CN213256240U - Chip recovery device - Google Patents
Chip recovery device Download PDFInfo
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- CN213256240U CN213256240U CN202021906919.4U CN202021906919U CN213256240U CN 213256240 U CN213256240 U CN 213256240U CN 202021906919 U CN202021906919 U CN 202021906919U CN 213256240 U CN213256240 U CN 213256240U
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Abstract
The utility model provides a chip recovery unit, include: the loading platform comprises a loading platform, a first heating part and a second heating part. The carrying platform is suitable for carrying the chip module. The first heating part is suitable for being located above the chip module. The second heating part is positioned at the side part of the loading platform. The utility model provides a chip recovery unit through the setting of two heating portions, can realize heating efficiency's improvement. In addition, the chip module can adapt to chip modules with different structures.
Description
Technical Field
The utility model relates to the field of semiconductor technology, concretely relates to chip recovery unit.
Background
In the production of electronic products, the chips are intact but other parts are not good, so that the products themselves become unusable inferior products (for example, display modules with poor display due to damaged screen bodies), and the intact chips need to be recycled. The chip recovery device in the prior art usually sets up the fixed zone of heating for single fixed microscope carrier, the chip that treats to get rid of in the zone of heating chip module to make the chip can separate out from the chip module, and then retrieve the chip and recycle.
However, such a chip recycling device has poor adaptability to modules with different structures, and has low heating efficiency for the modules, and it is difficult to satisfy efficient operation requirements.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides a chip recovery unit to solve the problem that prior art's chip recovery unit is not good to the not good and heating efficiency of isostructure module adaptability.
The utility model provides a chip recovery unit, include: the carrying platform is suitable for carrying the chip module; the first heating part is suitable for being positioned above the chip module; a second heating part located at a side of the stage; the first heating part and the second heating part are suitable for heating the chip module.
Optionally, the chip recycling apparatus further includes: the lifting adjusting part is arranged above the first heating part and is suitable for adjusting the lifting movement of the first heating part relative to the loading platform.
Optionally, the chip recovery device further comprises a device main body, the device main body comprises an upright post, a slide rail is arranged on the side of the upright post, and the lifting adjusting portion is clamped with the slide rail and is suitable for moving relative to the slide rail.
Optionally, the chip recycling device further includes a first heat insulation block, and the first heat insulation block is disposed between the lifting adjustment portion and the first heating portion.
Optionally, the second heating portion is disposed separately from the object stage, a heating surface of the second heating portion is flush with an object carrying surface of the object stage, the second heating portion is located below the first heating portion, and a gap is formed between the second heating portion and the first heating portion.
Optionally, a ventilation and cooling channel is arranged inside the loading platform, and the ventilation and cooling channel is provided with an air inlet and an air outlet; the chip recovery device further comprises a cooling air pipe, the cooling air pipe is communicated with the air inlet, and the cooling air pipe is suitable for ventilating and radiating the area, close to the second heating part, of the loading platform.
Optionally, the chip recycling apparatus further includes: the horizontal adjusting part is positioned below the object carrying platform and connected with the object carrying platform, and the horizontal adjusting part is suitable for enabling the object carrying platform to move along the horizontal direction.
Optionally, the chip recycling apparatus further includes: and a second heat insulating block provided below the second heating unit.
Optionally, the object-carrying platform includes a module adsorption area, and the module adsorption area is suitable for adsorbing the chip module; chip recovery unit still including set up in the screens slider on objective platform surface, the screens slider is located the lateral part of adsorption zone, the screens slider is suitable for objective platform's horizontal slip on the surface, the screens slider is suitable for with the chip module restriction is in the adsorption zone.
Optionally, the chip module includes a chip region; the chip area is suitable for being placed above the second heating part.
