CN219372882U - Zero-power-consumption LED display driving chip - Google Patents
Zero-power-consumption LED display driving chip Download PDFInfo
- Publication number
- CN219372882U CN219372882U CN202223513438.9U CN202223513438U CN219372882U CN 219372882 U CN219372882 U CN 219372882U CN 202223513438 U CN202223513438 U CN 202223513438U CN 219372882 U CN219372882 U CN 219372882U
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- chip
- connecting part
- connecting portion
- led display
- driving chip
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a zero-power-consumption LED display driving chip, which comprises a shell and a layered driving chip structure, wherein a cavity is arranged on the inner side of the shell, and the layered driving chip structure is arranged in the cavity; the layered driving chip structure is provided with a chip A, a chip B and a radiating fin, wherein the chip A is in a T-shaped sheet shape, the chip B is in a rectangular sheet shape, and the radiating fin is arranged between the chip A and the chip B and is connected with the chip A and the chip B through screws; the radiating fin has first connecting portion, second connecting portion and third connecting portion, and wherein first connecting portion, second connecting portion and third connecting portion integrated into one piece just its outside all are equipped with the heat dissipation tooth, and first connecting portion distributes in chip B's top side and both sides, and first connecting portion rear end both sides all are connected with second connecting portion and third connecting portion. According to the utility model, the chips A and B are arranged in a horizontal and vertical three-dimensional manner and are connected into a whole through the radiating fins, so that the problem of poor heat dissipation of the chips A and B when the chips A and B are stacked is avoided.
Description
Technical Field
The utility model relates to the field of driving chips, in particular to a zero-power-consumption LED display driving chip.
Background
The LED is called a fourth-generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, and is widely applied to various fields of indication, display, decoration, backlight sources, common illumination, urban night scenes and the like. According to different using functions, the display device can be divided into five categories, namely information display, signal lamps, vehicle lamps, liquid crystal screen backlights and general illumination. The existing LED display screen is generally composed of a plurality of independent LED display units arranged in an array, and each display unit includes an LED light emitting chip and a driving chip for driving the plurality of light emitting chips.
The zero-power driving chip refers to a driving chip with smaller power consumption, but because the number of driving chips is larger, the occupied space is larger when the driving chips are placed side by side, and the driving chips cannot dissipate heat when the driving chips are stacked, so that an LED display driving chip structure convenient for heat dissipation is needed.
Disclosure of Invention
The utility model aims to provide a zero-power-consumption LED display driving chip so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the zero-power-consumption LED display driving chip comprises a shell and a layered driving chip structure, wherein a cavity is arranged on the inner side of the shell, and the layered driving chip structure is arranged in the cavity; the layered driving chip structure is provided with a chip A, a chip B and a radiating fin, wherein the chip A is in a T-shaped sheet shape, the chip B is in a rectangular sheet shape, and the radiating fin is arranged between the chip A and the chip B and is connected with the chip A and the chip B through screws; the radiating fin is provided with a first connecting part, a second connecting part and a third connecting part, wherein the first connecting part, the second connecting part and the third connecting part are integrally formed, radiating teeth are arranged on the outer sides of the first connecting part, the second connecting part and the third connecting part, the first connecting part is distributed on the top side and two sides of the chip B, and the two sides of the rear end of the first connecting part are connected with the second connecting part and the third connecting part.
Preferably, the second connecting portion is an L-shaped connecting piece, and the second connecting portion is fixed at the lower end of the chip a.
Preferably, the third connecting part is a heat dissipation patch attached to the side surface of the chip A, and the end part of the third connecting part is connected with the second connecting part obliquely downwards and forms an inclined plane.
Preferably, the cavity of the housing further has an opening, and the housing is filled with a heat-dissipating glue through the opening when the layered drive chip structure is fixed therein.
Preferably, the chip A and the chip B are arranged in a horizontal and vertical three-dimensional mode and are connected into a whole through the radiating fin.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the chips A and B are arranged in a horizontal and vertical three-dimensional mode and are connected into a whole through the radiating fins, so that on one hand, the horizontal and vertical stacked chip scheme is more beneficial to the utilization of space, and on the other hand, the problem of poor heat dissipation of the chips A and B during stacked placement is avoided.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
In the figure: 1. a housing; 2. a chip A; 3. a chip B; 4. a heat sink; 401. a first connection portion; 402. a second connecting portion; 403. a third connecting portion; 404. heat dissipation teeth.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, the present utility model provides a technical solution: the zero-power-consumption LED display driving chip comprises a shell 1 and a layered driving chip structure, wherein a cavity is arranged on the inner side of the shell 1, and the layered driving chip structure is arranged in the cavity; the layered driving chip structure is provided with a chip A2, a chip B3 and a radiating fin 4, wherein the chip A2 is in a T-shaped sheet shape, the chip B3 is in a rectangular sheet shape, the radiating fin 4 is arranged between the chip A2 and the chip B3 and is connected with the chip A2 and the chip B3 through screws; the heat sink 4 has a first connection portion 401, a second connection portion 402, and a third connection portion 403, where the first connection portion 401, the second connection portion 402, and the third connection portion 403 are integrally formed, and heat dissipation teeth 404 are disposed on the outer sides of the first connection portion 401, the first connection portion 401 is distributed on the top side and two sides of the chip B3, and two sides of the rear end of the first connection portion 401 are connected with the second connection portion 402 and the third connection portion 403.
