CN212413513U

CN212413513U - Circuit board structure with variable resistance output

Info

Publication number: CN212413513U
Application number: CN202020688289.1U
Authority: CN
Inventors: 张东锋
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2021-01-26
Anticipated expiration: 2030-04-29

Abstract

The utility model provides a variable circuit board structure who hinders output, including upper strata, lower floor, spring unit, the upper strata includes first circuit board, first heat conduction insulation board, the second circuit board that from the top down set gradually, the terminal surface is equipped with first circuit layer under the second circuit board, the both ends edge of second circuit board all is equipped with elastic contact electric conduction arch, the lower floor includes third circuit board, second heat conduction insulation board, fourth circuit board, be equipped with second circuit layer on the fourth circuit board, second circuit layer lean on to it is equipped with decurrent resistance contact portion to dodge groove one end, elastic contact electric conduction arch with resistance contact portion sliding contact. The utility model discloses a circuit board structure realizes electric connection through sliding contact's mode between upper strata and the lower floor to increased resistance contact portion at the contact position, realized the function of variable resistance output, be applicable to in equipment such as electronic scale, use extensively.

Description

Circuit board structure with variable resistance output

Technical Field

The utility model relates to a circuit board technical field, concretely relates to circuit board structure of variable resistance output.

Background

The status of circuit boards in the electronics industry has increased year by year, and with the high-speed development of electronic technology, single-layer boards have not been able to meet the current diversification of electronic devices, and multilayer circuit boards have resulted in a high concentration of interconnection lines due to the increase in packaging density of integrated circuits, which necessitates the use of multiple substrates. Unforeseeable design problems, such as noise, stray capacitance, crosstalk, etc., arise in the layout of printed circuits. Therefore, printed circuit board design must strive to minimize signal line length and avoid parallel traces, etc. Obviously, in single panels, even double panels, these requirements do not give a satisfactory answer, due to the limited number of crossovers that can be achieved. In the case of a large number of interconnect and crossover requirements, the board must be scaled up to more than two layers to achieve a satisfactory performance, resulting in a multilayer board.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a circuit board structure of variable resistance output realizes electric connection through sliding contact's mode between upper strata and the lower floor to increased resistance contact portion at the contact position, realized the function of variable resistance output, be applicable to in equipment such as electronic scale, use extensively.

In order to achieve the above object, the present invention provides the following technical solutions:

a circuit board structure with variable resistance output comprises an upper layer, a lower layer connected with the upper layer in a sliding contact manner, and a spring assembly connected at the edge between the upper layer and the lower layer, wherein the upper layer comprises a first circuit board, a first heat-conducting insulating board and a second circuit board which are sequentially arranged from top to bottom, the section width of the second circuit board is smaller than that of the first heat-conducting insulating board, a first circuit layer is arranged on the lower end face of the second circuit board, elastic contact electric conduction bulges electrically connected with the first circuit layer are arranged at the edges of the two ends of the second circuit board, the lower layer comprises a third circuit board, a second heat-conducting insulating board and a fourth circuit board which are sequentially arranged from bottom to top, an avoiding groove is formed in the inner sides of the second heat-conducting insulating board and the fourth circuit board, the second circuit board moves in the avoiding groove, and a second circuit layer is arranged on the fourth circuit board, the second circuit layer is close to dodge groove one end and be equipped with decurrent resistance contact portion, the electrically conductive arch of elastic contact with resistance contact portion sliding contact.

Specifically, the spring assembly comprises a limiting column fixed to the upper end of the fourth circuit board, a spring sleeved on the outer side of the limiting column, and a limiting hole for the limiting column to move is formed in the upper layer.

Specifically, the upper end face of the first circuit board is provided with a third circuit layer, and a first metal conductive hole is connected between the third circuit layer and the first circuit layer.

Specifically, a fourth circuit layer and a fifth circuit layer are respectively arranged on the upper end face and the lower end face of the third circuit board, a second metal conductive hole is connected between the fifth circuit layer and the second circuit layer, and a third metal conductive hole is connected between the fourth circuit layer and the fifth circuit layer.

Specifically, a plurality of electronic components are further welded at the lower end of the first circuit layer and the upper end of the fourth circuit layer.

The utility model has the advantages that:

first, the multi-layer circuit board structure of the present invention realizes electrical connection between the upper layer and the lower layer by sliding contact, and increases the resistance contact portion at the contact position, thereby realizing the function of variable resistance output, and being suitable for electronic scales and other devices, and having wide application;

the second, set up electronic components and dodge the inslot side, can protect electronic components, prevent that electronic components from exposing in the air and laying dust or impaired to the life of circuit board has been promoted.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board structure with variable resistance output according to the present invention.

Fig. 2 is an enlarged view of a portion a in fig. 1.

The reference signs are: the circuit board comprises an upper layer 1, a first circuit board 11, a third circuit layer 111, a first metal conductive hole 112, a first heat-conducting insulating board 12, a second circuit board 13, a first circuit layer 131, an elastic contact conductive protrusion 132, a limiting hole 101, a lower layer 2, a third circuit board 21, a second heat-conducting insulating board 22, a fourth circuit board 23, a second circuit layer 231, a resistance contact part 232, an avoiding groove 201, a fourth circuit layer 211, a fifth circuit layer 212, a second metal conductive hole 213, a third metal conductive hole 214, a spring component 3, a limiting column 31, a spring 32 and an electronic component 4.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

