CN213092250U - Internet of things data processing device with high reaction speed - Google Patents
Internet of things data processing device with high reaction speed Download PDFInfo
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- CN213092250U CN213092250U CN202022426605.0U CN202022426605U CN213092250U CN 213092250 U CN213092250 U CN 213092250U CN 202022426605 U CN202022426605 U CN 202022426605U CN 213092250 U CN213092250 U CN 213092250U
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Abstract
The utility model relates to a thing networking device technical field specifically discloses a fast thing networking data processing apparatus of reaction rate, the on-line screen storage device comprises a base, the top fixed mounting of base has branch, the top fixed mounting of base has the support, the top fixed mounting of branch has the casing, the top fixed mounting of casing has the collar, the inside fixed mounting of collar has the sealing ring, the inside fixed mounting of sealing ring has the semiconductor refrigeration piece, the inside fixed mounting of collar has the protection axle that is located the sealing ring top, the inside fixed mounting of casing has the baffle, the inside fixed mounting of baffle has the heat exchange tube. This thing networking data processing device that reaction rate is fast has the advantage that reaction rate is fast, has solved thing networking data processing device when using, often because the treater radiating effect is not good, leads to the condition that the treater operation is slow, seriously still can lead to the problem of system's crash.
Description
Technical Field
The utility model relates to a thing networking device technical field specifically is a thing networking data processing apparatus that reaction rate is fast.
Background
The internet of things is an information carrier based on the internet, a traditional telecommunication network and the like, which enables all common physical objects capable of being independently addressed to form an interconnected and intercommunicated network, and is defined by connecting any object with the internet according to an agreed protocol through information sensing equipment such as radio frequency identification, infrared sensors, global positioning systems, laser scanners and the like, the network carries out information exchange and communication to realize intelligent identification, positioning, tracking, monitoring and management of articles.
In the prior art, when the data processing device of the internet of things is used, the situation that the processor runs slowly is often caused due to poor heat dissipation effect of the processor, and the system crash and the like are seriously caused, so that the data processing device of the internet of things with a high reaction speed is provided to solve the problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fast thing networking data processing apparatus of reaction rate to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
an Internet of things data processing device with high reaction speed comprises a base, wherein a supporting rod is fixedly mounted at the top of the base, a support is fixedly mounted at the top of the base, a shell is fixedly mounted at the top of the supporting rod, a mounting ring is fixedly mounted at the top of the shell, a sealing ring is fixedly mounted inside the mounting ring, a semiconductor refrigerating sheet is fixedly mounted inside the sealing ring, a protective shaft positioned above the sealing ring is fixedly mounted inside the mounting ring, a partition plate is fixedly mounted inside the shell, a heat exchange tube is fixedly mounted inside the partition plate, a refrigerant cavity communicated with the interior of the shell is formed inside the mounting ring, a heat dissipation cavity positioned below the partition plate is formed inside the shell, a mounting plate positioned inside the heat dissipation cavity is fixedly mounted inside the shell, and a processor is fixedly mounted at one end, away from the shell, of the mounting plate, the base is internally provided with an air hole.
As a further aspect of the present invention: the supporting rods are distributed at equal intervals and are positioned on the outer side of the supporting seat.
As a further aspect of the present invention: the supports are distributed equidistantly, and the tops of the supports are in contact with the processor.
As a further aspect of the present invention: the protection shafts are distributed at equal intervals, and a gap is arranged between every two adjacent protection shafts.
As a further aspect of the present invention: the air holes are distributed at equal intervals and are positioned below the processor.
As a further aspect of the present invention: the heat exchange tube is communicated with the refrigerant cavity, and the heat exchange tube is positioned above the processor.
As a further aspect of the present invention: the base is not contacted with the shell, and the bottom of the shell is open.
