CN213093194U

CN213093194U - Ceramic steam cavity radiator

Info

Publication number: CN213093194U
Application number: CN202021848453.7U
Authority: CN
Inventors: 铁鹏; 姚晓蕾; 井纬; 张忠政; 于世杰
Original assignee: China Electronics Technology Group Corp No 16 Institute
Current assignee: China Electronics Technology Group Corp No 16 Institute; CETC 16 Research Institute
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-04-30
Anticipated expiration: 2030-08-28

Abstract

A ceramic steam cavity radiator comprises two substrates and side walls, wherein one of the two substrates is used as a top wall of a shell, and the other substrate is used as a bottom wall of the shell; the two substrates and the side wall are integrally welded to form a shell structure containing a closed cavity, and liquid working media are filled in the shell; the substrate is made of a ceramic material; the side wall is made of metal copper. The utility model is compatible with the technological requirements of the semiconductor production process, and has wider application in the aspect of heat dissipation of devices; the steam cavity radiator and the component can be directly welded, so that hot spot heat of the component can be diffused quickly; the ceramic steam cavity replaces the traditional pcb layer, shortens the external heat transfer path of components and parts, and has more outstanding heat dissipation capacity. The surface of the ceramic steam cavity radiator can be patterned, so that the integrated integration of heat dissipation and component functions is realized, the heat dissipation capacity of the components can be greatly improved, and the overall packaging size can be reduced; meanwhile, a feasible heat dissipation solution is provided for the new fields of manufacturing of three-dimensional stacked chips and the like.

Description

Ceramic steam cavity radiator

Technical Field

The utility model relates to a heat dissipation technical field of chip, concretely relates to pottery steam chamber radiator.

Background

In recent years, as mobile electronic devices and equipment are rapidly developed in the direction of miniaturization, compactness and high performance, under the condition of limited space, due to the lack of external heat transfer enhancement means, the heat of the equipment is finally released to the environment by means of natural convection or radiation on the surface. It becomes critical to spread the heat quickly across the entire heat-dissipating surface at the hot spots with high heat flux density inside these devices. Based on this, the united states department of Defense Advanced Research Program Agency (DARPA) subsidized the work of research on related high-efficiency thermal diffusion materials to solve thermal problems caused by excessive hot spot temperatures.

For the thermal expansion technology of mobile electronic devices, the conventional thermal expansion methods mainly include metal sheet, graphite sheet, and vapor chamber technologies. Among them, the vapor chamber technology is attracting much attention because of its high thermal diffusion capability and the ability to effectively eliminate the "hot spot" problem generated by the electronic chip. Influenced by technical conditions and process flows. The commonly used steam cavity radiator is made of metal base materials, so that the steam cavity radiator must be arranged outside key devices such as chips, the radiating path is long, the heat expansion capability has great limitation, and a high-efficiency embedded heat diffusion technology needs to be developed.

It can be seen that currently, heat from the chip and TR assembly needs to be transferred through the encapsulated module to the module housing and then removed through a heat sink, a vapor cavity heat sink being one of the options for external heat expansion. However, the existing vapor cavity heat sink is prepared based on a metal substrate (such as copper, aluminum, etc.), and due to its material, the coefficient of thermal expansion of the metal-based vapor cavity heat sink is not matched with that of the core device (such as a bare chip, a semiconductor device, etc.) in the package module, so that the metal-based vapor cavity heat sink can only be installed outside the package module to dissipate heat, the heat transfer path is long, the process thermal resistance is large, and the difficulty of heat dissipation and the limitation of device use are increased.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of pottery steam chamber radiator can with components and parts direct welding such as naked chip, but the radiator surface is graphical simultaneously, realizes the wiring requirement, provides the demand of power, communication for chip work.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a ceramic steam cavity radiator comprises two substrates and side walls, wherein one of the two substrates is used as a top wall of a shell, and the other substrate is used as a bottom wall of the shell;

the two substrates and the side wall are integrally welded to form a shell structure containing a closed cavity, and liquid working media are filled in the shell;

the substrate is made of a ceramic material;

the side wall is made of metal copper.

Further, still include the support column, the support column is vertically arranged inside the casing.

Further, the liquid working medium is water or alcohol.

Furthermore, a heat sink is fixed outside the top of the shell, and a heat source is fixed at the bottom of the top of the shell.

Furthermore, the inner surface of the substrate is plated with nickel firstly and then plated with copper.

Furthermore, the outer surface of the substrate is provided with a patterned wiring.

According to the above technical scheme, the utility model discloses a ceramic steam chamber radiator has following beneficial effect:

1. the utility model prepares the steam cavity radiator by ceramic material, can be compatible with the technological requirements of the semiconductor production process, and has wider application in the aspect of heat dissipation of devices;

2. the utility model can directly weld the steam cavity radiator and the components, which is more beneficial to quickly diffuse the hot spot heat of the components; the ceramic steam cavity replaces the traditional pcb layer, shortens the external heat transfer path of components and parts, and has more outstanding heat dissipation capacity.

3. The surface of the ceramic steam cavity radiator is patterned, so that the integrated integration of heat dissipation and component functions is realized, the heat dissipation capacity of the components can be greatly improved, and the overall packaging size can be reduced; meanwhile, a feasible heat dissipation solution is provided for the new fields of manufacturing of three-dimensional stacked chips and the like.