The utility model discloses technical scheme has following advantage:
1. the utility model provides a chip recovery unit, including being suitable for the first heating portion that is located chip module top and the second heating portion that is located the cargo platform lateral part, through the setting of two heating portions, can realize heating efficiency's improvement. In addition, the chip recovery apparatus may further include two different heating modes, a first heating mode in which the first heating unit is a main heating unit and the second heating unit is an auxiliary heating unit, and the temperature of the first heating unit and the temperature of the second heating unit may be adjusted to be higher than that of the second heating unit, and a second heating mode in which the second heating unit and the temperature of the second heating unit are adjusted to be higher than that of the first heating unit. The first heating mode and the second heating mode can be selected adaptively according to the chip modules with different structures, and can adapt to the chip modules with different structures and different heating requirements.
2. The utility model provides a chip recovery unit, including the lift adjustment portion, the height of the first heating portion of accessible lift adjustment portion adjustment, the clearance size between first heating portion and the second heating portion can be through lift adjustment portion control, and the chip module is suitable for and places in the clearance between first heating portion and second heating portion, consequently can heat not unidimensional chip module.
3. The utility model provides a chip recovery unit is provided with first heat insulating block between lift adjustment portion and the first heating portion, first heat insulating block has thermal-insulated function, first heat insulating block can prevent heat energy in the first heating portion to lift adjustment portion transmits, avoids the high temperature of lift adjustment portion, takes place to scald when can avoiding operating personnel to operate lift adjustment portion, guarantees operating personnel's security.
4. The utility model provides a chip recovery unit, second heating portion set up with the objective platform separation, avoid second heating portion and objective platform contact, the separation has heated from the second to the heat transfer passageway of objective platform, avoids objective platform's high temperature, takes place to scald when avoiding operating personnel to operate objective platform, guarantees operating personnel's security.
5. The utility model provides a chip recovery unit, cargo platform are provided with the cooling passageway of ventilating, and the cooling passageway of ventilating has air inlet and gas outlet, and chip recovery unit still is provided with the cooling trachea, the cooling trachea with the air inlet intercommunication, the cooling trachea be suitable for to cargo platform is close to the regional heat dissipation of ventilating of second heating portion avoids cargo platform to be close to the regional high temperature of second heating portion reduces the condition that operating personnel contacted cargo platform when getting the chip module and causes the high temperature scald.
6. The utility model provides a chip recovery unit, second heating portion below sets up the second heat insulating block, the second heat insulating block prevents that second heating portion from to being located the other structure transmission heat of second heating portion below, and other structures of contact second heating portion below cause the operation scald when reducible getting when putting the module.
7. The utility model provides a chip recovery device, the objective platform includes module adsorption zone, the module adsorption zone is suitable for adsorbing the chip module; the chip recovery device further comprises a clamping slide block arranged on the surface of the carrying platform. The adsorption area is suitable for the bottom surface of the chip module to generate an adsorption force perpendicular to the bottom surface of the chip module, the clamping slide block is suitable for acting a limiting force in the horizontal direction on the side portion of the chip module, and the chip module is limited in the adsorption area by applying forces in the horizontal direction and the vertical direction to the chip module, so that the chip module is fixed and stable in the operation process and can adapt to modules of different sizes.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a chip recycling device according to the present invention;
description of reference numerals:
11 column
12 sliding rail
13 pushing member
14 base
21 first electric heating rod
22 first insulating block
23 heating plate
3 carrying platform
31 second electric heating bar
32 second insulating block
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The utility model provides a chip recovery device, see figure 1. Fig. 1 is a schematic structural diagram of an embodiment of the chip recycling device of the present invention. As shown in fig. 1, the utility model provides a chip recovery unit includes: objective platform 3, objective platform 3 is suitable for bearing the weight of the chip module. The first heating part is suitable for being positioned above the chip module. And the second heating part is positioned on the side part of the loading platform. The first heating part and the second heating part are suitable for heating the chip module.
In some embodiments, the first heating part comprises a first electric heating rod 21 and a heating plate 23, the first electric heating rod 21 is in contact with the heating plate 23, and the heating plate 23 is suitable for heating the chip module.
