WO2023211008A1 - Antenna pattern manufacturing method - Google Patents

Antenna pattern manufacturing method Download PDF

Info

Publication number
WO2023211008A1
WO2023211008A1 PCT/KR2023/004814 KR2023004814W WO2023211008A1 WO 2023211008 A1 WO2023211008 A1 WO 2023211008A1 KR 2023004814 W KR2023004814 W KR 2023004814W WO 2023211008 A1 WO2023211008 A1 WO 2023211008A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal sheet
antenna pattern
half groove
sheet
manufacturing
Prior art date
Application number
PCT/KR2023/004814
Other languages
French (fr)
Korean (ko)
Inventor
노진원
정의진
정을영
임기상
맹주승
Original Assignee
주식회사 아모텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아모텍 filed Critical 주식회사 아모텍
Publication of WO2023211008A1 publication Critical patent/WO2023211008A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections

Definitions

  • the present invention relates to a method of manufacturing an antenna pattern, and more specifically, to a method of manufacturing a loop-shaped antenna pattern that is mounted on a portable terminal and used for wireless power transmission and reception or communication.
  • high-output wireless charging applies a higher voltage to the antenna and substrate for wireless power transmission/reception, which can reduce charging efficiency or, in extreme cases, cause a fire.
  • Coil winding method, pattern printing method, and hybrid method are mainly used to manufacture antennas for wireless power transmission/reception.
  • the conventional manufacturing method cannot precisely form the line spacing (or line width) of the pattern when the thickness of the antenna becomes thick. Accordingly, antennas manufactured using conventional manufacturing methods can suppress heat generation, but have the problem of reduced charging efficiency.
  • the present invention was proposed to solve the above problems, and its purpose is to provide a method of manufacturing an antenna pattern that precisely forms the line spacing (or line width) of the antenna pattern by forming a through hole in a metal sheet through a double etching process. Do it as
  • the method of manufacturing an antenna pattern includes the steps of laminating a carrier sheet to the first side of a metal sheet, exposing the second side of the metal sheet opposite to the first side, Half-etching the second side of the metal sheet to form a first half groove cut in the inner direction of the metal sheet on the second side of the metal sheet, applying a coverlay sheet to the second side of the metal sheet on which the first half groove is formed. lamination, removing the carrier sheet laminated to the first side of the metal sheet, exposing the first side of the metal sheet from which the carrier sheet has been removed, and half-etching the first side of the metal sheet to form the metal sheet. and forming a second half-groove on the first side toward the inside of the metal sheet.
  • the second half groove may be formed so that at least part of the groove overlaps the first half groove.
  • the first half groove and the second half groove may form a through hole penetrating the first and second sides of the metal sheet.
  • the through hole forms the line spacing of the antenna pattern, and the line spacing of the antenna pattern may be equal to the thickness of the metal sheet.
  • the width of the through hole may be less than or equal to the thickness of the metal sheet.
  • the width of the through hole may be 80% or more and 120% or less of the thickness of the metal sheet.
  • a first half groove having a first central axis vertically penetrating the first and second sides of the metal sheet is formed, and in the step of forming the second half groove, the first half groove of the metal sheet is formed.
  • a second half groove may be formed having a second central axis vertically penetrating the first and second surfaces, and the first central axis and the second central axis may be spaced apart.
  • a first half groove having a first central axis vertically penetrating the first and second sides of the metal sheet is formed, and in the step of forming the second half groove, the first half groove of the metal sheet is formed.
  • a second half groove may be formed having a second central axis vertically penetrating the first and second surfaces, and the first central axis and the second central axis may be disposed on the same line.
  • the metal sheet is a plate-shaped substrate with a set thickness, and the set thickness may be 70 um or more.
  • the method may further include surface treating the first side of the metal sheet on which the second half groove is formed, and in the surface treatment step, a rust prevention film may be formed on the first side of the metal sheet.
  • the method may further include forming an outline of the antenna pattern by stamping the metal sheet on which the second half groove is formed.
  • the antenna pattern manufacturing method divides the etching process into two steps (i.e., the first half-groove forming step and the second half-groove forming step), thereby improving the antenna pattern compared to the antenna pattern formed by the conventional antenna pattern manufacturing method. It has the effect of reducing line spacing and/or line width by about 50%.
  • the antenna pattern manufacturing method reduces the width of the through hole (i.e., the line spacing or line width of the antenna pattern) by about 50% compared to the conventional method, allowing a line spacing (pitch) of 100um or less even in a metal sheet with a thickness of 3oz (105um) or more. There is an effect of being able to produce an antenna pattern with
  • the antenna pattern manufacturing method allows the production of an antenna pattern with a line spacing of about 80% to 120% of the metal thickness, which increases design freedom and enables performance-optimized design.
  • FIG. 1 is a diagram for explaining a method of manufacturing an antenna pattern according to an embodiment of the present invention.
  • Figure 2 is a flowchart illustrating a method of manufacturing an antenna pattern according to an embodiment of the present invention.
  • 3 and 4 are diagrams for explaining each step of the antenna pattern manufacturing method according to an embodiment of the present invention.
  • 5 and 6 are diagrams for explaining through holes formed in a metal sheet through a first half groove forming step and a second half groove forming step.
  • FIG. 7 and 8 are diagrams for comparing and explaining the conventional antenna pattern manufacturing method and the antenna pattern manufacturing method of the present invention.
  • each layer (film), region, pattern or structure is said to be formed “on” or “under” the substrate, each layer (film), region, pad or pattern.
  • “on” and “under” include both being formed “directly” or “indirectly” through another layer.
  • the standards for the top or bottom of each floor are based on the drawing.
  • the antenna pattern manufacturing method manufactures a loop-shaped antenna pattern 100 using a metal sheet 110.
  • the antenna pattern 100 manufactured through the antenna pattern manufacturing method is an antenna pattern for wireless power transmission/reception (WPC; Wireless Power Consortium), an antenna pattern for near field communication (NFC; Near Field Communication), and an antenna pattern for electronic payment (MST; Magnetic Secure). It can be used as an antenna pattern for transmission, etc.
  • WPC Wireless Power Consortium
  • NFC Near Field Communication
  • MST Magnetic Secure
  • the antenna pattern manufacturing method may be used to manufacture a combo antenna pattern including two or more of WPC, NFC, and MST.
  • one or more antenna patterns 100 manufactured by the antenna pattern manufacturing method according to an embodiment of the present invention may be assembled on a circuit board (FPCB) to form a single antenna or a combo antenna.
  • the antenna pattern 100 may be assembled on the circuit board through a soldering process, ultrasonic welding process, etc.
  • the WPC antenna pattern 100 manufactured by the following antenna pattern manufacturing method may be assembled into a circuit board through a soldering process, an ultrasonic welding process, etc., and a combo antenna may be formed by assembling a shielding sheet, a heat dissipation sheet, etc.
  • the antenna pattern manufacturing method includes a carrier sheet lamination step (S110), a first exposure step (S120), a first half groove forming step (S130), and a coverlay sheet. It includes a lamination step (S140), a carrier sheet removal step (S150), a second exposure step (S160), a second half groove forming step (S170), a surface treatment step (S180), and a stamping step (S190).
  • the carrier sheet 120 is laminated to the first side of the metal sheet 110.
  • the carrier sheet 120 is laminated to the first surface (that is, the upper surface of the metal sheet 110) of the metal sheet 110 having a thickness equal to or greater than the set thickness.
  • a metal sheet 110 having a thickness of approximately 2oz (i.e., approximately 70um) or more is prepared.
  • a metal sheet 110 made of copper (Cu) used for the general antenna pattern 100 is prepared.
  • an amorphous solid or semi-solid resin made of polymers such as polyimide (PI), polyethylene terephthalate (PET), or organic compounds and their derivatives is prepared as the carrier sheet 120.
  • the carrier sheet 120 is laminated to the first side of the metal sheet 110 through a roll to roll process.
  • the second surface of the metal sheet 110 is exposed.
  • an exposure film (photoresist film) 130 is laminated on the second side of the metal sheet 110 on which the carrier sheet 120 is laminated.
  • a photoresist may be applied to the second side of the metal sheet 110 on which the carrier sheet 120 is laminated.
  • an antenna pattern mask is laminated (or placed) on the second side of the metal sheet 110 on which the exposure film 130 is laminated, and the metal sheet 110 is exposed through an exposure device. UV light is shined on the second side of . Accordingly, the exposure film 130 laminated on the second surface of the metal sheet 110 is cured into the same shape as the antenna pattern 100 of the antenna pattern mask.
  • the first half groove 112 is formed in the metal sheet 110 by etching the second surface of the metal sheet 110 that has undergone the first exposure step.
  • the second surface of the metal sheet 110 on which the exposure film 130 is laminated is etched.
  • the second surface of the metal sheet 110 on which the exposure film 130 is laminated is etched through an etching process such as wet etching or dry etching. Accordingly, a first half groove 112 is formed in the metal sheet 110 from the second surface of the metal sheet 110 toward the inside of the metal sheet 110.
  • the cured exposure film 130 is removed after the first half groove 112 is formed.
  • coverlay sheet lamination step (S140) the coverlay sheet 140 is laminated to the second side of the metal sheet 110 on which the first half groove 112 is formed.
  • coverlay sheet lamination step (S140) the coverlay sheet 140 is laminated to the second side of the metal sheet 110 on which the first half groove 112 is formed.
  • the coverlay sheet 140 is an example of a sheet formed of a material such as PI, PET, or thermosetting resin.
  • the carrier sheet 120 is removed from the metal sheet 110 on which the coverlay sheet 140 is laminated to the first side.
  • the carrier sheet removal step (S150) the carrier sheet 120 laminated to the second side of the metal sheet 110 is removed.
  • the first side of the metal sheet 110 is exposed.
  • the exposure film 130 is laminated on the first side of the metal sheet 110 on which the carrier sheet 120 is laminated.
  • the photoresist may be applied to the first side of the metal sheet 110 on which the coverlay sheet 140 is laminated.
  • the antenna pattern mask is stacked (or placed) on the first side of the metal sheet 110 on which the exposure film 130 is laminated, and the first surface of the metal sheet 110 is exposed through an exposure device. Shine UV light on the cotton. Accordingly, the exposure film 130 laminated on the first surface of the metal sheet 110 is cured into the same shape as the antenna pattern 100 of the antenna pattern mask.
  • the first side of the metal sheet 110 is etched to form a second half groove 114 in the metal sheet 110.
  • the first side of the metal sheet 110 that has undergone the second exposure step is etched to form a second half groove 114 in the metal sheet 110.
  • the first side of the metal sheet 110 on which the exposure film 130 is laminated is etched.
  • the first side of the metal sheet 110 on which the exposure film 130 is laminated is etched through an etching process such as wet etching or dry etching. Accordingly, a second half groove 114 is formed in the metal sheet 110 from the first surface of the metal sheet 110 toward the inside of the metal sheet 110.
  • the second half groove 114 is formed so that at least part of the first half groove 112 overlaps with the first half groove forming step (S130). Accordingly, the first half groove 112 and the second half groove 114 form a through hole 116 penetrating the metal sheet 110, and the through hole 116 is formed by the metal sheet 110.
  • the line spacing of the antenna pattern 100 is formed.
  • the central axis (A) of the first half groove 112 and the central axis (B) of the second half groove 114 vertically penetrate the first and second surfaces of the metal sheet 110. ) are coincident (i.e., disposed on the same line), and the through hole 116 is formed in an “8” shape that penetrates the metal sheet 110 vertically.
  • the central axis A of the first half groove 112 and the central axes B of the second half grooves 114 are offset from each other in the horizontal direction in the drawing, and the through hole 116 may be formed in an inclined “8” shape that penetrates the metal sheet 110 diagonally.
  • an “8” shaped through hole 116 is formed as a groove is formed at the ends of the two metal sheets 110 adjacent to the hole 116, but the present invention is not limited thereto.
  • a groove may be formed at one end of the two metal sheets 110 adjacent to the through hole 116 to form a “B” shaped through hole 116.
  • the cured exposure film 130 is removed after the second half groove 114 is formed.
  • the conventional antenna pattern manufacturing method forms through holes 16 that form the line spacing of the antenna pattern 100 in the metal sheet 10 through one-time etching.
  • the width W1 of the through hole 16 increases in proportion to the thickness T of the metal sheet 10, and the width W1 of the through hole 16 formed through the conventional etching process is That is, the line spacing of the antenna pattern 100 is formed to be about twice (200%) the thickness (T) of the metal sheet 110.
  • the thickness T of the metal sheet 10 is about 2 oz (approximately 70 um)
  • the width W1 of the through hole 16 formed by the conventional antenna pattern manufacturing method that is, the antenna
  • the line spacing or line width of the pattern 100 is formed to be approximately 140 um.
  • the width W1 of the through hole 16 formed by the conventional antenna pattern manufacturing method is formed to be approximately 210um.
  • the antenna pattern manufacturing method involves an etching process in two steps (i.e., a first half groove forming step (S130) and a second half groove forming step (S170) to form the through hole 116. )), the width of the through hole 116 formed in the metal sheet 110 (i.e., the line spacing or line width of the antenna pattern 100) can be formed to be less than or equal to the thickness of the metal sheet 110.
  • the width of the through hole 116 (i.e., the line spacing or line width of the antenna pattern 100) may be formed to be about 80% to 120% of the thickness of the metal sheet 110, including errors during the manufacturing process.
  • the thickness T of the metal sheet 110 i.e., the antenna pattern 100
  • the width (W2, that is, the line spacing or line width of the antenna pattern 100) of the through hole 116 is formed to be approximately 70 um.
  • the thickness (T) of the metal sheet 110 i.e., the antenna pattern 100
  • the width (W2, i.e., the antenna) of the through hole 116 formed by the conventional antenna pattern manufacturing method is about 100 um.
  • the method of manufacturing an antenna pattern divides the etching process into two steps (i.e., the first half-groove forming step (S130) and the second half-groove forming step (S170)), thereby replacing the conventional antenna.
  • the width of the through hole 116 formed in the metal sheet 110 i.e., the line spacing or line width of the antenna pattern 100
  • the antenna pattern manufacturing method reduces the width of the through hole 116 (i.e., the line spacing or line width of the antenna pattern 100) by about 50% compared to the prior art, thereby reducing the thickness to 3oz (105um). ) or more, there is an effect of producing an antenna pattern 100 with a line spacing (pitch) of 100 um or less.
  • the antenna pattern manufacturing method enables the manufacturing of the antenna pattern 100 with a line spacing of approximately 80% to 120% of the metal thickness, thereby increasing design freedom and enabling performance-optimized design.
  • the first side of the metal sheet 110 is surface treated.
  • an organic material is applied through an Organic Solderability Preservative (OSP) process to form a rust prevention film 118 on the first side of the metal sheet 110.
  • OSP Organic Solderability Preservative
  • a plating layer may be formed by plating tin (Sn) or nickel (Ni) on the first side of the metal sheet 110 in order to prevent oxidation of the metal sheet 110 along with the OSP process.
  • stamping step (S190) an outline of the antenna pattern 100 is formed on the metal sheet 110 through a stamping process.
  • the metal sheet 110 is stamped using the stamping device 200 to form an outline of the antenna pattern 100.
  • the antenna pattern manufacturing method can manufacture the antenna pattern 100 having a line spacing of 80% or more and 120% or less of the thickness of the metal sheet 110.
  • the antenna pattern 100 manufactured through the above-described process is used as an antenna for wireless power transmission/reception (WPC; Wireless Power Consortium), near field communication (NFC; Near Field Communication), electronic payment (MST; Magnetic Secure Transmission), etc. It can work.
  • WPC Wireless Power Consortium
  • NFC Near Field Communication
  • MST Magnetic Secure Transmission

