CN213242506U - Buffer cavity and wafer conveying system - Google Patents

Abstract

A buffer chamber and wafer transfer system, the buffer chamber comprising: a plurality of layers of first cooling disks located in the first buffer chamber body, the first cooling disks including a first wafer contact region; a first displacement port located at the side of the first wafer contact area and penetrating through the first cooling plate; the first lifting unit comprises a first supporting component, the first supporting component is suitable for supporting the edge of the wafer and is suitable for reciprocating above the first displacement port, in the first displacement port and below the first displacement port; a first detection channel extending through the first cooling plate of the bottom layer; a first temperature detection device facing or extending into the first detection channel. The buffer cavity can monitor and feed back the cooling process of the wafer in real time, and the cooling efficiency and the transmission capacity are effectively improved.

Description

Buffer cavity and wafer conveying system

Technical Field

The utility model relates to a semiconductor manufacturing field especially relates to a cushion chamber and wafer transfer system.

Background

In semiconductor manufacturing, in some high temperature semiconductor processes, such as some CVD or photoresist stripping processes, the wafer temperature after the completion of the processing process is high and cannot be directly transferred to the wafer box. It is common practice to subject the wafer to a cooling operation via the following path: the process chamber → the transfer chamber → the buffer chamber (vacuum to atmosphere) → the cooling stage → the wafer cassette, wherein the vacuum transfer robot completes "the process chamber → the transfer chamber → the buffer chamber", and the atmospheric transfer robot completes "the buffer chamber (vacuum to atmosphere) → the cooling stage → the wafer cassette".

In the process of transferring the wafer, one layer of transfer operation is added relative to the normal temperature wafer transfer platform, that is, the buffer chamber (vacuum to atmosphere) → wafer box is changed into the buffer chamber (vacuum to atmosphere) → cooling platform → wafer box, so that the transfer efficiency of the atmospheric robot of the front end module of the equipment is greatly reduced. For short processes, especially ultra-short processes, the wafer throughput per unit time is strongly dependent on the transfer efficiency of the transfer platform. The transmission efficiency of the whole transmission platform is optimized by the following three factors: transfer chamber vacuum robot transfer efficiency; the speed of vacuumizing/breaking the vacuum of the buffer cavity; the transmission efficiency of the equipment front end module atmospheric robot.

Obviously, the transmission efficiency of the front-end module atmospheric robot is greatly reduced due to the addition of one layer of cooling transmission operation, and the temperature of the wafer in the cooling process cannot be monitored, so that the transmission efficiency of the whole transmission platform is also greatly reduced.

Disclosure of Invention

The utility model provides a problem provide a cushion chamber and wafer transfer system, can monitor and feed back in real time the cooling process of wafer, effectively promoted cooling efficiency and conveying ability.

In order to solve the technical problem, the utility model provides a cushion chamber, include: a first buffer chamber body; the side walls of the first cooling plates of all layers are fixed on the inner wall of the first buffer chamber body, and the first cooling plates comprise first wafer contact areas; a first displacement port located at a side of the first wafer contact zone and penetrating the first cooling plate; a first lift unit comprising a first support assembly in the first buffer chamber body, the first support assembly adapted to support an edge of a wafer, the first support assembly adapted to reciprocate above, in, and below the first displacement port; a first detection channel extending through the first cooling plate of the bottom layer; a first temperature detection device facing or extending into the first detection channel.

Optionally, the first probing channel penetrates through the first wafer contact area of the first cooling plate of the bottom layer and the bottom wall of the first buffer cavity body; the first temperature detection device is located below the first buffer cavity body and faces the first detection channel, and the first temperature detection device is an optical non-contact detection device.

Optionally, a first cavity opening penetrating through the bottom wall of the first buffer cavity body is formed in the bottom wall of the first buffer cavity body; part of the first cavity opening and the adjacent first displacement port communicated with the part of the first cavity opening form the first detection channel; the first temperature detection device is suitable for penetrating through the first detection channel and moving up and down along the first detection channel; the first temperature detection device is a thermocouple or a resistance-type temperature sensor, and a probe of the first temperature detection device is suitable for extending into the first buffer cavity body through the first detection channel; the first temperature detection device is embedded in the first lifting unit, and a probe of the first temperature detection device forms part of the first support assembly of the bottom layer.

Optionally, the method further includes: the first temperature monitoring feedback unit is connected with the first temperature detection device; the first temperature monitoring feedback unit is suitable for transmitting a first temperature signal monitored by the first temperature detection device to the control system, and the control system is suitable for carrying out threshold judgment on the first temperature signal.

Optionally, the method further includes: the first lifting unit further comprises a first lifting rod, wherein part of the first lifting rod is positioned in the first buffer chamber body and connected with the first supporting component, the first supporting component is perpendicular to the first lifting rod, the first supporting component and the first lifting rod are in an L shape, and the first lifting rod penetrates through the first displacement port and is suitable for lifting and moving relative to the first displacement port.

