CN213242530U

CN213242530U - Semiconductor chip package

Info

Publication number: CN213242530U
Application number: CN202022646504.4U
Authority: CN
Inventors: 陈宝康; 袁泉; 张子运; 袁虎; 王亮
Original assignee: Jiangsu Nepes Semiconductor Co ltd
Current assignee: Jiangsu Nepes Semiconductor Co ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-05-18
Anticipated expiration: 2030-11-16

Abstract

The utility model belongs to the technical field of chip packaging, and discloses a semiconductor chip package, which comprises a base, an upper cover and copper wires, wherein the center of the top of the base is provided with a mounting groove, the chip is arranged in the mounting groove, the edges of the two sides of the base are provided with eight pins at equal intervals, each pin is connected with a wiring point on the chip through the copper wires, the center of the upper cover is provided with a groove matched with the upper end of the chip, four corners of the top of the base are all fixed with buckles, the utility model discloses a base and the upper cover are arranged, four corners of the base are provided with buckles, and four clamping grooves II are arranged on the upper cover to be matched with the buckles, the buckles can be effectively clamped by the clamping plates in the clamping grooves II, when disassembly and maintenance are needed, the clamping blocks are pushed from the mounting gap by only using a blade, the upper cover can be separated from the base, realize light dismouting, but and encapsulation secondary usage improves economic benefits.

Description

Semiconductor chip package

Technical Field

The utility model belongs to the technical field of the chip package, concretely relates to semiconductor chip encapsulation.

Background

The package for mounting semiconductor IC chip has the functions of holding, fixing, sealing, protecting chip and strengthening electrothermal performance, and is also the bridge for connecting the chip inside world and external circuit. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.

Present semiconductor chip encapsulation adopts bonding mode to be fixed in the chip inside permanently, belongs to disposable encapsulation, when the chip damage need be maintained, dismantles inconveniently, unpacks the back apart the encapsulation, then can't carry out the secondary and use, economic benefits is low when the dismouting is troublesome, and the sealing performance of encapsulation is relatively poor, after the mainboard intake, water easily from the inside chip of the outside infiltration of encapsulation, leads to the chip to damage, can not be fine plays the guard action to the chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor chip package to solve the trouble non-recyclable of current semiconductor chip package dismouting and the poor problem of sealing performance.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor chip package, includes base, upper cover and copper line, the top center department of base has seted up the mounting groove, and installs the chip in the mounting groove, the equal equidistance of both sides edge department of base is provided with eight pins, every the pin all is connected with a wiring point on the chip through the copper line, the center department of covering on goes up sets up flutedly, and the upper end cooperation of recess and chip, four corners in the top of base all are fixed with the buckle, four corners of covering on going up have all seted up draw-in groove two, and every buckle all cooperates with a draw-in groove two.

Preferably, each buckle all includes the fixture block, and a side of fixture block is the arc, two buckles are a set of on the base and the adjacent one side in pin place limit, and two sets of buckles symmetry sets up, every all be fixed with the cardboard on the inner wall of draw-in groove two, and every cardboard all cooperates with a fixture block.

Preferably, each buckle still includes the fixed block, and every fixture block all is fixed in the top of fixed block.

Preferably, the top symmetry of base bonds and has two rubber strips, and every rubber strip is located a set of buckle one side, it inlays and is equipped with two rubber blocks, every to cover the symmetry on the upper cover the inside of rubber block has been seted up draw-in groove one, and every draw-in groove one all cooperates with a rubber strip.

Preferably, eight open slots are formed in the edges of the two sides of the upper cover at equal intervals, and each open slot is matched with one pin.

Preferably, a rubber pad is bonded on the inner wall of each open slot, and when the upper cover and the base are closed, each rubber pad is in close contact with the outer wall of one clamping block.

Compared with the prior art, the utility model, following beneficial effect has:

(1) the utility model discloses a set up base and upper cover to set up the buckle in four corners of base, and set up four draw-in grooves two and cooperate with it on covering, the cardboard in the draw-in groove two can effectively block the buckle, when needs dismantle the maintenance, only need utilize the blade to promote the fixture block from the installation gap, can be with upper cover and base separation, realize light dismouting, but and the encapsulation secondary use, improve economic benefits.

(2) The utility model discloses a set up the rubber strip and the block rubber of mutually supporting on base and upper cover, set up in pin complex open slot in the both sides edge of upper cover to set up the rubber pad in the open slot, can improve the leakproofness in pin department and installation gap well, effectively prevent on the inside chip of external water infiltration encapsulation, play fine guard action to the chip.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is an enlarged view of FIG. 1 at B;

in the figure: the novel chip comprises a base-1, a chip-2, pins-3, rubber strips-4, buckles-5, copper wires-6, an upper cover-7, a groove-8, a rubber block-9, a clamping groove I-10, an open groove-11, a rubber pad-12, a clamping groove II-13, a clamping block-14, a fixed block-15 and a clamping plate-16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a semiconductor chip encapsulation, the on-line screen storage device comprises a base 1, upper cover 7 and copper line 6, base 1's top center department has seted up the mounting groove, and install chip 2 in the mounting groove, base 1's equal equidistance in both sides edge is provided with eight pins 3, every pin 3 all is connected with a wiring point on the chip 2 through copper line 6, chip 2 passes through pin 3 and is connected with other devices, center department on the upper cover 7 sets up flutedly 8, and the upper end cooperation of recess 8 and chip 2, four corners in base 1's top all are fixed with buckle 5, four corners on the upper cover 7 have all seted up draw-in groove two 13, and every buckle 5 all cooperates with a draw-in groove two 13.

