CN213147730U - High-precision solder paste thickness measuring device - Google Patents
High-precision solder paste thickness measuring device Download PDFInfo
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- CN213147730U CN213147730U CN202022626099.XU CN202022626099U CN213147730U CN 213147730 U CN213147730 U CN 213147730U CN 202022626099 U CN202022626099 U CN 202022626099U CN 213147730 U CN213147730 U CN 213147730U
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Abstract
The utility model belongs to the technical field of measuring equipment, specifically a high accuracy tin cream thickness measurement device, including transmission device, measuring mechanism and elevating system, transmission device is used for carrying the circuit board forward, elevating system is used for upwards jacking the circuit board on the transmission device to the measuring range of measuring mechanism, measuring mechanism is used for measuring the tin cream thickness on the circuit board; the measuring mechanism comprises a support frame, a linear motion mechanism, a detection camera and a laser, the linear motion mechanism is installed on the support frame, the detection camera and the laser are installed at the output end of the linear motion mechanism, the detection camera and the laser are located right above the transmission mechanism, and the linear motion mechanism is used for driving the detection camera and the laser to move linearly in the horizontal direction. The solder paste thickness measuring device has high continuity and high measuring efficiency for measuring the solder paste thickness of the circuit board.
Description
Technical Field
The utility model relates to a measuring equipment technical field especially relates to a high accuracy tin cream thickness measurement device.
Background
In the field of electronic manufacturing, Surface Mount Technology (SMT) has been widely used, and solder paste printing process is a very critical part of the whole production process, so it is very important to detect the quality of solder paste printing, and according to statistics, the quality in SMT process is poor, and 70% of the quality comes from the link of solder paste printing.
However, the existing solder paste thickness measuring device has poor continuity of measuring the thickness of the solder paste on the circuit board and low measuring efficiency.
In order to solve the problems, the application provides a high-precision solder paste thickness measuring device.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide a high accuracy tin cream thickness measurement device for solve the relatively poor, lower problem of measurement efficiency of current tin cream thickness measurement device measurement continuity.
In order to solve the technical problem, the utility model provides a high accuracy tin cream thickness measurement device, include: the device comprises a transmission mechanism, a measurement mechanism and a lifting mechanism;
the conveying mechanism is used for conveying a circuit board forwards, the lifting mechanism is used for lifting the circuit board on the conveying mechanism upwards to a measuring range of the measuring mechanism, and the measuring mechanism is used for measuring the thickness of solder paste on the circuit board;
the measuring mechanism comprises a support frame, a linear motion mechanism, a detection camera and a laser, the linear motion mechanism is installed on the support frame, the detection camera and the laser are installed at the output end of the linear motion mechanism, the detection camera and the laser are located right above the transmission mechanism, and the linear motion mechanism is used for driving the detection camera and the laser to move linearly in the horizontal direction.
Optionally, the linear motion mechanism includes a slide rail, a slider, a lead screw and a first rotary driving part, the slide rail is fixed on the support frame, the slider is slidably mounted on the slide rail, the lead screw passes the slider and is matched through a thread, and the first rotary driving part is used for driving the lead screw to rotate.
Optionally, the device further comprises a rotating mechanism, and after the lifting mechanism lifts the circuit board to the measuring position, the rotating mechanism drives the circuit board to rotate.
Optionally, the lifting mechanism includes a linear driving member, a piston rod, a rotating shaft and a top plate, the linear driving member is a fixed structure, the linear driving member drives the piston rod to move up and down, the lower end of the rotating shaft is rotatably connected with the output end of the piston rod, the axial displacement of the rotating shaft and the axial displacement of the piston rod are relatively fixed, and the top plate is fixed at the upper end of the rotating shaft;
the rotating mechanism is used for driving the rotating shaft to rotate, and the output end of the rotating mechanism is matched with the rotating shaft through a spline structure.
Optionally, the rotating mechanism includes a second rotating driving element, a driving wheel, an output wheel and an axial limiting structure, the second rotating driving element drives the driving wheel to rotate, the driving wheel is engaged with the output wheel or the driving wheel is directly connected with the output wheel through a transmission element in a transmission manner, and the axial limiting structure is used for limiting axial displacement of the output wheel;
the output wheel is matched with the rotating shaft through a spline structure.
