CN213213945U - 5G signal shielding circuit board - Google Patents
5G signal shielding circuit board Download PDFInfo
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- CN213213945U CN213213945U CN202022441008.5U CN202022441008U CN213213945U CN 213213945 U CN213213945 U CN 213213945U CN 202022441008 U CN202022441008 U CN 202022441008U CN 213213945 U CN213213945 U CN 213213945U
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Abstract
The utility model discloses a 5G signal shielding circuit board relates to signal shielding technical field, including the lamellar structure, the lamellar structure includes first layer, second floor, third layer and the fourth floor that sets up from last down fixed in proper order, and first layer and fourth floor are the protection film, and second floor and third floor are the copper-clad plate, are provided with the several through-hole on the lamellar structure, and the through-hole correspondence runs through first layer, second floor, third layer and fourth floor setting, and fixed mounting has a location section of thick bamboo in the through-hole; the beneficial effects are that: the signal shielding is realized through the arrangement of the double-layer copper-clad plate, so that the components in the equipment cannot interfere with each other, the reserved position is not needed, the occupied space and the manufacturing cost of the equipment are reduced, the laminated structure is more stable due to the arrangement of the through hole and the positioning cylinder, and the electric wire can pass through the positioning cylinder, so that the effect of convenient wiring is realized.
Description
Technical Field
The utility model belongs to the technical field of the signal shielding technique and specifically relates to a 5G signal shielding circuit board is related to, is applicable to the isolation shielding among the signal emission module in the 5G signal basic station.
Background
One of the challenges facing 5G communications is electromagnetic interference. Due to the higher performance of 5G technology, this must be achieved by increasing the frequency. However, destructive interference is caused between components (such as a chip and an antenna) inside the device, and therefore, a position needs to be reserved during design so that the components do not interfere with each other, and the occupied space of the device is large.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an it is not enough to overcome above-mentioned condition, provides a technical scheme that can solve above-mentioned problem.
5G signal shielding circuit board, including laminated structure, laminated structure includes first layer, second floor, third layer and the fourth layer from last down fixed setting in proper order, and first layer and fourth layer are the protection film, and second floor and third layer are the copper-clad plate, are provided with the several through-hole on the laminated structure, and the through-hole correspondence runs through first layer, second floor, third layer and fourth layer setting, and fixed mounting has a location section of thick bamboo in the through-hole.
As a further aspect of the present invention: the upper end shaping of the through-hole of first layer has first counter sink, and the first counter sink is downthehole to paste and installs first spacing collar, and the lower extreme shaping of the through-hole of fourth layer has the second counter sink, and the downthehole second spacing collar of pasting and installing of second counter sink, and a location section of thick bamboo butt is installed between first spacing collar and second spacing collar.
As a further aspect of the present invention: and the first layer and the fourth layer both adopt liquid photo solder resists.
As a further aspect of the present invention: the first layer coating is disposed on an upper side surface of the second layer. The fourth layer coating is disposed on the underside surface of the third layer.
As a further aspect of the present invention: the side shaping of second floor and third layer has the mounting panel, and the outside shaping of mounting panel has inside sunken slot.
As a further aspect of the present invention: the mounting panel sets up a plurality ofly that upper and lower array distributes.
As a further aspect of the present invention: the surface of the positioning cylinder is provided with a gold plating layer.
Compared with the prior art, the beneficial effects of the utility model are that: the signal shielding is realized through the arrangement of the double-layer copper-clad plate, so that the components in the equipment cannot interfere with each other, the reserved position is not needed, the occupied space and the manufacturing cost of the equipment are reduced, the laminated structure is more stable due to the arrangement of the through hole and the positioning cylinder, and the electric wire can pass through the positioning cylinder, so that the effect of convenient wiring is realized.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the explosion structure of the present invention.
Fig. 3 is an enlarged schematic view of a portion a of fig. 2.
Shown in the figure: 1. a layered structure; 11. a first layer; 12. a second layer; 13. a third layer; 14. a fourth layer; 2. a through hole; 3. a positioning cylinder; 4. a first counterbore; 5. a first spacing collar; 6. a second counterbore; 7. a second limit ring; 8. mounting a plate; 9. a slot; 10. plating a gold layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a 5G signal shielding circuit board comprises a layered structure 1, the layered structure comprises a first layer 11, a second layer 12, a third layer 13 and a fourth layer 14 which are fixedly arranged from top to bottom in sequence, the first layer 11 and the fourth layer 14 are protective films, the second layer 12 and the third layer 13 are copper-clad plates, a plurality of through holes 2 are arranged on the layered structure 1, the through holes 2 correspondingly penetrate through the first layer 11, the second layer 12, the third layer 13 and the fourth layer 14, and a positioning cylinder 3 is fixedly arranged in the through holes 2; the principle is as follows: through the setting realization signal shielding of double-deck copper-clad plate, can not mutual interference between each subassembly in letting equipment, need not the reservation position, reduce the manufacturing cost of occupation space and equipment, the setting of through-hole 2 and a location section of thick bamboo 3 lets 1 more stable of lamellar structure, and the electric wire can pass a location section of thick bamboo 3 moreover, realizes the effect of convenient wiring.
