing grooves (8) are symmetrically formed in one sides of the sliding blocks (7).
3. An insulated gate bipolar transistor according to claim 1, wherein: the fixing groove (8) is semicircular, and the fixing groove (8) is matched with the fixing column (9).
4. An insulated gate bipolar transistor according to claim 1, wherein: the radiating fin (10) is made of copper materials, and the radiating fin (10) is in a grid shape.
5. An insulated gate bipolar transistor according to claim 1, wherein: the bottom fixedly connected with a plurality of fin (10) of heat-conducting plate (6), heat-conducting plate (6) are graphite alkene heat-conducting plate.
6. An insulated gate bipolar transistor according to claim 1, wherein: the sum of the lengths of the sliding plate (2) and the rubber column (4) is longer than the length of the pin (3).
CN202022622595.8U 2020-11-13 2020-11-13 Insulated gate bipolar transistor Active CN213340355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022622595.8U CN213340355U (en) 2020-11-13 2020-11-13 Insulated gate bipolar transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022622595.8U CN213340355U (en) 2020-11-13 2020-11-13 Insulated gate bipolar transistor

Publications (1)

Publication Number Publication Date
CN213340355U true CN213340355U (en) 2021-06-01

Family

ID=76077143

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022622595.8U Active CN213340355U (en) 2020-11-13 2020-11-13 Insulated gate bipolar transistor

Country Status (1)

Country Link
CN (1) CN213340355U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117012735A (en) * 2023-07-20 2023-11-07 先之科半导体科技(东莞)有限公司 Thin film insulated gate field effect transistor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117012735A (en) * 2023-07-20 2023-11-07 先之科半导体科技(东莞)有限公司 Thin film insulated gate field effect transistor
CN117012735B (en) * 2023-07-20 2024-05-31 先之科半导体科技(东莞)有限公司 Thin film insulated gate field effect transistor

Similar Documents

Publication Publication Date Title
CN208401601U (en) Wireless charger
CN213340355U (en) Insulated gate bipolar transistor
WO2024183515A1 (en) Power converter, packaging structure and heat dissipation structure
CN212517177U (en) Power MOS semiconductor device
CN205177814U (en) MOS pipe with good shock attenuation is sealed
CN208385414U (en) A kind of metal-oxide-semiconductor of included heat dissipation
Wang et al. Development of high thermal performance automotive power module with dual sided cooling capability
CN212851584U (en) Heat radiator for heating device
CN204732393U (en) A kind of metallic packaging power device radiating structure
CN204991680U (en) Chip with good shock attenuation is sealed
CN209544317U (en) A kind of power device packaging structure
CN213876624U (en) Ultra-thin radiator
CN213403983U (en) Heat radiation body structure
CN219108061U (en) Synchronous heat radiation structure of printed circuit board and chip package
CN211670426U (en) Semiconductor laser element
CN220510004U (en) Semiconductor shell with good waterproof performance
CN219042315U (en) Heat dissipation structure
CN205356936U (en) Box heat radiation structure and emergency command case
CN219979543U (en) Double-base island composite transistor packaging structure
CN216671673U (en) High-power flip-chip LED packaging structure
CN217544592U (en) Double-sided heat dissipation packaging device
Kumar et al. Review on electronics cooling systems
CN204216023U (en) A kind of triode with radiating surface
CN211827152U (en) CPU installation module and active and passive integrated heat dissipation structure of CPU
CN212542412U (en) Intelligent power module and equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant