CN213122894U

CN213122894U - High-efficient stable simulator heat radiation structure

Info

Publication number: CN213122894U
Application number: CN202022578296.9U
Authority: CN
Inventors: 崔世强
Original assignee: Tianjin Rising Technology Co ltd
Current assignee: Tianjin Rising Technology Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-05-04
Anticipated expiration: 2030-11-10

Abstract

The utility model discloses a high-efficiency and stable emulator radiating structure, which comprises a radiating shell, wherein ear plates are integrally formed on the left side and the right side of the inner wall of the radiating shell, a circuit board is arranged on the ear plates, and a stable wind power radiating structure is assembled at the lower end of the inner cavity of the radiating shell; the scheme adopts a stable wind power heat dissipation structure to cool and dissipate the circuit board, and wind power is uniformly dispersed and slowly flows through the wind power dispersion stable structure, so that the wind power is uniformly and gently blown to the bottom surface of the circuit board, and the electronic elements on the circuit board are comprehensively and uniformly dissipated; the scheme adopts the heat dissipation shell to assist the heat dissipation, and through the thin aluminium alloy sheet series connection plastic slab and the glass fiber layer of heat conduction pole and both sides, promotes the whole mechanical strength of heat dissipation shell.

Description

High-efficient stable simulator heat radiation structure

Technical Field

The utility model relates to a heat radiation structure technical field specifically is a high-efficient stable emulator heat radiation structure.

Background

The simulator can replace the MCU in your target system, simulate its operation. The simulator operates the same as the actual target processor, but adds other functions to enable you to observe the programs and data in the MCU through the desktop computer or other debugging interface and to control the operation of the MCU.

The existing simulator still has certain defects when in use, and is not beneficial to the use of the simulator, when the simulator runs, because the high-speed running of a computer can generate a large amount of heat, the prior art is optimized through an auxiliary heat dissipation device, the auxiliary heat dissipation device mainly dissipates heat by wind power, electronic elements are dissipated by a fan, but the wind power blown by the fan is concentrated, so that the problem of uneven heat dissipation is caused by different wind power received by different areas on a circuit board, and meanwhile, the wind power is concentrated at one position for a long time, so that the electronic elements at the position with stronger wind are easily damaged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient stable emulator heat radiation structure to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient stable emulator heat radiation structure, includes the heat dissipation shell, heat dissipation shell inner wall left and right sides integrated into one piece has the otic placode, be provided with the circuit board on the otic placode, heat dissipation shell inner chamber lower extreme is equipped with stable formula wind-force heat radiation structure.

Preferably, stable formula wind-force heat radiation structure is including pegging graft in the diaphragm of heat dissipation shell inner chamber lower extreme, and the upper surface and the laminating of otic placode bottom surface of diaphragm, circuit board edge, otic placode and diaphragm pass through screw fixed connection, evenly the embedding is equipped with the slope ventilation pipe on the diaphragm, the fresh air inlet has been seted up to heat dissipation shell left side wall lower extreme, and the fresh air fan of fixed being equipped with in the fresh air inlet, the lower extreme tangent plane of slope ventilation pipe is towards fresh air fan one side, heat dissipation shell right flank lower extreme has been seted up and has been exhausted the hole, the downthehole fixed dust screen that is equipped with of airing exhaust, the left and right sides be equipped.

Preferably, wind-force dispersion stable structure includes horizontal even fixed connection in the left and right sides horizontal fiber strip between the otic placode, the even fixedly connected with vertical fiber strip of lateral wall lower extreme around the heat dissipation shell inner chamber, and the horizontal transverse arrangement of vertical fiber strip, vertical fiber strip is located 1 ~ 2 millimeters department above the horizontal fiber strip.

Preferably, the heat dissipation shell includes the plastic slab, the plastic slab bottom surface is pasted and is had the glass fiber layer, glass fiber layer bottom surface laminating has bottom aluminum alloy heat conduction sheet metal, the upper surface laminating of plastic slab has top layer aluminum alloy heat conduction sheet metal, even fixedly connected with runs through the heat conduction pin on plastic slab and glass fiber layer between bottom aluminum alloy heat conduction sheet metal and the top layer aluminum alloy heat conduction sheet metal.

Compared with the prior art, this scheme has designed a high-efficient stable simulator heat radiation structure, has following beneficial effect:

(1) the scheme adopts a stable wind power heat dissipation structure to cool and dissipate heat of the circuit board, and wind passing through the wind power dispersion stable structure is uniformly dispersed and slowly flows, so that wind power is uniformly and gently blown to the bottom surface of the circuit board, and comprehensive and uniform heat dissipation of electronic elements on the circuit board is realized.

(2) The scheme adopts the heat dissipation shell to assist the heat dissipation, and through the thin aluminium alloy sheet series connection plastic slab and the glass fiber layer of heat conduction pole and both sides, promotes the whole mechanical strength of heat dissipation shell.

Drawings

Fig. 1 is a schematic sectional view of the structure of the present invention.

Fig. 2 is a schematic structural view of the middle wind dispersing and stabilizing structure of the present invention.

Fig. 3 is a schematic view of the structure of the heat dissipation housing of the present invention.

In the figure: the heat dissipation structure comprises a heat dissipation shell 1, a plastic plate 11, a glass fiber layer 12, a bottom aluminum alloy heat conduction sheet 13, a top aluminum alloy heat conduction sheet 14, a heat conduction thin rod 15, a lug plate 2, a circuit board 3, a stable type 4 wind power heat dissipation structure, a transverse plate 41, an inclined ventilation pipe 42, an air inlet 43, a miniature fan 44, an air outlet 45, an air dust net 46, a wind power dispersion and stabilization structure 47, transverse fiber strips 471 and longitudinal fiber strips 472.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: the utility model provides a high-efficient stable emulator heat radiation structure, includes heat dissipation shell 1, and 1 inner wall left and right sides integrated into one piece of heat dissipation shell has otic placode 2, is provided with circuit board 3 on the otic placode 2, and 1 inner chamber lower extreme of heat dissipation shell is equipped with stable formula wind-force heat radiation structure 4.

The stable wind power heat dissipation structure 4 is adopted to cool and dissipate heat of the circuit board 3, and wind passing through the wind power dispersion stable structure 471 is uniformly dispersed and slowly flowed, so that wind power is uniformly and gently blown to the bottom surface of the circuit board 3, and comprehensive and uniform heat dissipation of electronic elements on the circuit board 3 is realized.

Stable form wind-force heat radiation structure 4 is including pegging graft in the diaphragm 41 of 1 inner chamber lower extreme of heat dissipation shell, and the upper surface of diaphragm 41 and the laminating of 2 bottom surfaces of otic placode, circuit board 3 edge, otic placode 2 and diaphragm 41 pass through screw fixed connection, evenly the embedding is equipped with slope ventilation pipe 42 on diaphragm 41, fresh air inlet 43 has been seted up to 1 left side wall lower extreme of heat dissipation shell, and fresh air inlet 43 internal fixation is equipped with miniature fan 44, the lower extreme tangent plane of slope ventilation pipe 42 is towards miniature fan 44 one side, exhaust hole 45 has been seted up to 1 right flank lower extreme of heat dissipation shell, exhaust hole 45 internal fixation is equipped with dust screen 46, be equipped with wind-force dispersion stable structure 47 between the left.

In this embodiment, the micro fan 44 is connected to the power supply end of the circuit board 3, and discharges air to the lower end of the inner cavity of the heat dissipation housing 1 through the micro fan 44, the wind is guided to be discharged from the upper end after encountering the inclined ventilation pipe 42, and blows on the wind dispersing and stabilizing structure 47 above, and the wind passing through the wind dispersing and stabilizing structure 47 is uniformly dispersed and slowly flows.