Optionally, the rotating mechanism includes a second rotating driving member, a driving wheel, an output wheel and a rotating sleeve, the second rotating driving member drives the driving wheel to rotate, the driving wheel is engaged with the output wheel or the driving wheel is directly connected with the output wheel through a transmission member, and the rotating sleeve is fixed in axial displacement;
the output wheel is fixedly assembled on the rotating sleeve, and the rotating shaft is assembled inside the rotating sleeve through a spline structure.
Optionally, a T-shaped limiting groove is formed in the lower end of the rotating shaft, a T-shaped protrusion matched with the T-shaped limiting groove is formed in the upper end of the piston rod, and the upper end of the piston rod is movably sleeved in the T-shaped limiting groove in the lower end of the rotating shaft.
Optionally, the rotating shaft and the piston rod are connected through a bearing, and the rotating shaft and the piston rod are respectively fixedly connected with the inner ring and the outer ring of the bearing.
Optionally, the conveying mechanism is a roller conveyor.
Optionally, the conveying mechanism includes a left conveying group and a right conveying group, the left conveying group and the right conveying group are arranged at intervals to form a hollow conveying space, and the left conveying group and the right conveying group respectively support the left lower side and the right lower side of the circuit board;
the lifting mechanism is arranged below the interval between the left side conveying group and the right side conveying group.
The above technical scheme of the utility model has following profitable technological effect:
1. this tin cream thickness measurement device carries the circuit board through transport mechanism, when the circuit board is carried to the measuring mechanism below, drives the roof lifting through the piston rod to can be with circuit board lifting to measurement height, after the measurement is accomplished, rethread piston rod descends the circuit board to transport mechanism, utilizes transport mechanism to carry out the circuit board, and this tin cream thickness measurement device is higher to the tin cream thickness measurement continuity on the circuit board, and measurement of efficiency is high.
2. This solder paste thickness measurement device, in the measurement process, rotates driving piece drive action wheel through the second and rotates, utilizes the action wheel to drive the transmission of output wheel, and it is rotatory to drive the pivot to can drive the circuit board rotation on the roof, solder paste profile tolerance measuring point is many, can improve the precision of solder paste thickness measurement on the circuit board.
Drawings
FIG. 1 is a schematic structural view of a high-precision solder paste measuring apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a linear motion mechanism;
FIG. 3 is a schematic view of a structure of a rotary shaft rotatably connected to a piston rod;
fig. 4 is a schematic structural diagram of a transmission mechanism.
Reference numerals:
1 support leg
2 support
3 conveying mechanism
4 measuring mechanism
41 support frame
42 linear motion mechanism
43 detection camera
44 laser
5 rotating sleeve
6 rotating shaft
7 Top plate
8 first fixing plate
9 Linear driving piece
10 piston rod
11 output wheel
12 second fixing plate
13 second rotary driving member
14 driving wheel
15 first rotary drive member
16 sliding block
17 sliding rail
18 lead screw
19 left side conveying group
20 right conveying group
21 circuit board
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 4. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
The following examples are for illustrative purposes only. The various embodiments may be combined, and are not limited to what is presented in the following single embodiment.
Referring to fig. 1, the present invention provides a technical solution: a high-precision solder paste thickness measuring device comprises a transmission mechanism 3, a measuring mechanism 4 and a lifting mechanism; the conveying mechanism 3 is used for conveying the circuit board 21 forwards, the lifting mechanism is used for lifting the circuit board 21 on the conveying mechanism 3 upwards to a measuring range of the measuring mechanism 4, the measuring mechanism 4 is used for measuring the thickness of solder paste on the circuit board 21, after the thickness of the solder paste is measured, the lifting mechanism lowers the circuit board 21 onto the conveying mechanism 3, the conveying mechanism 3 conveys the circuit board 21 to a next process, the measuring continuity of the whole process is high, and the measuring efficiency is high; the measuring mechanism 4 comprises a supporting frame 41, a linear motion mechanism 42, a detection camera 43 and a laser 44, the linear motion mechanism 42 is installed on the supporting frame 41, the detection camera 43 and the laser 44 are installed at the output end of the linear motion mechanism 42 to move synchronously, the detection camera 43 and the laser 44 are located right above the transmission mechanism 3, the linear motion mechanism 42 is used for driving the detection camera 43 and the laser 44 to move linearly in the horizontal direction, the light emitted by the laser 44 is irradiated onto the tin paste surface of the circuit board 21, a plurality of same light bars are used for perspective projection, when the profile height of a measured object is changed, the change of an image point on the position of a photosensitive surface is caused, namely, the spatial modulation generated by the three-dimensional surface structural body on the structural light beam changes the angle of an imaging light beam, namely, the position of the imaging light spot on a detector array is changed, through the geometric parameter calibration of the system light path and the determination of the imaging light spot position, the thickness of the solder paste is calculated, a 3D simulation diagram of the solder paste is simulated, and the measuring efficiency is high.
Referring to fig. 2, in this embodiment, the linear motion mechanism 42 includes a slide rail 17, a slide block 16, a screw rod 18 and a first rotary driving member 15, the slide rail 17 is fixed on the support frame 41, the slide block 16 is slidably mounted on the slide rail 17, the screw rod 18 passes through the slide block 16 and is in threaded fit, the first rotary driving member 15 is used for driving the screw rod 18 to rotate, the first rotary driving member 15 may be a motor, and the motor drives the screw rod 18 to rotate, so that the slide block 16 realizes reciprocating linear motion, and the whole linear motion mechanism 42 has a simple structure and a good motion effect.
Referring to fig. 1, in this embodiment, the high-precision solder paste measuring apparatus further includes a rotating mechanism, and after the lifting mechanism lifts the circuit board 21 to a measuring position, the rotating mechanism drives the circuit board 21 to rotate, so that the laser 44 can measure the profile of the whole solder paste, thereby achieving the purpose of high measuring precision.
Referring to fig. 1, in the present embodiment, the lifting mechanism includes a linear driving member 9, a piston rod 10, a rotating shaft 6 and a top plate 7, the linear driving member 9 is fixedly mounted on the bracket 2 through a first fixing plate 8, the linear driving member 9 may be an air cylinder, the linear driving piece 9 drives the piston rod 10 to move up and down, the lower end of the rotating shaft 6 is rotationally connected with the output end of the piston rod 10, when the rotating shaft 6 rotates, the piston rod 10 can be prevented from rotating, the axial displacement of the rotating shaft 6 and the piston rod 10 is relatively fixed, the top plate 7 is fixed at the upper end of the rotating shaft 6, the linear driving piece 9 is started to drive the piston rod 10 to extend and retract, so that the rotating shaft 6 can be driven to extend and retract, the top plate 7 is further driven to stretch, the circuit board 21 on the transmission mechanism 3 is lifted to be measured, and the circuit board 21 is driven to descend to the transmission mechanism 3 after the measurement is finished; the rotating mechanism is used for driving the rotating shaft 6 to rotate so as to realize autorotation of the circuit board 21 during measurement, and the output end of the rotating mechanism and the rotating shaft 6 can be directly matched through a spline structure, so that the rotating shaft 6 can synchronously axially extend and retract while rotating.
Referring to fig. 1, in this embodiment, the rotating mechanism includes a second rotating driving element 13, a driving wheel 14, an output wheel 11 and an axial limiting structure, the second rotating driving element 13 drives the driving wheel 14 to rotate, the second driving element may be a driving motor, the second rotating driving element 13 is fixedly mounted on the bracket 2 through a second fixing plate 12, the driving wheel 14 and the output wheel 11 are directly engaged through a gear or the driving wheel 14 and the output wheel 11 are in transmission connection through a transmission element, the transmission connection may be belt transmission, and the axial limiting structure is used for limiting an axial displacement of the output wheel 11 and supporting the output wheel 11; the output wheel 11 and the rotating shaft 6 are matched through the spline structure, so that the rotating shaft 6 can synchronously axially extend and retract while rotating.
Referring to fig. 1, in this embodiment, the axial limiting structure may also be a rotating sleeve 5, the rotating sleeve 5 is rotatably fixed on the bracket 2, the output wheel 11 is fixedly assembled on the rotating sleeve 5, the rotating shaft 6 is assembled inside the rotating sleeve 5 through a spline structure, and the driving wheel 14 drives the output wheel 11 to rotate, so as to drive the rotating sleeve 5 fixed to the output wheel 11 to rotate synchronously, thereby driving the rotating shaft 6 to rotate.