Optionally, the method further includes: a second buffer chamber body located above the first buffer chamber body; a second cooling plate located in the second buffer chamber body, a sidewall of the second cooling plate being fixed to an inner wall of the second buffer chamber body, the second cooling plate including a second wafer contact zone, the second cooling plate having a second displacement port therein located at a side of the second wafer contact zone and penetrating the second cooling plate; a second lift unit comprising a second support assembly in the second buffer chamber body, the second support assembly adapted to support an edge of a wafer, the second support assembly adapted to reciprocate above the second displacement port, in the second displacement port, and below the second displacement port; a second detection channel penetrating the second cooling plate of the top layer; a second temperature detection device facing or extending into the second detection channel.

Optionally, the second detection channel penetrates through a second wafer contact area of a second cooling plate on the top layer and a top wall of the second buffer cavity body; the second temperature detection device is located above the second buffer cavity body, faces the second detection channel and is an optical non-contact detection device.

Optionally, a top wall of the second buffer cavity body has a second cavity opening therein, which penetrates through the top wall of the second buffer cavity body; part of the second cavity opening and an adjacent second displacement port communicated with the part of the second cavity opening form a second detection channel; the second temperature detection device is suitable for penetrating through the second detection channel and moving up and down along the second detection channel; the second temperature detection device is a thermocouple or a resistance-type temperature sensor, and a probe of the second temperature detection device is suitable for extending into the second buffer cavity body through the second detection channel; the second temperature detection device is embedded in the second lifting unit, and a probe of the second temperature detection device forms part of the second supporting component of the top layer.

Optionally, the method further includes: the second temperature monitoring feedback unit is connected with the second temperature detection device; the second temperature monitoring feedback unit is suitable for transmitting a second temperature signal monitored by the second temperature detection device to the control system, and the control system is suitable for carrying out threshold judgment on the second temperature signal.

Optionally, the second lifting unit further includes a second lifting rod, a portion of the second lifting rod is located inside the second buffer chamber body and connected to the second supporting assembly, the second supporting assembly is perpendicular to the second lifting rod, the second supporting assembly and the second lifting rod are in an "L" shape, and the second lifting rod passes through the second displacement port and is adapted to perform lifting movement relative to the second displacement port.

The utility model also provides a wafer transfer system, include: a transfer chamber; a process chamber located at a side of the transfer chamber; the buffer cavity of the utility model is positioned at the side part of the conveying cavity and is separated from the process cavity; a first transfer robot located in the transfer chamber.

Optionally, the method further includes: a wafer cassette; and the equipment front end module is positioned between the wafer box and the buffer cavity and comprises a second conveying robot.

Compared with the prior art, the technical scheme of the utility model following beneficial effect has:

the utility model discloses technical scheme provides a cushion chamber can not only carry out broken vacuum step to the wafer that is arranged in first buffering cavity main part, and first cooling plate can also cool off the wafer that is arranged in first buffering cavity main part, and broken vacuum step and the cooling to the wafer can go on in step. Secondly, the first temperature detection device can monitor the temperature of the wafer in the first buffer chamber main body, and when the temperature of the first cooling disc to the wafer is lower than a temperature threshold value, the wafer can be timely conveyed out of the first buffer chamber main body. In conclusion, the wafer transmission efficiency in the process is improved.

The utility model discloses technical scheme provides a wafer transfer system, including the cushion chamber, can not only carry out broken vacuum step to the wafer that is arranged in first buffering cavity main part, first cooling plate can also cool off the wafer that is arranged in first buffering cavity main part, broken vacuum step and the cooling to the wafer can go on in step. Secondly, the first temperature detection device can monitor the temperature of the wafer in the first buffer chamber main body, and when the temperature of the first cooling disc to the wafer is lower than a temperature threshold value, the wafer can be timely conveyed out of the first buffer chamber main body. In conclusion, the wafer transmission efficiency in the process is improved.

Secondly, can make the wafer pass into when going into the process of delivering through first lift unit that the finger of first transfer robot is effectively kept apart with first cooling pan, accomplish first cooling pan area and cooling capacity maximize to promote the cooling rate of cooling to the wafer greatly, promote high temperature process transmission system's transmission efficiency.

Drawings

Fig. 1 is a schematic cross-sectional view of a buffer chamber according to an embodiment of the present invention;

fig. 2 is a schematic top view of a buffer chamber according to an embodiment of the present invention;

fig. 3 is a schematic view of a wafer transfer system according to another embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a buffer chamber according to another embodiment of the present invention.

Detailed Description

An embodiment of the present invention provides a buffer chamber, please refer to fig. 1 and fig. 2, including:

a first buffer chamber body 302;

a plurality of layers of the first cooling plate 305 disposed within the first buffer chamber body 302, the sidewalls of the first cooling plate 305 of each layer being secured to the inner wall of the first buffer chamber body 302, the first cooling plate 305 including a first wafer contact area a 2;

a first displacement port 306 located laterally of the first wafer contact area a2 and extending through the first cooling plate 305;

a first lift unit comprising a first support assembly 308 in the first buffer chamber body 302, the first support assembly 308 adapted to support an edge of a wafer 10b, the first support assembly 308 adapted to reciprocate above the first displacement port 306, in the first displacement port 306, and below the first displacement port 306;

a first detection channel penetrating the first cooling pan 305 of the bottom layer;

a first temperature detection device 401, said first temperature detection device 401 facing said first detection channel.

