CN213073222U - Composite multilayer PCB - Google Patents

Composite multilayer PCB Download PDF

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Publication number
CN213073222U
CN213073222U CN202022312308.3U CN202022312308U CN213073222U CN 213073222 U CN213073222 U CN 213073222U CN 202022312308 U CN202022312308 U CN 202022312308U CN 213073222 U CN213073222 U CN 213073222U
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China
Prior art keywords
insulating plate
pcb
telescopic column
telescopic
fixedly connected
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CN202022312308.3U
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Chinese (zh)
Inventor
夏增强
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Fujian Kayfung Electronic Co ltd
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Fujian Kayfung Electronic Co ltd
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Priority to CN202022312308.3U priority Critical patent/CN213073222U/en
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Abstract

The utility model discloses a composite multilayer PCB, which relates to the technical field of PCB and comprises a first insulating plate, wherein the holes at the four corners of the first insulating plate are provided with guide holes, a sliding plate is movably arranged at the outer side of the first insulating plate, a fixed rod is arranged on a buckle between the sliding plates, a fixture block is fixedly connected with the two sides of the fixed rod, a static electricity releasing block is arranged on the first insulating plate in an electrical connection way, a second insulating plate is arranged at the lower end of the first insulating plate, the first insulating plate and the second insulating plate are fixedly connected through a telescopic rod, the telescopic rod comprises an upper telescopic column and a lower telescopic column, and a water absorbing layer is arranged at the inner side of the lower telescopic column, the normal use of the PCB is ensured.

