CN213236992U - Lamp panel based on intelligent IC - Google Patents
Lamp panel based on intelligent IC Download PDFInfo
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- CN213236992U CN213236992U CN202021883498.8U CN202021883498U CN213236992U CN 213236992 U CN213236992 U CN 213236992U CN 202021883498 U CN202021883498 U CN 202021883498U CN 213236992 U CN213236992 U CN 213236992U
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Abstract
The utility model discloses a lamp panel based on an intelligent IC, which comprises a PCB board, a first LED lamp group, a second LED lamp group, a third LED lamp group and a fourth LED lamp group, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are all arranged on the PCB, the PCB board is provided with a first intelligent IC, a second intelligent IC, a third intelligent IC and a fourth intelligent IC which are used for sensing circuit change and environment temperature change and adjusting current according to the change, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are connected in parallel, the first intelligent IC, the second intelligent IC, the third intelligent IC and the fourth intelligent IC are respectively connected with the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group in series, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are all arranged on the front surface of the PCB; this lamp plate life-span based on intelligent IC is high.
Description
Technical Field
The utility model relates to a lamp plate based on intelligence IC.
Background
The LED is called as a fourth generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, and is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like. According to different use functions, the system can be divided into five categories of information display, signal lamps, vehicle lamps, liquid crystal display backlight sources and general illumination.
Those skilled in the art will appreciate that the useful life of the LED light panel can be increased.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a lamp plate based on intelligent IC that life-span is high.
In order to solve the above problem, the utility model adopts the following technical scheme:
the utility model provides a lamp plate based on intelligence IC, includes PCB board, first LED banks, second LED banks, third LED banks and fourth LED banks are all installed on the PCB board, be provided with first intelligence IC, second intelligence IC, third intelligence IC and fourth intelligence IC that are used for perception circuit change and ambient temperature change and adjust current according to the change on the PCB board, first LED banks, second LED banks, third LED banks and fourth LED banks parallel connection, first intelligence IC, second intelligence IC, third intelligence IC and fourth intelligence IC all install in the front with first LED banks, second LED banks, third LED banks and fourth LED banks series connection respectively, first LED banks, second LED banks, third LED banks and fourth LED banks.
As preferred, the PCB board back is provided with the heat pipe, the heat pipe is the heliciform setting, heat pipe and PCB board fixed connection through disposing the heat pipe, can effectual promotion radiating efficiency, adopted spiral helicine design simultaneously, can guarantee to have great heat conduction area.
Preferably, the LED lamps of the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are distributed in an annular array, and the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are all located under the heat conduction pipe.
As preferred, the PCB board back is provided with the heat insulating mattress, the heat insulating mattress is the heliciform setting, the heat pipe inserts the heat insulating mattress and constitutes cyclic annular setting, the higher authority of heat insulating mattress keeps level with the higher authority of heat pipe and below respectively with below, be provided with the soaking pit below the heat insulating mattress, soaking pit and PCB board bolted connection, heat pipe and heat insulating mattress are all pressed from both sides between soaking pit and PCB board, through disposing the soaking pit, can make on the heat conduction on the heat pipe reach the soaking pit, can play good radiating effect, dispose the heat insulating mattress simultaneously, can effectually prevent on the heat transmission of soaking pit to the PCB board.
The utility model has the advantages that: be provided with on the PCB board and be used for perception circuit change and ambient temperature change and adjust the intelligent IC of electric current according to the change, can realize balanced power and whole lamp temperature's stability, guarantee that LED can work under suitable stable environment for a long time to reduce the light decay, promote practical life, in addition, the PCB board back is provided with the heat pipe, the heat pipe is the heliciform setting, heat pipe and PCB board fixed connection, through disposing the heat pipe, can effectual promotion radiating efficiency, adopted spiral helicine design simultaneously, can guarantee to have great heat conduction area. The LED lamps of the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are distributed in an annular array mode, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are located under the heat conduction pipe, and the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are located under the heat conduction pipe, so that heat transfer to the heat conduction pipe can be facilitated, and the heat transfer speed is increased. The PCB board back is provided with the heat insulating mattress, the heat insulating mattress is the heliciform setting, the heat pipe inserts the heat insulating mattress and constitutes cyclic annular setting, the higher authority of heat insulating mattress keeps level with the higher authority of heat pipe and below respectively with below, be provided with the soaking pit below the heat insulating mattress, soaking pit and PCB board bolted connection, heat pipe and heat insulating mattress are all pressed from both sides between soaking pit and PCB board, through disposing the soaking pit, can make on the heat transmission on the heat pipe to the soaking pit, can play good radiating effect, dispose the heat insulating mattress simultaneously, can effectually prevent that the heat on the soaking pit from transmitting to the PCB board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is the utility model relates to a top view structure schematic diagram of lamp plate based on intelligent IC.