The buffer chamber of the present embodiment can not only perform the step of breaking vacuum on the wafer 10b in the first buffer chamber body 302, but also cool the wafer 10b in the first buffer chamber body 302, and the step of breaking vacuum and the cooling of the wafer can be performed simultaneously. Next, the first temperature detecting device 401 can monitor the temperature of the wafer 10b in the first buffer chamber body 302, and when the temperature of the first cooling plate 305 to the wafer 10b reaches below the temperature threshold, the wafer 10b can be timely transferred out of the first buffer chamber body 302. In conclusion, the efficiency of transferring the wafer 10b during the process is improved.

In this embodiment, the first probe channel extends through the first wafer contact area a2 of the bottom first cooling plate 305 and the bottom wall of the first buffer chamber body 302; the first temperature detection device 401 is located below the first buffer cavity body 302, the first temperature detection device 401 faces the first detection channel, and the first temperature detection device 401 is an optical contactless detection device.

In this embodiment, the buffer chamber further includes: a first temperature monitoring feedback unit connected to the first temperature detection device 401; the first temperature monitoring feedback unit is adapted to transmit a first temperature signal monitored by the first temperature detection device 401 to a control system, and the control system is adapted to perform threshold judgment on the first temperature signal.

The first lifting unit further comprises a first lifting rod 310, a portion of the first lifting rod 310 is located inside the first buffer chamber body 302 and connected to the first support component 308, the first support component 308 is perpendicular to the first lifting rod 310, the first support component 308 and the first lifting rod 310 are in an "L" shape, and the first lifting rod 310 passes through the first displacement port 306 and is adapted to perform lifting movement relative to the first displacement port 306. One end of the first lift pin 310 extends outside the first buffer chamber body 302.

In this embodiment, one end of the first lift pin 310 extends below the first buffer chamber body 302.

The first elevating unit further includes a first elevating cylinder 312 positioned below the first buffer chamber body 302 and connected to the first elevating rod 310.

The first cooling plate 305 is a plurality of layers, and the plurality of layers of the first cooling plate 305 are separately arranged in the first buffer chamber main body 302 from top to bottom.

In this embodiment, one of the first buffer chamber bodies 302 has three layers of the first cooling plate 305, with one layer of the first cooling plate 305 including two first wafer contact areas a2, for example only. In other embodiments, one of the first buffer chamber bodies has one, two, or more than four first cooling plates therein, with one first cooling plate including one, or more than two first wafer contact zones.

The first supporting components 308 in the first lifting unit have a plurality of layers, and the arrangement direction of the plurality of layers of first supporting components 308 is parallel to the arrangement direction of the plurality of layers of first cooling trays 305. In this embodiment, the first support assembly 308 in one first lifting unit has three layers, merely as an example. In other embodiments, a first lifting unit may have one, two, or more than four first support members.

The layer of first cooling plate 305 corresponds to the layer of first support members 308, meaning that the layer of first support members is adapted to place the wafer 10b on the first wafer contact area a2 of the corresponding layer of first cooling plate 305.

For a first wafer contact zone a2, the number of first displacement ports 306 at the side of the first wafer contact zone a2 is plural, and the plural first displacement ports 306 are distributed evenly and discretely around the first wafer contact zone a 2.

For a first wafer contact zone a2, a first wafer contact zone a2 is surrounded by a plurality of first support members 308, one first support member 308 corresponding to one first displacement port 306, i.e., one first support member 308 is adapted to reciprocate above one first displacement port 306, in the first displacement port 306, and below the first displacement port 306. The number of first support members 308 is equal to the number of first displacement ports 306.

In the present embodiment, for one first wafer contact zone a2, the number of first displacement ports 306 at the side of the first wafer contact zone a2 is four, and four first displacement ports 306 are evenly and separately distributed around the first wafer contact zone a 2.

In other embodiments, the number of first displacement openings at the side of the first wafer contact area is other than the number of first displacement openings at the side of the first wafer contact area.

In this embodiment, the first cooling plate 305 of each layer has a first cooling duct therein. The buffer chamber further includes: a water inlet pipe communicated with one end of the first cooling pipe, and a water outlet pipe (not shown) communicated with the other end of the first cooling pipe.

In this embodiment, the buffer chamber further includes: a cavity vacuum valve G and a cavity large air valve G.

This embodiment still includes: a second buffer chamber body 301 positioned above the first buffer chamber body 302. That is, the buffer chamber of the present embodiment has a double-layer structure. It should be noted that, in other embodiments, the buffer chamber has a single-layer structure, and the buffer chamber includes the first buffer chamber body and does not include the second buffer chamber body.

In this embodiment, the buffer chamber further includes: a second cooling plate 303, the second cooling plate 303 being positioned in the second buffer chamber body 301, a side wall of the second cooling plate 303 being fixed to an inner wall of the second buffer chamber body 301, the second cooling plate 303 including a second wafer contact area A1, the second cooling plate 303 having a second displacement port 304 therein positioned at a side of the second wafer contact area A1 and penetrating the second cooling plate 303.