Description

Composite multilayer PCB
Technical Field
The utility model relates to a PCB board technical field specifically is a compound multilayer PCB board.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components.
After the composite multilayer PCB on the market is used for a long time at present, excessive dust accumulation on the PCB at the inner side can cause the open circuit and short circuit of the PCB, influence the normal use of the PCB, cause data loss and damage of electrical components; and the existing composite multilayer PCB is manufactured by directly welding a plurality of PCBs, elements on the PCB are directly eliminated when the arrangement of the elements is wrong, the elements on the inner layer PCB cannot be overhauled, and the reliability is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a compound multilayer PCB board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a compound multilayer PCB board, includes first insulation board, four corner end trompils of first insulation board are provided with the guide hole, first insulation board outside movable mounting is provided with the sliding plate, and the buckle is provided with the dead lever between the sliding plate to dead lever both sides fixed connection is provided with the fixture block, first insulation board electric connection is provided with the electrostatic discharge piece, first insulation board lower extreme is provided with the second insulation board, and just first insulation board passes through telescopic link fixed connection with the second insulation board, the telescopic link includes flexible post and lower flexible post, and the flexible post inboard is provided with the layer that absorbs water down, the second insulation board is provided with the third insulation board through telescopic link fixed connection, and the third insulation board is provided with the fourth insulation board through telescopic link fixed connection, the bonding in the first insulation board outside is provided with the dust absorption pad.
Preferably, the upper part of the lower telescopic column is wide and the lower part of the lower telescopic column is narrow, and the radius of the upper telescopic column is equal to the radius of the bottom of the lower telescopic column.
Preferably, go up flexible post outside opening and be provided with a plurality of round holes, and the even equidistance distribution of round hole.
Preferably, strip-shaped grains are uniformly arranged on the outer side of the clamping block.
Preferably, dust absorption pads are adhered to the outer sides of the first insulating plate, the second insulating plate, the third insulating plate and the fourth insulating plate.
Preferably, the outer side of the dust absorption pad is closely attached to the sliding plate.
Preferably, the telescopic rod is 1mm in telescopic length.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model provides a compound multilayer PCB board, through setting up sliding plate and dead lever, can live four layers of totally enclosed parcel of PCB board, prevent that the dust from getting into the PCB inboard layer between the PCB board, thereby avoid the dust to accumulate too much and cause opening circuit and the short circuit of PCB board, guaranteed the normal use of PCB board.
(2) The utility model provides a compound multilayer PCB board, through setting up the telescopic link, can pull open the telescopic link when PCB board winding displacement, makes things convenient for operating personnel winding displacement, when needs overhaul the electrical components of PCB inboard layer, equally pull open the telescopic link, makes things convenient for the maintainer to avoid the PCB board to damage and make direct useless processing, the reduction in production cost, the good reliability.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the fixing rod of the present invention;
FIG. 3 is a schematic view of the overall inner side structure of the present invention;
fig. 4 is a schematic view of the telescopic rod structure of the present invention.
In the figure: 1. a guide hole; 2. a first insulating plate; 3. a sliding plate; 4. fixing the rod; 401. a clamping block; 5. an electrostatic discharge block; 6. a dust absorption pad; 7. a second insulating plate; 8. a telescopic rod; 801. an upper telescopic column; 802. a lower telescopic column; 803. a water-absorbing layer; 9. third insulating plate, 10 fourth insulating plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that, in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Further, it will be appreciated that the dimensions of the various elements shown in the figures are not drawn to scale, for ease of description, and that the thickness or width of some layers may be exaggerated relative to other layers, for example.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined or illustrated in one figure, it will not need to be further discussed or illustrated in detail in the description of the following figure.
As shown in fig. 1-4, the utility model provides a technical solution: a composite multi-layer PCB board comprises a first insulating board 2, wherein guide holes 1 are arranged on the openings of four corner ends of the first insulating board 2, a sliding plate 3 is movably arranged on the outer side of the first insulating plate 2, a fixed rod 4 is buckled between the sliding plates 3, and the two sides of the fixed rod 4 are fixedly connected with and provided with a fixture block 401, the first insulating plate 2 is electrically connected with and provided with an electrostatic discharge block 5, the lower end of the first insulating plate 2 is provided with a second insulating plate 7, and the first insulating plate 2 and the second insulating plate 7 are fixedly connected through a telescopic rod 8, the telescopic rod 8 comprises an upper telescopic column 801 and a lower telescopic column 802, and the inner side of the lower telescopic column 802 is provided with a water absorbing layer 803, the second insulating plate 7 is fixedly connected with a third insulating plate 9 through a telescopic rod 8, and the third insulating plate 9 is fixedly connected with a fourth insulating plate 10 through a telescopic rod 8, and the dust absorption pad 6 is adhered to the outer side of the first insulating plate 2.
Referring to fig. 4, it is narrow under wide on the flexible post 802 down, and goes up flexible post 801 radius and equal to flexible post 802 bottom radius down, it is provided with a plurality of round holes to go up flexible post 801 outside opening, and the even equidistance of round hole distributes, through this kind of design, goes up flexible post 801 and can retract completely in flexible post 802 down to reduce the gap between each insulation board 6, and then reduce the dust and get into the PCB inboard layer from the gap of PCB board, winding displacement between the PCB board can follow the PCB board that gets into other layers in flexible post 801's the round hole, makes things convenient for the winding displacement.
Referring to fig. 2, the outer sides of the fixture blocks 401 are uniformly provided with strip-shaped lines, so that the friction force between the sliding plate 3 and the fixture blocks 401 on the two sides of the fixing rod 4 can be increased, the sliding plate 3 and the fixture blocks 401 are prevented from falling off, dust is prevented from entering the inner layers of the PCB plates from gaps among the PCB plates, and the operation reliability of elements on the PCB plates is further improved.
