CN213148324U - Heat dissipation testing arrangement based on car parts operating temperature analog system - Google Patents

Heat dissipation testing arrangement based on car parts operating temperature analog system Download PDF

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Publication number
CN213148324U
CN213148324U CN202022166974.0U CN202022166974U CN213148324U CN 213148324 U CN213148324 U CN 213148324U CN 202022166974 U CN202022166974 U CN 202022166974U CN 213148324 U CN213148324 U CN 213148324U
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CN
China
Prior art keywords
heat dissipation
mounting hole
cold water
shell
operating temperature
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Expired - Fee Related
Application number
CN202022166974.0U
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Chinese (zh)
Inventor
刘永强
吴毫
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Hongde Automotive Technology Kunshan Co ltd
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Hongde Automotive Technology Kunshan Co ltd
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Priority to CN202022166974.0U priority Critical patent/CN213148324U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a heat dissipation testing device based on an automobile part operating temperature simulation system, which belongs to the technical field of automobile heat dissipation testing, and comprises a heat dissipation shell and a fan, wherein an inner cavity of the heat dissipation shell is sequentially provided with a pore plate, an outer pipe and semiconductor refrigerating sheets from front to back, the top and the bottom of the outer pipe are respectively connected with a cold water pipe adapter I and a cold water pipe adapter II, the cold water pipe adapter I and the cold water pipe adapter II are inserted in a mounting hole, after the circulating cold water is connected into the outer pipe, the heat of the flowing hot water in the inner cavity of the inner pipe can be taken away, the water-cooling heat dissipation is realized, the fan blows air into the inner cavity of the heat dissipation shell, the temperature on the outer pipe can be taken away by the flowing air, the air cooling is realized, the air cooling is matched with the water-cooling, the quick heat dissipation can be realized, the, the air is rapidly cooled, and the efficiency of wind power heat dissipation is improved.

Description

Heat dissipation testing arrangement based on car parts operating temperature analog system
Technical Field
The utility model relates to an automobile heat dissipation test technical field specifically is a heat dissipation testing arrangement based on car parts operating temperature analog system.
Background
In order to protect automobile parts and reduce experiment cost, workers cannot directly use the automobile parts to perform heat dissipation tests in a laboratory, but adopt a simulation system to simulate the operating temperature of the automobile parts to perform heat dissipation tests, namely water is heated to the operating temperature of each part of an automobile, and then heat dissipation detection is performed on hot water in a pipe through a heat dissipation device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation testing arrangement based on car parts operating temperature analog system to solve the problem that provides among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation testing arrangement based on auto parts operating temperature analog system, includes heat dissipation shell and fan, heat dissipation shell inner chamber is by preceding orifice plate, outer tube, the semiconductor refrigeration piece of being equipped with in proper order after to, the top and the bottom of outer tube are connected with cold water pipe adapter one and cold water pipe adapter two respectively, the mounting hole has all been seted up to the top and the bottom of heat dissipation shell, cold water pipe adapter one and cold water pipe adapter two insert and establish in the mounting hole, the slot has been seted up in the left side of heat dissipation shell rear side outer wall, and the slot interpolation is equipped with the connection shell, connection shell inner chamber is by preceding being equipped with fan and screen cloth after to in proper order.
Further, the inner tube is arranged in the inner cavity of the outer tube, a first hot water pipe adapter and a second hot water pipe adapter are respectively installed at two ends of the inner tube, a mounting hole is formed in the right side of the joint of the bottom of the heat dissipation shell and the second cold water pipe adapter, the second hot water pipe adapter is installed in the mounting hole, the mounting hole is formed in the right side of the heat dissipation shell, the first hot water pipe adapter is inserted into the mounting hole, a cavity is formed between the outer tube and the inner tube, supporting blocks are arranged in the cavity, and the supporting blocks are distributed in a spiral shape.
Furthermore, heat conduction fins are welded on the front side and the rear side of the outer pipe, multiple groups of heat conduction fins are arranged on the left side and the right side at equal intervals, and the front heat conduction fins and the rear heat conduction fins are arranged in a staggered mode.
Furthermore, three groups of semiconductor refrigerating pieces are arranged in front of and behind the semiconductor refrigerating pieces, two adjacent groups of semiconductor refrigerating pieces are arranged in a staggered mode, and the distance between the two groups of semiconductor refrigerating pieces is two to three centimeters.
Further, connecting shell outer wall cover is equipped with fixed frame, fixed frame is equipped with the annular groove with the relative one side of heat dissipation shell, is provided with the sealing washer in two sets of annular grooves, the mounting hole has all been seted up at fixed frame top four corners, and the mounting hole internal thread cover is equipped with the screw, be provided with the connection screw on the heat dissipation shell.
Furthermore, a flow equalizing plate is arranged between the outer pipe and the semiconductor refrigerating sheet.
Compared with the prior art, the beneficial effects of the utility model are that: after the cold water of access circulation in the outer tube, can take away the hydrothermal heat that flows of inner tube inner chamber, realize the water-cooling heat dissipation, the fan blows in the air to the heat dissipation shell inner chamber, the temperature on the outer tube can be taken away to the air that flows, realize the forced air cooling, forced air cooling and water-cooling cooperation are used, can realize quick heat dissipation, and adjacent two sets of semiconductor refrigeration piece crisscross setting, can prolong the wind channel of circulation of air, make the air fully contact with the semiconductor refrigeration piece, carry out quick cooling to the air, improve wind-force radiating efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the outer tube of the present invention;
FIG. 3 is a schematic view illustrating the installation of the heat dissipation housing and the heat conduction fins of the present invention;
fig. 4 is a simulation block diagram of the operating temperature of the automobile component of the present invention.
In the figure: 1. a heat dissipation housing; 2. an outer tube; 21. a support block; 22. a cavity; 3. an inner tube; 4. a hot water pipe adapter I; 5. a first cold water pipe adapter; 6. a cold water pipe adapter II; 7. a hot water pipe adapter II; 8. heat conducting fins; 9. an orifice plate; 10. a seal ring; 11. a flow equalizing plate; 12. a semiconductor refrigeration sheet; 13. a connecting shell; 14. a fan; 15. screening a screen; 16. a fixing frame is provided.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a technical scheme: a heat dissipation testing device based on an automobile part operating temperature simulation system is disclosed, please refer to fig. 1, which comprises a heat dissipation shell 1 and a fan 14, wherein an inner cavity of the heat dissipation shell 1 is sequentially provided with a pore plate 9, an outer tube 2 and a semiconductor refrigerating sheet 12 from front to back, the top and the bottom of the outer tube 2 are respectively connected with a first cold water pipe adapter 5 and a second cold water pipe adapter 6, the top and the bottom of the heat dissipation shell 1 are respectively provided with a mounting hole, the first cold water pipe adapter 5 and the second cold water pipe adapter 6 are inserted in the mounting holes, after circulating cold water is introduced, the heat of flowing hot water in the inner cavity of the inner tube 3 can be taken away, so as to realize water cooling, the left side of the outer wall at the back side of the heat dissipation shell 1 is provided with a slot, a connecting shell 13 is inserted in the slot, the inner cavity of the connecting shell 13 is sequentially provided with the fan 14 and a screen 15 from, the fan 14 blows air into the inner cavity of the heat dissipation shell 1, the flowing air can take away the temperature on the outer pipe 2, air cooling is realized, and the air cooling and the water cooling are matched for use, so that quick heat dissipation can be realized;
referring to fig. 1-3, an inner tube 3 is arranged in an inner cavity of an outer tube 2, a first hot water tube adapter 4 and a second hot water tube adapter 7 are respectively installed at two ends of the inner tube 3, the hot water tube adapters are connected with a hot water pipeline, a heat dissipation device is connected between a water pump and a temperature detector 1 in fig. 4, a mounting hole is formed in the right side of the connection position of the bottom of a heat dissipation shell 1 and a second cold water tube adapter 6, the second hot water tube adapter 7 is installed in the mounting hole, a mounting hole is formed in the right side of the heat dissipation shell 1, the first hot water tube adapter 4 is inserted into the mounting hole, a cavity 22 is formed between the outer tube 2 and the inner tube 3, a supporting block 21 is arranged in the cavity 22, the supporting block 21 is spirally distributed;
