CN213104002U - Punching sheet recovery device - Google Patents
Punching sheet recovery device Download PDFInfo
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- CN213104002U CN213104002U CN202021373429.2U CN202021373429U CN213104002U CN 213104002 U CN213104002 U CN 213104002U CN 202021373429 U CN202021373429 U CN 202021373429U CN 213104002 U CN213104002 U CN 213104002U
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Abstract
The utility model discloses a punching sheet recovery device, which belongs to the technical field of punching, wherein an upper die and a lower die are matched to separate an iron belt into a ring sheet and a circular sheet; the first electromagnet on the lower surface of the upper die is used for adsorbing the ring sheets, the tray is horizontally inserted between the upper die and the lower die, and the ring sheets fall onto the tray after the first electromagnet is demagnetized; the lower surface of the tray is provided with a second electromagnet, the wafer left on the upper surface of the lower adsorption mold can fall onto a wafer recovery conveyor belt after the second electromagnet is demagnetized; the electromagnet III on the lower surface of the ring piece recovery platform is used for adsorbing the ring pieces on the tray, and the ring piece recovery platform is moved to the position above the ring piece recovery conveying belt under the driving of a ring piece recovery platform driving mechanism; after the electromagnet III is demagnetized, the ring sheets fall onto a ring sheet recovery conveying belt. The utility model discloses a towards piece recovery unit can carry out automatic collection to the part ring piece of needs to and also carry out automatic collection to the waste material disk and utilize, reduce artifical collection cost.
Description
Technical Field
The utility model belongs to the technical field of the punching press, specifically speaking relates to towards piece recovery unit.
Background
Among the prior art, when cutting motor core with the drift of die-cutting machine, need go up the ring shape iron sheet from the bar iron sheet and cut, when obtaining the ring shape iron sheet, also left the waste material, the waste material includes two parts, partly is the leftover bits, another part is the circular iron sheet in the middle of the ring shape paster, the circular iron sheet in the middle of present often can fall and can't collect in the die hole because of gravity, and often this part circular iron sheet can also utilize, adopt the manual work to collect circular paster again and waste time and energy.
SUMMERY OF THE UTILITY MODEL
The utility model aims at above-mentioned weak point provides towards piece recovery unit, and the scheduling problem that current manual work is wasted time and energy is collected again to the attempt of solving. In order to achieve the above object, the utility model provides a following technical scheme:
the punching sheet recovery device comprises a punching sheet device 1, a rack, a tray 3, a tray driving mechanism 4, a ring sheet recovery platform 5, a ring sheet recovery platform driving mechanism 6, a ring sheet recovery conveyor belt 7 and a wafer recovery conveyor belt 8; the punching device 1 comprises an upper die 11 and a lower die 12; the upper die 11 and the lower die 12 are used for matching with the iron belt 2 to punch the iron belt 2 so as to separate the iron belt 2 into a ring piece 21 and a circular piece 22; the lower surface of the upper die 11 is provided with a first electromagnet 23, and the first electromagnet 23 is used for adsorbing the ring sheet 21 to enable the ring sheet 21 to be tightly attached to the upper die 11; a wafer 22 is left on the upper surface of the lower die 12; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, so that the ring sheet 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the lower surface of the tray 3 is provided with a second electromagnet 24 for adsorbing the wafer 22 left on the upper surface of the lower die 12; the tray 3 can be horizontally moved below the ring piece recovery platform 5 and above the wafer recovery conveyor belt 8 under the driving of the tray driving mechanism 4, and the wafer 22 can fall onto the wafer recovery conveyor belt 8 after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 is used for adsorbing the ring pieces 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7. According to the structure, after the upper die 11 and the lower die 12 are matched with each other to punch the iron strip 2, the iron strip 2 is divided into the ring sheets 21 and the circular sheets 22; the ring piece 21 is a required part, and the wafer piece 22 is one of the waste materials after stamping; however, the ring piece 21 and the wafer piece 22 need to be respectively and automatically collected, so that the problem that manual collection wastes time and labor is reduced, and the wafer piece 22 is recycled; an electromagnet I23 is arranged on the lower surface of an upper die 11, and after being stamped down, a ring piece 21 is adsorbed by the electromagnet I23, so that the ring piece 21 is tightly attached to the upper die 11, and a wafer 22 is still left on the upper surface of a lower die 12 after being stamped down; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, and when the electromagnet I23 is demagnetized, the ring sheet 21 falls onto the tray 3 under the action of gravity; the lower surface of the tray 3 is provided with a second electromagnet 24 which can be used for adsorbing the wafer 22 left on the upper surface of the lower die 12; thus, the ring piece 21 and the wafer piece 22 are respectively attached to the upper surface and the lower surface of the tray 3 and are carried away along with the tray 3; the tray driving mechanism 4 drives the tray 3 to horizontally separate from the space between the upper die 11 and the lower die 12, the tray 3 reaches the position below the ring piece recovery platform 5 and the position above the wafer recovery conveyor belt 8, and at the moment, the wafer 22 falls onto the wafer recovery conveyor belt 8 under the action of gravity after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 can be used for adsorbing the ring piece 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring piece 21 and the wafer 22 can be respectively and automatically collected.
Further, the upper die 11 comprises a circular sheet male die 13 and a ring sheet female die 14, the ring sheet female die 14 surrounds the circular sheet male die 13, and a spring is arranged in the ring sheet female die 14, so that the ring sheet female die 14 can be recessed and keep the outward ejection trend when being subjected to an external force; the lower die 12 comprises a wafer female die 15 and a ring male die 16, the ring male die 16 surrounds the wafer female die 15, and a spring is arranged in the wafer female die 15, so that the wafer female die 15 can be sunken and keep the outward ejection trend when being subjected to external force; when the circular sheet convex die 13 is matched with the circular sheet concave die 15 and the ring sheet convex die 16 is matched with the ring sheet concave die 14, the iron belt 2 is divided into a ring sheet 21 and a circular sheet 22. According to the structure, when the wafer male die 13 punches the iron belt 2 from top to bottom, the wafer female die 15 sinks, the wafer 22 is punched from the iron belt 2, and the wafer female die 15 is reset under the action of the spring, so that the wafer 22 is left on the upper surface of the lower die 12; when the ring male die 16 punches the iron belt 2 relatively from bottom to top, the ring female die 14 sinks down, the ring 21 punches from the iron belt 2, the ring female die 14 resets under the action of a spring, and the ring female die 14 is provided with the electromagnet I23, so that the ring 21 is tightly attached to the upper die 11.
Further, tray actuating mechanism 4 is the telescopic link, and the flexible end and the tray 3 of telescopic link are fixed, and the stiff end of telescopic link is fixed in the frame, and the level of telescopic link control tray 3 is stretched into or is left between mould 11 and lower mould 12. According to the structure, the tray 3 needs to finish horizontal movement, the most conventional telescopic rod is adopted, the technology is mature, the control is convenient, and the cost is low.
Further, the ring piece recovery platform driving mechanism 6 comprises a driving motor, a left rod 61 and a right rod 62; the upper ends of the left rod 61 and the right rod 62 are hinged on the ring piece recovery platform 5, and the lower ends of the left rod 61 and the right rod 62 are hinged on the frame, so that four hinged points of the left rod 61 and the right rod 62 form a parallelogram; the driving motor is used for driving the left rod 61 or the right rod 62 to use one of the hinge points as a rotation center, so that the ring piece recycling platform 5 always keeps a horizontal state and moves to the position above the ring piece recycling conveyor belt 7. According to the structure, the hinge point of the upper end of the left rod 61 and the ring piece recovery platform 5, the hinge point of the upper end of the right rod 62 and the ring piece recovery platform 5, the hinge point of the lower end of the left rod 61 and the rack, and the hinge point of the lower end of the right rod 62 and the rack are connected to form a parallelogram, so that the ring piece recovery platform 5 can keep a horizontal state no matter the driving motor drives the left rod 61 or the right rod 62, the electromagnet three 25 on the lower surface of the ring piece recovery platform 5 adsorbs the ring pieces 21 on the tray 3, and the ring pieces 21 are always kept to move horizontally above the ring piece recovery conveyor belt 7; after the third electromagnet 25 is demagnetized, the ring piece 21 accurately falls onto the ring piece recovery conveyor belt 7 under the action of gravity.
Further, a power supply, a travel switch I, a travel switch II and a travel switch III are arranged on the rack; the travel switch I is used for controlling a power supply to supply power to the electromagnet I23; the second travel switch is used for controlling a power supply to supply power to the second electromagnet 24; the travel switch III is used for controlling a power supply to supply power to the electromagnet III 25; when the tray 3 is horizontally inserted between the upper die 11 and the lower die 12, the first travel switch is switched off, the first electromagnet 23 is demagnetized, the second travel switch is switched on, and the second electromagnet 24 generates magnetism; when the tray 3 is moved to the position above the wafer recycling conveyor belt 8, the ring piece recycling platform driving mechanism 6 drives the ring piece recycling platform 5 to move to the position above the tray 3, the second travel switch is switched off, the second electromagnet 24 is demagnetized, the third travel switch is switched on, and the third electromagnet 25 generates magnetism; and the ring piece recovery platform driving mechanism 6 drives the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7, the travel switch III is switched off, and the electromagnet III 25 is demagnetized. According to the structure, when the tray 3 is horizontally inserted between the upper die 11 and the lower die 12, the travel switch is turned off, the first electromagnet 23 is demagnetized, and the ring piece 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the second travel switch is closed, the second electromagnet 24 generates magnetism, and the second electromagnet 24 adsorbs the wafer 22 left on the upper surface of the lower die 12; when the tray 3 is moved to the position above the wafer recycling conveyor belt 8, the ring piece recycling platform driving mechanism 6 drives the ring piece recycling platform 5 to move to the position above the tray 3, the travel switch II is switched off, the electromagnet II 24 is demagnetized, and at the moment, the wafer 22 falls onto the wafer recycling conveyor belt 8 under the action of gravity after the electromagnet II 24 is demagnetized; the travel switch III is closed, the electromagnet III 25 generates magnetism, and the electromagnet III 25 adsorbs the ring piece 21 on the tray 3; the ring piece recovery platform driving mechanism 6 drives the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7, the travel switch III is switched off, the electromagnet III 25 is demagnetized, and after the electromagnet III 25 is demagnetized, the ring pieces 21 fall onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring pieces 21 and the wafer 22 can be automatically collected respectively.
The utility model has the advantages that:
the utility model discloses a punching sheet recovery device, wherein an upper die and a lower die are matched to separate an iron belt into a ring sheet and a circular sheet; the first electromagnet on the lower surface of the upper die is used for adsorbing the ring sheets, the tray is horizontally inserted between the upper die and the lower die, and the ring sheets fall onto the tray after the first electromagnet is demagnetized; the lower surface of the tray is provided with a second electromagnet, the wafer left on the upper surface of the lower adsorption mold can fall onto a wafer recovery conveyor belt after the second electromagnet is demagnetized; the electromagnet III on the lower surface of the ring piece recovery platform is used for adsorbing the ring pieces on the tray, and the ring piece recovery platform is moved to the position above the ring piece recovery conveying belt under the driving of a ring piece recovery platform driving mechanism; after the electromagnet III is demagnetized, the ring sheets fall onto a ring sheet recovery conveying belt. The utility model discloses a towards piece recovery unit can carry out automatic collection to the part ring piece of needs to and also carry out automatic collection to the waste material disk and utilize, reduce artifical collection cost.
Drawings
FIG. 1 is a schematic view of the overall structure of the ring-shaped piece of the electromagnet of the present invention when the ring-shaped piece is attached to the electromagnet I;
FIG. 2 is a schematic view of the overall structure of the ring-piece adsorption electromagnet III and the wafer adsorption electromagnet II of the present invention;
FIG. 3 is a schematic view of the overall structure of the circular sheet falling on the circular sheet recovery conveyor belt according to the present invention;
in the drawings: 1-punching device, 2-iron belt, 3-tray, 4-tray driving mechanism, 5-ring recovery platform, 6-ring recovery platform driving mechanism, 7-ring recovery conveyor belt, 8-wafer recovery conveyor belt, 11-upper die, 12-lower die, 13-wafer male die, 14-ring female die, 15-wafer female die, 16-ring male die, 21-ring, 22-wafer, 23-electromagnet I, 24-electromagnet II, 25-electromagnet III, 61-left rod and 62-right rod.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited to the following embodiments.