In this embodiment, the buffer chamber further includes: a second lift unit including a second support assembly 307 in the second buffer chamber body 301, the second support assembly 307 adapted to support an edge of the wafer 10a, the second support assembly 307 adapted to reciprocate above the second displacement port 304, in the second displacement port 304, and below the second displacement port 304;

in this embodiment, the buffer chamber further includes: a second detection passage (not shown) penetrating the top wall of the second buffer chamber body 301; a second temperature detection device (not shown) facing the second detection channel. The second temperature detection device is positioned above the second buffer cavity body and is an optical non-contact detection device.

The buffer chamber of the embodiment can not only perform the step of breaking vacuum on the wafer 10a in the second buffer chamber body 301, but also cool the wafer 10a in the second buffer chamber body 301, and the step of breaking vacuum on the second buffer chamber body 301 and the step of cooling the wafer 10a by the second buffer chamber body 301 can be performed simultaneously, thereby improving the transfer efficiency of the wafer 10a in the process. The buffer chamber of the present embodiment can not only perform the step of breaking vacuum on the wafer 10a in the second buffer chamber body 301, but also cool the wafer 10a in the second buffer chamber body 301, and the step of breaking vacuum on the second buffer chamber body 301 and the cooling of the wafer 10a by the second buffer chamber body 301 can be performed simultaneously. Secondly, the second temperature detecting device can monitor the temperature of the wafer in the second buffer chamber body 301, and when the temperature of the second cooling plate 303 to the wafer 10a reaches below the temperature threshold, the wafer 10a can be timely transferred out of the second buffer chamber body 301. In conclusion, the wafer transmission efficiency in the process is improved.

The second lifting unit further comprises a second lifting rod 309, a portion of the second lifting rod 309 is located inside the second buffer chamber body 301 and connected to the second support assembly 307, the second support assembly 307 is perpendicular to the second lifting rod 309, the second support assembly 307 and the second lifting rod 309 are in an "L" shape, and the second lifting rod 309 passes through the second displacement port 304 and is adapted to perform lifting movement relative to the second displacement port 304.

One end of the second lift pin 309 extends above the second buffer chamber body 301.

The second lifting unit further includes a second lifting cylinder 311 positioned above the second buffer chamber body 301 and connected to the second lifting rod 309.

The second cooling plate 303 is provided with a plurality of layers, and the plurality of layers of second cooling plates 303 are separately arranged in the second buffer chamber main body 301 from top to bottom.

The second supporting components 307 in the second lifting unit are provided with a plurality of layers, and the arrangement direction of the plurality of layers of second supporting components 307 is parallel to the arrangement direction of the plurality of layers of second cooling discs 303; one layer of the second cooling plate 303 corresponds to one layer of the second support member 307.

In this embodiment, one of the second buffer chamber bodies 301 has three layers of second cooling plates 303 therein, one layer of second cooling plates 303 including two second wafer contact areas a1, for example only. In other embodiments, one second buffer chamber body 301 has one, two, or four or more second cooling plates 303 therein, and one second cooling plate 303 includes one, or two or more second wafer contact areas a 1.

For one second wafer contact area a1, the number of second displacement ports 304 at the side of the second wafer contact area a1 is plural, and the plural second displacement ports 304 are evenly and discretely distributed around the second wafer contact area a 1.

For a second wafer contact area a1, a second wafer contact area a1 is surrounded by a plurality of second support members 307, one second support member 307 corresponding to one second displacement port 304, that is, one second support member 307 is adapted to reciprocate above one second displacement port 304, in the second displacement port 304, and below the second displacement port 304. The number of second support members 307 is equal to the number of second displacement ports 304.

In this embodiment, the second cooling plate 303 of each layer has a second cooling duct C therein.

In this embodiment, the buffer chamber further includes: a water inlet pipe (not shown) communicating with one end of the second cooling pipe, and a water outlet pipe (not shown) communicating with the other end of the second cooling pipe.

In this embodiment, the buffer chamber further includes: the second temperature monitoring feedback unit is connected with the second temperature detection device; the second temperature monitoring feedback unit is suitable for transmitting a second temperature signal monitored by the second temperature detection device to the control system, and the control system is suitable for carrying out threshold judgment on the second temperature signal.

Accordingly, another embodiment of the present invention further provides a wafer conveying system, referring to fig. 3, including: a transfer chamber 200; a process chamber 210 located at a side of the transfer chamber 200; the buffer chamber 220, the buffer chamber 220 being located at a side of the transfer chamber 200 and being separated from the process chamber 210; a first transfer robot 230 located in the transfer chamber 200; a wafer cassette 240; an equipment front end module 250 between the wafer cassette 240 and the buffer chamber 220, the equipment front end module 250 including a second transfer robot.