The utility model discloses a high temperature burns ceramic (AlN pottery) altogether as the substrate in steam chamber, and its advantage is embodied at: the thermal expansion coefficient of the ceramic is matched with that of a core device, and the ceramic can be directly welded with the core device without causing the problem of thermal mismatch; secondly, the steam cavity is in direct contact with the core device, the heat transfer path is short, the heat diffusion capacity is strong, the process thermal resistance is small, and the heat dissipation difficulty is reduced; and thirdly, the high-temperature co-fired ceramic is a carrier of the circuit, the ceramic is used as a base material of the steam cavity, the surface of the steam cavity radiator can be used as a carrier of the circuit, the integration of power supply, communication and heat dissipation is realized, and the system is more compact and has stronger function.

To sum up, the utility model discloses regard as the steam chamber substrate with pottery to can carry out single face or two-sided graphical wiring, with this with heating element direct mount such as chip (TR) at ceramic steam chamber surface, the wiring realization on function accessible ceramic steam chamber surface such as power supply and communication of components and parts such as chip (TR). This has shortened the heat dissipation route on the one hand, has promoted the radiating effect, and on the other hand has realized the integrated design of heat dissipation and function, can prepare more compact encapsulation module.

Drawings

Fig. 1 is a schematic sectional structure diagram of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

As shown in fig. 1, the ceramic vapor chamber heat sink of the present invention comprises two base plates 1 and a side wall 2, wherein one of the two base plates 1 is used as a top wall of the housing, and the other is used as a bottom wall of the housing;

the two substrates 1 and the side wall 2 are integrally welded to form a shell structure containing a closed cavity, and liquid working media are filled in the shell;

the substrate 1 is made of a ceramic material;

the side wall 2 is made of metal copper.

The shell is characterized by further comprising a supporting column 3, wherein the supporting column 3 is longitudinally arranged inside the shell.

The liquid working medium is water or alcohol.

The heat sink 5 is fixed to the outside of the top of the housing and the heat source 4 is fixed to the outside of the top of the housing.

The inner surface of the substrate 1 is plated with nickel first and then plated with copper.

Outer surface wiring of the substrate 1

Specifically, the substrate 1 is made of a ceramic material (AlN ceramic) with high thermal conductivity, the frame 2 and the support columns 3 are made of metal copper, the substrate 1 and the frame 2 are integrally welded to form a whole steam cavity frame, and a liquid working medium is filled in the whole steam cavity frame to prepare the efficient steam cavity radiator.

In fig. 1, the reference numeral 4 denotes a heat source, which is a bare chip (TR and other similar functional components) with complete functions, the ceramic vapor cavity radiator is wired on one side (or two sides), and the bare chip is directly mounted on the surface of the ceramic vapor cavity; the other side of the ceramic steam cavity uses a heat sink for heat dissipation.

The embodiment of the utility model provides a ceramic steam chamber radiator can carry out single face or two-sided graphical wiring to this is realized the wiring on power supply and communication etc. function accessible ceramic steam chamber surface of components and parts such as chip (TR) at ceramic steam chamber surface with heating element lug weld such as chip (TR). The ceramic steam cavity radiator integrates functions and heat dissipation.

The embodiment of the utility model provides a use high temperature to burn ceramic altogether as the substrate in steam chamber, preparation ceramic steam chamber radiator. The novel ceramic steam cavity radiator adopts ceramic with high heat conductivity and proper thermal expansion coefficient as a base material, and the framework of the novel ceramic steam cavity radiator is consistent with that of the original metal steam cavity.

The utility model discloses a realization of the matching compatibility and the technology of different materials. The steam cavity radiator shell is made of ceramic materials, and the internal support columns and the peripheral frame are made of metal materials.

In summary, the utility model discloses a pottery steam chamber radiator possesses characteristics down:

1. the heat dissipation, the integrated realization of function and the preparation of ceramic steam chamber.

2. The surface of the steam cavity radiator can be subjected to graphical wiring treatment, and the power and communication requirements are provided for the work of a bare chip; meanwhile, the steam cavity can effectively solve the problem of hot waste heat emission during the operation of the bare chip, and has short heat emission path and excellent performance.

3. The base material of the steam cavity is high-temperature co-fired ceramic.

4. The upper and lower bottom plates of the steam cavity are made of ceramic, the frame is made of metal copper, and the upper and lower bottom plates and the frame are welded.

5. The single side of the ceramic bottom plate is patterned, and the other side of the ceramic bottom plate is plated with nickel and then plated with copper, so that the welding of the ceramic bottom plate and the copper frame is ensured.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A ceramic steam chamber radiator, its characterized in that:

the LED display panel comprises two substrates (1) and side walls (2), wherein one substrate (1) is used as a top wall of a shell, and the other substrate (1) is used as a bottom wall of the shell;

the two substrates (1) and the side wall (2) are integrally welded to form a shell structure containing a closed cavity, and liquid working media are filled in the shell;

the substrate (1) is prepared from a ceramic material;

the side wall (2) is made of metal copper.

2. The ceramic vapor chamber heat sink of claim 1, wherein: the shell is characterized by further comprising a supporting column (3), wherein the supporting column (3) is longitudinally arranged inside the shell.

3. The ceramic vapor chamber heat sink of claim 2, wherein: the liquid working medium is water or alcohol.

4. The ceramic vapor chamber heat sink of claim 3, wherein: the heat sink is fixed outside the top of the shell, and the heat source is fixed outside the bottom of the shell.

5. The ceramic vapor chamber heat sink of claim 1, wherein: the inner surface of the substrate (1) is sequentially nickel and copper from inside to outside.

6. The ceramic vapor chamber heat sink of claim 1, wherein: the outer surface of the substrate (1) is provided with a patterned wiring.