The first embodiment is as follows:
see figures 1-3. The punching sheet recovery device comprises a punching sheet device 1, a rack, a tray 3, a tray driving mechanism 4, a ring sheet recovery platform 5, a ring sheet recovery platform driving mechanism 6, a ring sheet recovery conveyor belt 7 and a wafer recovery conveyor belt 8; the punching device 1 comprises an upper die 11 and a lower die 12; the upper die 11 and the lower die 12 are used for matching with the iron belt 2 to punch the iron belt 2 so as to separate the iron belt 2 into a ring piece 21 and a circular piece 22; the lower surface of the upper die 11 is provided with a first electromagnet 23, and the first electromagnet 23 is used for adsorbing the ring sheet 21 to enable the ring sheet 21 to be tightly attached to the upper die 11; a wafer 22 is left on the upper surface of the lower die 12; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, so that the ring sheet 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the lower surface of the tray 3 is provided with a second electromagnet 24 for adsorbing the wafer 22 left on the upper surface of the lower die 12; the tray 3 can be horizontally moved below the ring piece recovery platform 5 and above the wafer recovery conveyor belt 8 under the driving of the tray driving mechanism 4, and the wafer 22 can fall onto the wafer recovery conveyor belt 8 after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 is used for adsorbing the ring pieces 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7. According to the structure, after the upper die 11 and the lower die 12 are matched with each other to punch the iron strip 2, the iron strip 2 is divided into the ring sheets 21 and the circular sheets 22; the ring piece 21 is a required part, and the wafer piece 22 is one of the waste materials after stamping; however, the ring piece 21 and the wafer piece 22 need to be respectively and automatically collected, so that the problem that manual collection wastes time and labor is reduced, and the wafer piece 22 is recycled; an electromagnet I23 is arranged on the lower surface of an upper die 11, and after being stamped down, a ring piece 21 is adsorbed by the electromagnet I23, so that the ring piece 21 is tightly attached to the upper die 11, and a wafer 22 is still left on the upper surface of a lower die 12 after being stamped down; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, and when the electromagnet I23 is demagnetized, the ring sheet 21 falls onto the tray 3 under the action of gravity; the lower surface of the tray 3 is provided with a second electromagnet 24 which can be used for adsorbing the wafer 22 left on the upper surface of the lower die 12; thus, the ring piece 21 and the wafer piece 22 are respectively attached to the upper surface and the lower surface of the tray 3 and are carried away along with the tray 3; the tray driving mechanism 4 drives the tray 3 to horizontally separate from the space between the upper die 11 and the lower die 12, the tray 3 reaches the position below the ring piece recovery platform 5 and the position above the wafer recovery conveyor belt 8, and at the moment, the wafer 22 falls onto the wafer recovery conveyor belt 8 under the action of gravity after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 can be used for adsorbing the ring piece 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring piece 21 and the wafer 22 can be respectively and automatically collected.