Compared with the prior art, the beneficial effects of the utility model are that:
when the direct current electric heating processor is used, the semiconductor refrigerating sheet is electrified, the Peltier effect of the semiconductor materials is utilized, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, the refrigerating purpose can be realized, the semiconductor refrigerating sheet is used for refrigerating a refrigerant in a refrigerant cavity, the refrigerant is used for cooling and radiating air flow in a radiating cavity through a heat exchange tube, cold air flow in the radiating cavity is subjected to heat exchange with the processor to carry out heat exchange on the processor, so that the processor is cooled, the working temperature of the processor is reduced, the high-temperature work of the processor is avoided, and the purpose of high reaction speed is achieved.
Drawings
FIG. 1 is a schematic structural diagram of an Internet of things data processing device with a fast response speed;
FIG. 2 is a sectional view of the data processing device of the Internet of things with fast response speed;
fig. 3 is a structural plan view of a processor in an internet of things data processing device with a fast response speed.
In the figure: 1. a base; 2. a strut; 3. a housing; 4. a mounting ring; 5. a guard shaft; 6. a semiconductor refrigeration sheet; 7. a seal ring; 8. a refrigerant cavity; 9. air holes; 10. a support; 11. a processor; 12. mounting a plate; 13. a heat exchange pipe; 14. a partition plate; 15. and a heat dissipation cavity.
Detailed Description
Referring to fig. 1 to 3, in the embodiment of the present invention, an internet of things data processing device with a fast response speed includes a base 1, a support rod 2 is fixedly installed on the top of the base 1, a support 10 is fixedly installed on the top of the base 1, the support rod 2 is distributed equidistantly, the support rod 2 is located outside the support 10, a housing 3 is fixedly installed on the top of the support rod 2, a mounting ring 4 is fixedly installed on the top of the housing 3, a sealing ring 7 is fixedly installed inside the mounting ring 4, a semiconductor refrigeration sheet 6 is fixedly installed inside the sealing ring 7, a protection shaft 5 is fixedly installed inside the mounting ring 4 and located above the sealing ring 7, the protection shafts 5 are distributed equidistantly, a gap is formed between two adjacent protection shafts 5, a partition plate 14 is fixedly installed inside the housing 3, a heat exchange tube 13 is fixedly installed inside the partition plate 14, a refrigerant cavity 8 communicated with the interior of the housing 3 is formed, the inside of the shell 3 is provided with a heat dissipation cavity 15 positioned below the partition plate 14, the inside of the shell 3 is fixedly provided with a mounting plate 12 positioned inside the heat dissipation cavity 15, one end of the mounting plate 12 far away from the shell 3 is fixedly provided with a processor 11, a heat exchange tube 13 is communicated with the refrigerant cavity 8, the heat exchange tube 13 is positioned above the processor 11, the support 10 is distributed equidistantly, the top of the support 10 is contacted with the processor 11, the inside of the base 1 is provided with air holes 9, the air holes 9 are distributed equidistantly, the air holes 9 are positioned below the processor 11, the base 1 is not contacted with the shell 3, the bottom of the shell 3 is in an open shape, when the refrigerator is used, the semiconductor refrigeration sheet 6 is electrified, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so, semiconductor refrigeration piece 6 refrigerates the inside refrigerant in refrigerant chamber 8, and the refrigerant cools down the heat dissipation through heat exchange tube 13 to the inside air current in heat dissipation chamber 15, and the inside cold air current in heat dissipation chamber 15 is exchanging heat with treater 11, carries out the heat exchange to treater 11 to dispel the heat to treater 11, make the operating temperature who reduces treater 11, avoid treater 11 high temperature work, thereby reached the fast purpose of reaction rate.