Referring to fig. 3, the dust absorption pad 6 is adhered to the outer sides of the first insulation plate 2, the second insulation plate 7, the third insulation plate 9 and the fourth insulation plate 10, and through the design, the dust absorption pad 6 can absorb dust entering from the guide hole 1, so that the dust is prevented from entering the inner layer of the PCB, the phenomenon that the dust is accumulated too much to cause the open circuit and the short circuit of the PCB is avoided, and the normal use of the PCB is ensured
Referring to fig. 1 and 3, the outer side of the dust absorption pad 6 is precisely attached to the sliding plate 3, and by means of the design, the friction force borne by the sliding plate 3 is further increased, and the sliding plate 3 is prevented from falling off, so that dust is prevented from entering the inner layer of the PCB from gaps among the PCBs, and elements are prevented from being broken and short-circuited, and the reliability is high.
Referring to fig. 1 and 4, the telescopic rod 8 has a telescopic length of 1mm, and by adopting the design, the possibility of dust entering the inner layer of the PCB from the gap between the PCBs is further reduced, and the dust entering resistance of the PCB is enhanced.
The working principle is as follows: when the PCB is used, firstly, the PCB is ensured to be in an indoor environment without dust or with little dust, then the PCB is placed on a horizontal workbench for component welding and circuit arrangement, four layers of PCBs can be completely and hermetically wrapped by arranging the sliding plate 3 and the fixed rod 4, dust is prevented from entering the inner layer of the PCB from the space between the PCBs, the phenomenon that the PCB is broken and short-circuited due to excessive dust accumulation is avoided, the normal use of the PCB is ensured, the strip-shaped lines on the outer side of the clamping block 401 can increase the friction force between the sliding plate 3 and the clamping block 401 on two sides of the fixed rod 4, the sliding plate 3 and the clamping block 401 are prevented from falling off, thereby the dust is prevented from entering the inner layer of the PCB from the gap between the PCBs, the running reliability of components on the PCBs is further improved, and by arranging the telescopic rod 8 with the telescopic length of 1mm, the telescopic rod 8 can be pulled open when the PCBs, make things convenient for the operating personnel winding displacement, when needs overhaul the electrical components of PCB inboard layer, pull open telescopic link 8 equally, make things convenient for the maintainer to overhaul, thereby avoid the PCB board to damage and make direct useless processing, the production cost is reduced, high reliability, and further reduce the possibility that the dust gets into the PCB inboard layer from the gap between the PCB board, the anti dust of PCB board gets into the ability, simultaneously through setting up flexible post 802 under wide narrow down and be provided with the flexible post 801 on a plurality of round holes, go up flexible post 801 can be completely in flexible post 802 under the indentation, thereby reduce the gap between each insulation board, and then reduce the dust and get into the PCB inboard layer from the gap of PCB board, winding displacement between the PCB board can follow the PCB board that gets into other layers in flexible post 801's the round hole, make things convenient for the winding displacement.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A composite multilayer PCB board, includes first insulating sheet (2), its characterized in that: the hole is arranged at four corner ends of the first insulating plate (2) and is provided with a guide hole (1), the outer side of the first insulating plate (2) is movably provided with a sliding plate (3), a fixing rod (4) is arranged between the sliding plates (3) in a buckling mode, two sides of the fixing rod (4) are fixedly connected and provided with a clamping block (401), the first insulating plate (2) is electrically connected and provided with an electrostatic discharge block (5), the lower end of the first insulating plate (2) is provided with a second insulating plate (7), the first insulating plate (2) and the second insulating plate (7) are fixedly connected through a telescopic rod (8), the telescopic rod (8) comprises an upper telescopic column (801) and a lower telescopic column (802), the inner side of the lower telescopic column (802) is provided with a water absorption layer (803), the second insulating plate (7) is fixedly connected through the telescopic rod (8) and is provided with a third insulating plate (9), and the third insulating plate (9) is fixedly connected through the telescopic rod (8, and a dust absorption pad (6) is adhered to the outer side of the first insulating plate (2).
2. A composite multi-layer PCB panel as claimed in claim 1, wherein: the upper part of the lower telescopic column (802) is wide and the lower part of the lower telescopic column is narrow, and the radius of the upper telescopic column (801) is equal to the radius of the bottom of the lower telescopic column (802).
3. A composite multi-layer PCB panel as claimed in claim 2, wherein: go up flexible post (801) outside opening and be provided with a plurality of round holes, and the even equidistance distribution of round hole.
4. A composite multi-layer PCB panel as claimed in claim 1, wherein: and strip-shaped grains are uniformly arranged on the outer side of the fixture block (401).
5. A composite multi-layer PCB panel as claimed in claim 1, wherein: and dust absorption pads (6) are arranged on the outer sides of the first insulating plate (2), the second insulating plate (7), the third insulating plate (9) and the fourth insulating plate (10) in an adhering mode.
6. A composite multi-layer PCB board as recited in claim 5, wherein: the outer side of the dust absorption pad (6) is precisely attached to the sliding plate (3).
7. A composite multi-layer PCB panel as claimed in claim 1, wherein: the telescopic rod (8) has the telescopic length of 1 mm.
CN202022312308.3U 2020-10-16 2020-10-16 Composite multilayer PCB Active CN213073222U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022312308.3U CN213073222U (en) 2020-10-16 2020-10-16 Composite multilayer PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022312308.3U CN213073222U (en) 2020-10-16 2020-10-16 Composite multilayer PCB

Publications (1)

Publication Number Publication Date
CN213073222U true CN213073222U (en) 2021-04-27

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ID=75562386

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022312308.3U Active CN213073222U (en) 2020-10-16 2020-10-16 Composite multilayer PCB

Country Status (1)

Country Link
CN (1) CN213073222U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115052418A (en) * 2022-08-15 2022-09-13 四川恩巨实业有限公司 Buried hole structure of multilayer PCB and setting method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115052418A (en) * 2022-08-15 2022-09-13 四川恩巨实业有限公司 Buried hole structure of multilayer PCB and setting method thereof

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