Example two:
see figures 1-3. The punching sheet recovery device comprises a punching sheet device 1, a rack, a tray 3, a tray driving mechanism 4, a ring sheet recovery platform 5, a ring sheet recovery platform driving mechanism 6, a ring sheet recovery conveyor belt 7 and a wafer recovery conveyor belt 8; the punching device 1 comprises an upper die 11 and a lower die 12; the upper die 11 and the lower die 12 are used for matching with the iron belt 2 to punch the iron belt 2 so as to separate the iron belt 2 into a ring piece 21 and a circular piece 22; the lower surface of the upper die 11 is provided with a first electromagnet 23, and the first electromagnet 23 is used for adsorbing the ring sheet 21 to enable the ring sheet 21 to be tightly attached to the upper die 11; a wafer 22 is left on the upper surface of the lower die 12; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, so that the ring sheet 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the lower surface of the tray 3 is provided with a second electromagnet 24 for adsorbing the wafer 22 left on the upper surface of the lower die 12; the tray 3 can be horizontally moved below the ring piece recovery platform 5 and above the wafer recovery conveyor belt 8 under the driving of the tray driving mechanism 4, and the wafer 22 can fall onto the wafer recovery conveyor belt 8 after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 is used for adsorbing the ring pieces 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7. According to the structure, after the upper die 11 and the lower die 12 are matched with each other to punch the iron strip 2, the iron strip 2 is divided into the ring sheets 21 and the circular sheets 22; the ring piece 21 is a required part, and the wafer piece 22 is one of the waste materials after stamping; however, the ring piece 21 and the wafer piece 22 need to be respectively and automatically collected, so that the problem that manual collection wastes time and labor is reduced, and the wafer piece 22 is recycled; an electromagnet I23 is arranged on the lower surface of an upper die 11, and after being stamped down, a ring piece 21 is adsorbed by the electromagnet I23, so that the ring piece 21 is tightly attached to the upper die 11, and a wafer 22 is still left on the upper surface of a lower die 12 after being stamped down; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, and when the electromagnet I23 is demagnetized, the ring sheet 21 falls onto the tray 3 under the action of gravity; the lower surface of the tray 3 is provided with a second electromagnet 24 which can be used for adsorbing the wafer 22 left on the upper surface of the lower die 12; thus, the ring piece 21 and the wafer piece 22 are respectively attached to the upper surface and the lower surface of the tray 3 and are carried away along with the tray 3; the tray driving mechanism 4 drives the tray 3 to horizontally separate from the space between the upper die 11 and the lower die 12, the tray 3 reaches the position below the ring piece recovery platform 5 and the position above the wafer recovery conveyor belt 8, and at the moment, the wafer 22 falls onto the wafer recovery conveyor belt 8 under the action of gravity after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 can be used for adsorbing the ring piece 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring piece 21 and the wafer 22 can be respectively and automatically collected.
The upper die 11 comprises a circular sheet male die 13 and a ring sheet female die 14, the ring sheet female die 14 surrounds the circular sheet male die 13, and a spring is arranged in the ring sheet female die 14, so that the ring sheet female die 14 can be sunken and keep the outward ejection trend when being subjected to external force; the lower die 12 comprises a wafer female die 15 and a ring male die 16, the ring male die 16 surrounds the wafer female die 15, and a spring is arranged in the wafer female die 15, so that the wafer female die 15 can be sunken and keep the outward ejection trend when being subjected to external force; when the circular sheet convex die 13 is matched with the circular sheet concave die 15 and the ring sheet convex die 16 is matched with the ring sheet concave die 14, the iron belt 2 is divided into a ring sheet 21 and a circular sheet 22. According to the structure, when the wafer male die 13 punches the iron belt 2 from top to bottom, the wafer female die 15 sinks, the wafer 22 is punched from the iron belt 2, and the wafer female die 15 is reset under the action of the spring, so that the wafer 22 is left on the upper surface of the lower die 12; when the ring male die 16 punches the iron belt 2 relatively from bottom to top, the ring female die 14 sinks down, the ring 21 punches from the iron belt 2, the ring female die 14 resets under the action of a spring, and the ring female die 14 is provided with the electromagnet I23, so that the ring 21 is tightly attached to the upper die 11.