Fig. 2 is the utility model relates to a local section view of lamp plate based on intelligent IC.
Fig. 3 is the utility model relates to a structure schematic diagram after heat pipe and heat insulating mattress of lamp plate connect based on intelligent IC.
In the figure:
1. a PCB board; 2. a first LED lamp group; 3. a second LED lamp group; 4. a third LED lamp group; 5. a fourth LED lamp group; 6. a first smart IC; 7. a second smart IC; 8. a third smart IC; 9. a fourth smart IC; 10. a heat conducting pipe; 11. a heat insulating pad; 12. a soaking plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the embodiments, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a conventional manner such as bolt fixing, pin shaft connecting, adhesive fixing, or rivet fixing, which is commonly used in the prior art, and therefore, the detailed description thereof will not be provided in the examples.
Example 1
As shown in fig. 1-2, a lamp panel based on an intelligent IC includes a PCB board 1, a first LED lamp set 2, a second LED lamp set 3, a third LED lamp set 4 and a fourth LED lamp set, wherein the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4 and the fourth LED lamp set 5 are all mounted on the PCB board 1, the PCB board 1 is provided with a first intelligent IC6, a second intelligent IC7, a third intelligent IC8 and a fourth intelligent IC9 for sensing circuit changes and environmental temperature changes and adjusting current according to the changes, the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4 and the fourth LED lamp set 5 are connected in parallel, the first intelligent IC6, the second intelligent IC7, the third intelligent IC8 and the fourth intelligent IC9 are respectively connected in series with the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4 and the fourth LED lamp set 5, and the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4 and the fourth LED lamp set 5 are connected in series, The second LED lamp group 3, the third LED lamp group 4 and the fourth LED lamp group 5 are all installed on the front surface of the PCB board 1.
The beneficial effect of this embodiment does: be provided with on the PCB board and be used for perception circuit change and ambient temperature change and adjust the intelligent IC of electric current according to changing, can realize balanced power and the stability of whole lamp temperature, guarantee that LED can work under suitable stable environment for a long time to reduce the light decay, promote practical life.
Example 2
As shown in fig. 1-3, a lamp panel based on an intelligent IC includes a PCB board 1, a first LED lamp set 2, a second LED lamp set 3, and a third LED lamp set 4, wherein the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4, and the fourth LED lamp set 5 are all mounted on the PCB board 1, the PCB board 1 is provided with a first intelligent IC6, a second intelligent IC7, a third intelligent IC8, and a fourth intelligent IC9 for sensing circuit changes and ambient temperature changes and adjusting current according to the changes, the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4, and the fourth LED lamp set 5 are connected in parallel, the first intelligent IC6, the second intelligent IC7, the third intelligent IC8, and the fourth intelligent IC9 are respectively connected in series with the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4, and the fourth LED lamp set 5, and the first LED lamp set 2, the second LED lamp set 3, the third LED lamp set 4, and the fourth LED lamp set 5 are connected in series, and the second LED lamp set 2, 3, and the fourth LED lamp set 5 are, The third LED lamp group 4 and the fourth LED lamp group 5 are both arranged on the front surface of the PCB board 1.
In this embodiment, 1 face in the back of the PCB board is provided with heat pipe 10, heat pipe 10 is the heliciform setting, heat pipe 10 and 1 fixed connection of PCB board through disposing heat pipe 10, can effectual promotion radiating efficiency, adopted spiral helicine design simultaneously, can guarantee to have great heat conduction area.
In this embodiment, the LED lamps of the first LED lamp group 2, the second LED lamp group 3, the third LED lamp group 4 and the fourth LED lamp group 5 are all distributed in an annular array, the first LED lamp group 2, the second LED lamp group 3, the third LED lamp group 4 and the fourth LED lamp group 5 are all located under the heat pipe 10, and because the first LED lamp group 2, the second LED lamp group 3, the third LED lamp group 4 and the fourth LED lamp group 5 are all located under the heat pipe 10, the heat transfer to the heat pipe 10 can be facilitated, and the heat transfer speed can be increased.