Abstract

The present invention provides an antenna pattern manufacturing method in which: a half groove is formed in each of a first surface and a second surface of a metal sheet through a primary etching; and the half groove formed on the first surface and the second surface of the metal sheet forms a through-hole through the metal sheet so as to form a line spacing (or line width) of an antenna pattern to be less than the thickness of the antenna pattern, thereby increasing the degree of freedom in a design of antenna patterns and enabling performance optimization design.

Description

안테나 패턴 제조 방법Antenna pattern manufacturing method
본 발명은 안테나 패턴 제조 방법에 관한 것으로, 더욱 상세하게는 휴대 단말 등에 실장되어 무선 전력 송수신 또는 통신을 위해 사용되는 루프 형상의 안테나 패턴을 제조하는 방법에 관한 것이다.The present invention relates to a method of manufacturing an antenna pattern, and more specifically, to a method of manufacturing a loop-shaped antenna pattern that is mounted on a portable terminal and used for wireless power transmission and reception or communication.
최근 고속충전을 위해 20W 이상의 고출력(High Power) 무선 충전에 대한 시장 요구가 증가하고 있다. 고출력 무선 충전은 일반 충전 방식에 비해 무선 전력 전송/수신용 안테나와 기판인 높은 전압이 인가되기 때문에 충전 효율이 저하되거나, 심한 경우 화재가 발생할 수도 있다.Recently, market demand for high power wireless charging of 20W or more is increasing for fast charging. Compared to general charging methods, high-output wireless charging applies a higher voltage to the antenna and substrate for wireless power transmission/reception, which can reduce charging efficiency or, in extreme cases, cause a fire.
이에, 고출력 무선 충전 시장에서는 무선 충전 효율뿐만 아니라 발열 억제에 대한 중요성이 커지고 있고, 충전 효율 및 발열 억제를 위해 안테나의 두께가 두꺼워지고 있다.Accordingly, in the high-output wireless charging market, the importance of not only wireless charging efficiency but also heat suppression is increasing, and the thickness of the antenna is becoming thicker for charging efficiency and heat suppression.
무선 전력 전송/수신용 안테나를 제조하는 방법으로는 코일 권선 방식, 패턴 인쇄 방식 및 하이브리드 방식이 주로 사용되고 있다.Coil winding method, pattern printing method, and hybrid method are mainly used to manufacture antennas for wireless power transmission/reception.
하지만, 종래의 제조 방법은 안테나의 두께가 두꺼워지면 패턴의 선 간격(또는 선폭)을 정밀하게 형성할 수 없다. 이에, 종래의 제조 방법에 의해 제조된 안테나는 발열 억제가 가능하지만 충전 효율이 저하되는 문제점이 있다.However, the conventional manufacturing method cannot precisely form the line spacing (or line width) of the pattern when the thickness of the antenna becomes thick. Accordingly, antennas manufactured using conventional manufacturing methods can suppress heat generation, but have the problem of reduced charging efficiency.
이상의 배경기술에 기재된 사항은 발명의 배경에 대한 이해를 돕기 위한 것으로서, 공개된 종래 기술이 아닌 사항을 포함할 수 있다.The matters described in the above background technology are intended to aid understanding of the background of the invention and may include matters that are not disclosed prior art.
본 발명은 상기한 문제점을 해결하기 위해 제안된 것으로 이중 에칭 공정을 통해 금속 시트에 관통 홀을 형성하여 안테나 패턴의 선 간격(또는 선폭)을 정밀하게 형성하도록 한 안테나 패턴 제조 방법을 제공하는 것을 목적으로 한다.The present invention was proposed to solve the above problems, and its purpose is to provide a method of manufacturing an antenna pattern that precisely forms the line spacing (or line width) of the antenna pattern by forming a through hole in a metal sheet through a double etching process. Do it as
상기한 목적을 달성하기 위하여 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 금속 시트의 제1 면에 캐리어 시트를 합지하는 단계, 제1 면과 대향되는 금속 시트의 제2 면을 노광하는 단계, 금속 시트의 제2 면을 하프 에칭하여 금속 시트의 제2 면에서 금속 시트의 내부 방향으로 파여진 제1 하프 홈을 형성하는 단계, 제1 하프 홈이 형성된 금속 시트의 제2 면에 커버레이 시트를 합지하는 단계, 금속 시트의 제1 면에 합지된 캐리어 시트를 제거하는 단계, 캐리어 시트가 제거된 금속 시트의 제1 면을 노광하는 단계 및 금속 시트의 제1 면을 하프 에칭하여 금속 시트의 제1 면에서 금속 시트의 내부 방향으로 파여진 제2 하프 홈을 형성하는 단계를 포함한다.In order to achieve the above object, the method of manufacturing an antenna pattern according to an embodiment of the present invention includes the steps of laminating a carrier sheet to the first side of a metal sheet, exposing the second side of the metal sheet opposite to the first side, Half-etching the second side of the metal sheet to form a first half groove cut in the inner direction of the metal sheet on the second side of the metal sheet, applying a coverlay sheet to the second side of the metal sheet on which the first half groove is formed. lamination, removing the carrier sheet laminated to the first side of the metal sheet, exposing the first side of the metal sheet from which the carrier sheet has been removed, and half-etching the first side of the metal sheet to form the metal sheet. and forming a second half-groove on the first side toward the inside of the metal sheet.
제2 하프 홈을 형성하는 단계에서는 제1 하프 홈과 적어도 일부가 중첩되도록 제2 하프 홈을 형성할 수 있다.In the step of forming the second half groove, the second half groove may be formed so that at least part of the groove overlaps the first half groove.
제1 하프 홈 및 제2 하프 홈은 금속 시트의 제1 면 및 제2 면을 관통하는 관통 홀을 형성할 수 있다.The first half groove and the second half groove may form a through hole penetrating the first and second sides of the metal sheet.
관통 홀은 안테나 패턴의 선 간격을 형성하고, 안테나 패턴의 선 간격은 금속 시트의 두께와 동일할 수 있다. 관통 홀의 폭은 금속 시트의 두께 이하일 수 있다. 관통 홀의 폭은 금속 시트의 두께의 80% 이상 120% 이하일 수 있다.The through hole forms the line spacing of the antenna pattern, and the line spacing of the antenna pattern may be equal to the thickness of the metal sheet. The width of the through hole may be less than or equal to the thickness of the metal sheet. The width of the through hole may be 80% or more and 120% or less of the thickness of the metal sheet.
제1 하프 홈을 형성하는 단계에서는 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제1 중심 축을 갖는 제1 하프 홈을 형성하고, 제2 하프 홈을 형성하는 단계에서는 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제2 중심 축을 갖는 제2 하프 홈을 형성하고, 제1 중심 축과 제2 중심 축은 이격될 수 있다.In the step of forming the first half groove, a first half groove having a first central axis vertically penetrating the first and second sides of the metal sheet is formed, and in the step of forming the second half groove, the first half groove of the metal sheet is formed. A second half groove may be formed having a second central axis vertically penetrating the first and second surfaces, and the first central axis and the second central axis may be spaced apart.
제1 하프 홈을 형성하는 단계에서는 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제1 중심 축을 갖는 제1 하프 홈을 형성하고, 제2 하프 홈을 형성하는 단계에서는 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제2 중심 축을 갖는 제2 하프 홈을 형성하고, 제1 중심 축과 제2 중심 축은 동일 선상에 배치될 수 있다.In the step of forming the first half groove, a first half groove having a first central axis vertically penetrating the first and second sides of the metal sheet is formed, and in the step of forming the second half groove, the first half groove of the metal sheet is formed. A second half groove may be formed having a second central axis vertically penetrating the first and second surfaces, and the first central axis and the second central axis may be disposed on the same line.