Referring to fig. 3, in this embodiment, a T-shaped limiting groove is formed at the lower end of the rotating shaft 6, a T-shaped protrusion adapted to the T-shaped limiting groove is formed at the upper end of the piston rod 10, the upper end of the piston rod 10 is movably sleeved in the T-shaped limiting groove at the lower end of the rotating shaft 6, and the piston rod 10 and the rotating shaft 6 are rotatably connected together through the T-shaped limiting structure, so that when the rotating shaft 6 rotates, the piston rod 10 is prevented from rotating, and damage to the linear driving member 9 caused by movement of the piston rod 10 is reduced.
In this embodiment, optionally, the rotating shaft 6 and the piston rod 10 may be further connected by a bearing, and the rotating shaft 6 and the piston rod 10 are respectively fixedly connected with an inner ring and an outer ring of the bearing, so that when the rotating shaft 6 rotates, the piston rod 10 is prevented from rotating.
Referring to fig. 1, in this embodiment, the transmission mechanism 3 may be a roller conveyor, the roller conveyor is disposed adjacent to two rollers at an interval, the interval is used for the top plate 7 to lift, the transmission mechanism 3 is mounted on the support 2, and the support leg 1 is mounted at the lower portion of the support 2 for supporting.
Referring to fig. 4, in this embodiment, optionally, the conveying mechanism 3 includes a left conveying group 19 and a right conveying group 20, the left conveying group 19 and the right conveying group 20 are disposed at an interval to form a hollow conveying space, and the left conveying group 19 and the right conveying group 20 respectively hold the left lower side and the right lower side of the circuit board 21; the lifting mechanism is arranged below the interval between the left side conveying group 19 and the right side conveying group 20, the left side conveying group 19 and the right side conveying group 20 move at the same speed, the middle control positions between the left side conveying group 19 and the right side conveying group 20 can be used for lifting the top plate 7, the conveying mechanism 3 adopts a structure of two conveying groups, and when the thickness of solder paste is measured, the conveying mechanism 3 can work all the time, so that the efficiency is higher, and the process is simpler.
In summary, the solder paste thickness measuring device conveys the circuit board through the conveying mechanism, when the circuit board is conveyed to the position below the measuring mechanism, the piston rod drives the top plate to lift, so that the circuit board can be lifted to a measuring height, after the measurement is finished, the circuit board is lowered onto the conveying mechanism through the piston rod, and the circuit board is conveyed out through the conveying mechanism, so that the solder paste thickness measuring device has high continuity in solder paste thickness measurement on the circuit board and high measuring efficiency; in the measuring process, the second rotating driving piece drives the driving wheel to rotate, the driving wheel drives the output wheel to transmit, and the rotating shaft is driven to rotate, so that the circuit board on the top plate can be driven to rotate, and the precision of measuring the thickness of the solder paste on the circuit board can be improved. Therefore, the utility model discloses effectively overcome the relatively poor, lower problem of measurement of current tin cream thickness measurement device continuity and possess high industrial utilization and worth.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A high accuracy tin cream thickness measurement device which characterized in that includes: the device comprises a transmission mechanism, a measurement mechanism and a lifting mechanism;
the conveying mechanism is used for conveying a circuit board forwards, the lifting mechanism is used for lifting the circuit board on the conveying mechanism upwards to a measuring range of the measuring mechanism, and the measuring mechanism is used for measuring the thickness of solder paste on the circuit board;
the measuring mechanism comprises a support frame, a linear motion mechanism, a detection camera and a laser, the linear motion mechanism is installed on the support frame, the detection camera and the laser are installed at the output end of the linear motion mechanism, the detection camera and the laser are located right above the transmission mechanism, and the linear motion mechanism is used for driving the detection camera and the laser to move linearly in the horizontal direction.
2. A high precision solder paste thickness measuring apparatus according to claim 1, wherein: the linear motion mechanism comprises a sliding rail, a sliding block, a screw rod and a first rotating driving piece, the sliding rail is fixed on the supporting frame, the sliding block is slidably mounted on the sliding rail, the screw rod penetrates through the sliding block and is in threaded fit, and the first rotating driving piece is used for driving the screw rod to rotate.