Example three:
see figures 1-3. The punching sheet recovery device comprises a punching sheet device 1, a rack, a tray 3, a tray driving mechanism 4, a ring sheet recovery platform 5, a ring sheet recovery platform driving mechanism 6, a ring sheet recovery conveyor belt 7 and a wafer recovery conveyor belt 8; the punching device 1 comprises an upper die 11 and a lower die 12; the upper die 11 and the lower die 12 are used for matching with the iron belt 2 to punch the iron belt 2 so as to separate the iron belt 2 into a ring piece 21 and a circular piece 22; the lower surface of the upper die 11 is provided with a first electromagnet 23, and the first electromagnet 23 is used for adsorbing the ring sheet 21 to enable the ring sheet 21 to be tightly attached to the upper die 11; a wafer 22 is left on the upper surface of the lower die 12; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, so that the ring sheet 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the lower surface of the tray 3 is provided with a second electromagnet 24 for adsorbing the wafer 22 left on the upper surface of the lower die 12; the tray 3 can be horizontally moved below the ring piece recovery platform 5 and above the wafer recovery conveyor belt 8 under the driving of the tray driving mechanism 4, and the wafer 22 can fall onto the wafer recovery conveyor belt 8 after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 is used for adsorbing the ring pieces 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7. According to the structure, after the upper die 11 and the lower die 12 are matched with each other to punch the iron strip 2, the iron strip 2 is divided into the ring sheets 21 and the circular sheets 22; the ring piece 21 is a required part, and the wafer piece 22 is one of the waste materials after stamping; however, the ring piece 21 and the wafer piece 22 need to be respectively and automatically collected, so that the problem that manual collection wastes time and labor is reduced, and the wafer piece 22 is recycled; an electromagnet I23 is arranged on the lower surface of an upper die 11, and after being stamped down, a ring piece 21 is adsorbed by the electromagnet I23, so that the ring piece 21 is tightly attached to the upper die 11, and a wafer 22 is still left on the upper surface of a lower die 12 after being stamped down; the tray driving mechanism 4 is used for driving the tray 3 to be horizontally inserted between the upper die 11 and the lower die 12, and when the electromagnet I23 is demagnetized, the ring sheet 21 falls onto the tray 3 under the action of gravity; the lower surface of the tray 3 is provided with a second electromagnet 24 which can be used for adsorbing the wafer 22 left on the upper surface of the lower die 12; thus, the ring piece 21 and the wafer piece 22 are respectively attached to the upper surface and the lower surface of the tray 3 and are carried away along with the tray 3; the tray driving mechanism 4 drives the tray 3 to horizontally separate from the space between the upper die 11 and the lower die 12, the tray 3 reaches the position below the ring piece recovery platform 5 and the position above the wafer recovery conveyor belt 8, and at the moment, the wafer 22 falls onto the wafer recovery conveyor belt 8 under the action of gravity after the second electromagnet 24 is demagnetized; the lower surface of the ring piece recovery platform 5 is provided with a third electromagnet 25; the electromagnet III 25 can be used for adsorbing the ring piece 21 on the tray 3 and enabling the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7 under the driving of the ring piece recovery platform driving mechanism 6; after the third electromagnet 25 is demagnetized, the ring piece 21 falls onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring piece 21 and the wafer 22 can be respectively and automatically collected.
The upper die 11 comprises a circular sheet male die 13 and a ring sheet female die 14, the ring sheet female die 14 surrounds the circular sheet male die 13, and a spring is arranged in the ring sheet female die 14, so that the ring sheet female die 14 can be sunken and keep the outward ejection trend when being subjected to external force; the lower die 12 comprises a wafer female die 15 and a ring male die 16, the ring male die 16 surrounds the wafer female die 15, and a spring is arranged in the wafer female die 15, so that the wafer female die 15 can be sunken and keep the outward ejection trend when being subjected to external force; when the circular sheet convex die 13 is matched with the circular sheet concave die 15 and the ring sheet convex die 16 is matched with the ring sheet concave die 14, the iron belt 2 is divided into a ring sheet 21 and a circular sheet 22. According to the structure, when the wafer male die 13 punches the iron belt 2 from top to bottom, the wafer female die 15 sinks, the wafer 22 is punched from the iron belt 2, and the wafer female die 15 is reset under the action of the spring, so that the wafer 22 is left on the upper surface of the lower die 12; when the ring male die 16 punches the iron belt 2 relatively from bottom to top, the ring female die 14 sinks down, the ring 21 punches from the iron belt 2, the ring female die 14 resets under the action of a spring, and the ring female die 14 is provided with the electromagnet I23, so that the ring 21 is tightly attached to the upper die 11.
The ring piece recovery platform driving mechanism 6 comprises a driving motor, a left rod 61 and a right rod 62; the upper ends of the left rod 61 and the right rod 62 are hinged on the ring piece recovery platform 5, and the lower ends of the left rod 61 and the right rod 62 are hinged on the frame, so that four hinged points of the left rod 61 and the right rod 62 form a parallelogram; the driving motor is used for driving the left rod 61 or the right rod 62 to use one of the hinge points as a rotation center, so that the ring piece recycling platform 5 always keeps a horizontal state and moves to the position above the ring piece recycling conveyor belt 7. According to the structure, the hinge point of the upper end of the left rod 61 and the ring piece recovery platform 5, the hinge point of the upper end of the right rod 62 and the ring piece recovery platform 5, the hinge point of the lower end of the left rod 61 and the rack, and the hinge point of the lower end of the right rod 62 and the rack are connected to form a parallelogram, so that the ring piece recovery platform 5 can keep a horizontal state no matter the driving motor drives the left rod 61 or the right rod 62, the electromagnet three 25 on the lower surface of the ring piece recovery platform 5 adsorbs the ring pieces 21 on the tray 3, and the ring pieces 21 are always kept to move horizontally above the ring piece recovery conveyor belt 7; after the third electromagnet 25 is demagnetized, the ring piece 21 accurately falls onto the ring piece recovery conveyor belt 7 under the action of gravity.