금속 시트는 설정 두께를 갖는 판상 기재이고, 설정 두께는 70um 이상일 수 있다.The metal sheet is a plate-shaped substrate with a set thickness, and the set thickness may be 70 um or more.
제2 하프 홈이 형성된 금속 시트의 제1 면을 표면 처리하는 단계를 더 포함하고, 표면 처리하는 단계에서는 금속 시트의 제1 면에 방청막을 형성할 수 있다.The method may further include surface treating the first side of the metal sheet on which the second half groove is formed, and in the surface treatment step, a rust prevention film may be formed on the first side of the metal sheet.
제2 하프 홈이 형성된 금속 시트를 스탬핑하여 안테나 패턴의 아웃 라인을 형성하는 단계를 더 포함할 수 있다.The method may further include forming an outline of the antenna pattern by stamping the metal sheet on which the second half groove is formed.
본 발명에 의하면, 안테나 패턴 제조 방법은 에칭 공정을 2단계(즉, 제1 하프 홈 형성 단계 및 제2 하프 홈 형성 단계)로 나누어 수행함으로써, 종래의 안테나 패턴 제조 방법에 의해 형성된 안테나 패턴에 비해 선 간격 및/또는 선폭을 50% 정도로 감소시킬 수 있는 효과가 있다.According to the present invention, the antenna pattern manufacturing method divides the etching process into two steps (i.e., the first half-groove forming step and the second half-groove forming step), thereby improving the antenna pattern compared to the antenna pattern formed by the conventional antenna pattern manufacturing method. It has the effect of reducing line spacing and/or line width by about 50%.
또한, 안테나 패턴 제조 방법은 종래에 비해 관통 홀의 폭(즉, 안테나 패턴의 선 간격 또는 선폭)을 50% 정도로 감소시킴으로써, 두께가 3oz(105um) 이상인 금속 시트에서도 100um 이하의 선 간격(Pitch)을 갖는 안테나 패턴을 제작할 수 있는 효과가 있다.In addition, the antenna pattern manufacturing method reduces the width of the through hole (i.e., the line spacing or line width of the antenna pattern) by about 50% compared to the conventional method, allowing a line spacing (pitch) of 100um or less even in a metal sheet with a thickness of 3oz (105um) or more. There is an effect of being able to produce an antenna pattern with
또한, 안테나 패턴 제조 방법은 금속 두께의 80% 내지 120% 정도의 선 간격을 갖는 안테나 패턴의 제작이 가능하여 설계 자유도가 증가하고, 성능 최적화 설계가 가능한 효과가 있다.In addition, the antenna pattern manufacturing method allows the production of an antenna pattern with a line spacing of about 80% to 120% of the metal thickness, which increases design freedom and enables performance-optimized design.
도 1은 본 발명의 실시 예에 따른 안테나 패턴 제조 방법을 설명하기 위한 도면.1 is a diagram for explaining a method of manufacturing an antenna pattern according to an embodiment of the present invention.
도 2는 본 발명의 실시 예에 따른 안테나 패턴 제조 방법을 설명하기 위한 흐름도.Figure 2 is a flowchart illustrating a method of manufacturing an antenna pattern according to an embodiment of the present invention.
도 3 및 도 4는 본 발명의 실시 예에 따른 안테나 패턴 제조 방법의 각 단계를 설명하기 위한 도면.3 and 4 are diagrams for explaining each step of the antenna pattern manufacturing method according to an embodiment of the present invention.
도 5 및 도 6은 제1 하프 홈 형성 단계 및 제2 하프 홈 형성 단계를 통해 금속 시트에 형성되는 관통 홀을 설명하기 위한 도면.5 and 6 are diagrams for explaining through holes formed in a metal sheet through a first half groove forming step and a second half groove forming step.
도 7 및 도 8은 종래의 안테나 패턴 제조 방법과 본 발명의 안테나 패턴 제조 방법을 비교 설명하기 위한 도면.7 and 8 are diagrams for comparing and explaining the conventional antenna pattern manufacturing method and the antenna pattern manufacturing method of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.
실시예들은 당해 기술 분야에서 통상의 지식을 가진 자에게 본 발명을 더욱 완전하게 설명하기 위하여 제공되는 것이고, 하기 실시예는 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 하기 실시예에 한정되는 것은 아니다. 오히려, 이들 실시예는 본 개시를 더욱 충실하고 완전하게 하고, 본 발명의 사상을 완전하게 전달하기 위하여 제공되는 것이다. The examples are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in various other forms, and the scope of the present invention is limited to the following examples. It is not limited. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention.
본 명세서에서 사용된 용어는 특정 실시예를 설명하기 위하여 사용되며, 본 발명을 제한하기 위한 것이 아니다. 또한, 본 명세서에서 단수 형태는 문맥상 다른 경우를 분명히 지적하는 것이 아니라면, 복수의 형태를 포함할 수 있다.The terms used herein are used to describe specific embodiments and are not intended to limit the invention. Additionally, in this specification, singular forms may include plural forms, unless the context clearly indicates otherwise.
실시예의 설명에 있어서, 각 층(막), 영역, 패턴 또는 구조물들이 기판, 각 층(막), 영역, 패드 또는 패턴들의 "위(on)"에 또는 "아래(under)"에 형성되는 것으로 기재되는 경우에 있어, "위(on)"와 "아래(under)"는 "직접(directly)" 또는 "다른 층을 개재하여(indirectly)" 형성되는 것을 모두 포함한다. 또한, 각 층의 위 또는 아래에 대한 기준은 도면을 기준으로 하는 것을 원칙으로 한다.In the description of the embodiment, each layer (film), region, pattern or structure is said to be formed “on” or “under” the substrate, each layer (film), region, pad or pattern. Where described, “on” and “under” include both being formed “directly” or “indirectly” through another layer. In addition, in principle, the standards for the top or bottom of each floor are based on the drawing.
도면은 본 발명의 사상을 이해할 수 있도록 하기 위한 것일 뿐, 도면에 의해서 본 발명의 범위가 제한되는 것으로 해석되지 않아야 한다. 또한, 도면에서 상대적인 두께, 길이나 상대적인 크기는 설명의 편의 및 명확성을 위해 과장될 수 있다.The drawings are only intended to enable understanding of the spirit of the present invention, and should not be construed as limiting the scope of the present invention by the drawings. Additionally, in the drawings, relative thickness, length, or relative size may be exaggerated for convenience and clarity of explanation.
도 1을 참조하면, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 금속 시트(110)를 이용하여 루프 형상의 안테나 패턴(100)을 제조한다. 안테나 패턴 제조 방법을 통해 제조된 안테나 패턴(100)은 무선 전력 송신/수신(WPC; Wireless Power Consortium)용 안테나 패턴, 근거리 통신(NFC; Near Field Communication)용 안테나 패턴, 전자결제(MST; Magnetic Secure Transmission)용 안테나 패턴 등으로 사용될 수 있다.Referring to FIG. 1, the antenna pattern manufacturing method according to an embodiment of the present invention manufactures a loop-shaped antenna pattern 100 using a metal sheet 110. The antenna pattern 100 manufactured through the antenna pattern manufacturing method is an antenna pattern for wireless power transmission/reception (WPC; Wireless Power Consortium), an antenna pattern for near field communication (NFC; Near Field Communication), and an antenna pattern for electronic payment (MST; Magnetic Secure). It can be used as an antenna pattern for transmission, etc.
본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 WPC, NFC 및 MST 중에서 둘 이상으로 포함하는 콤보 안테나 패턴을 제조하기 위해 사용될 수도 있다.The antenna pattern manufacturing method according to an embodiment of the present invention may be used to manufacture a combo antenna pattern including two or more of WPC, NFC, and MST.
또한, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법에 의해 제조된 하나 이상의 안테나 패턴(100)들은 회로 기판(FPCB)에 조립되어 단일 안테나 또는 콤보 안테나를 구성할 수 있다. 이때, 안테나 패턴(100)은 솔더링(Soldering) 공정, 초음파 융착 공정 등을 통해 회로 기판에 조립될 수 있다.Additionally, one or more antenna patterns 100 manufactured by the antenna pattern manufacturing method according to an embodiment of the present invention may be assembled on a circuit board (FPCB) to form a single antenna or a combo antenna. At this time, the antenna pattern 100 may be assembled on the circuit board through a soldering process, ultrasonic welding process, etc.
이때, 회로 기판에는 NFC 안테나 패턴, MST 안테나 패턴 중 적어도 하나의 안테나 패턴과 안테나 패턴들을 외부 기판(예를 들면, 휴대 단말의 메인 기판)과 연결하기 위한 단자부들이 형성되고, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법에 의해 제조된 WPC용 안테나 패턴(100)을 솔더링 공정, 초음파 융착 공정 등을 통해 회로 기판이 조립하고, 차폐 시트, 방열 시트 등을 조립하여 콤보 안테나를 구성할 수도 있다.At this time, at least one antenna pattern among the NFC antenna pattern and the MST antenna pattern and terminal portions for connecting the antenna patterns to an external board (for example, the main board of a mobile terminal) are formed on the circuit board, and in an embodiment of the present invention, The WPC antenna pattern 100 manufactured by the following antenna pattern manufacturing method may be assembled into a circuit board through a soldering process, an ultrasonic welding process, etc., and a combo antenna may be formed by assembling a shielding sheet, a heat dissipation sheet, etc.
도 2 내지 도 4를 참조하면, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 캐리어 시트 합지 단계(S110), 1차 노광 단계(S120), 제1 하프 홈 형성 단계(S130), 커버레이 시트 합지 단계(S140), 캐리어 시트 제거 단계(S150), 2차 노광 단계(S160), 제2 하프 홈 형성 단계(S170), 표면 처리 단계(S180) 및 스탬핑 단계(S190)를 포함하여 구성된다.2 to 4, the antenna pattern manufacturing method according to an embodiment of the present invention includes a carrier sheet lamination step (S110), a first exposure step (S120), a first half groove forming step (S130), and a coverlay sheet. It includes a lamination step (S140), a carrier sheet removal step (S150), a second exposure step (S160), a second half groove forming step (S170), a surface treatment step (S180), and a stamping step (S190).
캐리어 시트 합지 단계(S110)에서는 금속 시트(110)의 제1 면에 캐리어 시트(120)를 합지한다. 캐리어 시트 합지 단계(S110)에서는 설정 두께 이상의 두께를 갖는 금속 시트(110)의 제1 면(즉, 금속 시트(110)의 상면)에 캐리어 시트(120)를 합지한다.In the carrier sheet lamination step (S110), the carrier sheet 120 is laminated to the first side of the metal sheet 110. In the carrier sheet lamination step (S110), the carrier sheet 120 is laminated to the first surface (that is, the upper surface of the metal sheet 110) of the metal sheet 110 having a thickness equal to or greater than the set thickness.
캐리어 시트 합지 단계(S110)에서는 대략 2oz(즉, 대략 70um) 이상의 두께를 갖는 금속 시트(110)를 준비한다. 이때, 캐리어 시트 합지 단계(S110)에서는 일반적인 안테나 패턴(100)에 사용되는 구리(Cu) 재질의 금속 시트(110)를 준비한다.In the carrier sheet lamination step (S110), a metal sheet 110 having a thickness of approximately 2oz (i.e., approximately 70um) or more is prepared. At this time, in the carrier sheet lamination step (S110), a metal sheet 110 made of copper (Cu) used for the general antenna pattern 100 is prepared.
캐리어 시트 합지 단계(S110)에서는 PI(polyimide), PET(polyethylene terephthalate) 등의 고분자, 또는 유기화합물 및 그 유도체로 이루어진 비결정성 고체 또는 반고체인 수지(resin)를 캐리어 시트(120)로 준비한다.In the carrier sheet lamination step (S110), an amorphous solid or semi-solid resin made of polymers such as polyimide (PI), polyethylene terephthalate (PET), or organic compounds and their derivatives is prepared as the carrier sheet 120.
캐리어 시트 합지 단계(S110)에서는 롤 투 롤(Roll to Roll) 공정을 통해 금속 시트(110)의 제1 면에 캐리어 시트(120)를 합지하는 것을 일례로 한다.In the carrier sheet lamination step (S110), for example, the carrier sheet 120 is laminated to the first side of the metal sheet 110 through a roll to roll process.
제1 노광(exposure) 단계(S120)에서는 금속 시트(110)의 제2 면을 노광한다.In the first exposure step (S120), the second surface of the metal sheet 110 is exposed.
1차 노광 단계(S120)에서는 캐리어 시트(120)가 합지된 금속 시트(110)의 제2 면에 노광 필름(130; photoresist film)을 합지한다. 이때, 1차 노광 단계(S120)에서는 캐리어 시트(120)가 합지된 금속 시트(110)의 제2 면에 감광액(photoresist)을 도포할 수도 있다.In the first exposure step (S120), an exposure film (photoresist film) 130 is laminated on the second side of the metal sheet 110 on which the carrier sheet 120 is laminated. At this time, in the first exposure step (S120), a photoresist may be applied to the second side of the metal sheet 110 on which the carrier sheet 120 is laminated.
1차 노광 단계(S120)에서는 노광 필름(130)이 합지된 금속 시트(110)의 제2 면에 안테나 패턴 마스크(mask)를 적층(또는 배치)한 상태에서 노광 장치를 통해 금속 시트(110)의 제2 면에 UV 광을 비춘다. 그에 따라, 금속 시트(110)의 제2 면에 합지된 노광 필름(130)은 안테나 패턴 마스크의 안테나 패턴(100)과 동일한 형상으로 경화된다.In the first exposure step (S120), an antenna pattern mask is laminated (or placed) on the second side of the metal sheet 110 on which the exposure film 130 is laminated, and the metal sheet 110 is exposed through an exposure device. UV light is shined on the second side of . Accordingly, the exposure film 130 laminated on the second surface of the metal sheet 110 is cured into the same shape as the antenna pattern 100 of the antenna pattern mask.
제1 하프 홈 형성 단계(S130)에서는 1차 노광 단계를 거친 금속 시트(110)의 제2 면을 에칭하여 금속 시트(110)에 제1 하프 홈(112)을 형성한다.In the first half groove forming step ( S130 ), the first half groove 112 is formed in the metal sheet 110 by etching the second surface of the metal sheet 110 that has undergone the first exposure step.
제1 하프 홈 형성 단계(S130)에서는 노광 필름(130)이 합지된 금속 시트(110)의 제2 면을 에칭한다. 제1 하프 홈 형성 단계(S130)에서는 웨트 에칭, 드라이 에칭 등의 에칭 공정을 통해 노광 필름(130)이 합지된 금속 시트(110)의 제2 면을 에칭한다. 그에 따라, 금속 시트(110)에는 금속 시트(110)의 제2 면에서 금속 시트(110)의 내부 방향으로 파여진 제1 하프 홈(112)이 형성된다.In the first half groove forming step (S130), the second surface of the metal sheet 110 on which the exposure film 130 is laminated is etched. In the first half groove forming step (S130), the second surface of the metal sheet 110 on which the exposure film 130 is laminated is etched through an etching process such as wet etching or dry etching. Accordingly, a first half groove 112 is formed in the metal sheet 110 from the second surface of the metal sheet 110 toward the inside of the metal sheet 110.
제1 하프 홈 형성 단계(S130)에서는 제1 하프 홈(112)이 형성된 후 경화된 노광 필름(130)을 제거한다.In the first half groove forming step (S130), the cured exposure film 130 is removed after the first half groove 112 is formed.
커버레이 시트 합지 단계(S140)에서는 제1 하프 홈(112)이 형성된 금속 시트(110)의 제2 면에 커버레이 시트(140)를 합지한다. 커버레이 시트 합지 단계(S140)에서는 제1 하프 홈(112)이 형성된 금속 시트(110)의 제2 면에 커버레이 시트(140)를 합지한다. 이때, 커버레이 시트(140)는 PI, PET, 열경화성 수지 등의 재질로 형성된 시트인 것을 일례로 한다.In the coverlay sheet lamination step (S140), the coverlay sheet 140 is laminated to the second side of the metal sheet 110 on which the first half groove 112 is formed. In the coverlay sheet lamination step (S140), the coverlay sheet 140 is laminated to the second side of the metal sheet 110 on which the first half groove 112 is formed. At this time, the coverlay sheet 140 is an example of a sheet formed of a material such as PI, PET, or thermosetting resin.
캐리어 시트 제거 단계(S150)에서는 제1 면에 커버레이 시트(140)가 합지된 금속 시트(110)로부터 캐리어 시트(120)를 제거한다. 캐리어 시트 제거 단계(S150)에서는 금속 시트(110)의 제2 면에 합지된 캐리어 시트(120)를 제거한다.In the carrier sheet removal step (S150), the carrier sheet 120 is removed from the metal sheet 110 on which the coverlay sheet 140 is laminated to the first side. In the carrier sheet removal step (S150), the carrier sheet 120 laminated to the second side of the metal sheet 110 is removed.
2차 노광 단계(S160)에서는 금속 시트(110)의 제1 면을 노광한다.In the second exposure step (S160), the first side of the metal sheet 110 is exposed.
2차 노광 단계(S160)에서는 캐리어 시트(120)가 합지된 금속 시트(110)의 제1 면에 노광 필름(130)을 합지한다. 이때, 2차 노광 단계(S160)에서는 커버레이 시트(140)가 합지된 금속 시트(110)의 제1 면에 감광액을 도포할 수도 있다.In the second exposure step (S160), the exposure film 130 is laminated on the first side of the metal sheet 110 on which the carrier sheet 120 is laminated. At this time, in the second exposure step (S160), the photoresist may be applied to the first side of the metal sheet 110 on which the coverlay sheet 140 is laminated.
2차 노광 단계(S160)에서는 노광 필름(130)이 합지된 금속 시트(110)의 제1 면에 안테나 패턴 마스크를 적층(또는 배치)한 상태에서 노광 장치를 통해 금속 시트(110)의 제1 면에 UV 광을 비춘다. 그에 따라, 금속 시트(110)의 제1 면에 합지된 노광 필름(130)은 안테나 패턴 마스크의 안테나 패턴(100)과 동일한 형상으로 경화된다.In the second exposure step (S160), the antenna pattern mask is stacked (or placed) on the first side of the metal sheet 110 on which the exposure film 130 is laminated, and the first surface of the metal sheet 110 is exposed through an exposure device. Shine UV light on the cotton. Accordingly, the exposure film 130 laminated on the first surface of the metal sheet 110 is cured into the same shape as the antenna pattern 100 of the antenna pattern mask.
제2 하프 홈 형성 단계(S170)에서는 금속 시트(110)의 제1 면을 에칭하여 금속 시트(110)에 제2 하프 홈(114)을 형성한다.In the second half groove forming step (S170), the first side of the metal sheet 110 is etched to form a second half groove 114 in the metal sheet 110.
제2 하프 홈 형성 단계(S170)에서는 2차 노광 단계를 거친 금속 시트(110)의 제1 면을 에칭하여 금속 시트(110)에 제2 하프 홈(114)을 형성한다.In the second half groove forming step (S170), the first side of the metal sheet 110 that has undergone the second exposure step is etched to form a second half groove 114 in the metal sheet 110.
제2 하프 홈 형성 단계(S170)에서는 노광 필름(130)이 합지된 금속 시트(110)의 제1 면을 에칭한다. 제2 하프 홈 형성 단계(S170)에서는 웨트 에칭, 드라이 에칭 등의 에칭 공정을 통해 노광 필름(130)이 합지된 금속 시트(110)의 제1 면을 에칭한다. 그에 따라, 금속 시트(110)에는 금속 시트(110)의 제1 면에서 금속 시트(110)의 내부 방향으로 파여진 제2 하프 홈(114)이 형성된다.In the second half groove forming step (S170), the first side of the metal sheet 110 on which the exposure film 130 is laminated is etched. In the second half groove forming step (S170), the first side of the metal sheet 110 on which the exposure film 130 is laminated is etched through an etching process such as wet etching or dry etching. Accordingly, a second half groove 114 is formed in the metal sheet 110 from the first surface of the metal sheet 110 toward the inside of the metal sheet 110.
이때, 제2 하프 홈 형성 단계(S170)에서는 제1 하프 홈 형성 단계(S130)에서 제1 하프 홈(112)과 적어도 일부가 중첩되도록 제2 하프 홈(114)을 형성한다. 그에 따라, 제1 하프 홈(112) 및 제2 하프 홈(114)은 금속 시트(110)를 관통하는 관통 홀(116)을 형성하고, 관통 홀(116)은 금속 시트(110)에 의해 형성되는 안테나 패턴(100)의 선 간격을 형성한다.At this time, in the second half groove forming step (S170), the second half groove 114 is formed so that at least part of the first half groove 112 overlaps with the first half groove forming step (S130). Accordingly, the first half groove 112 and the second half groove 114 form a through hole 116 penetrating the metal sheet 110, and the through hole 116 is formed by the metal sheet 110. The line spacing of the antenna pattern 100 is formed.
도 5를 참조하면, 금속 시트(110)의 제1 면 및 제2 면을 수직으로 관통하는 제1 하프 홈(112)의 중심 축(A)과 제2 하프 홈(114)의 중심 축(B)이 일치하고(즉, 동일 선상에 배치되고), 관통 홀(116)은 금속 시트(110)를 수직으로 관통하는 "8" 형상으로 형성된다.Referring to FIG. 5, the central axis (A) of the first half groove 112 and the central axis (B) of the second half groove 114 vertically penetrate the first and second surfaces of the metal sheet 110. ) are coincident (i.e., disposed on the same line), and the through hole 116 is formed in an “8” shape that penetrates the metal sheet 110 vertically.
다만, 도 6을 참조하면, 실제 공정에서 제1 하프 홈(112) 및 제2 하프 홈(114)을 정확하게 정렬하는 것은 매우 어렵기 때문에, 제1 하프 홈(112)의 중심 축(A)과 제2 하프 홈(114)의 중심 축(B)은 도면상 수평 방향으로 서로 어긋나고, 관통 홀(116)은 금속 시트(110)를 사선으로 관통하는 기울어진 "8" 형상으로 형성될 수도 있다.However, referring to FIG. 6, since it is very difficult to accurately align the first half groove 112 and the second half groove 114 in the actual process, the central axis A of the first half groove 112 and The central axes B of the second half grooves 114 are offset from each other in the horizontal direction in the drawing, and the through hole 116 may be formed in an inclined “8” shape that penetrates the metal sheet 110 diagonally.
여기서, 도 5 및 도 6에서는 홀(116)과 연접하는 두 개의 금속 시트(110)의 단부에 요홈이 형성됨에 따라 "8" 형상의 관통 홀(116)이 형성된 것으로 도시하였으나, 이에 한정되지 않고 관통 홀(116)과 연접하는 두 개의 금속 시트(110) 중에서 하나의 단부에 요홈이 형성되어 "B" 형상의 관통 홀(116)이 형성될 수도 있다.Here, in FIGS. 5 and 6, it is shown that an “8” shaped through hole 116 is formed as a groove is formed at the ends of the two metal sheets 110 adjacent to the hole 116, but the present invention is not limited thereto. A groove may be formed at one end of the two metal sheets 110 adjacent to the through hole 116 to form a “B” shaped through hole 116.
제2 하프 홈 형성 단계(S170)에서는 제2 하프 홈(114)이 형성된 후 경화된 노광 필름(130)을 제거한다.In the second half groove forming step (S170), the cured exposure film 130 is removed after the second half groove 114 is formed.
도 7을 참조하면, 종래의 안테나 패턴 제조 방법은 한 번의 에칭을 통해 안테나 패턴(100)의 선 간격을 형성하는 관통 홀(16)을 금속 시트(10)에 형성한다. 이 경우, 에칭 기술의 한계로 관통 홀(16)의 폭(W1)이 금속 시트(10)의 두께(T)에 비례하도록 커지며, 종래의 에칭 공정으로 통해 형성된 관통 홀(16)의 폭(W1, 즉, 안테나 패턴(100)의 선 간격)은 금속 시트(110) 두께(T)의 2배(200%) 정도로 형성된다.Referring to FIG. 7, the conventional antenna pattern manufacturing method forms through holes 16 that form the line spacing of the antenna pattern 100 in the metal sheet 10 through one-time etching. In this case, due to the limitations of etching technology, the width W1 of the through hole 16 increases in proportion to the thickness T of the metal sheet 10, and the width W1 of the through hole 16 formed through the conventional etching process is That is, the line spacing of the antenna pattern 100 is formed to be about twice (200%) the thickness (T) of the metal sheet 110.
즉, 금속 시트(10, 안테나 패턴(100))의 두께(T)가 2oz(대략 70um) 정도이면, 종래의 안테나 패턴 제조 방법에 의해 형성되는 관통 홀(16)의 폭(W1, 즉, 안테나 패턴(100)의 선 간격 또는 선폭)은 대략 140um 정도로 형성된다.That is, if the thickness T of the metal sheet 10 (antenna pattern 100) is about 2 oz (approximately 70 um), the width W1 of the through hole 16 formed by the conventional antenna pattern manufacturing method, that is, the antenna The line spacing or line width of the pattern 100 is formed to be approximately 140 um.
금속 시트(10, 안테나 패턴(100))의 두께(T)가 3oz(대략 105um) 정도이면, 종래의 안테나 패턴 제조 방법에 의해 형성되는 관통 홀(16)의 폭(W1, 즉, 안테나 패턴(100)의 선 간격 또는 선폭)은 대략 210um 정도로 형성된다.If the thickness T of the metal sheet 10 (antenna pattern 100) is about 3 oz (approximately 105 um), the width W1 of the through hole 16 formed by the conventional antenna pattern manufacturing method, that is, the antenna pattern ( The line spacing or line width of 100) is formed to be approximately 210um.
이에 반해, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 관통 홀(116)을 형성하기 위해 에칭 공정을 2단계(즉, 제1 하프 홈 형성 단계(S130) 및 제2 하프 홈 형성 단계(S170))로 나누어 수행함으로써, 금속 시트(110)에 형성된 관통 홀(116)의 폭(즉, 안테나 패턴(100)의 선 간격 또는 선폭)을 금속 시트(110) 두께 이하로 형성할 수 있다.On the other hand, the antenna pattern manufacturing method according to an embodiment of the present invention involves an etching process in two steps (i.e., a first half groove forming step (S130) and a second half groove forming step (S170) to form the through hole 116. )), the width of the through hole 116 formed in the metal sheet 110 (i.e., the line spacing or line width of the antenna pattern 100) can be formed to be less than or equal to the thickness of the metal sheet 110.
이때, 관통 홀(116)의 폭(즉, 안테나 패턴(100)의 선 간격 또는 선폭)은 제작 공정상 오차를 포함하여 금속 시트(110)의 두께의 80% 내지 120% 정도로 형성될 수 있다.At this time, the width of the through hole 116 (i.e., the line spacing or line width of the antenna pattern 100) may be formed to be about 80% to 120% of the thickness of the metal sheet 110, including errors during the manufacturing process.
일례로, 도 8을 참조하면, 금속 시트(110; 즉, 안테나 패턴(100))의 두께(T)가 2oz(대략 70um) 정도이면, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법에 의해 형성되는 관통 홀(116)의 폭(W2, 즉, 안테나 패턴(100)의 선 간격 또는 선폭)은 대략 70um 정도로 형성된다.For example, referring to FIG. 8, if the thickness T of the metal sheet 110 (i.e., the antenna pattern 100) is about 2oz (approximately 70um), it is formed by the antenna pattern manufacturing method according to an embodiment of the present invention. The width (W2, that is, the line spacing or line width of the antenna pattern 100) of the through hole 116 is formed to be approximately 70 um.
금속 시트(110; 즉, 안테나 패턴(100))의 두께(T)가 3oz(대략 105um) 정도이면, 종래의 안테나 패턴 제조 방법에 의해 형성되는 관통 홀(116)의 폭(W2, 즉, 안테나 패턴(100)의 선 간격 또는 선폭)은 대략 100um 정도로 형성된다.If the thickness (T) of the metal sheet 110 (i.e., the antenna pattern 100) is about 3 oz (approximately 105 um), the width (W2, i.e., the antenna) of the through hole 116 formed by the conventional antenna pattern manufacturing method is The line spacing or line width of the pattern 100 is formed to be approximately 100 um.
이처럼, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 에칭 공정을 2단계(즉, 제1 하프 홈 형성 단계(S130) 및 제2 하프 홈 형성 단계(S170))로 나누어 수행함으로써, 종래의 안테나 패턴 제조 방법에 비해 금속 시트(110)에 형성된 관통 홀(116)의 폭(즉, 안테나 패턴(100)의 선 간격 또는 선폭)을 50% 정도로 감소시킬 수 있다.As such, the method of manufacturing an antenna pattern according to an embodiment of the present invention divides the etching process into two steps (i.e., the first half-groove forming step (S130) and the second half-groove forming step (S170)), thereby replacing the conventional antenna. Compared to the pattern manufacturing method, the width of the through hole 116 formed in the metal sheet 110 (i.e., the line spacing or line width of the antenna pattern 100) can be reduced by about 50%.
또한, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 종래에 비해 관통 홀(116)의 폭(즉, 안테나 패턴(100)의 선 간격 또는 선폭)을 50% 정도로 감소시킴으로써, 두께가 3oz(105um) 이상인 금속 시트(110)에서도 100um 이하의 선 간격(Pitch)을 갖는 안테나 패턴(100)을 제작할 수 있는 효과가 있다.In addition, the antenna pattern manufacturing method according to an embodiment of the present invention reduces the width of the through hole 116 (i.e., the line spacing or line width of the antenna pattern 100) by about 50% compared to the prior art, thereby reducing the thickness to 3oz (105um). ) or more, there is an effect of producing an antenna pattern 100 with a line spacing (pitch) of 100 um or less.
또한, 안테나 패턴 제조 방법은 금속 두께의 80% 내지 120% 정도의 선 간격을 갖는 안테나 패턴(100)의 제작이 가능하여 설계 자유도가 증가하고, 성능 최적화 설계가 가능한 효과가 있다.In addition, the antenna pattern manufacturing method enables the manufacturing of the antenna pattern 100 with a line spacing of approximately 80% to 120% of the metal thickness, thereby increasing design freedom and enabling performance-optimized design.
표면 처리 단계(S180)에서는 금속 시트(110)의 제1 면을 표면 처리한다. 표면 처리 단계(S180)에서는 OSP(Organic Solderability Preservative) 공정을 통해 유기물을 도포하여 금속 시트(110)의 제1 면에 방청막(118)을 형성한다. 이를 통해, 금속 시트(110)의 제1 면을 평탄화하면서 금속 시트(110)와 공기가 접촉하는 것을 차단하여 금속 시트(110; 즉, 안테나 패턴(100))의 산화를 방지한다.In the surface treatment step (S180), the first side of the metal sheet 110 is surface treated. In the surface treatment step (S180), an organic material is applied through an Organic Solderability Preservative (OSP) process to form a rust prevention film 118 on the first side of the metal sheet 110. Through this, the first surface of the metal sheet 110 is flattened and air is blocked from contact with the metal sheet 110 to prevent oxidation of the metal sheet 110 (that is, the antenna pattern 100).
표면 처리 단계(S180)에서는 OSP 공정과 함께 금속 시트(110)의 산화 방지를 위해 금속 시트(110)의 제1 면에 주석(Sn), 니켈(Ni)을 도금하여 도금층을 형성할 수도 있다.In the surface treatment step (S180), a plating layer may be formed by plating tin (Sn) or nickel (Ni) on the first side of the metal sheet 110 in order to prevent oxidation of the metal sheet 110 along with the OSP process.
스탬핑 단계(S190)에서는 스탬핑 공정을 통해 금속 시트(110)에 안테나 패턴(100)의 아웃 라인을 형성한다. 스탬핑 단계(S190)에서는 스탬핑 장치(200)를 통해 금속 시트(110)를 스탬핑하여 안테나 패턴(100)의 아웃 라인을 형성한다.In the stamping step (S190), an outline of the antenna pattern 100 is formed on the metal sheet 110 through a stamping process. In the stamping step (S190), the metal sheet 110 is stamped using the stamping device 200 to form an outline of the antenna pattern 100.
상술한 과정을 통해, 본 발명의 실시 예에 따른 안테나 패턴 제조 방법은 금속 시트(110) 두께의 80% 이상 120% 이하의 선 간격을 갖는 안테나 패턴(100)을 제조할 수 있다. 상술한 공정을 통해 제조된 안테나 패턴(100)은 무선 전력 송신/수신(WPC; Wireless Power Consortium), 근거리 통신(NFC; Near Field Communication), 전자결제(MST; Magnetic Secure Transmission) 등을 위한 안테나로 동작할 수 있다.Through the above-described process, the antenna pattern manufacturing method according to an embodiment of the present invention can manufacture the antenna pattern 100 having a line spacing of 80% or more and 120% or less of the thickness of the metal sheet 110. The antenna pattern 100 manufactured through the above-described process is used as an antenna for wireless power transmission/reception (WPC; Wireless Power Consortium), near field communication (NFC; Near Field Communication), electronic payment (MST; Magnetic Secure Transmission), etc. It can work.
이상의 설명은 본 발명의 기술 사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 다양한 수정 및 변형이 가능할 것이다. 따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다. 본 발명의 보호 범위는 아래의 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

Claims (11)

  1. 금속 시트의 제1 면에 캐리어 시트를 합지하는 단계;laminating a carrier sheet to the first side of the metal sheet;
    상기 제1 면과 대향되는 상기 금속 시트의 제2 면을 노광하는 단계;exposing a second side of the metal sheet opposite the first side to light;
    상기 금속 시트의 제2 면을 하프 에칭하여 상기 금속 시트의 제2 면에서 상기 금속 시트의 내부 방향으로 파여진 제1 하프 홈을 형성하는 단계;Half-etching the second side of the metal sheet to form a first half groove dug in the inner direction of the metal sheet on the second side of the metal sheet;
    상기 제1 하프 홈이 형성된 상기 금속 시트의 제2 면에 커버레이 시트를 합지하는 단계;laminating a coverlay sheet to a second side of the metal sheet on which the first half groove is formed;
    상기 금속 시트의 제1 면에 합지된 캐리어 시트를 제거하는 단계;removing the carrier sheet laminated to the first side of the metal sheet;
    상기 캐리어 시트가 제거된 상기 금속 시트의 제1 면을 노광하는 단계; 및exposing a first side of the metal sheet from which the carrier sheet has been removed; and
    상기 금속 시트의 제1 면을 하프 에칭하여 상기 금속 시트의 제1 면에서 상기 금속 시트의 내부 방향으로 파여진 제2 하프 홈을 형성하는 단계를 포함하는 안테나 패턴 제조 방법.An antenna pattern manufacturing method comprising the step of half-etching the first side of the metal sheet to form a second half groove dug from the first side of the metal sheet toward the inside of the metal sheet.
  2. 제1항에 있어서,According to paragraph 1,
    상기 제2 하프 홈을 형성하는 단계에서는 상기 제1 하프 홈과 적어도 일부가 중첩되도록 상기 제2 하프 홈을 형성하는 안테나 패턴 제조 방법.In the step of forming the second half groove, the antenna pattern manufacturing method includes forming the second half groove so that at least a portion overlaps the first half groove.
  3. 제2항에 있어서,According to paragraph 2,
    상기 제1 하프 홈 및 상기 제2 하프 홈은 상기 금속 시트의 제1 면 및 제2 면을 관통하는 관통 홀을 형성하는 안테나 패턴 제조 방법.The first half groove and the second half groove form a through hole penetrating the first and second surfaces of the metal sheet.
  4. 제3항에 있어서,According to paragraph 3,
    상기 관통 홀은 상기 안테나 패턴의 선 간격을 형성하고, 상기 안테나 패턴의 선 간격은 상기 금속 시트의 두께와 동일한 안테나 패턴 제조 방법.The through hole forms a line spacing of the antenna pattern, and the line spacing of the antenna pattern is equal to the thickness of the metal sheet.
  5. 제3항에 있어서,According to paragraph 3,
    상기 관통 홀의 폭은 상기 금속 시트의 두께 이하인 안테나 패턴 제조 방법.An antenna pattern manufacturing method wherein the width of the through hole is less than or equal to the thickness of the metal sheet.
  6. 제3항에 있어서,According to paragraph 3,
    상기 관통 홀의 폭은 상기 금속 시트의 두께의 80% 이상 120% 이하인 안테나 패턴 제조 방법.A method of manufacturing an antenna pattern wherein the width of the through hole is 80% to 120% of the thickness of the metal sheet.
  7. 제1항에 있어서,According to paragraph 1,
    상기 제1 하프 홈을 형성하는 단계에서는 상기 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제1 중심 축을 갖는 제1 하프 홈을 형성하고,In forming the first half groove, a first half groove having a first central axis vertically penetrating the first and second surfaces of the metal sheet is formed,
    상기 제2 하프 홈을 형성하는 단계에서는 상기 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제2 중심 축을 갖는 제2 하프 홈을 형성하고,In the step of forming the second half groove, a second half groove having a second central axis vertically penetrating the first and second surfaces of the metal sheet is formed,
    상기 제1 중심 축과 상기 제2 중심 축은 이격된 안테나 패턴 제조 방법.The first central axis and the second central axis are spaced apart from each other.
  8. 제1항에 있어서,According to paragraph 1,
    상기 제1 하프 홈을 형성하는 단계에서는 상기 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제1 중심 축을 갖는 제1 하프 홈을 형성하고,In forming the first half groove, a first half groove having a first central axis vertically penetrating the first and second surfaces of the metal sheet is formed,
    상기 제2 하프 홈을 형성하는 단계에서는 상기 금속 시트의 제1 면 및 제2 면을 수직으로 관통하는 제2 중심 축을 갖는 제2 하프 홈을 형성하고,In the step of forming the second half groove, a second half groove having a second central axis vertically penetrating the first and second surfaces of the metal sheet is formed,
    상기 제1 중심 축과 상기 제2 중심 축은 동일 선상에 배치된 안테나 패턴 제조 방법.The first central axis and the second central axis are disposed on the same line.
  9. 제1항에 있어서,According to paragraph 1,
    상기 금속 시트는 설정 두께를 갖는 판상 기재이고,The metal sheet is a plate-shaped substrate having a set thickness,
    상기 설정 두께는 70um 이상인 안테나 패턴 제조 방법.A method of manufacturing an antenna pattern where the set thickness is 70um or more.
  10. 제1항에 있어서,According to paragraph 1,
    상기 제2 하프 홈이 형성된 상기 금속 시트의 제1 면을 표면 처리하는 단계를 더 포함하고,Further comprising surface treating the first side of the metal sheet on which the second half groove is formed,
    상기 표면 처리하는 단계에서는 상기 금속 시트의 제1 면에 방청막을 형성하는 안테나 패턴 제조 방법.An antenna pattern manufacturing method in which, in the surface treatment step, a rust-prevention film is formed on the first side of the metal sheet.
  11. 제1항에 있어서,According to paragraph 1,
    상기 제2 하프 홈이 형성된 상기 금속 시트를 스탬핑하여 상기 안테나 패턴의 아웃 라인을 형성하는 단계를 더 포함하는 안테나 패턴 제조 방법.An antenna pattern manufacturing method further comprising forming an outline of the antenna pattern by stamping the metal sheet on which the second half groove is formed.
PCT/KR2023/004814 2022-04-29 2023-04-10 Antenna pattern manufacturing method WO2023211008A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220053603A KR20230153772A (en) 2022-04-29 2022-04-29 Method for manufacturing antenna pattern
KR10-2022-0053603 2022-04-29

Publications (1)

Publication Number Publication Date
WO2023211008A1 true WO2023211008A1 (en) 2023-11-02

Family

ID=88519295

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2023/004814 WO2023211008A1 (en) 2022-04-29 2023-04-10 Antenna pattern manufacturing method

Country Status (2)

Country Link
KR (1) KR20230153772A (en)
WO (1) WO2023211008A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070113770A (en) * 2006-05-26 2007-11-29 (주)창성 Antenna structure composed with double-side circuit and magnetic member for rfid tag and manufacturing method thereof
KR20090043077A (en) * 2007-10-29 2009-05-06 강승오 Antenna for radio frequency identification and method of manufacturing the same
KR20100072790A (en) * 2008-12-22 2010-07-01 송민규 Manufacturing method for loop antenna portable phone
WO2011059151A1 (en) * 2009-11-13 2011-05-19 충주대학교 산학협력단 Transparent loop antenna for rfid tag and manufacturing method thereof
KR101263321B1 (en) * 2012-09-19 2013-05-15 에이큐 주식회사 One side loop antenna for nfc and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101218755B1 (en) 2012-11-05 2013-01-09 주식회사 다이나트론 Method of forming a metal pattern used for an antenna

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070113770A (en) * 2006-05-26 2007-11-29 (주)창성 Antenna structure composed with double-side circuit and magnetic member for rfid tag and manufacturing method thereof
KR20090043077A (en) * 2007-10-29 2009-05-06 강승오 Antenna for radio frequency identification and method of manufacturing the same
KR20100072790A (en) * 2008-12-22 2010-07-01 송민규 Manufacturing method for loop antenna portable phone
WO2011059151A1 (en) * 2009-11-13 2011-05-19 충주대학교 산학협력단 Transparent loop antenna for rfid tag and manufacturing method thereof
KR101263321B1 (en) * 2012-09-19 2013-05-15 에이큐 주식회사 One side loop antenna for nfc and manufacturing method thereof

Also Published As

Publication number Publication date
KR20230153772A (en) 2023-11-07

Similar Documents

Publication Publication Date Title
WO2012091373A2 (en) Method for manufacturing printed circuit board
WO2012169866A2 (en) Printed circuit board and method for manufacturing the same
WO2014088357A1 (en) Printed circuit board and manufacturing method therefor
WO2022103159A1 (en) Antenna module and wireless communication terminal comprising same
AU2019255870B2 (en) Antenna module including dielectric material and electronic device including antenna module
WO2018048165A1 (en) Stacked electrode assembly and flexible secondary battery comprising same
WO2018110897A2 (en) Multilayer printed circuit board and electronic device including the same
WO2014069734A1 (en) Printed circuit board
WO2023211008A1 (en) Antenna pattern manufacturing method
WO2024005451A1 (en) Antenna pattern manufacturing method
WO2024005449A1 (en) Antenna pattern manufacturing method and antenna pattern manufactured thereby
WO2023210994A1 (en) Antenna pattern
CN107529293A (en) A kind of mobile terminal, multilayer PCB circuit board and its manufacture method
WO2023085580A1 (en) Method for preparing flexible printed circuit board
WO2021256790A1 (en) Method for manufacturing flexible printed circuit board
WO2018182327A1 (en) Semiconductor package test socket and method for manufacturing same
WO2022108226A1 (en) Antenna module using cross section pattern
WO2021158041A1 (en) Cable module and method for manufacturing same
WO2024005450A1 (en) Antenna pattern and method for manufacturing same
KR102664534B1 (en) Antenna pattern
WO2019132509A1 (en) Antenna module and portable terminal comprising same
WO2019177357A1 (en) Wireless power receiving module and portable electronic device comprising same
WO2019164118A1 (en) Circuit board
WO2013089439A1 (en) The printed circuit board and the method for manufacturing the same
WO2014092386A1 (en) Printed circuit board and method of manufacturing same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23796657

Country of ref document: EP

Kind code of ref document: A1