The utility model discloses a theory of operation is: when in use, the semiconductor refrigerating sheet 6 is electrified, and when direct current passes through a couple formed by connecting two different semiconductor materials in series by utilizing the Peltier effect of the semiconductor materials, the semiconductor refrigerating sheet 6 refrigerates the refrigerant in the refrigerant cavity 8, the refrigerant cools the air flow in the heat dissipation cavity 15 through the heat exchange tube 13, the cold air flow in the heat dissipation cavity 15 exchanges heat with the processor 11, heat exchange is performed on the processor 11, thereby dissipating heat from the processor 11, lowering the operating temperature of the processor 11, avoiding high-temperature operation of the processor 11, thereby reached the purpose that the reaction rate is fast, solved thing networking data processing device when using, often because processor 11 radiating effect is not good, lead to the condition that processor 11 moves slowly, seriously still can lead to the problem of system's crash.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The Internet of things data processing device with high reaction speed comprises a base (1) and is characterized in that a supporting rod (2) is fixedly mounted at the top of the base (1), a support (10) is fixedly mounted at the top of the base (1), a shell (3) is fixedly mounted at the top of the supporting rod (2), a mounting ring (4) is fixedly mounted at the top of the shell (3), a sealing ring (7) is fixedly mounted inside the mounting ring (4), a semiconductor refrigerating sheet (6) is fixedly mounted inside the sealing ring (7), a protective shaft (5) positioned above the sealing ring (7) is fixedly mounted inside the mounting ring (4), a partition plate (14) is fixedly mounted inside the shell (3), a heat exchange tube (13) is fixedly mounted inside the partition plate (14), and a refrigerant cavity (8) communicated with the inside of the shell (3) is formed inside the mounting ring (4), the heat dissipation chamber (15) that are located baffle (14) below are seted up to the inside of casing (3), the inside fixed mounting of casing (3) has mounting panel (12) that are located heat dissipation chamber (15) inside, the one end fixed mounting that casing (3) were kept away from in mounting panel (12) has treater (11), gas pocket (9) are seted up to the inside of base (1).
2. The internet of things data processing device with high reaction speed according to claim 1, wherein the supporting rods (2) are distributed equidistantly, and the supporting rods (2) are located on the outer side of the support (10).
3. The internet of things data processing device with high response speed as claimed in claim 1, wherein the supports (10) are distributed equidistantly, and the top of the support (10) is in contact with the processor (11).
4. The Internet of things data processing device with the fast response speed as claimed in claim 1, wherein the protection shafts (5) are distributed equidistantly, and a gap is formed between every two adjacent protection shafts (5).
5. The internet of things data processing device with high response speed as claimed in claim 1, wherein the air holes (9) are distributed equidistantly, and the air holes (9) are located below the processor (11).
6. The internet of things data processing device with high reaction speed as recited in claim 1, wherein the heat exchange tube (13) is communicated with the refrigerant cavity (8), and the heat exchange tube (13) is located above the processor (11).
7. The internet of things data processing device with high reaction speed according to claim 1, wherein the base (1) and the shell (3) are not in contact with each other, and the bottom of the shell (3) is open.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022426605.0U CN213092250U (en) | 2020-10-28 | 2020-10-28 | Internet of things data processing device with high reaction speed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022426605.0U CN213092250U (en) | 2020-10-28 | 2020-10-28 | Internet of things data processing device with high reaction speed |
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| CN213092250U true CN213092250U (en) | 2021-04-30 |
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| CN202022426605.0U Active CN213092250U (en) | 2020-10-28 | 2020-10-28 | Internet of things data processing device with high reaction speed |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
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2020
- 2020-10-28 CN CN202022426605.0U patent/CN213092250U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
| CN113923938B (en) * | 2021-09-06 | 2023-03-24 | 联想(北京)有限公司 | Electronic device |
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Effective date of registration: 20230613 Address after: 710016 Room 601, Unit 1, Building 5, Beichen Village, Xujiawan Street, Weiyang District, Xi'an City, Shaanxi Province Patentee after: Shaanxi Guanjing Information Technology Co.,Ltd. Address before: 510000 room 212, scientific research office building, 63 Punan Road, Huangpu District, Guangzhou City, Guangdong Province Patentee before: Guangzhou qideyou Chengmei Information Technology Development Co.,Ltd. |