The rack is provided with a power supply, a travel switch I, a travel switch II and a travel switch III; the travel switch I is used for controlling a power supply to supply power to the electromagnet I23; the second travel switch is used for controlling a power supply to supply power to the second electromagnet 24; the travel switch III is used for controlling a power supply to supply power to the electromagnet III 25; when the tray 3 is horizontally inserted between the upper die 11 and the lower die 12, the first travel switch is switched off, the first electromagnet 23 is demagnetized, the second travel switch is switched on, and the second electromagnet 24 generates magnetism; when the tray 3 is moved to the position above the wafer recycling conveyor belt 8, the ring piece recycling platform driving mechanism 6 drives the ring piece recycling platform 5 to move to the position above the tray 3, the second travel switch is switched off, the second electromagnet 24 is demagnetized, the third travel switch is switched on, and the third electromagnet 25 generates magnetism; and the ring piece recovery platform driving mechanism 6 drives the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7, the travel switch III is switched off, and the electromagnet III 25 is demagnetized. According to the structure, when the tray 3 is horizontally inserted between the upper die 11 and the lower die 12, the travel switch is turned off, the first electromagnet 23 is demagnetized, and the ring piece 21 falls onto the tray 3 after the first electromagnet 23 is demagnetized; the second travel switch is closed, the second electromagnet 24 generates magnetism, and the second electromagnet 24 adsorbs the wafer 22 left on the upper surface of the lower die 12; when the tray 3 is moved to the position above the wafer recycling conveyor belt 8, the ring piece recycling platform driving mechanism 6 drives the ring piece recycling platform 5 to move to the position above the tray 3, the travel switch II is switched off, the electromagnet II 24 is demagnetized, and at the moment, the wafer 22 falls onto the wafer recycling conveyor belt 8 under the action of gravity after the electromagnet II 24 is demagnetized; the travel switch III is closed, the electromagnet III 25 generates magnetism, and the electromagnet III 25 adsorbs the ring piece 21 on the tray 3; the ring piece recovery platform driving mechanism 6 drives the ring piece recovery platform 5 to move above the ring piece recovery conveyor belt 7, the travel switch III is switched off, the electromagnet III 25 is demagnetized, and after the electromagnet III 25 is demagnetized, the ring pieces 21 fall onto the ring piece recovery conveyor belt 7 under the action of gravity, so that the ring pieces 21 and the wafer 22 can be automatically collected respectively.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (5)
1. Towards piece recovery unit, its characterized in that: the punching device comprises a punching device (1), a rack, a tray (3), a tray driving mechanism (4), a ring piece recovery platform (5), a ring piece recovery platform driving mechanism (6), a ring piece recovery conveyor belt (7) and a wafer recovery conveyor belt (8); the punching device (1) comprises an upper die (11) and a lower die (12); the upper die (11) and the lower die (12) are used for punching the iron belt (2) in a matched manner, so that the iron belt (2) is divided into a ring piece (21) and a circular piece (22); the lower surface of the upper die (11) is provided with a first electromagnet (23), and the first electromagnet (23) is used for adsorbing the ring sheet (21) to enable the ring sheet (21) to be tightly attached to the upper die (11); a wafer (22) is reserved on the upper surface of the lower die (12); the tray driving mechanism (4) is used for driving the tray (3) to be horizontally inserted between the upper die (11) and the lower die (12) so that the first electromagnet (23) is demagnetized and then the ring piece (21) falls onto the tray (3); the lower surface of the tray (3) is provided with a second electromagnet (24) for adsorbing the wafer (22) left on the upper surface of the lower die (12); the tray (3) can be horizontally moved below the ring piece recovery platform (5) and above the wafer recovery conveyor belt (8) under the driving of the tray driving mechanism (4), and the wafer (22) can fall onto the wafer recovery conveyor belt (8) after the electromagnet II (24) is demagnetized; the lower surface of the ring piece recovery platform (5) is provided with a third electromagnet (25); the electromagnet III (25) is used for adsorbing the ring piece (21) on the tray (3) and enabling the ring piece recovery platform (5) to move above the ring piece recovery conveyor belt (7) under the driving of the ring piece recovery platform driving mechanism (6); and after the electromagnet III (25) is demagnetized, the ring sheets (21) fall onto the ring sheet recycling conveyor belt (7).