Wind-force dispersion stable structure 47 includes horizontal fiber strip 471 between horizontal even fixed connection left and right sides otic placode 2, the even fixedly connected with longitudinal fiber strip 472 of lateral wall lower extreme around the heat dissipation shell 1 inner chamber, and the horizontal arrangement of longitudinal fiber strip 472, and longitudinal fiber strip 472 is located 1 ~ 2 millimeters department above horizontal fiber strip 471.

Concentrated wind power passes through gaps between the transverse fiber strips 471 and the longitudinal fiber strips 472 in sequence, and is scattered for multiple times and blown to the bottom surface of the circuit board 3 after slow flow, so that the wind power is uniformly and gently blown to the bottom surface of the circuit board 3, and comprehensive and uniform heat dissipation of electronic elements on the circuit board 3 is realized.

The heat dissipation shell 1 comprises a plastic plate 11, a glass fiber layer 12 is pasted on the bottom surface of the plastic plate 11, a bottom aluminum alloy heat conduction sheet 13 is pasted on the bottom surface of the glass fiber layer 12, a top aluminum alloy heat conduction sheet 14 is pasted on the upper surface of the plastic plate 11, and a heat conduction thin rod 15 which penetrates through the plastic plate 11 and the glass fiber layer 12 is uniformly and fixedly connected between the bottom aluminum alloy heat conduction sheet 13 and the top aluminum alloy heat conduction sheet 14.

Adopt heat dissipation shell 1 to assist the heat dissipation, through heat conduction pin 15 and the aluminum alloy sheet series connection plastic slab 11 and the glass fiber layer 12 of both sides, promote the whole mechanical strength of heat dissipation shell 1.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a high-efficient stable simulator heat radiation structure which characterized in that: including heat dissipation shell (1), heat dissipation shell (1) inner wall left and right sides integrated into one piece has otic placode (2), be provided with circuit board (3) on otic placode (2), heat dissipation shell (1) inner chamber lower extreme is equipped with stable formula wind-force heat radiation structure (4).

2. The heat dissipation structure of claim 1, wherein: the stable wind power heat dissipation structure (4) comprises a transverse plate (41) inserted at the lower end of the inner cavity of the heat dissipation shell (1), the upper surface of the transverse plate (41) is attached to the bottom surface of the lug plate (2), the edge of the circuit board (3), the lug plate (2) and the transverse plate (41) are fixedly connected through screws, the transverse plate (41) is uniformly embedded with an inclined ventilating pipe (42), the lower end of the left side wall of the heat dissipation shell (1) is provided with an air inlet hole (43), and a micro fan (44) is fixedly assembled in the air inlet hole (43), the lower end section of the inclined ventilation pipe (42) faces to one side of the micro fan (44), the hole of airing exhaust (45) have been seted up to heat dissipation shell (1) right flank lower extreme, hole of airing exhaust (45) internal fixation is equipped with dust screen (46), the left and right sides be equipped with wind-force dispersion stable structure (47) between otic placode (2).

3. The heat dissipation structure of claim 2, wherein: wind-force dispersion stable structure (47) are including horizontal even fixed connection in the left and right sides horizontal ribbon (471) between otic placode (2), the even fixedly connected with longitudinal ribbon (472) of lateral wall lower extreme around heat dissipation shell (1) inner chamber, and the horizontal transverse arrangement of longitudinal ribbon (472), longitudinal ribbon (472) are located horizontal ribbon (471) top 1 ~ 2 millimeters department.

4. The heat dissipation structure of claim 1, wherein: heat dissipation shell (1) includes plastic slab (11), plastic slab (11) bottom surface is pasted and is had glass fiber layer (12), the laminating of glass fiber layer (12) bottom surface has bottom aluminum alloy heat conduction sheet metal (13), the upper surface laminating of plastic slab (11) has top layer aluminum alloy heat conduction sheet metal (14), even fixedly connected with runs through heat conduction pin (15) of plastic slab (11) and glass fiber layer (12) between bottom aluminum alloy heat conduction sheet metal (13) and top layer aluminum alloy heat conduction sheet metal (14).