In one case, the number of the first electric heating rods 21 is two, the heating sheet 23 has a first portion and a second portion, the second portion is connected to the first portion, the first portion of the heating sheet 23 extends between the two first electric heating rods 21, the second portion of the heating sheet 23 is located outside the two first electric heating rods 21, and the second portion is perpendicular to the first portion and the second portion is perpendicular to the upper surface of the loading platform 3. The two first electric heating rods 21 are arranged in a direction parallel to the upper surface of the loading platform 3 or perpendicular to the upper surface of the loading platform 3.
In another case, the first electric heating rod horizontally penetrates through the heating plate, and a part of the first electric heating rod also extends out of the side part of the heating plate.
The skilled person can select the desired one according to the actual need. In the actual work, heighten the temperature of first heating rod, first heating rod takes place the contact heat transfer to the heating plate, through heating plate contact chip module, first heating portion is used for heating the chip module in the top of chip module.
In some specific embodiments, the second heating part includes a second electric heating rod 31.
The number of the second electric heating bars 31 may be set to two, one, or more than two. The second electric bar 31 is adapted to heat the chip module.
The second electric heating rod 31 of the second heating part and the first electric heating rod 21 of the first heating part are controlled by a temperature control system, and the temperature is controllable and adjustable, so that the heating degrees of the second electric heating rod 31 and the first electric heating rod 21 are controllable and adjustable, and different heating operation requirements can be met.
The utility model provides a chip recovery unit through the setting of two heating portions, can realize heating efficiency's improvement. In addition, the chip recovery apparatus may further include two different heating modes, a first heating mode in which the first heating unit is a main heating unit and the second heating unit is an auxiliary heating unit, and the temperature of the first heating unit and the temperature of the second heating unit may be adjusted to be higher than that of the second heating unit, and a second heating mode in which the second heating unit and the temperature of the second heating unit are adjusted to be higher than that of the first heating unit. The first heating mode and the second heating mode can be selected adaptively according to the chip modules with different structures, and can adapt to the chip modules with different structures and different heating requirements.
In some embodiments of the utility model, the chip recovery unit further includes a lifting adjusting part, and the lifting adjusting part is arranged above the first heating part and is suitable for adjusting the lifting movement of the first heating part relative to the loading platform. In some specific embodiments, the chip recycling apparatus further includes an apparatus body 1, the apparatus body 1 includes an upright 11, a side portion of the upright 11 has a slide rail 12, and a lifting adjusting portion is engaged with the slide rail 12, the lifting adjusting portion is adapted to move relative to the slide rail 12, and specifically, the lifting adjusting portion performs a lifting movement relative to the slide rail 12 in a direction perpendicular to the upper surface of the loading platform.
The utility model provides a chip recovery unit, including the lift adjustment portion, the height of the first heating portion of accessible lift adjustment portion adjustment deals with not unidimensional chip module.
In some embodiments of the present invention, the chip recovery device further comprises a first heat insulation block 22, and the first heat insulation block 22 is disposed between the lifting adjustment portion and the first heating portion. The first heat insulation block 22 may be a ceramic heat insulation block, and those skilled in the art may select a heat insulation block of other materials according to actual requirements.
The utility model provides a chip recovery unit is provided with first heat insulating block between lift adjustment portion and the first heating portion, and first heat insulating block has thermal-insulated function, and heat energy in first heating portion can be prevented to the transfer of lift adjustment portion by first heat insulating block, avoids the high temperature of lift adjustment portion, takes place to scald when can avoiding operating personnel to operate lift adjustment portion, guarantees operating personnel's security.
In some embodiments of the utility model, the second heating portion sets up with objective platform 3 separation, and the heating face of second heating portion flushes with objective platform 3's the year thing face, and the second heating portion is located the below of first heating portion, and has the clearance between second heating portion and the first heating portion.
The utility model provides a chip recovery unit, second heating portion set up with the objective platform separation, avoid second heating portion and objective platform contact, the separation has heated from the second to the heat transfer passageway of objective platform, avoids objective platform's high temperature, takes place to scald when avoiding operating personnel to operate objective platform, guarantees operating personnel's security. The second heating part is located below the first heating part, and a gap is formed between the second heating part and the first heating part. The relative position of first heating portion and second heating portion has been guaranteed and can be carried out the cooperation heating to the chip module.