The wafer transfer system of the present embodiment includes the buffer chamber 220, and not only can perform the vacuum breaking step on the wafer 10b in the first buffer chamber body 302, but also can cool the wafer 10b in the first buffer chamber body 302, and the vacuum breaking step and the cooling of the wafer 10b can be performed simultaneously. Next, the first temperature detecting device 401 can monitor the temperature of the wafer 10b in the first buffer chamber body 302, and when the temperature of the first cooling plate to the wafer reaches below the temperature threshold, the wafer can be timely transferred out of the first buffer chamber body 302. In conclusion, the efficiency of transferring the wafer 10b during the process is improved.

The wafer transfer system of the present embodiment can not only break the vacuum of the wafer 10a in the second buffer chamber body 301, but also cool the wafer 10a in the second buffer chamber body 301, and the breaking of the vacuum and the cooling of the wafer 10a can be performed simultaneously. Secondly, the second temperature detecting device can monitor the temperature of the wafer 10a in the second buffer chamber body 301, and when the temperature of the second cooling plate to the wafer reaches below the temperature threshold, the wafer 10a can be timely transferred out of the second buffer chamber body 301. In conclusion, the efficiency of transferring the wafer 10a during the process is improved.

In this embodiment, can make the wafer pass into when going out the process finger and the first cooling dish of first transfer robot 230 effectively keep apart with first cooling dish and second cooling dish through the lift unit, accomplish first cooling dish volume and cooling capacity maximize, accomplish second cooling dish volume and cooling capacity maximize to promote the cooling rate to the wafer greatly, promote high temperature process transmission system's transmission efficiency.

Correspondingly, the working method of the wafer conveying system is also provided, and comprises the following steps:

the wafer is processed in the process chamber 210;

after the wafer is processed in the process chamber 210, the first transfer robot 230 takes the wafer 10 out of the process chamber 210 and transfers it to the transfer chamber 200;

the first transfer robot 230 transfers the wafer 10 from the transfer chamber 200 onto the first wafer contact area a2 in the first buffer chamber body 302;

after the wafer 10 is transferred to the first wafer contact area a2 in the first buffer chamber body 302, the first buffer chamber body 302 is subjected to vacuum breaking, and during the vacuum breaking of the first buffer chamber body 302, the first cooling plate 305 cools the wafer 10;

the first temperature detection device 401 monitors the temperature of the wafer 10b on the first cooling plate 305 of the bottom layer;

monitoring the gas pressure inside the first buffer chamber body 302 when the first temperature signal monitored by the first temperature detecting device 401 is lower than a temperature threshold;

if the pressure of the gas inside the first buffer chamber body 302 is greater than the pressure threshold, the wafer 10b is transferred out of the first buffer chamber body 302.

In one particular embodiment, the breaking of the vacuum in the first buffer chamber body 302 is accomplished by charging the first buffer chamber body 302 with dry, high purity nitrogen gas.

In this embodiment, the method further includes: after the first cooling plate 305 cools the wafer 10, the second transfer robot transfers the wafer 10 into the pod 240 via the front end of the apparatus module 250.

In this embodiment, before the wafer is processed in the process chamber 210, the method further includes: unreacted wafers are transferred into the first buffer chamber body 302, then the first buffer chamber body 302 is vacuumized, and after the first buffer chamber body 302 is vacuumized, the unreacted wafers are sequentially transferred into the process chamber 210.

In one embodiment, the process of the first transfer robot 230 transferring the wafer 10 from the transfer chamber 200 onto the first wafer contact area a2 in the first buffer chamber body 302 includes: the first lifting unit is raised so that the first support member 308 is above the first cooling tray 305 of the same floor; the first transfer robot 230 transfers the wafer 10 from the transfer chamber 200 into the first buffer chamber body 302 and moves it downward so that the wafer 10 is placed on the first support member 308; after the wafer 10 is placed on the first support assembly 308, the first transfer robot 230 moves down off the wafer 10 and out of the first buffer chamber body 302; after the first transfer robot 230 moves out of the first buffer chamber body 302, the first lift unit is lowered such that the first support assembly 308 moves downward through the first transfer port to place the wafer 10 on the first wafer contact zone a 2. It should be noted that, by performing one cycle of the process, a wafer can be placed on one first wafer contact area a2, and the process is repeated until several wafers are placed on several different first wafer contact areas a2, respectively.

In another embodiment, the process of the first transfer robot 230 transferring the wafer 10 from the transfer chamber 200 to the first wafer contact area a2 in the first buffer chamber body 302 includes: the first transfer robot 230 transfers the wafer 10 from the transfer chamber 200 into the first buffer chamber body, the first lifting unit is lifted such that the first support member 308 holds the wafer 10, and the first transfer robot 230 is detached from the wafer 10; after the first support assembly 308 holds the wafer 10, the first transfer robot 230 moves out of the first buffer chamber body 302; the first lift unit is lowered such that the first support assembly 308 moves downwardly through the first transfer port 306 to place the wafer 10 on the first wafer contact area a 2. It should be noted that, by performing one cycle of the process, a wafer can be placed on one first wafer contact area a2, and the process is repeated until several wafers are placed on several different first wafer contact areas a2, respectively.