As shown in fig. 1-2:

a variable resistance output circuit board structure comprises an upper layer 1, a lower layer 2 connected with the upper layer 1 in a sliding contact mode, and a spring assembly 3 connected to the edge between the upper layer 1 and the lower layer 2, wherein the spring assembly 3 is used for enabling the upper layer 1 to have an automatic reset function, the upper layer 1 comprises a first circuit board 11, a first heat-conducting insulating board 12 and a second circuit board 13 which are sequentially arranged from top to bottom, the section width of the second circuit board 13 is smaller than that of the first heat-conducting insulating board 12, a first circuit board 131 is arranged on the lower end face of the second circuit board 13, elastic contact conductive protrusions 132 electrically connected with the first circuit board 131 are arranged on the edges of two ends of the second circuit board 13, the lower layer 2 comprises a third circuit board 21, a second heat-conducting insulating board 22 and a fourth circuit board 23 which are sequentially arranged from bottom to top, a avoidance groove 201 is formed in the inner sides of the second heat-conducting insulating board 22 and the fourth circuit board, the second circuit board 13 moves inside the avoiding groove 201, the fourth circuit board 23 is provided with a second circuit layer 231, one end of the second circuit layer 231, which is close to the avoiding groove 201, is provided with a downward resistance contact part 232, the elastic contact conductive protrusion 132 is in sliding contact with the resistance contact part 232, when the upper layer 1 is pressed downwards, the elastic contact conductive protrusion 132 moves downwards to slide on the resistance contact part 232, the principle is similar to that of a sliding rheostat, so that different voltages are output, and the rheostat principle can be applied to electronic scales and other equipment.

Preferably, the spring assembly 3 includes a limiting column 31 fixed on the upper end of the fourth circuit board 23, and a spring 32 sleeved on the outer side of the limiting column 31, the upper layer 1 is provided with a limiting hole 101 for the limiting column 31 to move, the spring 32 has continuous upward thrust to the upper layer 1, so that the upper layer 1 can automatically reset, and the action of the limiting column 31 restricts the moving track of the upper layer 1.

Preferably, the third circuit layer 111 is disposed on the upper end surface of the first circuit board 11, the first metal conductive hole 112 is connected between the third circuit layer 111 and the first circuit layer 131, the inner wall of the first metal conductive hole 112 is plated with copper, and the third circuit layer 111 and the first circuit layer 131 are electrically connected through the first metal conductive hole 112.

Preferably, the upper and lower end surfaces of the third circuit board 21 are respectively provided with a fourth circuit layer 211 and a fifth circuit layer 212, a second metal conductive hole 213 is connected between the fifth circuit layer 212 and the second circuit layer 231, the inner wall of the second metal conductive hole 213 is plated with copper, a bridge electrical connection is realized between the fifth circuit layer 212 and the second circuit layer 231 through the second metal conductive hole 213, a third metal conductive hole 214 is connected between the fourth circuit layer 211 and the fifth circuit layer 212, the inner wall of the third metal conductive hole 214 is plated with copper, and a bridge electrical connection is realized between the fourth circuit layer 211 and the fifth circuit layer 212 through the third metal conductive hole 214.

Preferably, a plurality of electronic components 4 are further welded at the lower end of the first circuit layer 131 and the upper end of the fourth circuit layer 211, the electronic components 4 are arranged on the inner side of the avoiding groove 201, the electronic components 4 can be protected, the electronic components 4 are prevented from being exposed in the air and being dusty or damaged, and therefore the service life of the circuit board is prolonged.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a variable circuit board structure of hindering output, its characterized in that, including upper strata (1), with lower floor (2), the connection that upper strata (1) sliding contact connects upper strata (1) with spring assembly (3) at edge between lower floor (2), upper strata (1) are including first circuit board (11), first heat conduction insulation board (12), second circuit board (13) that set gradually from the top down, the cross-sectional width of second circuit board (13) is less than the cross-sectional width of first heat conduction insulation board (12), the terminal surface is equipped with first circuit layer (131) under second circuit board (13), the both ends edge of second circuit board (13) all be equipped with first circuit layer (131) electric connection's elastic contact electrically conducts protruding (132), lower floor (2) include third circuit board (21) that set gradually from the bottom up, Second heat conduction insulation board (22), fourth circuit board (23), second heat conduction insulation board (22), fourth circuit board (23) inboard have been seted up one and have been dodged groove (201), second circuit board (13) move about in dodge groove (201) inboard, be equipped with second circuit layer (231) on fourth circuit board (23), second circuit layer (231) by to dodge groove (201) one end and be equipped with decurrent resistance contact portion (232), elastic contact electrically conductive protrusion (132) with resistance contact portion (232) sliding contact.

2. The variable resistance output circuit board structure according to claim 1, wherein the spring assembly (3) comprises a limiting post (31) fixed at the upper end of the fourth circuit board (23), and a spring (32) sleeved outside the limiting post (31), and the upper layer (1) is provided with a limiting hole (101) for the limiting post (31) to move.

3. The variable resistance output circuit board structure according to claim 1, wherein a third circuit layer (111) is disposed on the upper end surface of the first circuit board (11), and a first metal conductive hole (112) is connected between the third circuit layer (111) and the first circuit layer (131).

4. The variable resistance output circuit board structure according to claim 1, wherein a fourth circuit layer (211) and a fifth circuit layer (212) are respectively disposed on the upper and lower end surfaces of the third circuit board (21), a second metal conductive hole (213) is connected between the fifth circuit layer (212) and the second circuit layer (231), and a third metal conductive hole (214) is connected between the fourth circuit layer (211) and the fifth circuit layer (212).

5. The circuit board structure of claim 4, wherein a plurality of electronic components (4) are further soldered to the lower end of the first circuit layer (131) and the upper end of the fourth circuit layer (211).