As a further aspect of the present invention: a first counter sink 4 is formed at the upper end of the through hole 2 of the first layer 11, a first limiting ring 5 is mounted in the first counter sink 4 in a sticking manner, a second counter sink 6 is formed at the lower end of the through hole 2 of the fourth layer 14, a second limiting ring 7 is mounted in the second counter sink 6 in a sticking manner, and the positioning cylinder 3 is mounted between the first limiting ring 5 and the second limiting ring 7 in a butting manner; so that the installation of the positioning cylinder 3 is more stable.
As a further aspect of the present invention: the first layer 11 and the fourth layer 14 both adopt liquid photo solder resist; the liquid photo solder resist is also called green oil, and can play a role in protecting the copper-clad plate after being dried.
As a further aspect of the present invention: the first layer 11 is disposed on the upper surface of the second layer 12. The fourth layer 14 is coated and arranged on the lower side surface of the third layer 13; making the mounting of the first layer 11 and the fourth layer 14 more secure.
As a further aspect of the present invention: mounting plates 8 are formed on the side edges of the second layer 12 and the third layer 13, and inward-concave slots 9 are formed on the outer sides of the mounting plates 8; making the mounting of the layered structure 1 more stable.
As a further aspect of the present invention: the mounting plate 8 is provided with a plurality of mounting plates which are distributed in an up-and-down array; making the mounting of the layered structure 1 more stable.
As a further aspect of the present invention: a gold plating layer 10 is arranged on the surface of the positioning cylinder 3; play more pleasing to the eye effect, simultaneously, can reduce the electric wire and pass the friction of a location section of thick bamboo 3 when 3, increased the life of a location section of thick bamboo 3.
All 5G sending terminals and receiving terminal subassembly all need shield electromagnetic interference to ensure safe and reliable's data transmission, the utility model discloses 5G signal shielding circuit board's design can produce one kind and can directly attach the system architecture that can shield electromagnetic interference shield plate on the component, is exclusively used in the new system that electromagnetic shield's curing equipment constitutes, and the contrast technique on the market is more efficient, and the cost is also lower, and this new technology can save the cost by a wide margin and bring the material utilization ratio of maximize.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1.5G signal shielding circuit board, including laminated structure, its characterized in that: the laminated structure comprises a first layer, a second layer, a third layer and a fourth layer which are sequentially and fixedly arranged from top to bottom, the first layer and the fourth layer are protective films, the second layer and the third layer are copper-clad plates, a plurality of through holes are formed in the laminated structure and correspondingly penetrate through the first layer, the second layer, the third layer and the fourth layer, and a positioning cylinder is fixedly arranged in each through hole.
2. The 5G signal shielding circuit board according to claim 1, wherein: the upper end shaping of the through-hole of first layer has first counter sink, and the first counter sink is downthehole to paste and installs first spacing collar, and the lower extreme shaping of the through-hole of fourth layer has the second counter sink, and the downthehole second spacing collar of pasting and installing of second counter sink, and a location section of thick bamboo butt is installed between first spacing collar and second spacing collar.
3. The 5G signal shielding circuit board according to claim 1, wherein: and the first layer and the fourth layer both adopt liquid photo solder resists.
4. The 5G signal shielding circuit board according to claim 3, wherein: the first layer of coating is disposed on the upper surface of the second layer and the fourth layer of coating is disposed on the lower surface of the third layer.
5. The 5G signal shielding circuit board according to claim 1, wherein: the side shaping of second floor and third layer has the mounting panel, and the outside shaping of mounting panel has inside sunken slot.
6. The 5G signal shielding circuit board according to claim 5, wherein: the mounting panel sets up a plurality ofly that upper and lower array distributes.
7. The 5G signal shielding circuit board according to claim 1, wherein: the surface of the positioning cylinder is provided with a gold plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022441008.5U CN213213945U (en) | 2020-10-28 | 2020-10-28 | 5G signal shielding circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022441008.5U CN213213945U (en) | 2020-10-28 | 2020-10-28 | 5G signal shielding circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213213945U true CN213213945U (en) | 2021-05-14 |
Family
ID=75827033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022441008.5U Active CN213213945U (en) | 2020-10-28 | 2020-10-28 | 5G signal shielding circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213213945U (en) |
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2020
- 2020-10-28 CN CN202022441008.5U patent/CN213213945U/en active Active
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