In this embodiment, the second connecting portion 402 is an L-shaped connecting piece, and the second connecting portion 402 is fixed at the lower end of the chip A2.
In this embodiment, the third connecting portion 403 is a heat dissipation patch attached to the side of the chip A2, and the end of the third connecting portion 403 is connected to the second connecting portion 402 obliquely downward and forms an inclined plane.
In this embodiment, the cavity of the housing 1 further has an opening, and the housing 1 is filled with heat-dissipating glue through the opening when the layered driving chip structure is fixed therein.
In the present embodiment, the chips A2 and B3 are arranged in a vertical-horizontal three-dimensional manner and are integrally connected by the heat sink 4.
In this embodiment, the chips A2 and B3 are arranged in a vertical-horizontal three-dimensional manner and are integrally connected through the heat sink 4, so that on one hand, the vertical-horizontal stacked chip scheme is more beneficial to space utilization, and on the other hand, the chips A2 and B3 are not prone to poor heat dissipation during stacked placement.
In this embodiment, the heat sink 4 performs auxiliary heat dissipation by using the first connection portion 401, the second connection portion 402, and the third connection portion 403 thereon, so as to ensure efficient heat dissipation when the chips A2 and B3 are stacked.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The zero-power-consumption LED display driving chip is characterized by comprising a shell (1) and a layered driving chip structure, wherein a cavity is arranged on the inner side of the shell (1), and the layered driving chip structure is arranged in the cavity; the layered driving chip structure is provided with a chip A (2), a chip B (3) and a radiating fin (4), wherein the chip A (2) is in a T-shaped sheet shape, the chip B (3) is in a rectangular sheet shape, the radiating fin (4) is arranged between the chip A (2) and the chip B (3) and is connected with the chip A (2) and the chip B (3) through screws; the radiating fin (4) is provided with a first connecting part (401), a second connecting part (402) and a third connecting part (403), wherein the first connecting part (401), the second connecting part (402) and the third connecting part (403) are integrally formed, radiating teeth (404) are arranged on the outer sides of the first connecting part, the first connecting part (401) is distributed on the top side and two sides of the chip B (3), and the two sides of the rear end of the first connecting part (401) are connected with the second connecting part (402) and the third connecting part (403).
2. The zero power LED display driver chip of claim 1, wherein: the second connecting part (402) is an L-shaped connecting sheet, and the second connecting part (402) is fixed at the lower end of the chip A (2).
3. The zero power LED display driver chip of claim 1, wherein: the third connecting part (403) is a heat dissipation patch attached to the side surface of the chip A (2), and the end part of the third connecting part (403) is connected with the second connecting part (402) obliquely downwards to form an inclined plane.
4. The zero power LED display driver chip of claim 1, wherein: the cavity of the shell (1) is also provided with an opening, and the shell (1) is filled with heat-dissipating glue through the opening when the layered driving chip structure is fixed in the shell.
5. The zero power LED display driver chip of claim 1, wherein: the chip A (2) and the chip B (3) are arranged in a horizontal and vertical three-dimensional mode and are connected into a whole through the radiating fins (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223513438.9U CN219372882U (en) | 2022-12-28 | 2022-12-28 | Zero-power-consumption LED display driving chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223513438.9U CN219372882U (en) | 2022-12-28 | 2022-12-28 | Zero-power-consumption LED display driving chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219372882U true CN219372882U (en) | 2023-07-18 |
Family
ID=87145638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223513438.9U Active CN219372882U (en) | 2022-12-28 | 2022-12-28 | Zero-power-consumption LED display driving chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219372882U (en) |
-
2022
- 2022-12-28 CN CN202223513438.9U patent/CN219372882U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 East, floor 4, building 4, Shenzhen Software Park, No. 2, Gaoxin Zhonger Road, Maling community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee after: Shenzhen Meisi Micro Semiconductor Co.,Ltd. Address before: 518000 East, floor 4, building 4, Shenzhen Software Park, No. 2, Gaoxin Zhonger Road, Maling community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee before: SHENZHEN MEIXI MICRO SEMICONDUCTOR CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder |