CN213211584U - PCB circuit board of high accuracy multilayer LED display screen - Google Patents

PCB circuit board of high accuracy multilayer LED display screen Download PDF

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Publication number
CN213211584U
CN213211584U CN202022600958.8U CN202022600958U CN213211584U CN 213211584 U CN213211584 U CN 213211584U CN 202022600958 U CN202022600958 U CN 202022600958U CN 213211584 U CN213211584 U CN 213211584U
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CN
China
Prior art keywords
heat
circuit board
display screen
plate
led display
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Expired - Fee Related
Application number
CN202022600958.8U
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Chinese (zh)
Inventor
徐康
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Hangzhou Linan Kangyi Electronic Co Ltd
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Hangzhou Linan Kangyi Electronic Co Ltd
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Priority to CN202022600958.8U priority Critical patent/CN213211584U/en
Application granted granted Critical
Publication of CN213211584U publication Critical patent/CN213211584U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model provides a PCB circuit board of high accuracy multilayer LED display screen belongs to circuit board technical field. This PCB circuit board of high accuracy multilayer LED display screen includes circuit board body and heat dissipation mechanism, heat dissipation mechanism includes heat-conducting plate, fin, heat dissipation fan, heat conduction ring and heat conduction post, the heat-conducting plate set up in the circuit board body back, the circuit board body back with be provided with heat conduction silica gel layer between the heat-conducting plate, the multiunit the fin is annular equidistance fixed connection in the heat-conducting plate back, the heat conduction ring runs through in a plurality of groups the fin, heat conduction post one end fixed connection in the heat-conducting plate back. The heat-conducting plate of the utility model conducts the absorbed heat to the radiating fins for heat dissipation, and the arrangement of the heat-conducting columns and the heat-conducting rings accelerates the efficiency of the heat-conducting plate in conducting heat to the radiating fins; the heat dissipation fan rapidly extracts heat on the heat dissipation fins, so that heat generated by the circuit board body is rapidly dissipated.

Description

PCB circuit board of high accuracy multilayer LED display screen
Technical Field
The utility model relates to a circuit board field particularly, relates to a PCB circuit board of high accuracy multilayer LED display screen.
Background
The PCB circuit board is mainly designed in a layout mode, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate.
When the PCB circuit board inside the high-precision multilayer LED display screen is used, the heat generated by the circuit board is slowly radiated outwards, so that the circuit board body is easily damaged, and the normal use of the LED display screen is influenced.
SUMMERY OF THE UTILITY MODEL
In order to compensate above not enough, the utility model provides a PCB circuit board of high accuracy multilayer LED display screen aims at improving that the heat that the inside circuit board of LED display screen produced outwards gives off speed slower, easily leads to the impaired problem of circuit board body.
The utility model discloses a realize like this:
the utility model provides a PCB circuit board of high accuracy multilayer LED display screen, including circuit board body and heat dissipation mechanism, heat dissipation mechanism includes heat-conducting plate, fin, heat dissipation fan, heat conduction ring and heat conduction post, the heat-conducting plate set up in the circuit board body back, the circuit board body back with be provided with heat conduction silica gel layer between the heat-conducting plate, the multiunit the fin is annular equidistance fixed connection in the heat-conducting plate back, the heat conduction ring runs through in a plurality of groups the fin, heat conduction post one end fixed connection in the heat-conducting plate back, heat conduction post other end fixed connection in the heat conduction ring is close to heat conduction plate one side, fixed cover mounting cover is located heat dissipation fan is outside, the fixed cover outside is provided with the fixing bolt multiunit, fixing bolt's screw rod activity respectively runs through, The heat conducting plate with fixed cover, fixing nut has been connect to the spiro union in fixing bolt bottom.
The utility model discloses an in one embodiment, the first otic placode of heat-conducting plate outside fixedly connected with, fixed cover outer wall fixedly connected with second otic placode, fixing bolt activity respectively run through in first otic placode the second otic placode with the circuit board body, the fixing bolt spiro union run through in the nut.
In an embodiment of the present invention, the first ear plate and the second ear plate are provided with a support sleeve on the outside of the screw rod of the fixing bolt.
In an embodiment of the present invention, the two ends of the supporting sleeve are both provided with elastic washers, and the screw of the fixing bolt is movably penetrated through the elastic washers.
In an embodiment of the present invention, an elastic pad ring is disposed between the circuit board body and the first ear plate, and the screw of the fixing bolt is movably inserted into the elastic pad ring.
In an embodiment of the present invention, the nut is disposed below the second ear plate, and the screw bolt of the fixing bolt is connected to the nut.
In an embodiment of the present invention, the bottom end of the fixing bolt is provided with a fixing ring plate, and the bottom end of the fixing bolt is screwed with the fixing ring plate.
The utility model discloses an in the embodiment, retaining ring board top is provided with limit sleeve, fixing bolt bottom spiro union in inside the limit sleeve.
In an embodiment of the present invention, the heat sink has a through hole, and the heat conduction ring is disposed in the through hole.
The utility model discloses an in an embodiment, inside the through-hole the outside cover of heat conduction ring is equipped with heat conduction silica gel cover.
The utility model has the advantages that: the PCB circuit board of the high-precision multilayer LED display screen is obtained through the design, and the heat conducting plate on the back surface of the circuit board body can effectively absorb the heat generated by the circuit board body; the heat conducting plate conducts absorbed heat to the radiating fins for heat dissipation, and meanwhile, the arrangement of the heat conducting columns and the heat conducting rings accelerates the heat conducting efficiency of the heat conducting plate to the radiating fins; the heat dissipation fan takes out the heat on the fin fast for the heat that the circuit board body was produced is given off fast, can effectively protect the circuit board to use stably for a long time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a PCB circuit board of a high-precision multilayer LED display screen according to an embodiment of the present invention;
fig. 2 is a schematic view of a fixing bolt mounting structure provided in an embodiment of the present invention;
fig. 3 is a schematic bottom view of the heat-conducting plate and the heat sink according to the embodiment of the present invention;
fig. 4 is an enlarged schematic structural diagram of a portion a in fig. 3 according to an embodiment of the present invention.
In the figure: 10-a circuit board body; 20-a heat dissipation mechanism; 210-a thermally conductive plate; 211-a first ear plate; 220-a heat sink; 230-a heat dissipation fan; 240-heat conducting silica gel layer; 250-thermally conductive rings; 260-heat conducting columns; 270-a through hole; 30-fixing a ring plate; 310-fixing bolts; 320-fixing the sleeve; 321-a second ear plate; 330-a nut; 340-support sleeve; 350-elastic backing ring; 360-limiting sleeve.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1, the present invention provides a PCB circuit board of a high-precision multilayer LED display screen, which includes a circuit board body 10 and a heat dissipation mechanism 20.
Wherein, heat dissipation mechanism 20 installs at circuit board body 10 back, and heat dissipation mechanism 20 can make the heat that circuit board body 10 produced by give off fast, reduces circuit board body 10's heat for circuit board body 10 can stably use for a long time.
Referring to fig. 1, 3 and 4, the heat dissipating mechanism 20 includes a heat conducting plate 210, a heat sink 220, a heat dissipating fan 230, a heat conducting ring 250 and a heat conducting column 260. The heat conducting plate 210 is arranged on the back surface of the circuit board body 10, a heat conducting silica gel layer 240 is arranged between the back surface of the circuit board body 10 and the heat conducting plate 210, and a plurality of groups of radiating fins 220 are annularly and equidistantly fixedly connected to the back surface of the heat conducting plate 210; the heat sink 220 and the heat conductive plate 210 are integrally formed. The heat-conducting ring 250 penetrates through the plurality of sets of heat-radiating fins 220, one end of the heat-conducting column 260 is fixedly connected to the back surface of the heat-conducting plate 210, and the other end of the heat-conducting column 260 is fixedly connected to one side of the heat-conducting ring 250 close to the heat-conducting plate 210. The heat sink 220 is provided with a through hole 270, and the heat conduction ring 250 penetrates through the through hole 270; the through-holes 270 allow the heat conductive ring 250 to contact the heat sink 220 to improve heat conduction efficiency. A heat-conducting silica gel sleeve is sleeved outside the heat-conducting ring 250 in the through hole 270; the heat-conducting silicone sleeve enables gaps between the heat-conducting rings 250 and the heat-conducting rings 250 to be filled, and heat conduction efficiency is improved. The heat-conducting plate 210, the heat sink 220, the heat-conducting ring 250, and the heat-conducting pillars 260 are made of aluminum.
Referring to fig. 2, the fixing sleeve 320 is disposed on the outside of the heat dissipating fan 230, and a plurality of sets of fixing bolts 310 are disposed on the outside of the fixing sleeve 320, and screws of the fixing bolts 310 respectively penetrate through the circuit board body 10, the heat conducting plate 210 and the fixing sleeve 320. The bottom end of the fixing bolt 310 is screwed with a fixing nut 330. The bottom end of the fixing bolt 310 is provided with a fixing ring plate 30, and the bottom end of the fixing bolt 310 is screwed with the fixing ring plate 30. The fixing ring plate 30 realizes the auxiliary supporting installation of the circuit board body 10. The top of the fixed ring plate 30 is provided with a limit sleeve 360, and the bottom end of the fixing bolt 310 is screwed inside the limit sleeve 360. The limit sleeve 360 is used for mounting the fixing bolt 310 in a threaded manner.
Referring to fig. 2, a first ear plate 211 is fixedly connected to an outer side of the heat conducting plate 210, and the heat conducting plate 210 and the first ear plate 211 are integrally formed; the outer wall of the fixing sleeve 320 is fixedly connected with a second ear plate 321, and the fixing sleeve 320 and the second ear plate 321 are integrally formed. The fixing bolt 310 is movably inserted through the first ear plate 211, the second ear plate 321 and the circuit board body 10. The fixing bolt 310 is screwed through the nut 330. A support sleeve 340 is sleeved outside the screw rod of the fixing bolt 310 between the first lug plate 211 and the second lug plate 321. The first and second ear plates 211 and 321 are used for fixedly mounting the heat conductive plate 210 and the fixing sleeve 320. Elastic washers are arranged at two ends of the support sleeve 340, and the screw of the fixing bolt 310 movably penetrates through the elastic washers. The elastic washer is a rubber washer for protecting the first ear plate 211 and the second ear plate 321 at both ends of the support sleeve 340. An elastic cushion ring 350 is arranged between the circuit board body 10 and the first ear plate 211, and the screw of the fixing bolt 310 movably penetrates through the elastic cushion ring 350. The elastic backing ring 350 is a rubber gasket for elastically supporting the first ear plate 211 and the circuit board body 10. The nut 330 is disposed below the second ear plate 321, and the screw of the fixing bolt 310 is screwed through the nut 330. The nut 330 fixes the circuit board body 10, the heat conductive plate 210, the heat sink 220 and the heat sink fan 230.
The working principle of the PCB circuit board of the high-precision multilayer LED display screen is as follows: the heat conducting plate 210 on the back of the circuit board body 10 can effectively absorb the heat generated by the circuit board body 10; the heat conducting plate 210 conducts the absorbed heat to the heat sink 220 for heat dissipation, and the arrangement of the heat conducting columns 260 and the heat conducting rings 250 accelerates the efficiency of the heat conducting plate 210 in conducting heat to the heat sink 220; the heat dissipation fan 230 rapidly extracts heat from the heat dissipation plate 220, that is, the heat generated by the circuit board body 10 is rapidly dissipated, so that the circuit board body 10 can be effectively protected.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A PCB circuit board of a high-precision multilayer LED display screen is characterized by comprising
A circuit board body (10);
the heat dissipation mechanism (20) comprises a heat conduction plate (210), heat dissipation fins (220), heat dissipation fans (230), heat conduction rings (250) and heat conduction columns (260), wherein the heat conduction plate (210) is arranged on the back of the circuit board body (10), a heat conduction silica gel layer (240) is arranged between the back of the circuit board body (10) and the heat conduction plate (210), a plurality of groups of heat dissipation fins (220) are fixedly connected to the back of the heat conduction plate (210) in an annular equidistant manner, the heat conduction rings (250) penetrate through the groups of heat dissipation fins (220), one end of each heat conduction column (260) is fixedly connected to the back of the heat conduction plate (210), and the other end of each heat conduction column (260) is fixedly connected to one side, close to the heat conduction plate (210), of the;
fixed cover (320), fixed cover (320) installation cover is located heat dissipation fan (230) are outside, the fixed cover (320) outside is provided with fixing bolt (310) multiunit, the screw rod of fixing bolt (310) activity respectively run through in circuit board body (10) heat-conducting plate (210) with fixed cover (320), fixing bolt (310) bottom spiro union has fixation nut (330).
2. The PCB circuit board of a high-precision multi-layer LED display screen according to claim 1, wherein a first ear plate (211) is fixedly connected to the outer side of the heat conducting plate (210), a second ear plate (321) is fixedly connected to the outer wall of the fixing sleeve (320), the fixing bolt (310) is movably penetrated through the first ear plate (211), the second ear plate (321) and the circuit board body (10) respectively, and the fixing bolt (310) is screwed and penetrated through the nut (330).
3. The PCB circuit board of a high-precision multilayer LED display screen according to claim 2, wherein a support sleeve (340) is sleeved outside a screw rod of the fixing bolt (310) between the first ear plate (211) and the second ear plate (321).
4. The PCB circuit board of the high-precision multilayer LED display screen according to claim 3, wherein two ends of the support sleeve (340) are provided with elastic washers, and the screw of the fixing bolt (310) movably penetrates through the elastic washers.
5. The PCB circuit board of the high-precision multilayer LED display screen according to claim 2, wherein an elastic cushion ring (350) is arranged between the circuit board body (10) and the first ear plate (211), and a screw of the fixing bolt (310) movably penetrates through the elastic cushion ring (350).
6. The PCB circuit board of a high-precision multilayer LED display screen according to claim 2, wherein the nut (330) is arranged below the second ear plate (321), and the screw of the fixing bolt (310) is screwed through the nut (330).
7. The PCB circuit board of a high-precision multilayer LED display screen according to claim 1, wherein a fixing ring plate (30) is arranged at the bottom end of the fixing bolt (310), and the bottom end of the fixing bolt (310) is screwed with the fixing ring plate (30).
8. The PCB circuit board of a high-precision multilayer LED display screen according to claim 7, wherein a limiting sleeve (360) is arranged on the top of the fixing ring board (30), and the bottom end of the fixing bolt (310) is screwed inside the limiting sleeve (360).
9. The PCB circuit board of a high-precision multi-layer LED display screen according to claim 1, wherein the heat sink (220) is provided with a through hole (270), and the heat-conducting ring (250) penetrates through the through hole (270).
10. The PCB circuit board of a high-precision multi-layer LED display screen according to claim 9, wherein the heat-conducting ring (250) inside the through hole (270) is sleeved with a heat-conducting silica gel sleeve.
CN202022600958.8U 2020-11-11 2020-11-11 PCB circuit board of high accuracy multilayer LED display screen Expired - Fee Related CN213211584U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022600958.8U CN213211584U (en) 2020-11-11 2020-11-11 PCB circuit board of high accuracy multilayer LED display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022600958.8U CN213211584U (en) 2020-11-11 2020-11-11 PCB circuit board of high accuracy multilayer LED display screen

Publications (1)

Publication Number Publication Date
CN213211584U true CN213211584U (en) 2021-05-14

Family

ID=75828553

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022600958.8U Expired - Fee Related CN213211584U (en) 2020-11-11 2020-11-11 PCB circuit board of high accuracy multilayer LED display screen

Country Status (1)

Country Link
CN (1) CN213211584U (en)

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20210514