3. A high precision solder paste thickness measuring apparatus according to claim 1, wherein: the circuit board self-rotation measuring device further comprises a rotating mechanism, and the rotating mechanism drives the circuit board to rotate after the circuit board is jacked to the measuring position by the lifting mechanism.
4. A high precision solder paste thickness measuring apparatus according to claim 3, wherein: the lifting mechanism comprises a linear driving part, a piston rod, a rotating shaft and a top plate, the linear driving part is of a fixed structure, the linear driving part drives the piston rod to move up and down, the lower end of the rotating shaft is rotatably connected with the output end of the piston rod, the axial displacement of the rotating shaft and the axial displacement of the piston rod are relatively fixed, and the top plate is fixed at the upper end of the rotating shaft;
the rotating mechanism is used for driving the rotating shaft to rotate, and the output end of the rotating mechanism is matched with the rotating shaft through a spline structure.
5. A high precision solder paste thickness measuring apparatus according to claim 4, characterized in that: the rotating mechanism comprises a second rotating driving part, a driving wheel, an output wheel and an axial limiting structure, the second rotating driving part drives the driving wheel to rotate, the driving wheel is meshed with the output wheel or is directly connected with the output wheel through a transmission part in a transmission way, and the axial limiting structure is used for limiting the axial displacement of the output wheel;
the output wheel is matched with the rotating shaft through a spline structure.
6. A high precision solder paste thickness measuring apparatus according to claim 4, characterized in that: the rotating mechanism comprises a second rotating driving part, a driving wheel, an output wheel and a rotating sleeve, the second rotating driving part drives the driving wheel to rotate, the driving wheel is meshed with the output wheel or the driving wheel is directly connected with the output wheel through a transmission part in a transmission way, and the rotating sleeve is fixed in axial displacement;
the output wheel is fixedly assembled on the rotating sleeve, and the rotating shaft is assembled inside the rotating sleeve through a spline structure.
7. A high precision solder paste thickness measuring apparatus according to claim 4, characterized in that: the lower end of the rotating shaft is provided with a T-shaped limiting groove, the upper end of the piston rod is provided with a T-shaped protrusion matched with the T-shaped limiting groove, and the upper end of the piston rod is movably sleeved in the T-shaped limiting groove at the lower end of the rotating shaft.
8. A high precision solder paste thickness measuring apparatus according to claim 4, characterized in that: the rotating shaft is connected with the piston rod through a bearing, and the rotating shaft is fixedly connected with the piston rod and the inner ring and the outer ring of the bearing respectively.
9. A high precision solder paste thickness measuring apparatus according to claim 1, wherein said transporting mechanism is a roller conveyor.
10. A high precision solder paste thickness measuring apparatus according to claim 1, wherein: the transmission mechanism comprises a left side transmission group and a right side transmission group, the left side transmission group and the right side transmission group are arranged at intervals to form a hollow transmission space, and the left side transmission group and the right side transmission group respectively support the left side lower part and the right side lower part of the circuit board;
the lifting mechanism is arranged below the interval between the left side conveying group and the right side conveying group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022626099.XU CN213147730U (en) | 2020-11-13 | 2020-11-13 | High-precision solder paste thickness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022626099.XU CN213147730U (en) | 2020-11-13 | 2020-11-13 | High-precision solder paste thickness measuring device |
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| Publication Number | Publication Date |
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| CN213147730U true CN213147730U (en) | 2021-05-07 |
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| CN202022626099.XU Active CN213147730U (en) | 2020-11-13 | 2020-11-13 | High-precision solder paste thickness measuring device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117968546A (en) * | 2024-03-29 | 2024-05-03 | 德中(深圳)激光智能科技有限公司 | Multidimensional solder paste thickness detection system |
-
2020
- 2020-11-13 CN CN202022626099.XU patent/CN213147730U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117968546A (en) * | 2024-03-29 | 2024-05-03 | 德中(深圳)激光智能科技有限公司 | Multidimensional solder paste thickness detection system |
| CN117968546B (en) * | 2024-03-29 | 2024-06-04 | 德中(深圳)激光智能科技有限公司 | Multidimensional solder paste thickness detection system |
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