In some embodiments of the present invention, the carrying platform 3 has a ventilation and cooling channel inside, and the ventilation and cooling channel has an air inlet and an air outlet. The chip recovery device further comprises a cooling air pipe (not shown in the figure), and the cooling air pipe is communicated with the air inlet. The cooling air pipe is suitable for ventilating and radiating to the area of the loading platform 3 close to the second heating part.
The utility model provides a chip recovery unit is provided with the cooling passageway of ventilating in objective platform 3, and the cooling trachea of the air inlet of cooling passageway of ventilating is connected to the accessible, to ventilating in objective platform 3, for objective platform 3 cooling, avoids objective platform to be close to the high temperature in the region of second heating portion, reduces the condition that operating personnel contacted objective platform when getting and put the chip module and cause the high temperature scald.
In some embodiments of the present invention, the chip recovery device further comprises: the horizontal adjustment portion is located the below of objective platform, and horizontal adjustment portion connects objective platform, and horizontal adjustment portion is suitable for and makes objective platform along the horizontal direction motion.
In a specific embodiment, the device body 1 further comprises a base 14, the upright 11 is perpendicular to the base 14, and the upright 11 is fixedly connected with the base 14.
The horizontal adjustment portion includes a horizontal guide rail provided on the base 14 and a support table provided on the horizontal guide rail, and the stage is provided on the support table, and the support table is movable relative to the horizontal guide rail.
The horizontal adjustment part also comprises a pushing component 13, the pushing component 13 horizontally penetrates through the supporting platform, and the operator controls the supporting platform to move relative to the horizontal guide rail through a force applied on the pushing component 13.
The pushing member 13 includes a stud disposed horizontally.
When the pushing member 13 is a stud, a screw hole is formed inside the pushing member 13, and a thread matched with the stud is arranged on the inner surface of the screw hole.
The utility model discloses a chip recovery unit through the setting of horizontal adjustment portion for the horizontal direction motion can be followed to cargo platform, can be to the chip module of not unidimensional, cooperates first heating portion and second heating portion adjustment position, so that heat the operation.
In some embodiments of the present invention, the chip recovery device further comprises: and the second heat insulation block is arranged below the second heating part.
The utility model provides a chip recovery unit, through the setting of second heat insulating block below the second heating portion, the second heat insulating block prevents that second heating portion from to being located the other structure transmission heat of second heating portion below, and other structures of contact second heating portion below cause the operation scald when reducible getting is put the module.
In some embodiments of the present invention, the carrier platform comprises a module adsorption area, the module adsorption area being adapted to adsorb the chip module; chip recovery unit is still including setting up in the screens slider on objective platform surface, and the screens slider is located the lateral part of adsorption zone, and the screens slider is suitable for at objective platform's surperficial horizontal slip, and the screens slider is suitable for to restrict the chip module in the adsorption zone. The adsorption zone is suitable for the adsorption affinity to the bottom surface production perpendicular to chip module's of chip module, and the screens slider is suitable for the lateral part action horizontal direction's of chip module confining force, and through applying the power of horizontal direction and vertical side to the chip module with the chip module restriction in the adsorption zone, make the fixed firm of operation in-process chip module, and adaptable not unidimensional module.
In some specific embodiments, the adsorption zone is provided with the aperture, has the adsorption component that the trachea intercommunication set up in addition simultaneously, like the air pump, and adsorption component can provide the adsorption affinity to the adsorption zone for the chip module of placing on the adsorption zone is firmly adsorbed in the adsorption zone. Touch the chip module when avoiding the heating operation, take place the upper and lower vibration of chip module, avoid the skew predetermined heating position of chip in the module, avoid causing the damage of chip or chip to retrieve the failure.
In some embodiments of the present invention, the chip module includes a chip region; the chip area is suitable for being placed above the second heating part.