In this embodiment, 1 face in the back of the PCB board is provided with heat insulating mattress 11, heat insulating mattress 11 is the heliciform setting, heat pipe 10 inserts the heat insulating mattress and constitutes cyclic annular setting, the higher authority of heat insulating mattress 11 is equal with the higher authority of heat pipe 10 with below respectively with below, be provided with soaking board 12 below heat insulating mattress 11, soaking board 12 and 1 bolted connection of PCB board, heat pipe 10 and heat insulating mattress 11 are all sandwiched between soaking board 12 and PCB board 1, through disposing soaking board 12, can make on the heat conduction pipe 10 on the soaking board 12, can play good radiating effect, dispose heat insulating mattress 11 simultaneously, can effectually prevent on the heat transmission of soaking board to the PCB board.
The beneficial effect of this embodiment does: be provided with on the PCB board and be used for perception circuit change and ambient temperature change and adjust the intelligent IC of electric current according to the change, can realize balanced power and whole lamp temperature's stability, guarantee that LED can work under suitable stable environment for a long time to reduce the light decay, promote practical life, the PCB board back is provided with the heat pipe, the heat pipe is the heliciform setting, heat pipe and PCB board fixed connection through disposing the heat pipe, can effectual promotion radiating efficiency, adopted spiral helicine design simultaneously, can guarantee to have great heat conduction area. The LED lamps of the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are distributed in an annular array mode, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are located under the heat conduction pipe, and the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are located under the heat conduction pipe, so that heat transfer to the heat conduction pipe can be facilitated, and the heat transfer speed is increased. The PCB board back is provided with the heat insulating mattress, the heat insulating mattress is the heliciform setting, the heat pipe inserts the heat insulating mattress and constitutes cyclic annular setting, the higher authority of heat insulating mattress keeps level with the higher authority of heat pipe and below respectively with below, be provided with the soaking pit below the heat insulating mattress, soaking pit and PCB board bolted connection, heat pipe and heat insulating mattress are all sandwiched between soaking pit and PCB board, through disposing the soaking pit, can make on the heat pipe heat transfer to the soaking pit, can play good radiating effect, dispose the heat insulating mattress simultaneously, can effectually prevent on the soaking pit heat transfer to the PCB board.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention.
Claims (4)
1. The utility model provides a lamp plate based on intelligence IC which characterized in that: the LED lamp comprises a PCB, a first LED lamp group, a second LED lamp group, a third LED lamp group and a fourth LED lamp group, wherein the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are all installed on the PCB, a first intelligent IC, a second intelligent IC, a third intelligent IC and a fourth intelligent IC which are used for sensing circuit changes and ambient temperature changes and adjusting current according to changes are arranged on the PCB, the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are connected in parallel, the first intelligent IC, the second intelligent IC, the third intelligent IC and the fourth intelligent IC are respectively connected with the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group in series, and the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are all installed on the front face of the PCB.
2. The intelligent IC-based lamp panel of claim 1, wherein: the PCB back of the body is provided with the heat pipe, the heat pipe is the heliciform setting, heat pipe and PCB board fixed connection.
3. The intelligent IC-based lamp panel of claim 2, wherein: the LED lamps of the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are distributed in an annular array mode, and the first LED lamp group, the second LED lamp group, the third LED lamp group and the fourth LED lamp group are located right below the heat conduction pipe.
4. The intelligent IC-based lamp panel of claim 3, wherein: the PCB board back is provided with the heat insulating mattress, the heat insulating mattress is the heliciform setting, the heat pipe inserts the heat insulating mattress and constitutes cyclic annular setting, the higher authority of heat insulating mattress keeps level with the higher authority of heat pipe respectively with below, be provided with the soaking board below the heat insulating mattress, soaking board and PCB board bolted connection, heat pipe and heat insulating mattress are all pressed from both sides between soaking board and PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021883498.8U CN213236992U (en) | 2020-09-01 | 2020-09-01 | Lamp panel based on intelligent IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021883498.8U CN213236992U (en) | 2020-09-01 | 2020-09-01 | Lamp panel based on intelligent IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213236992U true CN213236992U (en) | 2021-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021883498.8U Active CN213236992U (en) | 2020-09-01 | 2020-09-01 | Lamp panel based on intelligent IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213236992U (en) |
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2020
- 2020-09-01 CN CN202021883498.8U patent/CN213236992U/en active Active
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