2. The punch recovery device of claim 1, wherein: the upper die (11) comprises a circular convex die (13) and a ring concave die (14), the ring concave die (14) surrounds the circular convex die (13), and a spring is arranged in the ring concave die (14), so that the ring concave die (14) can be sunken and keep the outward ejection trend when being subjected to external force; the lower die (12) comprises a wafer female die (15) and a ring male die (16), the ring male die (16) surrounds the wafer female die (15), and a spring is arranged in the wafer female die (15), so that the wafer female die (15) can be sunken and keep the outward ejection trend when being subjected to external force; the circular sheet male die (13) is matched with the circular sheet female die (15), and when the circular sheet male die (16) is matched with the circular sheet female die (14), the iron belt (2) is divided into a circular sheet (21) and a circular sheet (22).
3. The punch recovery device of claim 1, wherein: tray actuating mechanism (4) are the telescopic link, and the flexible end and tray (3) of telescopic link are fixed, and the stiff end of telescopic link is fixed in the frame, and telescopic link control tray (3) level is stretched into or is left between mould (11) and lower mould (12).
4. The punch recovery device of claim 3, wherein: the ring piece recovery platform driving mechanism (6) comprises a driving motor, a left rod (61) and a right rod (62); the upper ends of the left rod (61) and the right rod (62) are hinged to the ring piece recovery platform (5), and the lower ends of the left rod and the right rod are hinged to the rack, so that four hinged points of the left rod (61) and the right rod (62) form a parallelogram; the driving motor is used for driving the left rod (61) or the right rod (62) to move to the position above the ring piece recycling conveyor belt (7) by taking one of hinge points as a rotating center so that the ring piece recycling platform (5) always keeps a horizontal state.
5. The punch recovery device of claim 4, wherein: the rack is provided with a power supply, a travel switch I, a travel switch II and a travel switch III; the travel switch I is used for controlling a power supply to supply power to the electromagnet I (23); the second travel switch is used for controlling a power supply to supply power to the second electromagnet (24); the travel switch III is used for controlling a power supply to supply power to the electromagnet III (25); when the tray (3) is horizontally inserted between the upper die (11) and the lower die (12), the first travel switch is switched off, the first electromagnet (23) is demagnetized, the second travel switch is switched on, and the second electromagnet (24) generates magnetism; when the tray (3) is moved to the position above the wafer recovery conveyor belt (8), the ring piece recovery platform driving mechanism (6) drives the ring piece recovery platform (5) to move to the position above the tray (3), the second travel switch is switched off, the second electromagnet (24) is demagnetized, the third travel switch is switched on, and the third electromagnet (25) generates magnetism; and the ring piece recovery platform driving mechanism (6) drives the ring piece recovery platform (5) to move above the ring piece recovery conveyor belt (7), the travel switch III is switched off, and the electromagnet III (25) is demagnetized.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021373429.2U CN213104002U (en) | 2020-07-14 | 2020-07-14 | Punching sheet recovery device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021373429.2U CN213104002U (en) | 2020-07-14 | 2020-07-14 | Punching sheet recovery device |
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| CN213104002U true CN213104002U (en) | 2021-05-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111974867A (en) * | 2020-07-14 | 2020-11-24 | 兰州电机股份有限公司 | Punching sheet recovery device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111974867A (en) * | 2020-07-14 | 2020-11-24 | 兰州电机股份有限公司 | Punching sheet recovery device |
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