In yet another embodiment, the process of the first transfer robot 230 transferring the wafer 10 from the transfer chamber 200 onto the first wafer contact area a2 in the first buffer chamber body 302 includes: a first sub-step in which the first transfer robot 230 transfers the wafer 10 from the transfer chamber 200 into the first buffer chamber body 302; a second sub-step of raising the first lifting unit such that the first support member 308 holds the wafer 10 and the first transfer robot 230 is detached from the wafer 10; in a third sub-step, after the first support assembly 308 holds the wafer 10, the first transfer robot 230 moves out of the first buffer chamber body 302; a fourth substep of lowering the first lifting unit so that the first support member 308 moves downward and is positioned higher than the first cooling pan 305 of the same floor; repeating the first, second, third, and fourth substeps until a plurality of wafers are transferred from the transfer chamber 200 onto a different first support assembly in the first buffer chamber body 302; after the plurality of wafers are transferred from the transfer chamber 200 to the different first support members 308 in the first buffer chamber body, the first elevating unit is lowered such that the first support members 308 move downward through the first transfer ports 306 to place the plurality of wafers on the different first wafer contact areas a2, respectively.

For the second buffer chamber main body 301, unreacted wafers are transferred into the second buffer chamber main body 301, then the second buffer chamber main body 301 is vacuumized, then the unreacted wafers are sequentially transferred into the process cavity by the second buffer chamber main body 301 to be reacted, the reacted wafers are sequentially transferred back to the second buffer chamber main body 301, and the wafers are subjected to process treatment in the process cavity; after the wafer is subjected to process treatment in the process cavity, the first conveying robot takes the wafer out of the process cavity and conveys the wafer to the conveying cavity; the first transfer robot transfers the wafer from the transfer chamber onto the second wafer contact area of the second buffer chamber body 301; after the wafer is transferred onto the second wafer contact area in the second buffer chamber body 301, the second buffer chamber body 301 is subjected to vacuum breaking, and the wafer is cooled by the second cooling plate during the vacuum breaking process of the second buffer chamber body 301. Meanwhile, the first transfer robot transfers the reacted wafer from the transfer chamber to the lower wafer contact area of the first buffer chamber body 302, after the wafer is transferred to the first buffer chamber body 302, the first buffer chamber body 302 is subjected to vacuum breaking, in the process of vacuum breaking of the first buffer chamber body 302, the wafer is cooled by the first cooling disc, and the cooled wafer is transferred to the wafer box.

For the buffer cavity with the double-layer structure, the upper buffer cavity and the lower buffer cavity are alternately vacuumized and broken, and the transmission efficiency of the whole system is higher.

In one embodiment, the process of the first transfer robot transferring the wafer from the transfer chamber onto the second wafer contact area of the second buffer chamber body 301 comprises: the second lifting unit is lifted so that the second support assembly is higher than the second cooling plate on the same layer; the first transfer robot transfers the wafer from the transfer chamber into the second buffer chamber body 301 and moves down, so that the wafer is placed on the second support member; after placing the wafer on the second support assembly, the first transfer robot moves down off the wafer and out of the second buffer chamber body 301; after the first transfer robot moves out of the second buffer chamber body 301, the second lift unit is lowered such that the second support assembly moves downward through the second transfer port to place a wafer on the second wafer contact area. It should be noted that, by performing one cycle in the process, a wafer can be placed on one second wafer contact area, and the process is repeated until a plurality of wafers are placed on a plurality of different second wafer contact areas, respectively.

In another embodiment, the process of the first transfer robot transferring the wafer from the transfer chamber onto the second wafer contact area of the second buffer chamber body 301 comprises: the first conveying robot conveys the wafer into the buffer cavity from the conveying cavity, and the second lifting unit is lifted to enable the second supporting component to support the wafer and enable the first conveying robot to be separated from the wafer; after the second supporting component supports the wafer, the first conveying robot moves out of the buffer cavity; the second lifting unit descends to enable the second supporting component to move downwards to pass through the second displacement port so as to place the wafer on the second wafer contact area. It should be noted that, by performing one cycle of the process, a wafer can be placed in one second wafer contact area a1, and the process is repeated until several wafers are placed in several different second wafer contact areas a 1.

In yet another embodiment, the process of the first transfer robot transferring the wafer from the transfer chamber onto the second wafer contact area of the second buffer chamber body 301 comprises: a first sub-step of transferring the wafer from the transfer chamber into the second buffer chamber body 301 by the first transfer robot; in the second sub-step, the second lifting unit is lifted to enable the second supporting component to support the wafer, and the first conveying robot is separated from the wafer; in the third substep, after the second supporting component holds the wafer, the first transfer robot moves out of the second buffer chamber body; a fourth substep of lowering the second lifting unit so that the second support assembly moves downward and is positioned higher than the second cooling pan on the same floor; repeating the first, second, third and fourth substeps until a plurality of wafers are transferred from the transfer chamber onto a different second support assembly in the second buffer chamber body; after the wafers are transferred from the transfer cavity to different second support assemblies in the second buffer chamber body, the second lifting unit descends to enable the second support assemblies to move downwards to penetrate through the second displacement ports, and therefore the wafers are placed on different second wafer contact areas respectively.

Note that the finger 9 of the first transfer robot is in contact with the back surface portion of the wafer during transfer of the wafer, and the finger 9 of the first transfer robot is not in contact with the cooling plate.

In this embodiment, the method further includes: after the wafer 10 is transferred to a second wafer contact area in the second buffer chamber body, the second buffer chamber body is subjected to vacuum breaking, and the wafer 10 is cooled by the second cooling disc in the process of vacuum breaking of the second buffer chamber body; the second temperature detection device monitors the temperature of the wafer on the second cooling disc on the top layer; when a second temperature signal monitored by the second temperature detection device is lower than a temperature threshold value, monitoring the air pressure in the second buffer chamber body; if the air pressure inside the second buffer chamber body is greater than the air pressure threshold, the wafer is transferred out of the second buffer chamber body.

In this embodiment, the first temperature detecting device is an optical non-contact detecting device, and the first temperature detecting device is suitable for monitoring the temperature of the wafer on the first cooling plate on the bottom layer in real time. The second temperature detection device is an optical non-contact detection device and is suitable for monitoring the temperature of the wafer on the second cooling disc on the top layer in real time.

In this embodiment, when the first temperature signal monitored by the first temperature detecting device 401 is lower than the temperature threshold, the air pressure inside the first buffer chamber body 302 is monitored; if the gas pressure inside the first buffer chamber body 302 is less than or equal to the gas pressure threshold, the first buffer chamber body 302 continues to break the vacuum until the gas pressure inside the first buffer chamber body 302 is greater than the gas pressure threshold.

Another embodiment of the present invention further provides a buffer chamber, please refer to fig. 4, the difference between the present embodiment and the previous embodiment is: the first detection channel, the first temperature detection device 501, the second detection channel, and the second temperature detection device of this embodiment are different from those of the previous embodiment. The same portions of this embodiment as those of the previous embodiment will not be described in detail.

In the buffer chamber of this embodiment, the bottom wall of the first buffer chamber main body 302 has a first chamber opening penetrating through the bottom wall of the first buffer chamber main body 302; a part of the first cavity opening and an adjacent first displacement port 306 communicated with the part of the first cavity opening form the first detection channel; the first temperature detection device 501 is adapted to pass through the first detection channel and move up and down along the first detection channel; the first temperature detection device 501 is a thermocouple or a resistance temperature sensor, and a probe of the first temperature detection device 501 is adapted to extend into the first buffer cavity body 302 through the first detection channel; the first temperature detection device 501 is embedded in the first lifting unit, and a probe of the first temperature detection device 501 forms part of the first support member 308 of the bottom layer.

The top wall of the second buffer cavity body 301 is provided with a second cavity opening penetrating through the top wall of the second buffer cavity body 301; a part of the second cavity opening and an adjacent second displacement port 304 communicated with the part of the second cavity opening form the second detection channel; the second temperature detection device is suitable for penetrating through the second detection channel and moving up and down along the second detection channel; the second temperature detection device is a thermocouple or a resistance-type temperature sensor, and a probe of the second temperature detection device is suitable for extending into the second buffer cavity body 301 through the second detection channel; the second temperature detection means is embedded in the second lifting unit, the probe of which constitutes part of the second support member 307 of the top layer.

Correspondingly, another embodiment of the present invention further provides a wafer conveying system, including: a transfer chamber; a process chamber located at a side of the transfer chamber; the buffer cavity is positioned at the side part of the transfer cavity and is separated from the process cavity; a first transfer robot located in the transfer chamber; a wafer cassette; and the equipment front end module is positioned between the wafer box and the buffer cavity and comprises a second conveying robot.

Correspondingly, a working method of the wafer transfer system is also provided, and the working method of the wafer transfer system of the present embodiment is different from the working method of the wafer transfer system of the previous embodiment in that: after the first cooling disc cools the wafer for a period of time, the first lifting unit is lifted to enable the first supporting component to lift the wafer, and a probe of the first temperature detection device carries out temperature test on the wafer on the first supporting component at the bottom layer; if the first temperature signal monitored by the first temperature detection device is higher than or equal to the temperature threshold value, the first lifting unit descends to enable the wafer to be placed on the first cooling disc so as to continue cooling the wafer; and circulating the first supporting assembly to drag the wafer, carrying out temperature test on the wafer by a probe of the first temperature detection device, and lowering the first lifting unit to enable the wafer to be placed on the first cooling disc so as to continue cooling the wafer until a first temperature signal monitored by the first temperature detection device is lower than a temperature threshold value. After the second cooling disc cools the wafer for a period of time, the second lifting unit is lifted to enable the second supporting assembly to drag the wafer, and the probe of the second temperature detection device carries out temperature test on the wafer on the second supporting assembly on the top layer; if the second temperature signal monitored by the second temperature detection device is higher than or equal to the temperature threshold value, the second lifting unit descends to enable the wafer to be placed on the second cooling disc so as to continue cooling the wafer; and circulating the second supporting assembly to lift the wafer, carrying out temperature test on the wafer by a probe of the second temperature detection device, and lowering the second lifting unit to enable the wafer to be placed on the second cooling disc so as to continue cooling the wafer until a second temperature signal monitored by the second temperature detection device is lower than a temperature threshold value.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention, and the scope of the present invention is defined by the appended claims.