referring to fig. 1-3, heat conduction fins 8 are welded on the front and rear sides of the outer tube 2, a plurality of groups of heat conduction fins 8 are arranged at equal intervals from left to right, the front and rear groups of heat conduction fins 8 are arranged in a staggered manner, and the heat conduction fins 8 can play a role in heat conduction while supporting the outer tube 2, thereby improving the heat dissipation efficiency;
referring to fig. 1, three groups of semiconductor chilling plates 12 are arranged in front of and behind, two adjacent groups of semiconductor chilling plates 12 are arranged in a staggered manner, so that an air channel for air circulation is prolonged, air is fully contacted with the semiconductor chilling plates 12, the air is rapidly cooled, the heat dissipation efficiency is improved, and the distance between the two groups of semiconductor chilling plates 12 is two to three centimeters;
referring to fig. 1, a fixing frame 16 is sleeved on the outer wall of a connecting shell 13, annular grooves are formed in one side of the fixing frame 16 opposite to a heat dissipation shell 1, sealing rings 10 are arranged in the two groups of annular grooves, mounting holes are formed in four corners of the top of the fixing frame 16, screws are sleeved in the mounting holes in a threaded manner, connecting screw holes are formed in the heat dissipation shell 1, and the sealing rings 10 can improve the tightness of connection between the fixing frame and the heat dissipation shell and prevent cold air from leaking;
referring to fig. 1, a flow equalizing plate 11 is disposed between the outer tube 2 and the semiconductor cooling fins 12 to uniformly spray the cooled air to the outer tube 2, so as to remove heat from the outer tube 2.
Referring to fig. 4, fig. 4 is a flow chart of cooling the simulation temperature: after heating water tank (simulation automobile parts's operating temperature) heated cold water, the pump body was taken hot water out and is inserted in the radiator, the radiator cools off the back to hot water, thermodetector 1 measures the temperature after the cooling, reach target temperature after, the switch-on in three way connection right side, through flowmeter 2, valve 2 backward flow goes into heating water tank, thermodetector 1 measures when the temperature does not reach the target, the switch-on in three way connection top, through valve 1, flowmeter 1, the intercooler, the deionizer, the intercooler cools off intraductal hot water once more, then thermodetector 2 measures the intraductal temperature, reach target temperature after, the backward flow goes into heating water tank, heat once more, the effect of water tank in the picture, collect overheated hot water, make hot water can not flow the part in the picture, avoid water overheat to lead to follow-up device to damage.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a heat dissipation testing arrangement based on automobile parts operating temperature analog system, includes heat dissipation shell (1) and fan (14), its characterized in that: the utility model discloses a heat dissipation shell (1) inner chamber is by preceding orifice plate (9), outer tube (2), semiconductor refrigeration piece (12) of being equipped with in proper order to the back, the top and the bottom of outer tube (2) are connected with cold water pipe adapter (5) and cold water pipe adapter two (6) respectively, the mounting hole has all been seted up to the top and the bottom of heat dissipation shell (1), cold water pipe adapter (5) and cold water pipe adapter two (6) are inserted and are established in the mounting hole, the slot has been seted up in the left side of heat dissipation shell (1) rear side outer wall, and the slot interpolation is equipped with connecting shell (13), connecting shell (13) inner chamber is by preceding being equipped with fan (14) and screen cloth (15) after to in proper order.
2. The heat dissipation testing device based on the automobile part operating temperature simulation system according to claim 1, characterized in that: outer tube (2) inner chamber is provided with inner tube (3), hot-water line adapter (4) and hot-water line adapter two (7) are installed respectively to the both ends of inner tube (3), the mounting hole has been seted up on the right side of heat dissipation shell (1) bottom and cold water pipe adapter two (6) junction, hot-water line adapter two (7) are installed in the mounting hole, the mounting hole has been seted up on heat dissipation shell (1) right side, hot-water line adapter (4) are inserted and are established in the mounting hole, vacuole formation (22) between outer tube (2) and inner tube (3), be provided with supporting shoe (21) in cavity (22), supporting shoe (21) are the heliciform and distribute.
3. The heat dissipation testing device based on the automobile part operating temperature simulation system according to claim 1, characterized in that: heat conduction wings (8) are welded on the front side and the rear side of the outer pipe (2), a plurality of groups of heat conduction wings (8) are arranged at the left side and the right side at equal intervals, and the heat conduction wings (8) are arranged in a staggered mode.
4. The heat dissipation testing device based on the automobile part operating temperature simulation system according to claim 1, characterized in that: three groups of semiconductor refrigerating pieces (12) are arranged in front of and behind the semiconductor refrigerating pieces, two adjacent groups of semiconductor refrigerating pieces (12) are arranged in a staggered mode, and the distance between the two groups of semiconductor refrigerating pieces (12) is two to three centimeters.
5. The heat dissipation testing device based on the automobile part operating temperature simulation system according to claim 1, characterized in that: connect shell (13) outer wall cover and be equipped with fixed frame (16), fixed frame (16) are equipped with annular groove with the relative one side of heat dissipation shell (1), are provided with sealing washer (10) in two sets of annular groove, the mounting hole has all been seted up in fixed frame (16) top four corners, and the mounting hole internal thread cover is equipped with the screw, be provided with the connection screw on heat dissipation shell (1).
6. The heat dissipation testing device based on the automobile part operating temperature simulation system according to claim 1, characterized in that: a flow equalizing plate (11) is arranged between the outer pipe (2) and the semiconductor refrigerating sheet (12).
CN202022166974.0U 2020-09-28 2020-09-28 Heat dissipation testing arrangement based on car parts operating temperature analog system Expired - Fee Related CN213148324U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022166974.0U CN213148324U (en) 2020-09-28 2020-09-28 Heat dissipation testing arrangement based on car parts operating temperature analog system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022166974.0U CN213148324U (en) 2020-09-28 2020-09-28 Heat dissipation testing arrangement based on car parts operating temperature analog system

Publications (1)

Publication Number Publication Date
CN213148324U true CN213148324U (en) 2021-05-07

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Application Number Title Priority Date Filing Date
CN202022166974.0U Expired - Fee Related CN213148324U (en) 2020-09-28 2020-09-28 Heat dissipation testing arrangement based on car parts operating temperature analog system

Country Status (1)

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CN (1) CN213148324U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114484641A (en) * 2022-01-13 2022-05-13 佛山市顺德区通昊电器有限公司 Water-cooling fan capable of circularly refrigerating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114484641A (en) * 2022-01-13 2022-05-13 佛山市顺德区通昊电器有限公司 Water-cooling fan capable of circularly refrigerating

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210507

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