Further, every buckle 5 all includes fixture block 14, and a side of fixture block 14 is the arc, and two buckles 5 are a set of on the base 1 with adjacent one side in pin 3 place limit, and two sets of buckles 5 symmetry sets up, and the arcwall of buckle 5 is outwards, all is fixed with cardboard 16 on the inner wall of every draw-in groove two 13, and every cardboard 16 all cooperates with a fixture block 14.

Further, each clip 5 further comprises a fixing block 15, and each clip 14 is fixed on the top of the fixing block 15.

Specifically, the top symmetry of base 1 bonds and has two rubber strips 4, and every rubber strip 4 is located 5 one sides of a set of buckle, and the symmetry inlays on upper cover 7 and is equipped with two rubber blocks 9, and draw-in groove 10 has been seted up to the inside of every rubber block 9, and every draw-in groove 10 all cooperates with a rubber strip 4, improves the leakproofness in upper cover 7 and base 1 installation gap.

It is worth to explain that eight opening grooves 11 are equally spaced at the edges of two sides of the upper cover 7, and each opening groove 11 is matched with one pin 3.

Further, all bond rubber pad 12 on the inner wall of every open slot 11, and when upper cover 7 and base 1 were closed, every rubber pad 12 all with the outer wall in close contact with of a fixture block 14, improved the leakproofness of pin 3 department, and then effectively promoted the leakproofness of whole encapsulation, played fine guard action to chip 2.

The utility model discloses a theory of operation and use flow: when the utility model is used, a worker firstly places a chip 2 in a mounting groove on a base 1, and respectively connects a wiring point on the chip 2 with pins 3 by using a copper wire 6, then aligns a groove 8 of an upper cover 7 with the upper end of the chip 2, and respectively aligns four buckles 5 by four clamping grooves two 13, presses the upper cover 7, easily installs the upper cover 7 on the base 1, clamps a rubber strip 4 into the clamping groove one 10 to be matched with a rubber block 9, and simultaneously each pin 3 is matched with an open groove 11 to be tightly contacted with a rubber pad 12, thereby effectively improving the sealing performance of the packaging mounting gap and the pin 3, effectively preventing external water from permeating into the chip 2 inside the package, and playing a good protection role on the chip 2;

when chip 2 damages and needs the maintenance, only need utilize the blade to promote buckle 5 towards the installation gap of encapsulation, make fixture block 14 cross cardboard 16 and leave draw-in groove two 13, can easily take off upper cover 7, take out chip 2 again and maintain, after the maintenance, can continue to use this encapsulation installation fixed chip 2, whole encapsulation dismouting is simple, and economic benefits is high.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip package, includes base (1), upper cover (7) and copper line (6), its characterized in that: the top center department of base (1) has seted up the mounting groove, and installs chip (2) in the mounting groove, the equal equidistance in both sides edge department of base (1) is provided with eight pins (3), every pin (3) all are connected with a wiring point on chip (2) through copper line (6), center department on upper cover (7) is seted up flutedly (8), and the upper end cooperation of recess (8) and chip (2), four corners in the top of base (1) all are fixed with buckle (5), draw-in groove two (13) have all been seted up to four corners on upper cover (7), and every buckle (5) all with a draw-in groove two (13) cooperation.

2. A semiconductor chip package according to claim 1, wherein: every buckle (5) all include fixture block (14), and a side of fixture block (14) is the arc, two buckles (5) are a set of on base (1) and the adjacent one side in pin (3) place limit, and two sets of buckles (5) symmetry set up, every all be fixed with cardboard (16) on the inner wall of draw-in groove two (13), and every cardboard (16) all with a fixture block (14) cooperation.

3. A semiconductor chip package according to claim 2, wherein: each buckle (5) further comprises a fixing block (15), and each clamping block (14) is fixed to the top of the fixing block (15).

4. A semiconductor chip package according to claim 1, wherein: the top symmetry of base (1) bonds and has two rubber strips (4), and every rubber strip (4) are located a set of buckle (5) one side, the symmetry inlays on upper cover (7) and is equipped with two rubber blocks (9), every draw-in groove (10) have been seted up to the inside of rubber block (9), and every draw-in groove (10) all with a rubber strip (4) cooperation.

5. A semiconductor chip package according to claim 1, wherein: eight open slots (11) have been seted up to both sides edge equal equidistance on upper cover (7), and every open slot (11) all cooperates with a pin (3).

6. A semiconductor chip package according to claim 5, wherein: and a rubber pad (12) is bonded on the inner wall of each open groove (11), and when the upper cover (7) and the base (1) are closed, each rubber pad (12) is in close contact with the outer wall of one clamping block (14).