During the heating operation, place the chip module at objective platform 3, place the position correspondence in the chip district of chip module to second heating portion top, heat through second electric bar 31. Meanwhile, the first heating part can be matched to heat the chip module. Through second heating portion and the cooperation heating of first heating portion, the heat degree of adjustable two parts to the heating demand of adaptation different modules. For example, for some modules, heating from below may cause melting of the components below, adversely affect removal of the chip, and may even indirectly damage the chip, thus making it more suitable for heating from above. For such a module, the temperature of the second heating part can be lowered, the temperature of the first heating part can be raised, and the first heating part is used as the main heating part to perform heating and removing operation. And for the module suitable for heating from the lower part, the temperature of the first heating part can be reduced, the temperature of the second heating part can be increased, and the second heating part is used as a main heating part for heating and removing operation.
The present invention has been described above by way of examples, and it is believed that one skilled in the art can appreciate the present invention from the above examples. It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. A chip reclamation apparatus, comprising:
the carrying platform is suitable for carrying the chip module;
the first heating part is suitable for being positioned above the chip module;
a second heating part located at a side of the stage;
the first heating part and the second heating part are suitable for heating the chip module.
2. The chip recycle apparatus according to claim 1, further comprising:
the lifting adjusting part is arranged above the first heating part and is suitable for adjusting the lifting movement of the first heating part relative to the loading platform.
3. The chip recovery apparatus according to claim 2,
the chip recovery device further comprises a device main body, the device main body comprises an upright post, a slide rail is arranged on the side portion of the upright post, and the lifting adjusting portion is connected with the slide rail in a clamped mode and is suitable for moving relative to the slide rail.
4. The chip recovery apparatus according to claim 2,
the first heat insulation block is arranged between the lifting adjusting portion and the first heating portion.
5. The chip recovery apparatus according to claim 1,
the second heating part and the loading platform are arranged separately, the heating surface of the second heating part is flush with the loading surface of the loading platform, and the second heating part is located below the first heating part and has a gap with the first heating part.
6. The chip recovery apparatus according to claim 1 or 5,
the interior of the carrying platform is provided with a ventilating and cooling channel, and the ventilating and cooling channel is provided with an air inlet and an air outlet;
the chip recovery device further comprises a cooling air pipe, the cooling air pipe is communicated with the air inlet, and the cooling air pipe is suitable for ventilating and radiating the area, close to the second heating part, of the loading platform.
7. The chip recycle apparatus according to claim 1, further comprising: the horizontal adjusting part is positioned below the object carrying platform and connected with the object carrying platform, and the horizontal adjusting part is suitable for enabling the object carrying platform to move along the horizontal direction.
8. The chip recycle apparatus according to claim 1, further comprising: and a second heat insulating block provided below the second heating unit.
9. The chip recovery apparatus according to claim 1,
the carrying platform comprises a module adsorption area, and the module adsorption area is suitable for adsorbing the chip module;
chip recovery unit still including set up in the screens slider on objective platform surface, the screens slider is located the lateral part of adsorption zone, the screens slider is suitable for objective platform's horizontal slip on the surface, the screens slider is suitable for with the chip module restriction is in the adsorption zone.
10. The chip recovery apparatus according to claim 1,
the chip module comprises a chip area;
the chip area is suitable for being placed above the second heating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021906919.4U CN213256240U (en) | 2020-09-03 | 2020-09-03 | Chip recovery device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021906919.4U CN213256240U (en) | 2020-09-03 | 2020-09-03 | Chip recovery device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213256240U true CN213256240U (en) | 2021-05-25 |
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ID=75937746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021906919.4U Active CN213256240U (en) | 2020-09-03 | 2020-09-03 | Chip recovery device |
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| CN (1) | CN213256240U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023284050A1 (en) * | 2021-07-12 | 2023-01-19 | 长鑫存储技术有限公司 | Heating apparatus and heating method for semiconductor thermal process |
-
2020
- 2020-09-03 CN CN202021906919.4U patent/CN213256240U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023284050A1 (en) * | 2021-07-12 | 2023-01-19 | 长鑫存储技术有限公司 | Heating apparatus and heating method for semiconductor thermal process |
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