Claims (12)

1. A buffer chamber, comprising:

a first buffer chamber body;

a plurality of layers of first cooling disks located in the first buffer chamber body, the first cooling disks including a first wafer contact region;

a first displacement port located at a side of the first wafer contact zone and penetrating the first cooling plate;

a first lift unit comprising a first support assembly in the first buffer chamber body, the first support assembly adapted to support an edge of a wafer, the first support assembly adapted to reciprocate above, in, and below the first displacement port;

a first detection channel extending through the first cooling plate of the bottom layer;

a first temperature detection device facing or extending into the first detection channel.

2. The buffer chamber of claim 1, wherein the first probe channel extends through the first wafer contact region of the underlying first cooling plate and the bottom wall of the first buffer chamber body; the first temperature detection device is located below the first buffer cavity body and faces the first detection channel, and the first temperature detection device is an optical non-contact detection device.

3. The cushion chamber of claim 1, wherein the bottom wall of the first cushion chamber body has a first chamber opening therein that extends through the bottom wall of the first cushion chamber body; part of the first cavity opening and the adjacent first displacement port communicated with the part of the first cavity opening form the first detection channel; the first temperature detection device is suitable for penetrating through the first detection channel and moving up and down along the first detection channel;

the first temperature detection device is a thermocouple or a resistance-type temperature sensor, and a probe of the first temperature detection device is suitable for extending into the first buffer cavity body through the first detection channel;

the first temperature detection device is embedded in the first lifting unit, and a probe of the first temperature detection device forms part of the first support assembly of the bottom layer.

4. The cushion chamber of claim 1, further comprising: the first temperature monitoring feedback unit is connected with the first temperature detection device; the first temperature monitoring feedback unit is suitable for transmitting a first temperature signal monitored by the first temperature detection device to the control system, and the control system is suitable for carrying out threshold judgment on the first temperature signal.

5. The cushion chamber of claim 1, further comprising: the first lifting unit further comprises a first lifting rod, wherein part of the first lifting rod is positioned in the first buffer chamber body and connected with the first supporting component, the first supporting component is perpendicular to the first lifting rod, the first supporting component and the first lifting rod are in an L shape, and the first lifting rod penetrates through the first displacement port and is suitable for lifting and moving relative to the first displacement port.

6. The cushion chamber of claim 1, further comprising:

a second buffer chamber body located above the first buffer chamber body;

a second cooling plate located in the second buffer chamber body, the second cooling plate including a second wafer contact zone, the second cooling plate having a second displacement port therein located at a side of the second wafer contact zone and extending through the second cooling plate;

a second lift unit comprising a second support assembly in the second buffer chamber body, the second support assembly adapted to support an edge of a wafer, the second support assembly adapted to reciprocate above the second displacement port, in the second displacement port, and below the second displacement port;

a second detection channel penetrating the second cooling plate of the top layer;

a second temperature detection device facing or extending into the second detection channel.

7. The buffer chamber of claim 6, wherein the second probe passage extends through a top wall of the second buffer chamber body; the second temperature detection device is located above the second buffer cavity body, faces the second detection channel and is an optical non-contact detection device.

8. The cushion chamber of claim 6, wherein the top wall of the second cushion chamber body has a second chamber opening therein through the top wall of the second cushion chamber body; part of the second cavity opening and an adjacent second displacement port communicated with the part of the second cavity opening form a second detection channel; the second temperature detection device is suitable for penetrating through the second detection channel and moving up and down along the second detection channel;

the second temperature detection device is a thermocouple or a resistance-type temperature sensor, and a probe of the second temperature detection device is suitable for extending into the second buffer cavity body through the second detection channel;

the second temperature detection device is embedded in the second lifting unit, and a probe of the second temperature detection device forms part of the second supporting component of the top layer.

9. The cushion chamber of claim 6, further comprising: the second temperature monitoring feedback unit is connected with the second temperature detection device; the second temperature monitoring feedback unit is suitable for transmitting a second temperature signal monitored by the second temperature detection device to the control system, and the control system is suitable for carrying out threshold judgment on the second temperature signal.

10. The buffer chamber of claim 6, wherein the second lifting unit further comprises a second lifting rod, a portion of the second lifting rod is disposed inside the second buffer chamber body and connected to the second support assembly, the second support assembly is perpendicular to the second lifting rod, the second support assembly and the second lifting rod are L-shaped, and the second lifting rod passes through the second displacement port and is adapted to perform lifting movement relative to the second displacement port.

11. A wafer transfer system, comprising:

a transfer chamber;

a process chamber located at a side of the transfer chamber;

the buffer chamber according to any of claims 1 to 10, which is located at a side of the transfer chamber and is separate from the process chamber;

a first transfer robot located in the transfer chamber.

12. The wafer transfer system of claim 11, further comprising: a wafer cassette; and the equipment front end module is positioned between the wafer box and the buffer cavity and comprises a second conveying robot.

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